CN221282067U - Wafer changing device - Google Patents
Wafer changing device Download PDFInfo
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- CN221282067U CN221282067U CN202322947316.9U CN202322947316U CN221282067U CN 221282067 U CN221282067 U CN 221282067U CN 202322947316 U CN202322947316 U CN 202322947316U CN 221282067 U CN221282067 U CN 221282067U
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- 230000007246 mechanism Effects 0.000 claims abstract description 74
- 239000000463 material Substances 0.000 claims abstract description 65
- 238000007599 discharging Methods 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 10
- 230000002146 bilateral effect Effects 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 9
- 230000003749 cleanliness Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 57
- 230000005540 biological transmission Effects 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a wafer changing device, which comprises a lifting mechanism, a clamping mechanism, a conveying mechanism and a material box respectively positioned at a discharging position and a feeding position, wherein the conveying mechanism comprises a sliding seat which is used for moving between the material boxes at the discharging position and the feeding position; the clamping mechanism comprises two clamping blocks which are bilaterally symmetrical, the two clamping blocks are respectively arranged on the vertical plate of the sliding seat through a rotating shaft, a plurality of first clamping grooves and a plurality of second clamping grooves are respectively arranged on two sides of each clamping block along the length direction, and the first clamping grooves and the second clamping grooves are symmetrically centered on the axle center of the rotating shaft; the clamping mechanism also comprises a driving mechanism which drives the two rotating shafts to synchronously and reversely rotate, so that the clamping machine is in a horizontal or vertical state; the material boxes of the unloading level and the loading level are horizontally arranged at intervals and are positioned below the clamping mechanism; the lifting mechanism is used for conveying the wafer between the material box and the clamping mechanism along the vertical direction. The utility model ensures the cleanliness of the wafer in the wafer changing process.
Description
Technical Field
The utility model relates to the technical field of wafer processing, in particular to a wafer replacing device.
Background
In the wafer processing process, different functions are required to be realized by using the material boxes of different materials, for example, the material boxes made of PFA material are used for loading the wafer for carrying out integral medicine washing, the material boxes made of PP material are used for loading the wafer for carrying out transmission, and the wafer is required to be transferred into different material boxes by using a wafer changer so as to finish corresponding processing procedures. The wafer changer is typically provided with a clamping mechanism for clamping the wafer. Before the medicine washing link, the clamping mechanism clamps the dirty piece to be cleaned, then transfers the dirty piece to the material box made of PFA material, after the medicine washing link, the clamping mechanism clamps the clean piece, which can cause cross contamination, so that the cleanliness of the wafer in the wafer changing process can not be ensured.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a wafer replacing device, which aims to ensure the cleanliness of wafers in the wafer replacing process.
The technical scheme adopted by the utility model is as follows:
The wafer changing device comprises a lifting mechanism, a clamping mechanism, a conveying mechanism and a material box respectively positioned at a discharging position and a loading position, wherein:
The conveying mechanism comprises a sliding seat which is used for moving between a discharging position and a feeding position of the material box;
The clamping mechanism comprises two clamping blocks which are bilaterally symmetrical, each clamping block is arranged on the sliding seat vertical plate through a rotating shaft, each clamping block is of a central symmetrical structure, a plurality of first clamping grooves and a plurality of second clamping grooves are respectively arranged on two sides of the clamping mechanism along the length direction, and the first clamping grooves and the second clamping grooves take the axle center of the rotating shaft as the symmetrical center;
The clamping mechanism further comprises a driving mechanism which drives the two rotating shafts to synchronously and reversely rotate, so that the clamping machine is in a horizontal or vertical state;
The first clamping grooves and the second clamping grooves of the two clamping blocks are respectively in a bilateral symmetry state in a horizontal state, and the first clamping grooves of the two clamping blocks are in bilateral one-to-one correspondence to form a plurality of first clamping positions, or the second clamping grooves of the two clamping blocks are in bilateral one-to-one correspondence to form a plurality of second clamping positions;
the vertical state and the horizontal state form an included angle of 90 degrees;
the diameter of the wafer to be clamped is smaller than the distance between the two clamping blocks in the vertical state and larger than the distance between the two clamping blocks in the horizontal state;
The material boxes of the unloading level and the loading level are horizontally arranged at intervals and are positioned below the clamping mechanism;
The lifting mechanism is used for conveying the wafer between the material box and the clamping mechanism along the vertical direction.
The further technical scheme is as follows:
The rotary shafts are provided with shading sheets, and the position, close to each rotary shaft, of the vertical plate of the sliding seat is respectively provided with a horizontal detection sensor and a vertical detection sensor which are matched with the shading sheets and used for detecting whether clamping blocks on the rotary shafts are turned in place or not.
