CN103591825A - Solid-liquid phase change heat absorption device - Google Patents
Solid-liquid phase change heat absorption device Download PDFInfo
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- CN103591825A CN103591825A CN201310553847.8A CN201310553847A CN103591825A CN 103591825 A CN103591825 A CN 103591825A CN 201310553847 A CN201310553847 A CN 201310553847A CN 103591825 A CN103591825 A CN 103591825A
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- phase change
- solid
- liquid phase
- change material
- encapsulating housing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
The invention belongs to heat absorption devices, and particularly relates to a solid-liquid phase change heat absorption device. The solid-liquid phase change heat absorption device aims to solve the problems that the contact thermal resistance between a traditional solid-liquid phase change material and a temperature-controlled surface is large, reliability of assembly connection is poor and leakage occurs after the phase change material is molten. The solid-liquid phase change heat absorption device comprises a packaging case body (1) provided with a cavity, a heat conduction glue piece A (2) is attached to the bottom of the cavity inside the packaging case body (1), the solid-liquid phase change material (3) is arranged above the heat conduction glue piece A (2) and packaged in the cavity of the packaging case body (1) through a packaging cover plate (5), the assembly surface of the packaging case body (1) and the packaging cover plate (5) is provided with a seal ring (4), and a heat conduction glue piece B (7) is attached to the bottom of the outer side of the packaging case body (1).
Description
Technical field
The invention belongs to heat sink, be specifically related to a kind of solid-liquid phase change heat sink.
Background technology
Phase-change material (PCM-Phase Change Material) refers to and varies with temperature and change form and the material of latent heat can be provided.Phase-change material can be divided into organic (Organic) and inorganic (Inorganic) phase-change material, modal organic phase change material is as paraffin class phase-change material, modal inorganic phase-changing material is water, phase-change material can be used as energy storage device, and this specific character has great meaning in fields such as energy-conservation, temperature controls.Therefore, phase-change material and application thereof become research topic widely.
When carrying out phase-transition heat-storage, can there is the variation of form in phase-change material, if water is the process of the aqueous water melting from solid-state (ice) heat absorption, can produce along with the variation of state mobile characteristic.The flow behavior that this phase-change material produces when being liquid from Solid State Transformation, in fields such as industry manufacture, space flight and aviation and electronics manufactures, brings a difficult problem to the application of such material, for this reason, and the sprouting like the mushrooms after rain of the encapsulation technology of phase-change material.Yet, the phase-change material especially encapsulation technology of solid-liquid phase change material is a world-famous puzzle always, different encapsulation all has feature separately, and to these existing technologies, more or less there are the following problems, that is: sealing is poor, heat-conductive characteristic is poor, structure is heavy or intensity is low etc.
Therefore, need that a kind of good airproof performance, heat-conductive characteristic are strong badly, reliable in structure and light and handy solid-liquid phase change heat sink.
Summary of the invention
The object of the invention is to provide the solid-liquid phase change heat sink of a kind of High Efficiency Thermal conduction, high strength, high-seal, solve after traditional solid-liquid phase change material melts with, assembly connection poor reliability large by temperature control face Contact thermal resistance and phase-change material and produce the problems such as leakage.
The technical solution adopted in the present invention is:
A kind of solid-liquid phase change heat sink, comprise the encapsulating housing that has cavity, heat conduction film A is posted in the bottom of described encapsulating housing internal cavities, and described heat conduction film A top is equipped with solid-liquid phase change material, by encapsulation cover plate, solid-liquid phase change material is enclosed in encapsulating housing cavity; The fitting surface of encapsulating housing and encapsulation cover plate is provided with sealing ring; Described encapsulating housing exterior bottom is posted heat conduction film B.
A kind of solid-liquid phase change heat sink as above, wherein: described encapsulating housing has one or more cavitys, the assembling one or more heat conduction film A corresponding with cavity number, one or more solid-liquid phase change material, one or more encapsulation cover plate, one or more sealing ring, one or more heat conduction film B.
A kind of solid-liquid phase change heat sink as above, wherein: the thickness of described heat-conducting patch A is less than 1mm.
A kind of solid-liquid phase change heat sink as above, wherein: the thickness of described heat conduction film B is less than 1mm.
A kind of solid-liquid phase change heat sink as above, wherein: the connection of described encapsulating housing and encapsulation cover plate adopts jam nut A.
The invention has the beneficial effects as follows:
1) solid-liquid phase change material is encapsulated in a metal shell, and adopts rubber seal to seal, use jam nut to assemble housing, guaranteed that largely solid-liquid phase change material can not leak out from enclosure interior when melting; 2) at solid-liquid phase change material and between by temperature control face, adopt the metal skin structure that a layer thickness is thinner, and in the inside and outside both sides of covering, install 1mm additional with interior heat-conducting silicone grease (or thermal grease conduction, heat conduction film), reduced to the full extent solid-liquid phase change material and by the thermal resistance between temperature control face; 3) this device adopts metal framework to add covering integrated design method, adopt jam nut that this device is assemblied in by temperature control face simultaneously, guaranteed that this packaging system has good structural strength, adopt simultaneously and on metal end frame, join the mode of beating lightening hole, alleviated largely the weight of this device; 4) this packaging system is invertibity structure, and reusable, as need to be changed the kind of phase change material inside time, can easily realize replacing; 5) this device can adopt modularization idea design, and the position of temperature control face, area and intensity freely design the structure of encapsulating housing as required.
Accompanying drawing explanation
Fig. 1 is a kind of solid-liquid phase change heat sink profile signal explosive view provided by the invention;
Fig. 2 is encapsulated shell structural figure (not containing lightening hole);
Fig. 3 is that the A-A of Fig. 2 is to view;
Fig. 4 is that the B-B of Fig. 2 is to view;
In figure: 1. encapsulating housing; 2. heat conduction film A; 3. solid-liquid phase change material; 4. sealing ring; 5. encapsulation cover plate; 6. backing-up screw A; 7. heat conduction film B; 8. backing-up screw B.
The specific embodiment
Below in conjunction with drawings and Examples, a kind of solid-liquid phase change heat sink provided by the invention is introduced:
As shown in Fig. 1～4, a heat sink, comprises the encapsulating housing 1 that has cavity, and heat conduction film A2 is posted in the bottom of encapsulating housing 1 internal cavities, heat conduction film A2 top is equipped with solid-liquid phase change material 3, by encapsulation cover plate 5, solid-liquid phase change material 3 is enclosed in encapsulating housing 1 cavity; The fitting surface of encapsulating housing 1 and encapsulation cover plate 5 is equipped with sealing ring 4; Encapsulating housing 1 exterior bottom is posted heat conduction film B7.
For obtaining more excellent effect, can carry out preferably following:
Encapsulating housing 1 and can adopt copper or aluminium alloy class material containing encapsulation cover plate 5, encapsulating housing 1 should have certain cavity volume, cavity inside space is used for filling for example docosane phase-change material of solid-liquid phase change material 3(), and cavity floor is a planar structure, thickness thin as far as possible (being covering).
The thickness of heat-conducting patch A2 is less than 1mm.
The cavity of encapsulating housing 1 can be a plurality of, and each cavity is equipped with encapsulation cover plate 5, sealing ring 4, solid-liquid phase change material 3, heat conduction film A2, heat conduction film B7 accordingly.
Adopt several jam nuts A6 to assemble encapsulating housing 1, encapsulation cover plate 5 and inner solid-liquid phase change material 3.During assembling, require encapsulation cover plate can compress inner solid-liquid phase change material 3 and sealing ring 4, to guarantee solid-liquid phase change material 3 and encapsulating housing 1 bottom surface close contact, guarantee that solid-liquid phase change material 3 can be sealed in encapsulating housing 1 simultaneously.
During use, outside at packaged solid-liquid phase change material 3, encapsulating housing 1 with by the outer surface of temperature control face phase-contact surface, sticked the heat-conducting patch B7 that a layer thickness is less than 1mm, and packaged solid-liquid phase change material 3 is pasted and tied up on by temperature control face, adopt several backing-up screws B8 simultaneously, to envelope encapsulating housing 1 with by temperature control face, undertaken fasteningly, require packaged solid-liquid phase change material 3 can and be fitted tightly between temperature control face, can realize the decalescence temperature control by by temperature control face.
Encapsulation problem for solid-liquid phase change material, apparatus of the present invention are relatively large by a thermal conductivity factor, there is the metal shell of certain mechanical strength as the storing containers of solid-liquid phase change material, and by a metal cover board with certain mechanical strength, solid-liquid phase change material is encapsulated, and adopt backing-up screw to metal shell, solid-liquid phase change material, sealing ring, metal cover board assembles, in order to guarantee solid-liquid phase change material can be sealed in enclosure interior after heat absorption fusing, do not leak out, cushioning one deck rubber seal between metal cover board and metal shell, to play sealing function.
Device provided by the invention in order to reduce between device self inside and housing, device and by the thermal contact resistance between temperature control face, by between solid-liquid phase change material and encapsulating housing and apparatus of the present invention and installed additional one deck 1mm between by temperature control face with interior heat-conducting silicone grease (or thermal grease conduction, heat conduction film), and adopt the fastening mode of jam nut to assemble, to reduce solid-liquid phase change material and by the thermal contact resistance between temperature control face.
Device provided by the invention is in order to alleviate the weight of encapsulating housing, guarantee that encapsulating housing has certain mechanical strength simultaneously, adopt metal framework to add covering integrated design structure, encapsulating housing is by self relatively thick frame load, with by temperature control face phase-contact surface, adopted the stressed-skin construction of thinner thickness, in the time of loss of weight, also reduced to a certain extent solid-liquid phase change material and by the thermal resistance by between temperature control face, in addition, in order further to alleviate the weight of encapsulating housing, on the end frame of encapsulating housing 1, join and beat circular or U-shaped lightening hole.
Claims (5)
1. a solid-liquid phase change heat sink, it is characterized in that: comprise the encapsulating housing (1) that has cavity, heat conduction film A(2 is posted in the bottom of described encapsulating housing (1) internal cavities), described heat conduction film A(2) top is equipped with solid-liquid phase change material (3), by encapsulation cover plate (5), solid-liquid phase change material (3) is enclosed in encapsulating housing (1) cavity; The fitting surface of encapsulating housing (1) and encapsulation cover plate (5) is provided with sealing ring (4); Described encapsulating housing (1) exterior bottom is posted heat conduction film B(7).
2. a kind of solid-liquid phase change heat sink according to claim 1, it is characterized in that: described encapsulating housing (1) has one or more cavitys the assembling one or more heat conduction film A(2 corresponding with cavity number), one or more solid-liquid phase change material (3), one or more encapsulation cover plate (5), one or more sealing ring (4), one or more heat conduction film B(7).
3. a kind of solid-liquid phase change heat sink according to claim 1, is characterized in that: thickness described heat-conducting patch A(2) is less than 1mm.
4. a kind of solid-liquid phase change heat sink according to claim 1, is characterized in that: thickness described heat conduction film B(7) is less than 1mm.
5. a kind of solid-liquid phase change heat sink according to claim 1, is characterized in that: the connection of described encapsulating housing (1) and encapsulation cover plate (5) adopts jam nut A(6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553847.8A CN103591825A (en) | 2013-11-08 | 2013-11-08 | Solid-liquid phase change heat absorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310553847.8A CN103591825A (en) | 2013-11-08 | 2013-11-08 | Solid-liquid phase change heat absorption device |
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| Publication Number | Publication Date |
|---|---|
| CN103591825A true CN103591825A (en) | 2014-02-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310553847.8A Pending CN103591825A (en) | 2013-11-08 | 2013-11-08 | Solid-liquid phase change heat absorption device |
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| CN (1) | CN103591825A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104235966A (en) * | 2014-08-27 | 2014-12-24 | 珠海格力电器股份有限公司 | Heat accumulator and outdoor unit comprising heat accumulator |
| CN104803127A (en) * | 2014-03-21 | 2015-07-29 | 中集集团集装箱控股有限公司 | Insulation case |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852567A (en) * | 2010-06-24 | 2010-10-06 | 重庆大学 | Energy-saving and temperature-regulating module |
| CN102353231A (en) * | 2011-07-21 | 2012-02-15 | 杨宪宁 | Temperature-regulating and energy-storing device for novel wine cabinet |
-
2013
- 2013-11-08 CN CN201310553847.8A patent/CN103591825A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101852567A (en) * | 2010-06-24 | 2010-10-06 | 重庆大学 | Energy-saving and temperature-regulating module |
| CN102353231A (en) * | 2011-07-21 | 2012-02-15 | 杨宪宁 | Temperature-regulating and energy-storing device for novel wine cabinet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104803127A (en) * | 2014-03-21 | 2015-07-29 | 中集集团集装箱控股有限公司 | Insulation case |
| CN104235966A (en) * | 2014-08-27 | 2014-12-24 | 珠海格力电器股份有限公司 | Heat accumulator and outdoor unit comprising heat accumulator |
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Application publication date: 20140219 |