CN104389009A - Electroplating solution heating tank - Google Patents
Electroplating solution heating tank Download PDFInfo
- Publication number
- CN104389009A CN104389009A CN201410715277.2A CN201410715277A CN104389009A CN 104389009 A CN104389009 A CN 104389009A CN 201410715277 A CN201410715277 A CN 201410715277A CN 104389009 A CN104389009 A CN 104389009A
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- China
- Prior art keywords
- casing
- tank body
- electroplate liquid
- electroplating solution
- pipeline
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses an electroplating solution heating tank. The electroplating solution heating tank comprises a tank body which is bonded by a plurality of polytetrafluoroethylene plates, and a heating device with a refrigerant circulating pipeline, wherein a heat exchange coiled tube connected to the refrigerant circulating pipeline is arranged in the tank body; at least one group of reinforcing frame bodies is bonded at the periphery of the tank body along the height direction of the tank body; and a U-shaped bracket for fixing the pipeline is arranged on the tank body. The electroplating solution heating tank is used for heating the electroplating solution by adopting a refrigerant, and is capable of preventing a local temperature from being excessively high, and high in safety. The box body is formed by bonding the polytetrafluoroethylene plates, so that the production cost is low, and the corrosion resistance of the tank body is high; moreover, a reinforcing plate is bonded at the periphery of the tank body, so that the connecting strength between the polytetrafluoroethylene plates is greatly strengthened, and the tank body is prevented from being cracked at the bonded part; meanwhile, the U-shaped bracket on the tank body can be used for fixing the pipeline, and therefore, the electroplating solution heating tank is convenient to use.
Description
Technical field
The present invention relates to electroplating device, particularly a kind of electroplate liquid heating container.
Background technology
Existing electroplate liquid heating container generally adopts calrod to heat, during calrod heating, the temperature of electroplating solution be in around calrod can apparently higher than the temperature of electroplating solution of other positions of heating container, namely local temperature can be caused too high, fire is easily caused to occur, security is low, in addition, also there is the shortcoming that production cost is high, corrosion resistance is low in existing electroplate liquid heating container.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides the electroplate liquid heating container that a kind of security is high, production cost is low, corrosion resistance is high.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of electroplate liquid heating container, comprise by the bonding casing formed of some polyfluortetraethylene plates, and the heating unit of band medium circulation pipeline, the heat exchange coil be connected with described medium circulation pipeline is provided with in described casing, casing periphery is bonded with at least one group and strengthens framework along box height direction, casing is provided with the U-shaped support for restrained line.
As the improvement of technique scheme, described U-shaped support is provided with two jig arm, and be formed with the deep-slotted chip breaker suitable with pipeline outer wall between two jig arm, the free end of two jig arm is equipped with wedge buckle.
Further, the thickness of the polyfluortetraethylene plate of described composition casing is 6 ~ 30mm.
Further, described heating unit is air energy thermal pump system or refrigerant heater.
Further, described reinforcement framework is formed by some polyfluortetraethylene plates are bonding.
The invention has the beneficial effects as follows: the present invention is by arranging by the bonding casing formed of some polyfluortetraethylene plates and the heating unit being with medium circulation pipeline, and the heat exchange coil be connected with medium circulation pipeline is set in casing, by heating devices heat refrigerant, electroplate liquid when high temperature refrigerant flow to heat exchange coil from medium circulation pipeline and in casing carries out heat exchange, thus realizes heating electroplate liquid.This structure heats electroplate liquid owing to adopting refrigerant, and local temperature can be prevented too high, and security is high; Owing to adopting the bonding formation casing of polyfluortetraethylene plate, production cost is low, and casing corrosion resistance is high, and casing periphery is bonded with reinforcement framework, strengthens the connection between polyfluortetraethylene plate, prevents casing from splitting in bonding place; U-shaped support simultaneously on casing can be used for restrained line, easy to use.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of the casing in the present invention.
Embodiment
See figures.1.and.2, a kind of electroplate liquid heating container of the present invention, comprises by the bonding casing 1 formed of some polyfluortetraethylene plates, and the heating unit 2 of band medium circulation pipeline, and described heating unit 2 is air energy thermal pump system or refrigerant heater, but does not limit to.The heat exchange coil 3 be connected with described medium circulation pipeline is provided with in described casing 1, described casing 1 periphery is bonded with some stiffening plates along casing 1 short transverse, preferably, described reinforcement framework 11 is formed by some polyfluortetraethylene plates are bonding, at this, described casing 1 and reinforcement framework 11 adopt the plate adhesion of same material to be formed, the convenient manufacturing.Described casing 1 is provided with the U-shaped support 12 for restrained line.
The present invention heats refrigerant by heating unit 2, and electroplate liquid when high temperature refrigerant flow to heat exchange coil 3 from medium circulation pipeline and in casing 1 carries out heat exchange, thus realizes heating electroplate liquid.This structure heats electroplate liquid owing to adopting refrigerant, and local temperature can be prevented too high, and security is high; Owing to adopting the bonding formation casing 1 of polyfluortetraethylene plate, production cost is low, and casing 1 corrosion resistance is high, and casing 1 periphery is bonded with reinforcement framework 11, strengthens the connection between polyfluortetraethylene plate, prevents casing 1 to split in bonding place; U-shaped support 12 simultaneously on casing 1 can be used for restrained line, easy to use.
