CN2218909Y - Multi-stage semi-conductor refrigerating particle - Google Patents
Multi-stage semi-conductor refrigerating particle Download PDFInfo
- Publication number
- CN2218909Y CN2218909Y CN 94248147 CN94248147U CN2218909Y CN 2218909 Y CN2218909 Y CN 2218909Y CN 94248147 CN94248147 CN 94248147 CN 94248147 U CN94248147 U CN 94248147U CN 2218909 Y CN2218909 Y CN 2218909Y
- Authority
- CN
- China
- Prior art keywords
- particle
- stage
- semiconductor refrigerating
- refrigerating
- stage semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a multi-stage semiconductor refrigerating particle. The structure of the multi-stage semiconductor refrigerating particle is that a plurality of single-stage particles are divided by metal materials by layers and then are welded in turn to form a whole multi-stage semiconductor refrigerating particle structure on the basis of whole single-stage particle structure. The multi-stage semiconductor refrigerating particle has simple structure, easy fabrication, and high work efficiency, and the temperature difference of the cold and hot ends of the multi-stage semiconductor refrigerating particle is far higher than single-stage particle. The utility model is suitable for the dissipation and constant temperature keeping of the special objects of various fields, and can also be used as a refrigerating and baking two-purpose box, a cooling and heating fan, an air conditioner, a refrigerator, etc. for civil products.
Description
The utility model relates to semiconductor refrigerating equipment, specifically a kind of multilevel semiconductor refrigeration particle.
Semiconductor cooler is a kind of new energy transducer, be used widely in some fields in recent years, for example: the dissipation from electronic devices in the space technology, various low temperature detecting head, low-noise amplifier, medical science cuvette groove constant temperature, freezing microtome section, environmental test chamber etc. are still, the overall structure of the semiconductor cooler that uses is the single-stage particle of single layer structure mostly at present, the semiconductor cooler efficient of this structure is low, refrigerating capacity is few, hot junction and cold-end temperature difference are little, its range of application is restricted, and can not satisfy the demand of the application that enlarges day by day.
The purpose of this utility model just provides a kind of multilevel semiconductor refrigeration particle, it can enlarge cold and hot end the temperature difference, increase refrigerating capacity, increase work efficiency.
In order to achieve the above object, the technical solution adopted in the utility model is: be on the basis of individual layer single-stage refrigeration particle in overall structure, a plurality of single-stage refrigeration particles are separated from level to level with metal material and welded successively, form an overall structure, promptly constitute multilevel semiconductor refrigeration particle, the layer plane is vertical with the sense of current.
The utility model has the advantages that: simple in structure, high efficiency, the temperature difference of its cold and hot end is much larger than the single-stage particle, except that existing application is used, also can expand the normal domestic product to, as uses such as refrigeration baking dual-purpose case, cold and warm air heating radiator, air-conditioner, refrigerators.
Fig. 1 is the structural representation of single-stage particulate semiconductor cooler.
Fig. 2 is the structural representation of multistage particulate semiconductor cooler of the present utility model.
Below in conjunction with accompanying drawing the utility model is done to describe in further detail.
Semiconductor cooler is by semi-conducting material P-Bi
2Te3S
B2Te
3N-B
I2Te
3S
B2Te
3Make, the operation principle of this device is based on Pa Er card (Peltier) effect, but its qualitative interpretation is the energy difference that participates in the carrier of electric current in different materials.When carrier at the contact interface place of two kinds of materials when a kind of material with higher-energy shifts out, unnecessary energy will be passed to the lattice of second kind of material, at this moment have heat to emit on contact.If sense of current is opposite, then carrier comes makeup energy by lattice, so absorb heat at this contact, promptly begins refrigeration.
In Fig. 1, T
1, T
2, T
3Be metal material, be generally copper coin, be called flow deflector.T
2Rise and connect T
1And T
3Effect.At T
1With T
3Between be connected to DC current E, like this with regard to structure a closed-loop path that comprises power supply E.N, P are respectively n type semiconductor element and P-type semiconductor element.Under the driving of electric current, because the peltier effect effect, heat is by T
2Turn to T
1And T
3, make T
2The temperature of end descends gradually, usually T
2End is called refrigeration or working end, and T
1And T
3End generally is to be connected with a radiator, is called radiating end.Regulate the whole refrigeration speed of operating current adjustable size; The switch current direction can make refrigerator change the pyrogenicity state immediately into from the refrigeration duty.
The core of semiconductor cooler is the refrigeration particle, and Fig. 2 is the structural representation of multistage particulate semiconductor refrigerator of the present utility model.As seen from the figure, n ' and P ' are the single-stage particles, and they are separated from level to level by metal material X and weld, and form a refrigeration particle that integral body is the multilayer multilevel hierarchy.The multistage particle of this structure can become product separately, needs only and correct supporting connection of external condition, can constitute the temperature difference and the refrigerating capacity cooler much larger than the single-stage particle.Certainly, except that three grades of particles shown in the figure, can also be with level Four, Pyatyi so that more multistage welding, but be not less than two-stage at least, should decide according to the practical application needs.
Claims (1)
1, a kind of multilevel semiconductor refrigeration particle, comprise single-stage refrigeration particle, it is characterized in that, it also comprises: have at least two single-stage refrigeration particles to be separated from level to level by metal material and weld successively, promptly constituting an overall structure is multilevel semiconductor refrigeration particle, and the layer plane is vertical with the sense of current.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 94248147 CN2218909Y (en) | 1994-12-15 | 1994-12-15 | Multi-stage semi-conductor refrigerating particle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 94248147 CN2218909Y (en) | 1994-12-15 | 1994-12-15 | Multi-stage semi-conductor refrigerating particle |
Publications (1)
Publication Number | Publication Date |
---|---|
CN2218909Y true CN2218909Y (en) | 1996-01-31 |
Family
ID=33853160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 94248147 Expired - Fee Related CN2218909Y (en) | 1994-12-15 | 1994-12-15 | Multi-stage semi-conductor refrigerating particle |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN2218909Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105371522A (en) * | 2014-08-29 | 2016-03-02 | 陈树山 | Multistage semiconductor thermoelectric cooling assembly |
CN106979671A (en) * | 2017-03-13 | 2017-07-25 | 上海理工大学 | Semiconductor grain heat-drying case |
CN110243104A (en) * | 2019-05-17 | 2019-09-17 | 华中科技大学 | A kind of semiconductor chilling plate of segmentation structure |
-
1994
- 1994-12-15 CN CN 94248147 patent/CN2218909Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105371522A (en) * | 2014-08-29 | 2016-03-02 | 陈树山 | Multistage semiconductor thermoelectric cooling assembly |
CN106979671A (en) * | 2017-03-13 | 2017-07-25 | 上海理工大学 | Semiconductor grain heat-drying case |
CN110243104A (en) * | 2019-05-17 | 2019-09-17 | 华中科技大学 | A kind of semiconductor chilling plate of segmentation structure |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |