CN2263403Y

CN2263403Y - Non-fan radiator for semiconductor element

Info

Publication number: CN2263403Y
Application number: CN 96209771
Authority: CN
Inventors: 叶元璋
Original assignee: Individual
Current assignee: Individual
Priority date: 1996-05-02
Filing date: 1996-05-02
Publication date: 1997-09-24
Anticipated expiration: 2006-05-02

Abstract

The utility model relates to a non-fan radiator for a semiconductor element. The utility model is at least provided with one radiating plate with good heat conduction, a heat transferring block which is appressed on a scheduled position of a plated surface at one side of the radiating plate, and a heat pipe provided with a two-phase heat transmission system. The heat transferring block is used for contacting a surface of a semiconductor heat element to lead heat generated by the semiconductor element to be transferred to the radiating plate. A pipe body of the heat pipe is appressed on the radiating plate. The heat which is transferred by the heat transferring block is quickly distributed to each place of the radiating plate to escape outwards through the high heat-conducting property of the heat pipe.

Description

Fan-free type semiconductor element heat abstractor

The utility model relates to a kind of heat abstractor of electronic component, particularly a kind of fan-free type semiconductor element heat abstractor.

Present commercial power sub-element, computer cpu (CPU) chip for example, because its performance is more and more higher, the heat that this class component is produced when operation also improves relatively, therefore radiating treatment becomes an important topic of relevant industries then, novel No. 81206220 " improvement of CPU heat abstractor " patent case in Taiwan for example, novel No. 81210253 " improvement of computer cpu heat-radiating structure " the patent case in Taiwan, novel No. 83206520 " host computer wafer heat abstractor " the patent case in Taiwan, novel No. 84200757 " IC heat abstractor " the patent case in Taiwan, and novel No. 84209819 " structure-improved of microprocessor heat abstractor " patent case etc., all are solutions that industry is proposed under afore-mentioned, study the respectively radiator structure of this patent case in great detail, be additional to radiator and on the electronic component and be fixed in fan on this radiator when finding all to have one.As everyone knows, use radiator fan no doubt can increase radiating efficiency, but its negative effect is arranged but, the total volume is strengthened, these influences are even more serious to notebook computer, fan can produce noise in the running, and can increase power consumption, and this must use the occasion of battery particularly unfavorable.In order to solve these harmful effects, Taiwan Hongji Computer Co., Ltd once proposed novel No. 82212565 " computer radiating apparatus of low thermal resistance " patent case, the principal character of this patent case be on a heating panel, set firmly-end face is the heat transfer dome on plane, and then contact with computer components by the plane of this dome, so can strengthen heating panel and contact and reach with surface between thermal element and needn't use fan promptly to have the purpose of great heat radiation effect.Only in fact, though the applicant finds that this heat transfer dome can strengthen heating panel and contact with the surface of thermal element, maximum shortcoming then is that it also can't be passed to heating panel everywhere equably with heat, does not therefore reach ideal on radiating effect yet.

The purpose of this utility model is promptly overcoming the defective of above-mentioned prior art, and a kind of auxiliary semiconductor element heat abstractor that gets final product efficient dissipation heat and have low thermal impedance of fan that do not need is provided.

For reaching aforementioned purpose, the utility model fan-free type semiconductor element heat abstractor has a heating panel made from the good material of heat conduction at least; One is attached at the heat transfer block on this heating panel side plate face precalculated position, and in order to touch with semiconductor component surfaces, the heat that this semiconductor element is produced passes and causes this heating panel; And the heat pipe with the hot biography of two-phase system, be attached on this heating panel with its pipe shaft, will pass the heat that attracts from this heat transfer block in order to the high thermal conductivity of this heat pipe of mat and promptly be distributed to this heating panel and dissipation outward everywhere.

What this must one carries be, the topmost intention of aforementioned fan-free type semiconductor element heat abstractor is to utilize a heat transfer block directly to contact with the semiconductor heat element, in order to heat is directed on the bigger heating panel of an area, and then utilize a heat pipe that amplexiforms with this heating panel plate body, to pass the heat that draws and come by this heat transfer block equably rapidly and reach this heating panel everywhere, and then dissipation outward in large quantities, the design of this kind radiator structure never is suggested.

Enumerate a preferred embodiment below and also in conjunction with the accompanying drawings the utility model heat abstractor is described further, wherein:

Fig. 1 is applied to the schematic perspective view of laptop for preferred embodiment of the utility model.

Fig. 2 is preferred embodiment of the utility model cutaway view on the 2-2 direction in Fig. 1.

Consult accompanying drawing, a preferred embodiment of the heat abstractor of the utility model fan-free type semiconductor element, shown in figure number 10, it is by a heating panel 12, one radiating blocks 14, and a heat pipe 16 constitutes.This embodiment is the heat abstractor as laptop, it concerns that the position as shown in Figure 1, this heating panel 12 is placed in keyboard 20 belows, 14 of this heat transfer blocks are placed in the recessed space 30 of a rectangle, wherein figure number 32 those shown are the circuit board surface of computer cpu CPU, and it is fitted tightly with this heat transfer block 14.

