CN2360425Y - Electroplating liquid temp. regulating device - Google Patents
Electroplating liquid temp. regulating device Download PDFInfo
- Publication number
- CN2360425Y CN2360425Y CN 99219543 CN99219543U CN2360425Y CN 2360425 Y CN2360425 Y CN 2360425Y CN 99219543 CN99219543 CN 99219543 CN 99219543 U CN99219543 U CN 99219543U CN 2360425 Y CN2360425 Y CN 2360425Y
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- CN
- China
- Prior art keywords
- electroplating
- snake
- regulating device
- electroplating liquid
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses an electroplating liquid temperature regulating device. A snake-shaped transmitting pipe which is back and forth folded is arranged below an electroplating liquid face next to the inner wall of an electroplating bath, the pipe wall of the snake-shaped transmitting pipe is made of heat conducting materials, an inlet and an outlet of the snake-shaped transmitting pipe are led out of the electroplating bath, and a heating medium or a cooling medium is led into the snake-shaped transmitting pipe to transmit heat or cold to electroplating liquid through circulation so that the electroplating liquid reaches the optimal temperature of electroplating. The utility model also has the same effect on heating acid-alkali liquid carrying out rust and oil removal for the surfaces of electroplating pieces. The electroplating liquid temperature regulating device has the advantages of simple structure and low manufacture and use cost, and is suitable for small electroplating factories.
Description
The utility model belongs to a kind of heat exchanger, in particular for Electroplating Production, by carry out the device that heat exchange comes attemperation in plating bath.
To plating piece plating metal on surface layer time, suitable temperature will be no more than up and down in 2~5 ℃ the scope at 35 ℃ could guarantee electroplating quality, is to solve the low excessively problem of temperature, general way with energising heating plating bath, but electric cost is higher; Production environment temperature height was added when electroplating and will be generated heat summer, and bath temperature will substantially exceed 35 ℃, often will influence the output and the quality of Electroplating Production.
The purpose of this utility model is that a kind of plating bath of controlling of design is produced and temperature control equipment with low cost under optimal temperature.
For realizing this purpose, but the technical solution of the utility model is near the reciprocal catadioptric shape transfer tube that tube wall heat conduction is installed in the plating bath of coating bath inwall, and its import and outlet are drawn outside the coating bath.
Because transfer tube passes plating bath, coating bath is drawn at two ends, Guan Zhongke feeds mediums such as hot water, steam or cold water, by transmitting tube wall with heat or cold loosing in plating bath, thereby regulating plating bath electroplates it under suitable temperature, that guarantee to produce normally carries out and galvanized quality, and this thermostat is simple in structure, makes, use cost is low, thermoregulation effect good.
The utility model is described in further detail below in conjunction with drawings and Examples.
Fig. 1 is the shaft side figure of temperature of electroplating solution setting device.
Among the figure, in coating bath 1, along its inner side-wall transfer tube 2 is installed, the import 5 and the outlet 4 of its pipe are drawn beyond the coating bath 1, tube wall is made with thermally conductive material, and the cross section of pipe can be arbitrary shapes such as square, circle, and is more abundant for making heat exchange, pipe can be back and forth catadioptric snakelike arrangement, also can be other forms that help conducting heat; Can be one group of whole shape, also can be many groups that are convenient to regulate, laying side by side of promptly a plurality of imports and outlet can also be loaded onto valve 3 on importing and exporting, by regulating the import and export amount temperature adjustment of medium.
Electroplate when temperature required when bath temperature is lower than, feed steam or hot water from the import 5 of transfer tube 2, heat is distributed to by tube wall temperature is improved, and the water after the release of heat is by outlet 4 circulation reheat; When bath temperature is too high,, by tube wall the heat in the plating bath is taken out of, thereby made bath temperature transfer to suitable temperature from the import 5 feeding cold water of pipe.This kind temperature control equipment can be used for also before the plating of plating piece that acid etching derusts and alkaline etching is deoiled improves the temperature of acid ﹠ alkali liquid, reaches that the plating piece surface is removed not only soon but also clean, and purpose with low cost.
Claims (2)
1, a kind of temperature of electroplating solution setting device, be placed in the coating bath near among the plating bath of inwall, it is characterized in that: the transfer tube (2) of forming this device is reciprocal catadioptric serpentine tube, and tube wall is that thermally conductive material is made, and its import (5) and outlet (4) are drawn beyond the coating bath.
2, temperature of electroplating solution setting device as claimed in claim 1 is characterized in that, in import (5) of its transfer tube (2) and the outlet (4) valve (3) is housed respectively.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 99219543 CN2360425Y (en) | 1999-01-08 | 1999-01-08 | Electroplating liquid temp. regulating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 99219543 CN2360425Y (en) | 1999-01-08 | 1999-01-08 | Electroplating liquid temp. regulating device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2360425Y true CN2360425Y (en) | 2000-01-26 |
Family
ID=34010441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 99219543 Expired - Fee Related CN2360425Y (en) | 1999-01-08 | 1999-01-08 | Electroplating liquid temp. regulating device |
Country Status (1)
Country | Link |
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CN (1) | CN2360425Y (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101024890B (en) * | 2007-01-11 | 2010-09-01 | 福州大学 | Wire material electroplating or pretreating heating technology |
WO2012136154A1 (en) * | 2011-04-08 | 2012-10-11 | 江西稀有金属钨业控股集团有限公司 | Heater and heating method for wet extraction tank |
CN102778150A (en) * | 2012-07-18 | 2012-11-14 | 梅州市志浩电子科技有限公司 | Chemical deposition temperature control system and temperature regulation method thereof |
CN103088396A (en) * | 2013-01-29 | 2013-05-08 | 惠州中京电子科技股份有限公司 | Chemical water treatment method for PCB (printed circuit board) electro-coppering trough |
CN104389009A (en) * | 2014-11-28 | 2015-03-04 | 江门市宏丰电子科技有限公司 | Electroplating solution heating tank |
CN106087019A (en) * | 2016-08-21 | 2016-11-09 | 无锡瑾宸表面处理有限公司 | Heat and cool down adjustable electric coating bath |
CN106958037A (en) * | 2017-05-16 | 2017-07-18 | 湖州浩森科技股份有限公司 | One kind plating firing equipment |
-
1999
- 1999-01-08 CN CN 99219543 patent/CN2360425Y/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101024890B (en) * | 2007-01-11 | 2010-09-01 | 福州大学 | Wire material electroplating or pretreating heating technology |
WO2012136154A1 (en) * | 2011-04-08 | 2012-10-11 | 江西稀有金属钨业控股集团有限公司 | Heater and heating method for wet extraction tank |
CN102778150A (en) * | 2012-07-18 | 2012-11-14 | 梅州市志浩电子科技有限公司 | Chemical deposition temperature control system and temperature regulation method thereof |
CN103088396A (en) * | 2013-01-29 | 2013-05-08 | 惠州中京电子科技股份有限公司 | Chemical water treatment method for PCB (printed circuit board) electro-coppering trough |
CN103088396B (en) * | 2013-01-29 | 2015-10-28 | 惠州中京电子科技股份有限公司 | A kind of PCB copper electroplating groove liquid medicine treatment process |
CN104389009A (en) * | 2014-11-28 | 2015-03-04 | 江门市宏丰电子科技有限公司 | Electroplating solution heating tank |
CN106087019A (en) * | 2016-08-21 | 2016-11-09 | 无锡瑾宸表面处理有限公司 | Heat and cool down adjustable electric coating bath |
CN106958037A (en) * | 2017-05-16 | 2017-07-18 | 湖州浩森科技股份有限公司 | One kind plating firing equipment |
CN106958037B (en) * | 2017-05-16 | 2019-01-11 | 湖南省鎏源新能源有限责任公司 | A kind of plating heating equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |