CN221486462U - Automatic tray arranging equipment for chip semiconductors - Google Patents

Abstract

The utility model discloses a chip semiconductor automatic swaying device, which comprises: the processing machine is provided with a feeding group, a material transferring device and a swinging disc group; the material loading group includes: the feeding device comprises a material taking and conveying mechanism, a material tray feeding mechanism, a material tray discharging mechanism and a material tray transferring manipulator; the wobble plate group includes: the device comprises a material taking and arranging mechanism, a arranging and disc taking mechanism and a film disc feeding and discharging mechanism; the processing effect of automatic accurate swaying disk in the chip semiconductor swaying disk processing is realized; the high-precision vision system is matched with the swaying disc mechanism to realize the high-precision adjustment work of the chip semiconductor in the swaying disc process; in the working process, the feeding group and the swinging disc group can independently realize processing operation, and the effects of chip semiconductor feeding and chip semiconductor swinging disc simultaneous processing are realized; the processing accuracy is ensured, and meanwhile, the overall processing efficiency is effectively improved; and the processing income is improved maximally.

Description

Automatic tray arranging equipment for chip semiconductors

Technical Field

The utility model belongs to the technical field of chip semiconductor production and processing, and relates to automatic tray arranging equipment for chip semiconductors.

Background

The chip printing is divided into printing of a substrate conductive layer inside the chip and printing of model information of a chip protective shell, wherein the printing of the substrate conductive layer is to coat the surface layer of the substrate conductive layer with the conductive layer at the beginning of chip production so as to connect circuits among various electronic elements;

Before the chip printing process, the die after the dicing process needs to be fixed in a corresponding film tray in a wobble plate mode. The chips are required to be sequentially arranged on the material tray, and the placing angles of the chips are required to be oriented in the same direction; in the prior art, the chip direction is generally identified by manpower to screen, and meanwhile, the semi-automatic tray loading equipment is matched to carry out tray loading operation, so that the defect is that the labor cost is high, and the operation efficiency is low.

Disclosure of utility model

In order to solve the technical problems, the utility model adopts the following technical scheme:

An automatic wobble plate apparatus for a chip semiconductor, comprising: the processing machine is provided with a feeding group, a material transferring device and a swinging disc group; the feeding group and the swinging plate group are arranged in a vertical direction, the material transferring device is arranged at a position between the feeding group and the swinging plate group, and the transferring effect is realized through the material transferring device;

The material loading group includes: the feeding device comprises a material taking and conveying mechanism, a material tray feeding mechanism, a material tray discharging mechanism and a material tray transferring manipulator; a group of feeding visual cameras are arranged between the material taking and conveying mechanism and the material transferring device;

The wobble plate group includes: the device comprises a material taking and arranging mechanism, a arranging and disc taking mechanism and a film disc feeding and discharging mechanism; a group of swaying disc vision cameras are arranged between the material taking swaying disc mechanism and the material transferring device.

As a further scheme of the utility model: the material transferring device comprises: a material rotating seat and a material rotating motor for driving the material rotating seat to rotate; the material transferring rotary seat is provided with a material carrying seat for carrying materials, and a plurality of loading positions which are arranged in a straight line are formed in the material carrying seat.

As a further scheme of the utility model: the material taking and conveying mechanism comprises: the material taking and traversing module extends from the material tray feeding mechanism to the material transferring device;

a group of material taking lifting modules are arranged on the material taking transverse moving module, and a group of material taking forward moving modules are arranged on the material taking lifting modules;

A plurality of extracting mechanisms are installed on the extracting advancing module, and the extracting mechanisms comprise: a material taking suction head, a material taking rotary motor and a material taking lifting mechanism; the material taking suction head is arranged on the material taking rotary motor, and is driven to rotate by the material taking rotary motor; and the material taking rotary motor is arranged on the material taking lifting mechanism, and the material taking suction head is driven to lift through the material taking lifting mechanism.

As a further scheme of the utility model: the material loading group still includes: a group of material taking vision cameras arranged at the upper end of the material tray feeding mechanism; the material taking visual camera is used for placing the chip semiconductor in the material tray feeding mechanism, and the material taking conveying mechanism is used for achieving the effect of accurately taking materials according to visual information.

As a further scheme of the utility model: the charging tray feed mechanism is the same with charging tray unloading mechanism structure, all includes: a discharging seat, a seat board lifting module and a seat board moving module;

The seat board lifting module and the seat board moving module are arranged at the lower end of the table top of the processing machine table, and the seat board lifting module drives the discharging seat to lift up towards the table top of the processing machine table; and the seat board moving module drives the discharging seat to move towards the outer end direction of the processing machine table.

As a further scheme of the utility model: a plurality of limiting rods are arranged in the discharging seat;

The limiting rod consists of a fixed limiting section and a movable limiting section; the fixed limiting section is fixedly arranged in the discharging seat, and the movable limiting section is arranged at the upper end of the fixed limiting section; and a limiting seat propped against the processing machine is arranged at the top end of the movable limiting section.

As a further scheme of the utility model: the material taking wobble plate mechanism comprises: the swinging disc transverse moving module extends from the material transferring device to the position of the swinging disc taking mechanism;

A group of swaying plate advancing modules are arranged on the swaying plate traversing module, and a group of swaying plate lifting modules are arranged on the swaying plate advancing modules; the machining action of XYZ three axes of material taking work is realized through the swaying disc transverse moving module, the swaying disc lifting module and the swaying disc forward moving module;

A plurality of wobble plate mechanisms are installed on the wobble plate lifting module, and the wobble plate mechanism comprises: a wobble plate suction head, a wobble plate rotating motor and a wobble plate lifting mechanism; the swing disc suction head is arranged on the swing disc rotating motor; the swing disc rotating motor is arranged on the swing disc lifting mechanism;

And a group of wobble plate positioning cameras are further arranged on the wobble plate lifting module.

As a further scheme of the utility model: the tray arranging and taking mechanism comprises; a group of disc taking units and a lifting base;

The tray taking unit includes: the tray taking moving module extends towards the direction of the film tray feeding and discharging mechanism, a tray taking frame is arranged on the tray taking moving module, the other end of the tray taking frame extends to the lifting base position and faces the tray taking moving module;

the other end of the tray taking frame is provided with a chuck clamping jaw for realizing the work of the chuck;

The lifting base sets up in the unloading position of unloading mechanism on the membrane dish, and it includes: the disc placing base station and the disc placing lifting module are used for driving the disc placing base station to lift; a positioning column is arranged on the disc placing base;

And the side end position of the disc placing base table is also provided with a group of compressing devices, and the compressing devices comprise compressing blocks and compressing cylinders for driving the compressing blocks to move towards one side of the disc placing base table.

As a further scheme of the utility model: unloading mechanism includes on the membrane dish: the tray discharging device comprises a tray discharging frame, an upper and lower material lifting module for driving the tray discharging frame to lift, and an upper and lower material moving module for driving the tray discharging frame to move back and forth;

And the tray rack comprises: the inner end surfaces of the rack side plates are provided with a plurality of fixing grooves which are horizontally arranged, and a tray placing position for placing the membrane tray is formed between the two symmetrical fixing grooves.

The utility model has the beneficial effects that: the processing effect of automatic accurate swaying disk in the chip semiconductor swaying disk processing is realized; the high-precision vision system is matched with the swaying disc mechanism to realize the high-precision adjustment work of the chip semiconductor in the swaying disc process; in the working process, the feeding group and the swinging disc group can independently realize processing operation, and the effects of chip semiconductor feeding and chip semiconductor swinging disc simultaneous processing are realized; the processing accuracy is ensured, and meanwhile, the overall processing efficiency is effectively improved; and the processing income is improved maximally.

Drawings

Fig. 1 is a schematic diagram of the structure of the present utility model.

FIG. 2 is a schematic diagram of the structure of the feeding set in the present utility model.

Fig. 3 is a schematic view of the structure of the take-off conveyor of the present utility model.

Fig. 4 is a schematic structural diagram of a tray feeding mechanism and a tray discharging mechanism in the present utility model.

Fig. 5 is a schematic structural view of the transfer device of the present utility model.

Fig. 6 is a schematic structural view of a wobble plate set in the present utility model.

Fig. 7 is a schematic structural view of a material taking wobble plate mechanism in the present utility model.

Fig. 8 is a schematic structural view of a wobble plate pickup mechanism in the present utility model.

Fig. 9 is a schematic structural view of a feeding and discharging mechanism of a membrane disc in the utility model.

Detailed Description

The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments, and the present application is not limited by the exemplary embodiments described herein. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the embodiments of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

The utility model provides referring to fig. 1 to 8, in an embodiment of the utility model, an automatic tray arranging device for chip semiconductors comprises: the processing machine table 1 is provided with a feeding group 2, a material transferring device 4 and a swinging disc group 6;

The feeding group 2 and the swinging plate group 6 are arranged in a vertical direction, the material transferring device 4 is arranged between the feeding group 2 and the swinging plate group 6, and the transferring effect is realized through the material transferring device 4;

The feeding group 2 comprises: the material taking and conveying mechanism 21, the material tray feeding mechanism 24, the material tray discharging mechanism 25 and the material tray transferring manipulator 23; in the processing process, chip semiconductors to be subjected to tray arrangement work are placed in a tray, the tray is placed in a tray feeding mechanism 24 in a stacking mode, the tray is sent to a material taking position of a material taking conveying mechanism 21 through the tray feeding mechanism 24, and the chip semiconductors in the tray are sent to a material transferring device 4 through the material taking conveying mechanism 21;

After the chip semiconductors in the trays are completely loaded, the empty trays are taken away by the tray transfer manipulator 23 and conveyed to the tray blanking mechanism 25; the tray feeding mechanism 24 will send the new tray to the material taking position again, and the chip semiconductor feeding process is repeatedly realized;

A group of feeding visual cameras 3 are also arranged between the material taking and conveying mechanism 21 and the material transferring device 4; when the material taking and conveying mechanism 21 conveys the chip semiconductors to the material transferring device 4, the chip semiconductors taken and conveyed by the material taking and conveying mechanism 21 pass through the upper end of the feeding visual camera 3, the fly shooting effect is realized through the feeding visual camera 3, and the adsorption position and the angle of the chip semiconductors are determined in a visual detection mode; then the angle adjustment of the chip semiconductor is carried out through the material taking and conveying mechanism 21, and then the position adjustment is carried out according to the adsorption position of the chip semiconductor, so that the alignment is realized in the material transferring device 4;

Wobble plate set 6 includes: a material taking and arranging mechanism 61, a arranging and arranging mechanism 63 and a film disc feeding and discharging mechanism 62; in the process of processing, a plurality of groups of film trays A for containing chip semiconductors are placed on a film tray feeding and discharging mechanism 62, the film trays A mainly comprise an outer frame body 1A and a blue film 2A arranged in the outer frame body 1A, and the surface of the blue film 2A has viscosity; the film tray A is sent to a material taking position of a tray arranging and taking mechanism 63 through a film tray feeding and discharging mechanism 62, and then the film tray A is taken out through the tray arranging and taking mechanism 63;

After the chip semiconductors are placed on the material transferring device 4 by the material loading group 2, the material transferring device 4 drives each chip semiconductor to rotate, so that the chip semiconductors enter the processing position of the wobble plate group 6;

then, a chip semiconductor alignment tray sent by the feeding group 2 is arranged on the blue film 2A position of the film tray A from the material transferring device 4 through a material taking tray arranging mechanism 61, and is fixed through the blue film 2A;

After the film tray A is fully filled with the chip semiconductor, the film tray A is returned to the film tray feeding and discharging mechanism 62 through the tray arranging and taking mechanism 63; then the film tray feeding and discharging mechanism 62 sends a new film tray A to the material taking position; the wobble plate processing of the chip semiconductor is repeatedly realized;

A group of swaying disc vision cameras 5 are also arranged between the material taking swaying disc mechanism 61 and the material transferring device 4; when the chip semiconductor is received by the material taking wobble plate mechanism 61 from the material transferring device 4, the chip semiconductor taken by the material taking wobble plate mechanism 61 passes through the upper end of the wobble plate visual camera 5, a fly shooting effect is realized through the wobble plate visual camera 5, and the adsorption position and angle of the chip semiconductor are determined in a visual detection mode; then the angle adjustment of the chip semiconductor is carried out by the material taking wobble plate mechanism 61, and then the position adjustment is carried out according to the adsorption position of the chip semiconductor, so that the alignment wobble plate is arranged on the film plate A.

Further, the material transferring device 4 includes: a material rotating seat 41 and a material rotating motor (not shown) for driving the material rotating seat 41 to rotate; a material carrying seat 42 for carrying materials is arranged on the material transferring rotary seat 41, and a plurality of carrying material positions 43 which are arranged in a straight line are formed in the material carrying seat 42; in the processing process, the material carrying seat 42 in the material receiving state is kept in a parallel state with the material taking and conveying mechanism 21 in the material loading group 2; after receiving, the material transferring motor drives the material loading seat 42 to rotate, so that the material loading seat and the material taking wobble plate mechanism 61 in the wobble plate group 6 are kept in a parallel state, and a material discharging state is achieved; thereby realizing the transfer effect.

Further, the material taking and conveying mechanism 21 includes: the material taking and traversing module 211, wherein the material taking and traversing module 211 extends from the tray feeding mechanism 24 to the position of the material transferring device 4;

A group of material taking lifting modules 212 are arranged on the material taking transverse moving module 211, and a group of material taking forward moving modules 213 are arranged on the material taking lifting modules 212; the processing actions of XYZ three axes of the material taking work are realized through the material taking transverse moving module 211, the material taking lifting module 212 and the material taking advancing module 213;

A plurality of extracting mechanisms 214 are mounted on the extracting advancing module 213, and the extracting mechanisms 214 include: a pick-up head 218, a pick-up rotary motor 217, and a pick-up lift mechanism 216; the material taking suction head 218 is arranged on the material taking rotary motor 217, and the material taking rotary motor 217 drives the material taking suction head 218 to rotate, so that the effect of adjusting the position and the angle of chip components on the material taking suction head 218 is realized; and a material taking rotary motor 217 is installed on the material taking lifting mechanism 216, and the material taking lifting mechanism 216 drives the material taking suction head 218 to lift, so that the material taking and discharging working effect of the material taking suction head 218 is realized.

Still further, the feeding group 2 further includes: a set of pick-up vision cameras 22 arranged at the upper end of the tray feeding mechanism 24; the placing position of the chip semiconductor in the tray feeding mechanism 24 is performed by the material taking vision camera 22, and the material taking conveying mechanism 21 achieves the effect of accurately taking materials according to the vision information.

Further, the tray feeding mechanism 24 and the tray discharging mechanism 25 have the same structure, and both include: a discharging seat 251, a seat plate lifting module 253 and a seat plate moving module 251;

The seat plate lifting module 253 and the seat plate moving module 251 are arranged at the lower end of the table top of the processing machine table 1, and the seat plate lifting module 253 drives the material discharging seat 251 to realize jacking work towards the table top direction of the processing machine table 1, and are used for cartridge clip type feeding work in the material disc feeding mechanism 24 and cartridge clip type receiving work in the material disc discharging mechanism 25; and the seat board moving module 251 drives the discharging seat 251 to move towards the outer end direction of the processing machine table 1 for feeding the material tray in the material tray feeding mechanism 24 and discharging the material tray in the material tray discharging mechanism 25.

Furthermore, a plurality of limiting rods 254 are arranged in the discharging seat 251, and the limiting effect of each tray placed in the discharging seat 251 is realized by each limiting rod 254;

And the limiting rod 254 is composed of a fixed limiting section 257 and a movable limiting section 256; the fixed limit section 257 is fixedly arranged in the discharging seat 251, the movable limit section 256 is arranged at the upper end position of the fixed limit section 257, and when the discharging seat 251 is propped up, the fixed limit section 257 can prop up against the movable limit section 256 to move up together; and the top end position of the movable limiting section 256 is provided with a limiting seat 255 propped against the processing machine table 1, when the tray discharging mechanism 25 drives the movable limiting section 256 to move down to the lowest position, the limiting seat 255 can prop against the processing machine table 1, and the effect of high limiting is achieved, so that the discharging seat 251 can be smoothly sent out from the processing machine table 1.

Further, the material taking tray deck 61 includes: a wobble plate traversing module 611, the wobble plate traversing module 611 extending from the material transfer device 4 to the wobble plate taking mechanism 63;

A set of wobble plate advancing modules 613 are mounted on the wobble plate traversing module 611, and a set of wobble plate lifting modules 612 are mounted on the wobble plate advancing modules 613; the swing disc traversing module 611, the swing disc lifting module 612 and the swing disc advancing module 613 are used for realizing the XYZ three-axis machining action of the material taking work;

A plurality of wobble plate mechanisms 615 are mounted on the wobble plate lifting module 612, and the wobble plate mechanisms 615 include: wobble plate suction head 618, wobble plate rotation motor 617, and wobble plate lifting mechanism 616; the wobble plate suction head 618 is arranged on the wobble plate rotating motor 617, and is driven to rotate through the wobble plate rotating motor 617, so that the effect of adjusting the position and the angle of chip components on the wobble plate suction head 618 is achieved; the swing disc rotating motor 617 is arranged on the swing disc lifting mechanism 616, and the swing disc lifting mechanism 616 drives the swing disc suction head 618 to lift, so that the material taking and discharging working effect of the swing disc suction head 618 is realized;

And a group of wobble plate positioning cameras 614 are further arranged on the wobble plate lifting module 612, the wobble plate positioning cameras 614 determine the positions of wobble plates in the wobble plate processing process, and the wobble plate positioning cameras are driven by the triaxial module to position the wobble plate mechanism 615 one by one.

Further, the tray-setting and tray-taking mechanism 63 includes; a set of tray taking units 631 and a lifting base 632;

The tray taking unit 631 includes: a set of tray taking moving modules 311 extending towards the film tray feeding and discharging mechanism 62, a set of tray taking frames 312 are arranged on the tray taking moving modules 311, and the other ends of the tray taking frames 312 extend to the lifting base 632 and face the tray taking moving modules 311;

The other end of the tray taking frame 312 is provided with a chuck clamping jaw 313 for realizing the work of a chuck, and the chuck clamping jaw 313 is driven to push forwards by the tray taking moving module 311 to pull out a film tray A in the film tray feeding and discharging mechanism 62 and place the film tray A on a lifting base 632 of the lifting base 632;

Lifting base 632 sets up in the ejection of compact position of unloading mechanism 62 on the membrane dish, and it includes: a tray base 321 and a tray lifting module 322 for driving the tray base 321 to lift; when the disc taking unit 631 performs disc taking work of the film disc A, the disc placing lifting module 322 drives the disc placing base 321 to descend so as to achieve an avoidance effect; after the tray taking operation is completed, the tray lifting module 322 drives the tray base 321 to lift for receiving; in order to fix the film tray a on the tray base 321, the tray base 321 is provided with a positioning column 324, and the outer frame 1A of the film tray a is also provided with a positioning hole corresponding to the positioning column 324;

The lateral end of the tray placing base 321 is also provided with a group of pressing devices, and the pressing devices comprise pressing blocks 323 and pressing cylinders 322 for driving the pressing blocks 323 to move towards one side of the tray placing base 321; when the fixing work is carried out, the compressing block 323 is driven by the compressing cylinder 322 to prop against the side end of the membrane disc A, so that the positioning column 324 props against the wall of the positioning hole, and the positioning effect of the membrane disc A is realized.

Further, the tray-arranging and tray-taking mechanism 63 further comprises; the material receiving guide frames 633 are arranged between the tray placing base 321 and the film tray feeding and discharging mechanism 62, so that a transitional effect is realized; the material receiving guide frame 633 has a U-shaped structure; the two ends are formed with a guide frame 331 with an upward edge, the top end of the guide frame 331 is provided with a guide rail 332, and when the film tray A is taken out from the film tray feeding and discharging mechanism 62, the guide frame 331 in the material receiving guide frame 633 is used for supporting the two sides and is sent to the processing position of the tray placing base 321 along the guide rail 332.

Further, the film tray loading and unloading mechanism 62 includes: the tray 621 comprises an up-and-down lifting module 622 for driving the tray 621 to lift and lower, and an up-and-down moving module 623 for driving the tray 621 to move back and forth;

And the tray 621 includes: a pair of parallel rack side plates 624, wherein a plurality of fixing grooves 625 which are horizontally arranged are formed on the inner end surface of the rack side plates 624, and a tray placing position for placing the film tray A is formed between the two symmetrical fixing grooves 625;

In the working process, the film trays A are placed in the tray placing positions one by one, and the tray placing positions are driven by the feeding and discharging lifting module 622 to correspond to the height positions of the chuck clamping jaws 313 so as to realize the material taking work of the film trays A; after the tray arranging work of the film tray A is completed, the film tray A is sent into the same tray placing position again; then the feeding and discharging lifting module 622 drives the other tray placing position to the material taking position, so that the continuous processing effect is realized;

When the film tray a in the tray 621 is completely processed, the feeding and discharging moving module 623 drives the tray 621 to move out of the processing machine 1, so as to facilitate the material changing of the film tray a in the tray 621.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. An automatic wobble plate apparatus for a chip semiconductor, comprising: the processing machine is provided with a feeding group, a material transferring device and a swinging disc group; the feeding group and the swinging plate group are arranged in a vertical direction, the material transferring device is arranged at a position between the feeding group and the swinging plate group, and the transferring effect is realized through the material transferring device;

The material loading group includes: the feeding device comprises a material taking and conveying mechanism, a material tray feeding mechanism, a material tray discharging mechanism and a material tray transferring manipulator; a group of feeding visual cameras are arranged between the material taking and conveying mechanism and the material transferring device;

The wobble plate group includes: the device comprises a material taking and arranging mechanism, a arranging and disc taking mechanism and a film disc feeding and discharging mechanism; a group of swaying disc vision cameras are arranged between the material taking swaying disc mechanism and the material transferring device.

2. The automatic tray arranging device for chip semiconductors according to claim 1, wherein the material transferring device comprises: a material rotating seat and a material rotating motor for driving the material rotating seat to rotate; the material transferring rotary seat is provided with a material carrying seat for carrying materials, and a plurality of loading positions which are arranged in a straight line are formed in the material carrying seat.

3. The automatic tray arrangement for chip semiconductors of claim 1, wherein the pick-up and delivery mechanism comprises: the material taking and traversing module extends from the material tray feeding mechanism to the material transferring device;

a group of material taking lifting modules are arranged on the material taking transverse moving module, and a group of material taking forward moving modules are arranged on the material taking lifting modules;

A plurality of extracting mechanisms are installed on the extracting advancing module, and the extracting mechanisms comprise: a material taking suction head, a material taking rotary motor and a material taking lifting mechanism; the material taking suction head is arranged on the material taking rotary motor, and is driven to rotate by the material taking rotary motor; and the material taking rotary motor is arranged on the material taking lifting mechanism, and the material taking suction head is driven to lift through the material taking lifting mechanism.

4. A chip semiconductor automatic wobble plate apparatus according to any one of claims 1 or 3, wherein the loading group further comprises: a group of material taking vision cameras arranged at the upper end of the material tray feeding mechanism; the material taking visual camera is used for placing the chip semiconductor in the material tray feeding mechanism, and the material taking conveying mechanism is used for achieving the effect of accurately taking materials according to visual information.

5. The automatic tray arranging device for chip semiconductors according to claim 1, wherein the tray feeding mechanism and the tray discharging mechanism have the same structure, and each device comprises: a discharging seat, a seat board lifting module and a seat board moving module;

The seat board lifting module and the seat board moving module are arranged at the lower end of the table top of the processing machine table, and the seat board lifting module drives the discharging seat to lift up towards the table top of the processing machine table; and the seat board moving module drives the discharging seat to move towards the outer end direction of the processing machine table.

6. The automatic tray arranging device for chip semiconductors according to claim 5, wherein a plurality of limit rods are arranged in the material placing seat;

The limiting rod consists of a fixed limiting section and a movable limiting section; the fixed limiting section is fixedly arranged in the discharging seat, and the movable limiting section is arranged at the upper end of the fixed limiting section; and a limiting seat propped against the processing machine is arranged at the top end of the movable limiting section.

7. The automatic semiconductor die placement device as recited in claim 4, wherein the pick-up placement mechanism comprises: the swinging disc transverse moving module extends from the material transferring device to the position of the swinging disc taking mechanism;

A group of swaying plate advancing modules are arranged on the swaying plate traversing module, and a group of swaying plate lifting modules are arranged on the swaying plate advancing modules; the machining action of XYZ three axes of material taking work is realized through the swaying disc transverse moving module, the swaying disc lifting module and the swaying disc forward moving module;

A plurality of wobble plate mechanisms are installed on the wobble plate lifting module, and the wobble plate mechanism comprises: a wobble plate suction head, a wobble plate rotating motor and a wobble plate lifting mechanism; the swing disc suction head is arranged on the swing disc rotating motor; the swing disc rotating motor is arranged on the swing disc lifting mechanism;

And a group of wobble plate positioning cameras are further arranged on the wobble plate lifting module.

8. The automatic semiconductor wafer arranging apparatus according to claim 4, wherein the wafer arranging and taking mechanism comprises; a group of disc taking units and a lifting base;

The tray taking unit includes: the tray taking moving module extends towards the direction of the film tray feeding and discharging mechanism, a tray taking frame is arranged on the tray taking moving module, the other end of the tray taking frame extends to the lifting base position and faces the tray taking moving module;

the other end of the tray taking frame is provided with a chuck clamping jaw for realizing the work of the chuck;

The lifting base sets up in the unloading position of unloading mechanism on the membrane dish, and it includes: the disc placing base station and the disc placing lifting module are used for driving the disc placing base station to lift; a positioning column is arranged on the disc placing base;

And the side end position of the disc placing base table is also provided with a group of compressing devices, and the compressing devices comprise compressing blocks and compressing cylinders for driving the compressing blocks to move towards one side of the disc placing base table.

9. The automatic tray arranging device for chip semiconductors according to claim 1, wherein the film tray feeding and discharging mechanism comprises: the tray discharging device comprises a tray discharging frame, an upper and lower material lifting module for driving the tray discharging frame to lift, and an upper and lower material moving module for driving the tray discharging frame to move back and forth;

And the tray rack comprises: the inner end surfaces of the rack side plates are provided with a plurality of fixing grooves which are horizontally arranged, and a tray placing position for placing the membrane tray is formed between the two symmetrical fixing grooves.