CN2454904Y - Improvement of light-emitting diode - Google Patents
Improvement of light-emitting diode Download PDFInfo
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- CN2454904Y CN2454904Y CN00252125U CN00252125U CN2454904Y CN 2454904 Y CN2454904 Y CN 2454904Y CN 00252125 U CN00252125 U CN 00252125U CN 00252125 U CN00252125 U CN 00252125U CN 2454904 Y CN2454904 Y CN 2454904Y
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- Prior art keywords
- frame
- light
- wafer
- emitting diode
- improvement
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
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- 238000009739 binding Methods 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 abstract description 4
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- 239000000463 material Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 210000002683 foot Anatomy 0.000 description 2
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- 238000000465 moulding Methods 0.000 description 2
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Abstract
The utility model relates to an improvement of light-emitting diodes, which comprises a frame body integrally formed by a conductive metal sheet. Two groups of frame feet are respectively separate, wherein, one group of frame feet are connected with a frame connection; the other group of frame feet is connected with a frame piece; a frame cup is arranged out of the intermediate section of the frame piece adjacent to the frame connection; a wafer is arranged in the frame cup; a bonding wire is connected with the wafer and is also connected with the frame connection; sealing glue to is coated at parts of the wafer, the bonding wire, the frame piece and the frame connection. The width of the frame piece is wider than that of the frame feet. The coating of the sealing glue causes the frame piece and the frame connection of lower section to expose. The utility model further provides an LED with a supporting member; the supporting member is contacted with a circuit board so as to disperse heat for optimal heat conduction.
Description
The utility model is a kind of light-emitting diode, refers to that especially a kind of pedestal bottom can not expose light-emitting diode with heat radiation for sealing.
Press with light-emitting diode as light source, have for many years, it has long service life, the advantage that brightness height and power consumption are low, so it can be used in indicator light widely, automobile brake lamp is the birth tree ... Deng, and see through the design of circuit, then more can be the flicker effect that moment flickers, therefore, even to this day, light-emitting diode has the trend that replaces traditional tungsten lamp gradually.
The principle of light-emitting diode is as shown in Figure 1, is the binding of both positive and negative polarity via at least two pin A, and top one side of the one utmost point, and then tool one pedestal B is for ccontaining wafer or crystal grain C, and is linked to the pole piece E that other utmost point is extended with a sealing wire D, to form path; Wherein, described pin A, pedestal B, pole piece E etc. all make for conductive metal sheet, actually, when producing, are by conducting electricity the integrated punching moulding of book sheet institute.
As shown in Figure 2, be to be the embryo sheet after the known punching press, wherein, and pin A, pedestal B and just like moulding of pole piece E, and this pedestal B is the taper that is indent, and the no part of strip had been removed for dashing already, formed waste material.
And as shown in Figure 3, then be through after the folding pin, pin A is at right angles with respect to pedestal B and pole piece E, then, promptly can bonding wire D links the pole piece E and the wafer C of top.
For making its tool protective effect; the sealing so the circuit relevant portion is all insulated; that is our alleged sealing, and as shown in Figure 4, then with the tool of tool dented space in; it can be corresponding to the unit framework F of each light-emitting diode material so that it can be therebetween nested; and inject transparent adhesive material in top, each unit, as epoxy resin, when its upper limb with this framework F respectively is concordant; and after the sclerosis; it is deviate from, and separate one by one, promptly form light-emitting diode as shown in Figure 1; at this moment; by shown in Figure 1, this pedestal B is hedged off from the outer world for sealing completely, and pedestal B is with top; also be closed state completely, and be hedged off from the outer world.
And we all know, light-emitting diode is owing to transient starting, so the immediate current consumption is big, and its temperature is higher, and light in continuing, and even when using for a long time, the temperature of wafer and bonding wire is because of deriving, formation is smouldered, so influence the life-span, the necessity that is improved is arranged in fact.
Based on above reason, the inventor is before once with " light-emitting diode and method for making thereof and embryo sheet " a case, to Patent Office of the People's Republic of China application for a patent for invention is proposed, and be No. 00107611.6 application case (corresponding to No. 00111453.7 patent application case in Europe and the U.S.'s the 09/583rd, 236 patent application case) through compiling.
The applicant is originally in follow-up study, and the phase can be obtained the purpose of product diversification with the research of different light-emitting diodes, through experiment repeatedly, firstly appears and makes " improvement of light-emitting diode " of the present utility model.
The purpose of this utility model is, a kind of improvement of light-emitting diode is provided, and it has preferable heat conducting and radiating effect, thereby can improve the physical life of diode.
The improvement of a kind of light-emitting diode of the utility model, it comprises: a support body, for conductive metal sheet one-body molded, its two groups respectively is two frame pin that separate, wherein one group of perpendicular direction of frame pin links a company, organize the frame pin separately and then link a sheet with its vertical direction, the nearly frame of frame medium film section connects the place and is arranged with a cup; One wafer is to put and be positioned in aforesaid the cup; One bonding wire is to be conductive metal wire, and an end is linked to crystal grain, and end then is linked to frame even in addition; Sealing is to be coated on the part that aforesaid wafer, bonding wire, frame sheet and frame connect, and forms an outstanding lamp holder in the wafer top; It is characterized in that the width of frame sheet is wide than the frame pin, and sealant covers even exposes the frame sheet of hypomere and frame.
Wherein frame connect the stage casing corresponding to frame cup place for to frame cup arc evagination.
The frame pin that wherein differs from wafer must be for separately, and link respectively with two or above bonding wire and to place at least two or above wafer in the frame cup.
The improvement of a kind of light-emitting diode of the utility model is characterized in that, it comprises: a support body, and one-body molded for conductive metal sheet, its two groups respectively is two frame pin that separate, wherein one group frame pin is the bigger frame face of area, and opens a hole; One support member, its upper end tool stay tube, its size is corresponding to the frame hole, and after passing through the frame hole, the support wall of stay tube bursts forth to periphery, forms one horn-like; One wafer is to place at the bottom of the support of horn-like stay tube bottom; One bonding wire is to be conductive metal wire, is linked to wafer respectively and organizes the frame pin separately; Sealing is to coat support body and support member epimere together with wafer and bonding wire, and only support member and support body hypomere are for exposing.
Wherein the support seat of support spare hypomere must be hollow.
Wherein the machining hole periphery of support body gets the scrobicular ring of the isometrical depression of tool.
Wherein the binding of support member and support body is a riveted.
Wherein support member is good with circle.
Wherein sealing must form a lamp holder.
The frame pin that wherein differs from wafer must be for separately, and link respectively with two or above bonding wire and to place at least two or above wafer at the support end.
Effect for further disclosing concrete technology contents of the present utility model and can reach at first sees also diagram, wherein:
Fig. 1 is known light-emitting diode schematic diagram;
Fig. 2 is the embryo plate plane figure after the punching press of known diode material;
Fig. 3 is the schematic diagram behind the known diode material embryo sheet folding pin;
Fig. 4 is known light-emitting diode sealing schematic diagram;
Fig. 5 sends out the plane graph of diode embryo sheet for the utility model;
Fig. 6 is the profile after the light-emitting diode embryo sheet bending of Fig. 5;
Schematic perspective view when Fig. 7 is the sealing of the utility model light-emitting diode;
Fig. 8 is the finished product schematic diagram of the utility model light-emitting diode;
Fig. 9 is the plane graph of the light-emitting diode embryo sheet of another embodiment of the utility model;
Figure 10 be after the light-emitting diode embryo sheet bending of Fig. 9 with the profile of support member;
Figure 11 is the profile after linking with support member after the light-emitting diode embryo sheet bending of Fig. 9;
Schematic perspective view when Figure 12 is the light-emitting diode sealing of another embodiment of the utility model;
Figure 13 is the finished product schematic diagram of another embodiment light-emitting diode of the utility model;
Figure 14 is the light-emitting diode of Fig. 9 and the profile of another support member;
Figure 15 is implemented on the schematic diagram of polychrome wafer for one group of frame pin of the light-emitting diode of Fig. 9;
To shown in Figure 8, basically, the light-emitting diode of first embodiment of the present utility model is by formed support body 1, one wafer of embryo sheet (or crystal grain) 2, one bonding wires 3 as Fig. 5, and sealing 4 is combined.
Wherein, support body 1 is as shown in Figure 5, and it is the continuous punch forming of a conducting metal book sheet one, it forms four stent foots 11, and this pin 11 is divided into two groups, and wherein company of one group of tool 12 is that central authorities link, the stage casing of this company 12, must be curved for the tool arc, only not as limit, and 11 on the frame pin of organizing separately, the frame sheet 13 that then tool one width is bigger links, the stage casing part of this sheet 13, then integrated punching forms the frame cup 14 of a depression, so that for the usefulness of putting wafer 2.Please consult Fig. 6 again, actually in adding man-hour, be from frame connect 12 with the end place of frame sheet 13,11 bendings of frame pin are formed vertical configuration.
Wafer 2 is for known, and it is to place location in aforesaid the cup 14 when implementing.
Bonding wire 3 is with conducting metal for it, and via bonding equipment aforesaid company 12 and wafer 2 is linked, to form path.
Please consult Fig. 8 again, finished product of the present utility model, the epimere of its company 12 and frame sheet 13 is coated by sealing 4, outside only both hypomeres then are exposed to, reaching the function of heat radiation, and we all know, the especially speed of heat loss through conduction of dispelling the heat, be and area of dissipation tool parameters relationship, that is conduction surface is when big, and then heat radiation is faster, and because of the present utility model sheet 13 its more traditional width are wide, and end section exposes, so can reach better heat radiating effect.
Please consult Fig. 9 to Figure 13 again, that disclosed is second embodiment of light-emitting diode of the present utility model, and it is combined by formed support body 5, one support members, 6, one wafers of embryo sheet (or crystal grain) 7, one bonding wires 8 and sealing 9.
Wherein, the embryo sheet of support body 5 as shown in Figure 9, it is by the continuous punch forming of conducting metal book sheet one, to form four stent foots 51, this pin 51 is divided into two groups, and wherein one group frame pin is 51, is the frame face 52 of broad, its central authorities then open a hole 53, and its periphery is the scrobicular ring 54 of equidistant depression.See also Figure 10,, the frame pin is bent into vertical configuration, and frame face 52 and organize 51 on frame pin separately, for incision separates in for adding man-hour.
Wafer 7 is known, locatees in 623 at the bottom of it is to place aforesaid support when implementing.
Bonding wire 8 is with conducting metal for it, and links via the middle body and the wafer 7 of bonding equipment with aforesaid one group of leg 51, to form path.
Please consult Figure 13 again, finished product of the present utility model, remove frame pin 11 hypomeres, frame face 52 partly and support member 6 hypomeres for exposing, all the other are all aforesaid sealing 9 and coat, and when finished product is intercalated in circuit board, then can be outside the heat radiation because of support member 6 bottoms and frame face 52 expose, but also nationality can be contacted with circuit board by support member 6 and be heat conduction, more shape is quickened heat radiation.
Please consult Figure 14 again, it is another embodiment of the utility model support member 6, and the support seat 61 of support member 6 wherein is the ring-type of central tool hole, and so, but also its ring-type periphery of nationality contacts with circuit board and is heat radiation.
In addition, support member 6 combines with support body 5, except that aforesaid riveted, also can by as the adhesion, screw togather ... etc. mode for it, only this all belongs to known equivalent gimmick, so do not intend giving unnecessary details.
As shown in figure 15, then be this group frame pin 51 that differs from wafer 7 of the utility model light-emitting diode embryo sheet, its middle body is cut, and is respectively wafer 7 bindings of different color, so, promptly can be the colorful demonstration of different color light, and as shown in FIG., be to be three crystal grain, as red, green, blue or red, yellow, blue, then it can be the demonstration of full-color different color light combination, and only this is to be prior art, so do not intend giving unnecessary details.
The utility model those disclosed herein are a kind of than Cui embodiment, and patent right category of the present utility model is not all taken off in Ju Bu change or modification and come from technological thought of the present utility model and be easy to know by inference by the people who is familiar with this skill such as.
Claims (10)
1, a kind of improvement of light-emitting diode, it comprises:
One support body, one-body molded for conductive metal sheet, its two groups respectively is two frame pin that separate, and wherein one group of perpendicular direction of frame pin links a company, organizes the frame pin separately and then links a sheet with its vertical direction, and the nearly frame of frame medium film section connects the place and is arranged with a cup;
One wafer is to put and be positioned in aforesaid the cup;
One bonding wire is to be conductive metal wire, and an end is linked to crystal grain, and end then is linked to frame even in addition;
Sealing is to be coated on the part that aforesaid wafer, bonding wire, frame sheet and frame connect, and forms an outstanding lamp holder in the wafer top;
It is characterized in that the width of frame sheet is wide than the frame pin, and sealant covers even exposes the frame sheet of hypomere and frame.
2, the improvement of light-emitting diode according to claim 1 is characterized in that, wherein frame connect the stage casing corresponding to frame cup place for to frame cup arc evagination.
3, the improvement of light-emitting diode according to claim 1 is characterized in that, the frame pin that wherein differs from wafer must be for separately, and links respectively with two or above bonding wire and to place at least two or above wafer in the frame cup.
4, a kind of improvement of light-emitting diode is characterized in that, it comprises:
One support body, one-body molded for conductive metal sheet, its two groups respectively is two frame pin that separate, wherein one group frame pin is the bigger frame face of area, and opens a hole;
One support member, its upper end tool stay tube, its size is corresponding to the frame hole, and after passing through the frame hole, the support wall of stay tube bursts forth to periphery, forms one horn-like;
One wafer is to place at the bottom of the support of horn-like stay tube bottom;
One bonding wire is to be conductive metal wire, is linked to wafer respectively and organizes the frame pin separately;
Sealing is to coat support body and support member epimere together with wafer and bonding wire, and only support member and support body hypomere are for exposing.
5, the improvement of light-emitting diode according to claim 4 is characterized in that, wherein the support seat of support spare hypomere must be hollow.
6, the improvement of light-emitting diode according to claim 4 is characterized in that, wherein the machining hole periphery of support body gets the scrobicular ring of the isometrical depression of tool.
7, the improvement of light-emitting diode according to claim 4 is characterized in that, wherein the binding of support member and support body is a riveted.
8, the improvement of light-emitting diode according to claim 4 is characterized in that, wherein support member is good with circle.
9, the improvement of light-emitting diode according to claim 4 is characterized in that, wherein sealing must form a lamp holder.
10, the improvement of light-emitting diode according to claim 4 is characterized in that, the frame pin that wherein differs from wafer must be for separately, and links respectively with two or above bonding wire and to place at least two or above wafer at the support end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00252125U CN2454904Y (en) | 2000-11-21 | 2000-11-21 | Improvement of light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN00252125U CN2454904Y (en) | 2000-11-21 | 2000-11-21 | Improvement of light-emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2454904Y true CN2454904Y (en) | 2001-10-17 |
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ID=33609856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN00252125U Expired - Fee Related CN2454904Y (en) | 2000-11-21 | 2000-11-21 | Improvement of light-emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2454904Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
-
2000
- 2000-11-21 CN CN00252125U patent/CN2454904Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290962B (en) * | 2007-04-19 | 2012-07-18 | 斯坦雷电气株式会社 | Optical device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SANMEI PHOTOELECTRIC TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: YOU MUJIN Effective date: 20070817 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070817 Address after: Mauritius Aiben No. 35 Digital City Patentee after: Mitsumi photoelectric Polytron Technologies Inc Address before: Taiwan City, Taipei province Yanshou County Tucheng Road No. 117 3 floor Patentee before: You Mujin |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20011017 Termination date: 20091221 |