A first sensor is arranged on a vertical plate of the sliding seat and used for detecting whether the lifting mechanism lifts the wafer in place or not; and a second sensor is also arranged for detecting whether the wafer on the clamping mechanism falls off.
The lifting mechanism comprises a lifting cylinder, a lifting piece is arranged at the top end of a piston rod of the lifting cylinder, the lifting mechanism structurally comprises a lifting plate, supporting blocks are symmetrically arranged on the left side and the right side of the lifting plate, a plurality of supporting grooves are uniformly distributed on the supporting blocks along the length direction, and the supporting grooves on the left side and the right side are in one-to-one correspondence to form a plurality of supporting positions.
The material box is located on the fixed substrate, a plurality of material placing grooves are symmetrically formed in the left side and the right side in the material box, the material placing grooves on the left side and the right side are in one-to-one correspondence to form a plurality of material placing positions, an upper opening is formed in the top end of the material box, a lower opening is formed in the lower end of the material box, the width of the lower opening is not greater than that of the upper opening, and the lower opening is used for the lifting plate to pass through.
The distance between two adjacent second clamping positions is the same as the distance between two adjacent first clamping positions, and is the same as the distance between two adjacent supporting positions and the distance between two adjacent material positions.
The sliding seat is arranged at the output end of the electric sliding table, and the electric sliding table is positioned on the fixed substrate.
The width of the lifting piece is smaller than the distance between the two clamping blocks in the horizontal state.
The material of the material box positioned at the unloading position and the material loading position is different.
The driving mechanism comprises a motor, a driving wheel, a driven shaft and a bevel gear meshing part, wherein the output end of the motor is connected with the driving wheel, the driving wheel is connected with the driven wheel through a transmission belt, the driven wheel is connected with the input end in the middle of the driven shaft, and the output ends on two sides of the driven shaft are respectively connected with two rotating shafts through a group of bevel gear meshing parts.
The beneficial effects of the utility model are as follows:
The wafer replacing device is reasonable in structural design and convenient to operate, can realize wafer replacing work of wafers in different material boxes, and can form a first clamping position or a second clamping position by overturning two clamping blocks of the clamping mechanism, so that the cleanliness of the wafers in the wafer replacing process can be ensured.
The utility model has high efficiency, can realize the replacement of a plurality of wafers at one time, can accelerate the wafer replacement efficiency and reduces the cost.
Additional features and advantages of the utility model will be set forth in the description which follows, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a schematic perspective view of an embodiment of the present utility model.
Fig. 2 is a schematic view of an installation structure of a clamping mechanism according to an embodiment of the utility model.
Fig. 3 is a schematic structural diagram of a lifting mechanism according to an embodiment of the utility model.
Fig. 4 is a schematic structural view of a cartridge according to an embodiment of the present utility model.
Fig. 5 is a schematic structural diagram of a driving mechanism according to an embodiment of the present utility model.
Fig. 6 is a schematic structural view of the clamping structure in a horizontal state when the embodiment of the utility model works.
In the figure: 1. a first sensor; 2. a sliding seat; 3. a rotating shaft; 4. a clamping block; 5. a magazine; 6. a wafer; 7. fixing the substrate; 8. a lifting member; 9. jacking the air cylinder; 10. a driving wheel; 11. a vertical detection sensor; 12. a level detection sensor; 13. an electric sliding table; 14. a light shielding sheet; 15. a second sensor; 16. a helical gear engagement member; 17. a driven shaft; 18. driven wheel; 19. a motor; 41. a first clamping groove; 42. a second clamping groove; 51. a material placing groove; 52. a lower opening; 53. an upper opening; 81. a lifting plate; 82. a support block; 821. and a support groove.
Detailed Description
The following describes specific embodiments of the present utility model with reference to the drawings.
