CN221354849U - Heat conduction structure, phase change heat storage device and satellite - Google Patents
Heat conduction structure, phase change heat storage device and satellite Download PDFInfo
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- CN221354849U CN221354849U CN202323034987.2U CN202323034987U CN221354849U CN 221354849 U CN221354849 U CN 221354849U CN 202323034987 U CN202323034987 U CN 202323034987U CN 221354849 U CN221354849 U CN 221354849U
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- 230000008859 change Effects 0.000 title claims abstract description 44
- 238000005338 heat storage Methods 0.000 title abstract description 33
- 239000012071 phase Substances 0.000 description 35
- 239000012782 phase change material Substances 0.000 description 12
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 n-octadecyl Chemical group 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
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Abstract
The application relates to a heat conduction structure, a phase change heat storage device and a satellite. The heat conduction structure includes: a housing provided with a cavity; the heat conduction frame sets up in the cavity, and the heat conduction frame includes: a first side surface including first upper convex portions and first lower convex portions alternately arranged; the second side face is arranged opposite to the first side face and comprises second upper convex portions and second lower convex portions which are alternately arranged, the second upper convex portions are arranged opposite to the first lower convex portions, and the second lower convex portions are arranged opposite to the first upper convex portions. The heat conduction structure can improve the heat storage efficiency of the phase change heat storage device and save the heat storage time.
Description
Technical Field
The application relates to the field of aerospace, in particular to a heat conduction structure, a phase change heat storage device and a satellite.
Background
The research of setting SAR (synthetic aperture radar) load on satellite is increasing, the heat capacity of the TR component (receiving and transmitting component) in SAR load is smaller, the working temperature range is harsh, and during the satellite in orbit, the heat flow change of the outer space is severe, which is unfavorable for the operation of the TR component.
The phase change heat storage device utilizes the characteristic that the phase change material absorbs and releases the phase change latent heat when the phase change occurs to achieve the accumulation and release of heat energy. The aerospace thermal control system adopts a phase change heat storage device to adjust the set temperature. The existing phase-change heat storage device has long heat storage time, and is difficult to meet the temperature adjustment requirement of the TR component.
Disclosure of utility model
Based on the problems, the application provides the heat conduction structure, the phase-change heat storage device and the satellite, and the phase-change heat storage device has high heat storage efficiency and saves heat storage time.
In order to achieve the above effects, the technical scheme adopted by the application is as follows:
in a first aspect, an embodiment of the present application provides a thermally conductive structure, comprising:
A housing provided with a cavity;
the heat conduction frame, set up in the cavity, the heat conduction frame includes:
A first side surface including first upper convex portions and first lower convex portions alternately arranged;
The second side is opposite to the first side, the second side comprises second upper convex parts and second lower convex parts which are alternately arranged, the second upper convex parts are opposite to the first lower convex parts, and the second lower convex parts are opposite to the first upper convex parts.
According to some embodiments of the application, the first side and the second side each extend in a spiral form.
According to some embodiments of the application, the housing comprises:
A lower housing provided with a groove with an opening at the top end;
And the upper shell is connected with the lower shell and covers the opening of the groove to form the cavity.
According to some embodiments of the application, the upper housing is detachably connected to the lower housing.
According to some embodiments of the application, the lower housing, the upper housing and the thermally conductive frame are integrally formed.
According to some embodiments of the application, the upper housing is provided with a filling hole, the housing further comprising a cover plate closing the filling hole.
According to some embodiments of the application, the thickness of the thermally conductive frame is 0.15-0.3 mm.
According to some embodiments of the application, the wall thickness of the housing is 0.7-1 mm.
In a second aspect, an embodiment of the present application provides a phase-change heat storage device including:
A thermally conductive structure as described above;
and the phase change layer is filled in the cavity.
In a third aspect, an embodiment of the application provides a satellite comprising a phase change thermal storage device as described above.
The heat conducting structure has the advantages that the contact area between the heat conducting frame and the phase change layer is large, the heat storage efficiency of the phase change heat storage device can be improved, the heat storage time is saved, and the temperature adjustment requirement of the TR component is met.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings by a person skilled in the art without departing from the scope of the present application as claimed.
FIG. 1 is a schematic view of a heat conducting structure according to an embodiment of the present application;
FIG. 2 is an exploded view of a thermally conductive structure according to an embodiment of the present application;
FIG. 3 is a schematic view of a first heat conducting frame according to an embodiment of the present application;
FIG. 4 is a second schematic view of a heat conducting rack according to an embodiment of the present application;
FIG. 5 is a top view of a thermally conductive frame according to an embodiment of the present application;
FIG. 6 is an exploded view of the housing of the embodiment of the present application;
FIG. 7 is a schematic view showing an embodiment of the present application in which a housing and a heat conducting frame are integrally formed;
FIG. 8 is a graph showing the average temperature change of a phase change thermal storage device according to an embodiment of the present application;
FIG. 9 is a plot of the liquid phase volume fraction change of a phase change material according to an embodiment of the present application;
FIG. 10 is a graph showing a top temperature distribution of a phase change thermal storage device according to an embodiment of the present application;
Fig. 11 is a bottom temperature distribution diagram of a phase change thermal storage device according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made more complete and clear by reference to the accompanying drawings of embodiments of the present application, wherein it is evident that the embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
As shown in fig. 1 and 2, an embodiment of the present application provides a heat conductive structure 100, and the heat conductive structure 100 includes a housing 1 and a heat conductive frame 2. The phase-change layer is filled in the shell 1, and the heat conduction structure 100 can increase the contact area between the heat conduction frame 2 and the phase-change layer and improve the heat transfer efficiency between the heat conduction frame 2 and the phase-change layer.
The shell 1 is approximately cuboid, a closed cavity is formed in the shell 1, and a phase change layer of the phase change heat storage device is filled in the cavity of the shell 1. The phase change layer is a phase change material, for example, n-octadecane.
As shown in fig. 2 and 3, the heat conductive frame 2 is disposed in the cavity of the housing 1. The thermally conductive frame 2 includes a top surface 21, a bottom surface 22, a first side surface 23, a second side surface 24, a third side surface 25, and a fourth side surface 26. The first side 23 and the second side 24 are arranged opposite each other, and the third side 25 and the fourth side 26 are arranged opposite each other. The top surface 21 of the heat conducting frame 2 is connected with the top wall of the cavity, and the bottom surface 22 of the heat conducting frame 2 is connected with the bottom wall of the cavity. The first side 23, the second side 24, the third side 25 and the fourth side 26 are curved.
As shown in fig. 4 and 5, the heat conduction frame 2 has a uniform thickness, and the first side 23 includes first upper protrusions 231 and first lower protrusions 232 alternately arranged, and the first upper protrusions 231 are connected to the adjacent first lower protrusions 232. The second side 24 includes second upper protrusions 241 and second lower protrusions 242 alternately arranged, and the second upper protrusions 241 are connected with adjacent second lower protrusions 242. The second upper protrusion 241 faces the first lower protrusion 232, and the second lower protrusion 242 faces the first upper protrusion 231. The projection of the first side 23 and the projection of the second side 24 are both substantially wave-shaped.
Alternatively, the heat conductive frame 2 is prepared by a rectangular sheet, which is screwed a plurality of times from the top surface 21 to the bottom surface 22 with the axis of the screwing being parallel to the center line of the long side of the sheet, to obtain the heat conductive frame 2. For example, each time a screw is turned 90 °, four times. The heat conduction frame 2 can be made of aluminum alloy. The number of the heat conduction frames 2 is set according to the requirement.
The heat conduction frame 2 can be with the heat introduction cavity of casing surface in, and heat conduction frame 2 and phase transition layer contact are for traditional heat conduction frame, and under the unchangeable circumstances of casing, heat conduction frame 2 and phase transition layer area of contact of this embodiment is bigger, has improved the heat transfer efficiency between heat conduction frame 2 and the phase transition layer, saves the heat accumulation time of phase transition heat accumulation device, satisfies the temperature adjustment demand of TR subassembly.
In some embodiments, the first side 23 and the second side 24 each extend in a spiral form, and the heat conductive frame 2 is in a DNA double spiral form to increase the contact area of the heat conductive frame 2 with the phase change layer.
As shown in fig. 6, in some embodiments, the housing 1 includes: a lower housing 11 and an upper housing 12. The lower housing 11 is provided with a recess 111 open at the top. The upper case 12 is connected to the lower case 11, and the upper case 12 is disposed on the top surface of the lower case 11 to cover the opening of the groove 111, forming a cavity of the case 1.
In some embodiments, the upper housing 12 is removably attached to the lower housing 11. For example, the upper case 12 is fastened to the lower case 11 by screws. A sealing ring may be provided between the lower case 11 and the upper case 12 to improve sealability of the cavity.
As shown in fig. 7, in some embodiments, the lower housing 11, the upper housing 12, and the heat conductive frame 2 are integrally formed. For example, the heat conductive structure 100 is manufactured by 3D printing, and the lower case 11, the upper case 12, and the heat conductive frame 2 are integrally printed and molded. Optionally, the 3D printed material from which the thermally conductive structure 100 is fabricated is AlSi 10 Mg.
When the lower case 11, the upper case 12 and the heat conductive frame 2 are integrally formed, the upper case 12 is provided with a filling hole 121 to facilitate filling the phase change material into the cavity of the case 1. The housing 1 further comprises a cover plate 13, the cover plate 13 closing the filling hole 121. After the phase change material is filled, the cover plate 13 is welded to the upper case 12 to close the filling hole 121.
In some embodiments, the thickness of the thermally conductive frame 2 is 0.15-0.3 mm. For example, the thickness of the heat conductive frame 2 is 0.2mm or 0.3mm. The heat conduction frame 2 is excessively thick, occupies the space of the phase-change layer in the cavity of the shell 1, and influences the heat storage capacity of the phase-change heat storage device. The thickness of the heat conduction frame 2 is too small, and the structural strength is low.
In some embodiments, the wall thickness of the housing 1 is 0.7-1 mm. For example, the wall thickness of the housing 1 is 0.8mm or 0.9mm. Too large a wall thickness of the housing 1 increases the weight of the heat conducting structure 100. The wall thickness of the housing 2 is too small to affect the structural strength of the housing 1.
Embodiments of the present application also provide a phase-change thermal storage device including the thermally conductive structure 100 and a phase-change layer as described above. The phase change layer is a phase change material and fills the cavity of the heat conductive structure 100.
Embodiments of the present application also provide a satellite comprising a phase change thermal storage device as described above. The phase-change heat storage device is arranged below the TR component and is used for efficiently storing heat so as to adjust the temperature of the TR component.
Example 1
The analysis software is used for analyzing the heat storage capacity of the phase-change heat storage device, and the method is set as follows:
1. The heat consumption of the TR component is 26.62W (the weight of the TR component is 75g, the operating temperature range is less than 40 ℃), and the phase change heat storage device is positioned below the TR component; the dimensions of the TR assembly were 51.9mm by 88.6mm by 9.8mm and the heat losses were evenly distributed. Ambient temperature (initial conditions): 5 ℃, the working time is as follows: the operation is carried out for 4min per cycle.
2. The shell 1 is rectangular, the dimensions of the shell 1 are 38.35mm multiplied by 90.1mm multiplied by 8.75mm, the wall thickness of the shell 1 is 0.8mm, and the material is AlSi 10 Mg.
3. The heat conduction frame 2 is AlSi 10 Mg, and a rectangular sheet with the thickness of 7.15mm multiplied by 2mm multiplied by 0.2mm is obtained by four times of 90-degree screwing from top to bottom during modeling. The heat conducting frame 2 is arranged in the cavity of the shell 1.
4. The phase change material n-octadecane with a phase change point of 28 ℃ fills the cavity of the shell 1.
5. Under the space condition, the whole outer envelope of the phase-change heat storage device is provided with other structures, so that gravity is not considered, space radiation is not considered, heat conduction is only calculated, and contact heat conduction between the phase-change heat storage device and other structures is not considered. The phase change thermal storage device top boundary condition was set to Heat flux=tr module Heat consumption (26.62W)/phase change thermal storage device top area (38.35 mm×90.1 mm) =7705W/m 2. The thermal coupling resistance of the contact surface of the phase change material and the shell and the heat conducting frame is 0.001m 2 K/W.
The analysis results are shown in fig. 8, 9, 10 and 11.
Fig. 8 shows an average temperature change curve of the phase change heat storage device body, and it can be seen from the graph that the highest temperature of the temperature change curve is 35.5 ℃, the temperature rise is 30.5 ℃, and the requirement that the temperature rise of the TR component is not more than 32 ℃ is met. In addition, during the initial solid phase temperature rise phase (48 s ago), the phase change thermal storage device quickly rises in temperature at a speed of about 0.5 ℃/s, and the change curve of the phase change thermal storage device is obviously turned around 48 s.
Fig. 9 shows a change curve of the liquid phase volume fraction of the phase change material, wherein the liquid phase volume fraction starts to rise about 48s, and the phase change material starts to perform phase change heat accumulation. The temperature gradient change is slowed down before 48s, and the n-octadecyl completes the phase change melting at about 240s, and the liquid phase volume fraction of the phase change material approaches 1.
As shown in fig. 10 and 11, by analyzing the temperature cloud patterns of the upper and lower surfaces of the phase change heat storage device, it was found that the temperature distribution at the top of the phase change device was uniform, the temperature difference did not exceed 0.67 ℃, and the highest temperature occurred around the housing. The solid AlSi 10 Mg material with better heat conduction performance is arranged around the shell, and the enthalpy value of the AlSi 10 Mg material is not higher than that of the phase change material, so that the periphery is the highest temperature position. As shown by the analysis result of software, the average temperature of the bottom of the phase-change heat storage device is 308.48K, the average temperature of the top of the phase-change heat storage device is 309.89K, the thickness of the phase-change heat storage device is 0.00875m, the calculated heat conductivity coefficient is 47.95W/(m.K), and the requirement of more than 20W/(m.K) is met.
The above description of the embodiments of the present application is provided in detail. The principles and embodiments of the present application have been described herein with reference to specific examples, which are provided to facilitate understanding of the technical solution of the present application and the core ideas thereof. Therefore, those skilled in the art will appreciate that many changes and modifications can be made in the specific embodiments and applications of the application based on the spirit and scope of the application. In view of the foregoing, this description should not be construed as limiting the application.
Claims (10)
1. A thermally conductive structure, comprising:
A housing provided with a cavity;
the heat conduction frame, set up in the cavity, the heat conduction frame includes:
A first side surface including first upper convex portions and first lower convex portions alternately arranged;
The second side is opposite to the first side, the second side comprises second upper convex parts and second lower convex parts which are alternately arranged, the second upper convex parts are opposite to the first lower convex parts, and the second lower convex parts are opposite to the first upper convex parts.
2. The thermally conductive structure of claim 1, wherein the first side and the second side each extend in a spiral fashion.
3. The thermally conductive structure of claim 1, wherein the housing comprises:
A lower housing provided with a groove with an opening at the top end;
And the upper shell is connected with the lower shell and covers the opening of the groove to form the cavity.
4. A thermally conductive structure as claimed in claim 3 wherein said upper housing is removably connected to said lower housing.
5. A thermally conductive structure according to claim 3, wherein said lower housing, said upper housing and said thermally conductive frame are integrally formed.
6. The thermally conductive structure of claim 5, wherein the upper housing is provided with a fill hole, the housing further comprising a cover plate that closes the fill hole.
7. The structure of claim 1, wherein the thickness of the thermally conductive frame is 0.15-0.3 mm.
8. The structure of claim 1, wherein the wall thickness of the housing is 0.7-1 mm.
9. A phase change thermal storage device, comprising:
the thermally conductive structure of any one of claims 1 to 8;
and the phase change layer is filled in the cavity.
10. A satellite comprising the phase change thermal storage device of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323034987.2U CN221354849U (en) | 2023-11-09 | 2023-11-09 | Heat conduction structure, phase change heat storage device and satellite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323034987.2U CN221354849U (en) | 2023-11-09 | 2023-11-09 | Heat conduction structure, phase change heat storage device and satellite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221354849U true CN221354849U (en) | 2024-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323034987.2U Active CN221354849U (en) | 2023-11-09 | 2023-11-09 | Heat conduction structure, phase change heat storage device and satellite |
Country Status (1)
| Country | Link |
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| CN (1) | CN221354849U (en) |
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- 2023-11-09 CN CN202323034987.2U patent/CN221354849U/en active Active
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