This heating panel 12 is to make with aluminium alloy plate, and its rectangle that is shaped as 100mm * 20mm in the present embodiment, thickness then are 1.0mm, and generally speaking, the shape of this heating panel should be decided according to the laptop that is cooperated, and thickness does not also have particular determination.When assembling, be that it is adhered on the keyboard bottom surface.

This radiating block 14 is Al alloy blocks of a Filled Rectangle, its size should be recessed into space 30 for cooperating, be 50mm * 50mm * 5.0mm in the present embodiment, in order to can positively be incorporated in this space and to amplexiform by the surface (being the circuit surface 32 of CPU) of its bottom surface and semiconductor heat element, its end face then is close to the bottom surface of this heating panel 12, can conduct to this heating panel 12 via this heat transfer block 14 with the heat that this semiconductor heat element was produced, in other words, the effect of this heat transfer block 14 such as same heat dump.When practical combinations, preferably this radiating block 14 is attached at the geometric center of this heating panel 12, so can make the thermal impedance of the two reduce to minimum, the applicant once placed this heat transfer block one jiao of this heating panel, with the geometric center that is placed on this heating panel, the average temperature rising of the two relatively, when heat that the semiconductor heat element produced is 8.0W and ambient temperature when being 19.2 ℃, the former temperature rise is 37.6 ℃ and the latter's temperature rise only is 32.2 ℃.What must one carry is that aforesaid test is to carry out not installing under the situation of heat pipe.

This heat pipe 16 is the metal tube that an inside has the hot biography of two-phase (being the gas-liquid phase) system, furtherly, promptly a kind of working fluid of people is irritated in this metal tube inside under vacuum state, and its inboard tube wall is provided with capillary structure, under low-temp low-pressure, the inner gas-liquid phase equilibrium that forms of this metal tube, and when the one end absorbs heat, working fluid near this end will evaporate because of the moment heat absorption, this kind phenomenon that gasifies rapidly, pressure will be raise and promote gas and liquefy to the mobile heat release simultaneously of the other end, this liquefied working fluid will be back to capable again another time endothermic gasification of former heat absorption one end via the capillarity of capillary structure, and so the circulation running can reach heat biography effect fast.Generally speaking, the effective thermal conductivity of this kind heat pipe is about the 10-10 of onesize copper rod, 000 times.The flat tube of the utility model heat pipe 16, and in the mode of crossing these heat transfer block 14 positions its pipe shaft is attached at the upper surface of this heating panel 12, can passes the heat that causes this heating panel 12 from this heat transfer block 14 whereby and conduct to this heating panel 12 rapidly equably and dissipation outward everywhere.

The applicant in production process once to have or not the radiating effect after this heat pipe is tested the combination of this heating panel and this heat transfer block, the heat that is produced when the semiconductor heat element is 8W, when ambient temperature is 20 ℃, the temperature rise of no heat pipe is 48.4 ℃, the temperature rise of disposing this heat pipe is 35.4 ℃, and test result can confirm that heat abstractor disclosed in the utility model has suitable better heat radiating effect really thus.In addition, the configuration structure of this heat pipe is also influential for the radiating effect of entire heat dissipation device.The applicant is arranged with a groove 122 in the upper face middle position of this heating panel 12 along its length direction in the present embodiment, this heat pipe 16 promptly is posted solid in this groove 122, this kind structure is owing to can increase the contact area of heat pipe and heating panel, therefore the person is good than only being pasted with the heat pipe again on radiating effect, is only causing 31.4 ℃ temperature rise under the condition as hereinbefore.

Claims

1. fan-free type semiconductor element heat abstractor is characterized in that it has following member at least:

One heating panel made from the good material of heat conduction;

One heat transfer block is attached on the precalculated position of this heating panel side plate face, and in order to contact with semiconductor component surfaces, the heat that this semiconductor element is produced passes and causes this heating panel; And

One has the heat pipe of the hot biography of two-phase system, is attached on this heating panel with pipe shaft, will pass the heat that attracts from this heat transfer block in order to the high thermal conductivity by this heat pipe and be distributed to this heating panel rapidly and dissipation outward everywhere.

2. according to the described fan-free type semiconductor element of claim 1 heat abstractor, it is characterized in that described heat transfer block is the geometric center that is attached at this heating panel plate face.

3. according to the described fan-free type semiconductor element of claim 1 heat abstractor, it is characterized in that described heat pipe is its pipe shaft to be attached at described heating panel in the mode of extending toward the other end from the end on the described heating panel length direction not to be pasted with on another lateral plates of described heat transfer block.

4, according to described yuan of fan-type semiconductor element of claim 1 heat abstractor, it is characterized in that, the plate face of described heating panel be provided with size corresponding to the groove of described heat pipe outside caliber in order to hold described heat pipe.

5. according to the described fan-free type semiconductor element of claim 4 heat abstractor, it is characterized in that described groove is by the zone of described heating panel upper face corresponding to described heat transfer block position.