As shown in fig. 1 and 2, the wafer exchange device of the present embodiment includes a lifting mechanism, a clamping mechanism, a conveying mechanism, and a magazine 5 located at a unloading position and a loading position, respectively, wherein:
the transport mechanism comprises a slide seat 2 for moving between a discharge position and a cartridge 5 of a loading position;
The clamping mechanism comprises two clamping blocks 4 which are bilaterally symmetrical, the two clamping blocks 4 are respectively arranged on the vertical plate of the sliding seat 2 through a rotating shaft 3, each clamping block 4 is of a central symmetrical structure, a plurality of first clamping grooves 41 and second clamping grooves 42 are respectively arranged on two sides of the clamping mechanism along the length direction, and the first clamping grooves 41 and the second clamping grooves 42 take the axle center of the rotating shaft 3 as the symmetrical center;
The clamping mechanism further comprises a driving mechanism which drives the two rotating shafts 3 to synchronously and reversely rotate, so that the clamping machine is in a horizontal or vertical state; the first clamping grooves 41 and the second clamping grooves 42 of the two clamping blocks 4 are respectively in a bilateral symmetry state in the horizontal state, and the first clamping grooves 41 of the two clamping blocks 4 are in bilateral one-to-one correspondence to form a plurality of first clamping positions, or the second clamping grooves 42 are in bilateral one-to-one correspondence to form a plurality of second clamping positions; the vertical state and the horizontal state form an included angle of 90 degrees, the diameter of the wafer to be clamped is smaller than the distance between the two clamping blocks 4 in the vertical state and larger than the distance between the two clamping blocks 4 in the horizontal state;
The material boxes 5 for unloading and loading are horizontally arranged at intervals and are positioned below the clamping mechanism;
The structure of the lifting mechanism comprises a lifting cylinder 9, and a lifting piece 8 is arranged at the top end of a piston rod of the lifting cylinder 9 and used for conveying wafers between the material box 5 and the clamping mechanism along the vertical direction.
Wherein each first clamping position (second clamping position) is used for supporting one wafer from two sides.
Specifically, the rotating shafts 3 are provided with light shielding sheets 14, and the vertical plates of the sliding seat 2 are respectively provided with a horizontal detection sensor 12 and a vertical detection sensor 11 which are matched with the light shielding sheets 14 at positions close to each rotating shaft 3 and are used for detecting whether the clamping blocks 4 on the rotating shafts 3 are turned in place or not.
Specifically, a vertical plate of the sliding seat 2 is provided with a first sensor 1 for detecting whether the lifting mechanism lifts the wafer in place; a second sensor 15 is also provided for detecting whether the wafer on the clamping mechanism has fallen.
As shown in fig. 3, the structure of the lifting member 8 includes a lifting plate 81, support blocks 82 are symmetrically disposed on the left and right sides of the lifting plate 81, a plurality of support grooves 821 are uniformly distributed on the support blocks 82 along the length direction, the support grooves 821 on the left and right sides form a plurality of support positions in one-to-one correspondence, and each support position is used for supporting one wafer from two sides.
Wherein the width of the lifting member 8 is smaller than the distance between the two clamping blocks 4 in the horizontal state.
As shown in fig. 4, the material box 5 is located on the fixed substrate 7, a plurality of material placing grooves 51 are symmetrically arranged on the left side and the right side in the material box 5, the material placing grooves 51 on the left side and the right side are in one-to-one correspondence to form a plurality of material placing positions, each material placing position is used for fixing one wafer from two sides, an upper opening 53 is arranged at the top end of the material box 5, a lower opening 52 is arranged at the lower end of the material box 5, the width of the lower opening 52 is not greater than the width of the upper opening 53, and the lower opening 52 is used for the lifting plate 81 to pass through.
The distance between two adjacent second clamping positions is the same as the distance between two adjacent first clamping positions, and is the same as the distance between two adjacent supporting positions and the distance between two adjacent material positions.
The sliding seat 2 is installed at the output end of the electric sliding table 13, and the electric sliding table 13 is located on the fixed substrate 7, as shown in fig. 2.
As shown in fig. 5, which is another view of fig. 2, the driving mechanism includes a motor 19, a driving wheel 10, a driven wheel 18, a driven shaft 17 and a bevel gear engagement member 16, wherein an output end of the motor 19 is connected with the driving wheel 10, the driving wheel 10 is connected with the driven wheel 18 through a transmission belt, the driven wheel 18 is connected with an input end in the middle of the driven shaft 17, and output ends on two sides of the driven shaft 17 are respectively connected with two rotating shafts 3 through a group of bevel gear engagement members 16.
The rotating shafts of the two clamping blocks are connected with the driven shaft through the same bevel gear meshing piece, the rotation angles of the two clamping blocks can be ensured to be synchronous, and the rotation directions are always opposite. The motor is connected with the synchronous belt wheel on the bevel gear mounting column to provide power for the clamping mechanism.
The material of the cartridges 5 at the discharge level and the loading level is different. Specifically, the material box of the unloading position is made of PP material and can be used as a carrier with a wafer transmission function between wafer processing equipment; the material box of the material loading position adopts PFA material and can be used for a medicine washing process.
Referring to fig. 1 and 6, the working flow of the wafer exchange device of the present embodiment is as follows:
Initializing a clamping mechanism: the driving mechanism is controlled to synchronously and reversely rotate the two rotating shafts 3, so that the clamping mechanism is in a vertical state, namely, a state rotated by 90 degrees along the direction indicated by an arrow in fig. 6, at the moment, the first clamping groove 41 of each clamping block 4 is positioned at the lower side, and the second clamping groove 42 is positioned at the upper side; the shading sheet 14 on the rotating shaft 3 gives a signal to the vertical detection sensor 11 on the vertical plate of the sliding seat 2, and confirms whether the clamping block is turned in place or not, if so, gives a signal to the next process;
Lifting a wafer: after the clamping blocks are turned over to place, the right lifting cylinder 9 in fig. 6 is started, the lifting piece 8 at the top of the lifting cylinder passes through the lower opening 52 shown in fig. 4, and the wafer 6 in the position level of the right material box 5 (the material box of the unloading level) is lifted upwards through the supporting position formed by the supporting grooves 821 on the supporting blocks 82 at the two sides, and then the wafer 6 is ejected out of the upper opening 53 of the material box 5; because the clamping mechanism is in a vertical state, the distance between the two clamping blocks 4 is larger, the lifted wafer 6 can pass through the space between the two clamping blocks 4, and then the first sensor 1 on the vertical plate of the sliding seat 2 detects whether the lifting air cylinder 9 lifts the wafer 6 in place or not and gives a signal to the next process;
wafer clamping: after the jacking air cylinder is lifted in place, the first sensor 1 sends a signal to the control system, the jacking air cylinder 9 is static, the control driving mechanism synchronously and reversely rotates the two rotating shafts 3 to enable the clamping mechanism to be in a horizontal state, at the moment, the first clamping grooves 41 of the two clamping blocks 4 correspondingly form a first clamping position left and right, then the shading sheet 14 on the rotating shafts 3 sends a signal to the horizontal detection sensor 12 on the vertical plate of the sliding seat 2, whether the clamping blocks are turned in place is confirmed, and if yes, a next procedure signal is given;
After the clamping blocks are turned over in place, the lifting air cylinder 9 is continuously started, the wafer is driven to descend, the lifting piece 8 can pass through between the two clamping blocks 4, the wafer 6 is placed into a first clamping position of the clamping mechanism in the descending process, clamping is completed, then a second sensor 15 on a vertical plate of the sliding seat 2 detects whether the wafer on the clamping mechanism falls off, and then a next process signal is given;
If no wafer drop is detected, the lifting cylinder 9 continues to descend to the bottom of the magazine 5, and the state of the whole device is shown in fig. 6.
Wafer conveying: the sliding seat 2 moves to drive the clamping mechanism and the wafer thereon to move to the upper part of the left material box 5 (the material box for feeding the material);
Unloading a wafer: the left jacking cylinder 9 below the left material box 5 acts, moves upwards and passes through the space between the two 4 clamping mechanisms to lift the wafer, the first sensor 1 senses the wafer, and the left jacking cylinder 9 is static; the clamping mechanism starts to rotate from a horizontal state to a vertical state, after the rotation is completed, the jacking cylinder 9 starts to descend, and the wafer is placed in the left material box, so that the unloading of the wafer is completed.
During practical application, the first clamping position and the second clamping position can be used for clamping the dirty sheets and the clean sheets respectively, the first clamping position is used for clamping the dirty sheets to be cleaned in the left material box for introduction, then the left material box carries the wafer to be cleaned to a cleaning link for cleaning, and after the cleaning is finished, the angle of the rotating shaft is adjusted (rotated by 180 degrees), so that the second clamping grooves of the two clamping blocks are bilaterally symmetrical to form a plurality of second clamping positions, and the clean sheets which are cleaned by the second clamping positions can be used for clamping.
Those of ordinary skill in the art will appreciate that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. The wafer changing device is characterized by comprising a lifting mechanism, a clamping mechanism, a conveying mechanism and a material box (5) respectively positioned at a discharging position and a loading position, wherein:
The conveying mechanism comprises a sliding seat (2) for moving between a discharging position and a feeding position of a material box (5);
The clamping mechanism comprises two clamping blocks (4) which are bilaterally symmetrical, the two clamping blocks (4) are respectively arranged on the vertical plate of the sliding seat (2) through a rotating shaft (3), each clamping block (4) is of a central symmetry structure, a plurality of first clamping grooves (41) and a plurality of second clamping grooves (42) are respectively arranged on two sides of the clamping block (4) along the length direction, and the first clamping grooves (41) and the second clamping grooves (42) take the axle center of the rotating shaft (3) as the symmetry center;
the clamping mechanism further comprises a driving mechanism which drives the two rotating shafts (3) to synchronously and reversely rotate, so that the clamping mechanism is in a horizontal or vertical state;
The first clamping grooves (41) and the second clamping grooves (42) of the two clamping blocks (4) are respectively in a bilateral symmetry state in a horizontal state, and the first clamping grooves (41) of the two clamping blocks (4) are in bilateral one-to-one correspondence to form a plurality of first clamping positions, or the second clamping grooves (42) of the two clamping blocks (4) are in bilateral one-to-one correspondence to form a plurality of second clamping positions;
the vertical state and the horizontal state form an included angle of 90 degrees;
The diameter of the wafer to be clamped is smaller than the distance between the two clamping blocks (4) in the vertical state and larger than the distance between the two clamping blocks (4) in the horizontal state;
The material boxes (5) for unloading and loading are horizontally arranged at intervals and are positioned below the clamping mechanism;
The lifting mechanism is used for conveying the wafer between the material box (5) and the clamping mechanism along the vertical direction.
2. The wafer film changing device according to claim 1, wherein the rotating shafts (3) are provided with light shielding films (14), and the vertical plates of the sliding seats (2) are respectively provided with a horizontal detection sensor (12) and a vertical detection sensor (11) which are matched with the light shielding films (14) at positions close to each rotating shaft (3) and are used for detecting whether the clamping blocks (4) on the rotating shafts (3) are turned in place.
3. The wafer exchange device according to claim 1, wherein a first sensor (1) is provided on a vertical plate of the slide base (2) for detecting whether the lifting mechanism lifts the wafer in place; and a second sensor (15) is also arranged for detecting whether the wafer on the clamping mechanism falls off.
4. The wafer film changer according to claim 1, wherein the lifting mechanism comprises a lifting cylinder (9), a lifting piece (8) is arranged at the top end of a piston rod of the lifting cylinder (9), the structure of the lifting mechanism comprises a lifting plate (81), supporting blocks (82) are symmetrically arranged on the left side and the right side of the lifting plate (81), a plurality of supporting grooves (821) are uniformly distributed on the supporting blocks (82) along the length direction, and the supporting grooves (821) on the left side and the right side are in one-to-one correspondence to form a plurality of supporting positions.
5. The wafer changer according to claim 4, wherein the magazine (5) is located on the fixed substrate (7), a plurality of material placing grooves (51) are symmetrically arranged on the left side and the right side in the magazine (5), the material placing grooves (51) on the left side and the right side form a plurality of material placing levels in a one-to-one correspondence manner, an upper opening (53) is arranged at the top end of the magazine (5), a lower opening (52) is arranged at the lower end of the magazine, the width of the lower opening (52) is not greater than the width of the upper opening (53), and the lower opening (52) is used for the lifting plate (81) to pass through.
6. The wafer handling device of claim 5, wherein a pitch of two adjacent second clamping locations is the same as a pitch of two adjacent first clamping locations and is the same as a pitch of two adjacent support locations and a pitch of two adjacent placement locations.
7. Wafer handling device according to claim 5, characterized in that the slide holder (2) is mounted at the output of an electric slide table (13), the electric slide table (13) being located on the stationary base plate (7).
8. Wafer handling device according to claim 4, characterized in that the width of the lifting element (8) is smaller than the distance between the two clamping blocks (4) in the horizontal state.
9. Wafer handling device according to claim 1, characterized in that the cassettes (5) located in the unloading and loading positions are of different materials.
10. The wafer film changer according to claim 1, wherein the driving mechanism comprises a motor (19), a driving wheel (10), a driven wheel (18), a driven shaft (17) and a bevel gear meshing piece (16), the output end of the motor (19) is connected with the driving wheel (10), the driving wheel (10) is connected with the driven wheel (18) through a driving belt, the driven wheel (18) is connected with the input end in the middle of the driven shaft (17), and the output ends on two sides of the driven shaft (17) are respectively connected with the two rotating shafts (3) through a group of bevel gear meshing pieces (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322947316.9U CN221282067U (en) | 2023-11-01 | 2023-11-01 | Wafer changing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322947316.9U CN221282067U (en) | 2023-11-01 | 2023-11-01 | Wafer changing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221282067U true CN221282067U (en) | 2024-07-05 |
Family
ID=91701097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322947316.9U Active CN221282067U (en) | 2023-11-01 | 2023-11-01 | Wafer changing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221282067U (en) |
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2023
- 2023-11-01 CN CN202322947316.9U patent/CN221282067U/en active Active
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