Further, described U-shaped support 12 is provided with two jig arm, and the free end being formed with deep-slotted chip breaker 121, two jig arm suitable with pipeline outer wall between two jig arm is equipped with wedge buckle 122.When pipeline is snapped in U-shaped support 12, the inclined-plane of wedge buckle 122 leads to pipeline, save the reactive force that user promotes pipeline, user is facilitated to be pushed by pipeline in deep-slotted chip breaker 121, deep-slotted chip breaker 121 is suitable with pipeline outer wall simultaneously, add the contact area between U-shaped support 12 and pipeline, thus enhance the clamping force of U-shaped support 12 pairs of pipelines, effectively prevent pipeline in use double swerve or displacement.
Preferably, the thickness of the polyfluortetraethylene plate of described composition casing 1 is 6 ~ 30mm, and this thickness range makes polyfluortetraethylene plate have preferably intensity and corrosion resistance, avoids again polyfluortetraethylene plate too thick and causes production cost too high simultaneously.
Certainly, the present invention, except above-mentioned embodiment, can also have other structural distortion, and these equivalent technical solutions also should within its protection domain.
Claims (5)
1. an electroplate liquid heating container, it is characterized in that: comprise by the bonding casing (1) formed of some polyfluortetraethylene plates, and the heating unit (2) of band medium circulation pipeline, the heat exchange coil (3) be connected with described medium circulation pipeline is provided with in described casing (1), casing (1) periphery is bonded with at least one group along casing (1) short transverse and strengthens framework (11), casing (1) is provided with the U-shaped support (12) for restrained line.
2. a kind of electroplate liquid heating container according to claim 1, it is characterized in that: described U-shaped support (12) is provided with two jig arm, be formed with the deep-slotted chip breaker (121) suitable with pipeline outer wall between two jig arm, the free end of two jig arm is equipped with wedge buckle (122).
3. a kind of electroplate liquid heating container according to claim 1, is characterized in that: the thickness of the polyfluortetraethylene plate of described composition casing (1) is 6 ~ 30mm.
4. a kind of electroplate liquid heating container according to claim 1, is characterized in that: described heating unit (2) is air energy thermal pump system or refrigerant heater.
5. a kind of electroplate liquid heating container according to claim 1, is characterized in that: described reinforcement framework (11) is formed by some polyfluortetraethylene plates are bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715277.2A CN104389009A (en) | 2014-11-28 | 2014-11-28 | Electroplating solution heating tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715277.2A CN104389009A (en) | 2014-11-28 | 2014-11-28 | Electroplating solution heating tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104389009A true CN104389009A (en) | 2015-03-04 |
Family
ID=52606963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410715277.2A Pending CN104389009A (en) | 2014-11-28 | 2014-11-28 | Electroplating solution heating tank |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104389009A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2360425Y (en) * | 1999-01-08 | 2000-01-26 | 郭长兴 | Electroplating liquid temp. regulating device |
| KR20120121069A (en) * | 2011-04-26 | 2012-11-05 | 주식회사 에스엠월드 | Heater Apparatus For Heating Plating Tank |
| CN202881432U (en) * | 2012-11-07 | 2013-04-17 | 东莞市宏德电子设备有限公司 | Electroplating heating device |
| CN202913076U (en) * | 2012-10-16 | 2013-05-01 | 厦门欣建雅工贸有限公司 | Heating system used in electroplating |
| CN203550287U (en) * | 2013-10-14 | 2014-04-16 | 广东芬尼克兹节能设备有限公司 | Electroplating heat pump for heating electroplating liquid |
| CN203625521U (en) * | 2013-11-15 | 2014-06-04 | 西安博昱新能源有限公司 | Electroplating liquid insulation system based on heat pump |
| CN203728953U (en) * | 2014-03-19 | 2014-07-23 | 无锡金信表面处理有限公司 | Electroplating bath adopting air energy for heating |
| CN204237886U (en) * | 2014-11-28 | 2015-04-01 | 江门市宏丰电子科技有限公司 | A kind of electroplate liquid heating container |
-
2014
- 2014-11-28 CN CN201410715277.2A patent/CN104389009A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2360425Y (en) * | 1999-01-08 | 2000-01-26 | 郭长兴 | Electroplating liquid temp. regulating device |
| KR20120121069A (en) * | 2011-04-26 | 2012-11-05 | 주식회사 에스엠월드 | Heater Apparatus For Heating Plating Tank |
| CN202913076U (en) * | 2012-10-16 | 2013-05-01 | 厦门欣建雅工贸有限公司 | Heating system used in electroplating |
| CN202881432U (en) * | 2012-11-07 | 2013-04-17 | 东莞市宏德电子设备有限公司 | Electroplating heating device |
| CN203550287U (en) * | 2013-10-14 | 2014-04-16 | 广东芬尼克兹节能设备有限公司 | Electroplating heat pump for heating electroplating liquid |
| CN203625521U (en) * | 2013-11-15 | 2014-06-04 | 西安博昱新能源有限公司 | Electroplating liquid insulation system based on heat pump |
| CN203728953U (en) * | 2014-03-19 | 2014-07-23 | 无锡金信表面处理有限公司 | Electroplating bath adopting air energy for heating |
| CN204237886U (en) * | 2014-11-28 | 2015-04-01 | 江门市宏丰电子科技有限公司 | A kind of electroplate liquid heating container |
Non-Patent Citations (1)
| Title |
|---|
| 曹凤国主编: "《特种加工手册》", 30 November 2010, 机械工业出版社 * |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150304 |