CN2384771Y - Thermal sensitive printing head - Google Patents
Thermal sensitive printing head Download PDFInfo
- Publication number
- CN2384771Y CN2384771Y CN 99221578 CN99221578U CN2384771Y CN 2384771 Y CN2384771 Y CN 2384771Y CN 99221578 CN99221578 CN 99221578 CN 99221578 U CN99221578 U CN 99221578U CN 2384771 Y CN2384771 Y CN 2384771Y
- Authority
- CN
- China
- Prior art keywords
- common electrode
- printing head
- heater
- printed substrate
- holding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a thermal sensitive printing head. The thermal sensitive printing head comprises a common electrode, a separate electrode, a heater, printed circuit board signal wires, and a bonding welding tray. The resistance printing field of the common electrode is connected with the printed circuit board signal wires, and the range of the lower partial width w of the resistance printing field is 22.5 muM < w <= 30 muM. The range of the thickness H of the lower part of the resistance of the heater and the bonding welding tray is H >= 0.6 muM. The utility model has the advantages of smaller volume, and uniformly lettering. The thermal sensitive printing head can be widely used for electrographs, cashing machines, etc.
Description
The utility model relates to a kind of print member, is a kind of thermal printing head specifically.
The ceramic substrate of existing thermal printing head generally is made of part glaze, common electrode, heater and glass glaze diaphragm, and common electrode and individual electrode evenly distribute under the heater, and live width is 22.5 μ m.It is bigger that this structure causes wiring to take up room, thereby make the ceramic substrate volume bigger.In the process that realizes the quick printhead miniaturization of gesture, because it is bigger to flow through the electric current of the common electrode that links to each other with the printed substrate holding wire, the thermal losses at common electrode place increases under the heater, cause lettering density unevenness one when printing and the heating of this common electrode occurs, even the common electrode phenomenon of blowing.
The purpose of this utility model is exactly the deficiency that overcomes existing printhead, provides that a kind of volume is less, the thermal printing head of lettering concentration homogeneous.
For achieving the above object, a kind of thermal printing head, it comprises that ceramic substrate, printed substrate, ceramic substrate are provided with common electrode, individual electrode, heater, pressure welding pad, printed substrate is provided with holding wire, the part common electrode links to each other with the printed substrate holding wire, the heater resistance print field bottom partial width w that it is characterized in that the common electrode that links to each other with the printed substrate holding wire is: 22.5 μ m＜W≤30 μ m, the lead of heater resistance print field bottom and the thickness H of pressure welding pad are: H 〉=0.6 μ m.
The utility model is owing to strengthened the width of the common electrode that links to each other with the printed substrate holding wire, thickeied the thickness of heater resistance print field lower wire and pressure welding pad simultaneously, thereby reduced the power consumption of common electrode, reduced the common electrode caloric value, when reducing the printhead volume, solved the phenomenon of lettering density unevenness one.
Below in conjunction with accompanying drawing the utility model is described further.
Fig. 1 is the utility model structural representation.3, the common electrode that links to each other with the printed substrate holding wire; 5, common electrode; 7, the heater resistance print field bottom part of the common electrode that links to each other with the printed substrate holding wire; 8, pressure welding pad.
Fig. 2 is the A-A cutaway view of Fig. 1.1, ceramic substrate; 2, part glaze; 3, common electrode; 4, heater; 6, glass glaze diaphragm;
With reference to Fig. 2; the utility model comprises that ceramic substrate 1, part glaze 2, glass glaze diaphragm 6, printed substrate, ceramic substrate 1 are provided with common electrode 3, individual electrode, heater 4; printed substrate is provided with holding wire; part common electrode 3 links to each other with the printed substrate holding wire; with the width of 7 in the common electrode 3 that the printed substrate holding wire links to each other is 25 μ m, and the lead of heater resistance print field bottom and the thickness of pressure welding pad are 0.6 μ m.With reference to Fig. 1, part common electrode 3 links to each other with the printed substrate holding wire, is 25 μ m with the width of 7 in the common electrode 3 that the printed substrate holding wire links to each other; Make this thermal printing head and comprise steps such as printing, sintering, photoetching, in printing process, on whole ceramic substrate, carry out earlier a down payment printing, carry out the once printing of part gold simultaneously in heater print field bottom and pressure welding pad place then, the lead of heater resistance print field bottom and the thickness of pressure welding pad are 0.6 μ m.Because of the golden lead on the ceramic substrate 1 is very thin, in the thermal printing head production process, exist the relatively poor problem of pressure welding.With the technology that the lead of pressure welding pad 8 and the print field bottom of heater 4 prints simultaneously, both simplified production craft step, reduced equipment loss, improved yield rate again, effectively reduce cost.The present invention can be widely used in fields such as facsimile machine, commercial cashing machine, medicine equipment, bar-code printer, terminal PRN device.
Claims (4)
1, a kind of thermal printing head, it comprises ceramic substrate, printed substrate etc., ceramic substrate is provided with common electrode, individual electrode, heater, pressure welding pad, printed substrate is provided with holding wire, the part common electrode links to each other with the printed substrate holding wire, the width w that it is characterized in that the heater resistance print field bottom part of the common electrode that links to each other with the printed substrate holding wire is: 22.5 μ m＜W≤30 μ m, the lead of heater resistance print field bottom and the thickness H of pressure welding pad are: H 〉=0.6 μ m.
2, thermal printing head according to claim 1 is characterized in that the width of the described common electrode heater resistance print field bottom part that links to each other with the printed substrate holding wire is 25 μ m.
3, thermal printing head according to claim 1 and 2 is characterized in that the conductor thickness of described heater resistance print field bottom is 0.6 μ m.
4, thermal printing head according to claim 1 and 2, the thickness that it is characterized in that described pressure welding pad are 0.6 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99221578 CN2384771Y (en) | 1999-07-09 | 1999-07-09 | Thermal sensitive printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99221578 CN2384771Y (en) | 1999-07-09 | 1999-07-09 | Thermal sensitive printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2384771Y true CN2384771Y (en) | 2000-06-28 |
Family
ID=34012117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99221578 Expired - Fee Related CN2384771Y (en) | 1999-07-09 | 1999-07-09 | Thermal sensitive printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2384771Y (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
-
1999
- 1999-07-09 CN CN 99221578 patent/CN2384771Y/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107901613A (en) * | 2017-11-27 | 2018-04-13 | 山东华菱电子股份有限公司 | A kind of novel thermosensitive printhead heating base plate and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |