CN221270818U - Device for cleaning wafer polishing pad and wafer polishing equipment - Google Patents

Abstract

The utility model discloses a device for cleaning a wafer grinding pad and wafer grinding equipment, wherein the device comprises: a cleaning cloth; the cleaning cloth is arranged on the rotating platform, the rotating platform is switched between a first position and a second position through rotation, the cleaning cloth arranged on the rotating platform is attached to the surface to be cleaned of the wafer grinding pad in the first position so as to clean the surface to be cleaned, and the rotating platform is away from the wafer grinding pad together with the cleaning cloth arranged on the rotating platform in the second position.

Description

Device for cleaning wafer polishing pad and wafer polishing equipment

Technical Field

The present utility model relates to the field of semiconductor wafer production, and more particularly, to a device for cleaning a wafer polishing pad and a wafer polishing apparatus.

Background

For the production of semiconductor wafers, it is generally necessary first to draw a crystal bar with a crystal pulling furnace, then to cut the crystal bar into a plurality of crystal bar segments, then to cut each crystal bar segment into a sheet-like starting wafer by means of, for example, multi-wire cutting, and then to subject the starting wafer to grinding, rinsing and possibly epitaxy, etc., so that a finished wafer is obtained.

For polishing of wafers, polishing is typically accomplished using a wafer polishing apparatus. Wafer polishing equipment typically includes a polishing pad against which a wafer is pressed and relative motion is imparted to the polishing pad to effect polishing of the wafer. During the polishing process of the wafer, particles such as crystal particles or impurities on the wafer, which are polished to leave the wafer, remain and accumulate on the polishing pad, and when such particles accumulate to a certain extent, adverse effects on the polishing of the wafer, such as dents, are left on the polished wafer, and thus the yield of the wafer is reduced. Therefore, the polishing pad needs to be cleaned at regular time to remove the particles on the polishing pad, so as to ensure the normal polishing process.

At present, the cleaning of polishing pad is accomplished mainly through the manual work utilizes the cleaning brush, and such cleaning method is time-consuming and laborious, has led to the usable period of wafer grinding equipment to reduce, has increased manufacturing cost, and in addition, granule on the polishing pad also can cause the pollution to the cleaning brush, at present with once every month's cleaning frequency to cleaning brush under the circumstances, can lead to the clean ability decline of cleaning brush or can no longer realize the effective cleaning to the polishing pad, can lead to the degree aggravation that the polishing pad was polluted by the granule because of cleaning brush's cleanness even.

Disclosure of utility model

In order to solve the above technical problems, it is desirable to provide a device for cleaning a wafer polishing pad and a wafer polishing apparatus, which can avoid the problems of time and effort consuming for manual cleaning, thereby improving the usable period of the wafer polishing apparatus, reducing the production cost, and avoiding the problems of cleaning capacity degradation and even aggravation of the degree of pollution of the wafer polishing pad caused by pollution of a brush.

The technical scheme of the utility model is realized as follows:

in a first aspect, an embodiment of the present utility model provides an apparatus for cleaning a wafer polishing pad, the apparatus comprising:

A cleaning cloth;

The cleaning cloth is arranged on the rotating platform, the rotating platform is switched between a first position and a second position through rotation, the cleaning cloth arranged on the rotating platform is attached to the surface to be cleaned of the wafer grinding pad in the first position so as to clean the surface to be cleaned, and the rotating platform is away from the wafer grinding pad together with the cleaning cloth arranged on the rotating platform in the second position.

In the device for cleaning a wafer polishing pad according to the above embodiment of the present utility model, firstly, cleaning of the wafer polishing pad is automatically achieved by rotation of the rotating platform, so that the problem that manual cleaning is time-consuming and labor-consuming is avoided, the usable period of the wafer polishing apparatus is increased, and the production cost is reduced.

Preferably, the wafer polishing pad is circular, and the cleaning of the wafer polishing pad is achieved by rotating the wafer polishing pad relative to the cleaning cloth, and in the first position, the dimension of the cleaning cloth in the radial direction of the wafer polishing pad is equal to the radius of the wafer polishing pad.

In this way, the wafer polishing pad itself can be utilized to rotate to obtain the relative motion between the cleaning cloth and the wafer polishing pad, so that the device is prevented from being added with components for driving the rotating platform to move relative to the wafer polishing pad, and the cost of the device is saved.

Preferably, the apparatus further comprises a water jet disposed on the rotating platform, the water jet configured to spray water onto the surface to be cleaned of the wafer polishing pad during switching of the rotating platform from the second position to the first position.

In this way, it is realized that water is sprayed on the wafer polishing pad in advance before the wafer polishing pad is cleaned, so that the cleaning process is facilitated to be completed, and the water spraying is completed in the switching process, that is, the cleaning cloth arranged on the rotating platform is not adhered to the surface to be cleaned of the wafer polishing pad, so that the water can be sprayed to the whole surface to be cleaned, or the water spraying is not interfered or interfered by the cleaning cloth.

Preferably, the apparatus further comprises a cleaning mechanism for cleaning the cleaning cloth provided on the rotating platform when the rotating platform is rotated to the first position.

The cleaning mechanism is used for cleaning the cleaning cloth, so that the problem that the cleaning capacity of the cleaning cloth is reduced or the cleaning cloth can not be used for effectively cleaning the wafer polishing pad any more is avoided, and the cleaning of the cleaning cloth is completed when the rotating platform is at the second position, namely, the position away from the wafer polishing pad is completed, so that the cleaning cloth can be prevented from interfering or interfering with the wafer polishing pad, or the cleaning liquid can be prevented from being sputtered to the wafer polishing pad under the condition that the cleaning cloth is cleaned by using the cleaning liquid, so that the wafer polishing pad is damaged.

Preferably, the cleaning mechanism includes:

A pressurizing container for containing a cleaning liquid and pressurizing the cleaning liquid;

And a nozzle provided on the pressurized container for spraying the pressurized cleaning liquid to the cleaning cloth.

Preferably, the apparatus further comprises:

a weighing mechanism for weighing the cleaning cloth which has been cleaned by the cleaning mechanism;

and a replacement mechanism for replacing the overweight cleaning cloth having a weight exceeding the reference weight with a new cleaning cloth.

Because the cleaning cloth is difficult to clean to be suitable for continuous use, the cleaning cloth still contains a large amount of impurity particles after being cleaned, and the contained impurity particles cause the weight of the cleaning cloth to be increased, the following judgment can be accomplished by weighing the cleaning cloth: whether the cleaning cloth is polluted or not reaches the degree that the cleaning cloth can not be recovered to the degree that the wafer grinding pad can be effectively cleaned even if the cleaning is performed.

Preferably, the change mechanism comprises a conveyor belt for conveying the overweight cleaning cloth away from the rotating platform, the conveyor belt also being used for conveying the new cleaning cloth to the rotating platform.

Preferably, the device further comprises a storage box in which the new cleaning cloth is stored.

Preferably, the nozzle is configured to spray the cleaning liquid in a scattering manner to spray the cleaning liquid throughout the cleaning cloth.

In a second aspect, an embodiment of the present utility model provides a wafer polishing apparatus, including:

a wafer polishing pad for polishing a wafer;

The apparatus according to the first aspect.

Drawings

FIG. 1 is a schematic front view of an apparatus for cleaning a wafer polishing pad according to an embodiment of the present utility model;

FIG. 2 is a schematic top view of the device of FIG. 1;

FIG. 3 is a schematic top view of an apparatus according to another embodiment of the utility model;

FIG. 4 is a schematic front view of an apparatus according to another embodiment of the utility model;

FIG. 5 is a schematic front view of an apparatus according to another embodiment of the utility model;

fig. 6 is a perspective view of a wafer polishing apparatus according to an embodiment of the present utility model.

Detailed Description

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 in combination with fig. 2, an apparatus 10 for cleaning a wafer polishing pad 20 is provided in an embodiment of the present utility model, the wafer polishing pad 20 is schematically illustrated in fig. 1 by a dot-filled box, and the apparatus 10 may include:

a cleaning cloth 100, as schematically shown by the cross-hatched box in fig. 1;

The rotating table 200 is arranged on the rotating table 200, the rotating table 200 being switched by rotation between a first position and a second position, as is shown in particular in fig. 1, the rotating table 200 being rotatable about the rotation axis X so as to be rotatable in a first position, which is shown by a solid line, and to be rotatable in a second position, which is shown by a broken line, in addition to the rotating table 200 being schematically shown in fig. 1 by a double arrow around the rotation axis X, in particular by rotation in two directions opposite to each other, the rotating table 200 being switched between the first position and the second position, in particular by rotation in a single direction, in fig. 1, in such a way that the rotating table 200 is rotatable in a clockwise direction or in a counter-clockwise direction, and the polishing pad 200 is arranged on the surface of the polishing table 100 in a second position, as is shown by a solid line 20, in the first position, and in a polishing pad 20, if the rotating table 200 is rotatable in a clockwise direction from the first position to the second position, as is shown by rotation of the solid line, and the polishing pad 200 is arranged in the first position, as is arranged in the polishing pad 100, and the polishing pad 20, in the polishing pad 20.

In the apparatus 10 for cleaning the wafer polishing pad 20 according to the above embodiment of the present utility model, firstly, cleaning of the wafer polishing pad 20 is automatically achieved by rotation of the rotating platform 200, so that the problem of time and effort consuming for manual cleaning is avoided, the available period of the wafer polishing apparatus is improved, the production cost is reduced, secondly, cleaning cloth 100 is used instead of a brush for cleaning, and since the cleaning cloth 100 is less susceptible to contamination by particles on the wafer polishing pad 20 than the brush, the problem that the brush may be contaminated, resulting in a decrease in cleaning ability and even an increase in the degree of contamination of the wafer polishing pad 20 is avoided, and finally, since the rotating platform 200 can switch between the first position for cleaning the wafer polishing pad 20 and the second position away from the wafer polishing pad 20, not only cleaning of the wafer polishing pad 20 can be achieved, but also interference or interference to such a setting process is not generated when the wafer is required to be set on the wafer polishing pad 20 so as to complete polishing of the wafer.

As particularly shown in fig. 1, the rotating platen 200 may be disposed on a rotating shaft 200S and suspended perpendicularly outwardly with respect to the rotating shaft 200S, and the rotating shaft 200S or the rotating axis X may be perpendicular to the wafer polishing pad 20, so that the cleaning cloth 100 disposed on the rotating platen 200 is facilitated to be adhered to the surface 21 to be cleaned of the wafer polishing pad 20, and the rotating platen 200 and the cleaning cloth 100 are facilitated to be spaced apart from the wafer polishing pad 20 as much as possible.

In a preferred embodiment of the present utility model, referring to fig. 2, the wafer polishing pad 20 may be circular, and the cleaning of the wafer polishing pad 20 may be achieved by rotating the wafer polishing pad 20 relative to the cleaning cloth 100, as schematically illustrated by the arrow surrounding the wafer polishing pad 20 in fig. 2, in a first position, i.e., when the rotating platen 200 is in the position shown in solid lines in fig. 2, the dimension of the cleaning cloth 100 in the radial direction of the wafer polishing pad 20 is equal to the radius of the wafer polishing pad 20.

In this way, the wafer polishing pad 20 itself can be rotated to obtain the relative motion between the cleaning cloth 100 and the wafer polishing pad 20, so that the device 10 is prevented from adding components for driving the rotary table 200 to move relative to the wafer polishing pad 20, and the cost of the device 10 is saved.

Typically, water needs to be sprayed onto the wafer polishing pad 20 in advance before the wafer polishing pad 20 is cleaned in order to facilitate the completion of the cleaning process. In this regard, in a preferred embodiment of the present utility model, referring to fig. 3, the apparatus 10 may further include a water jet 300 provided on the rotary stage 200, the water jet 300 being configured such that water WA is sprayed onto the surface 21 to be cleaned of the wafer polishing pad 20 during switching of the rotary stage 200 from the second position to the first position, and in particular, in fig. 3, the rotary stage 200 in both the first and second positions described above is shown by a broken line, while the position of the rotary stage 200 suitable for spraying water during switching is shown by a solid line, and the angle at which the water WA is sprayed is shown.

In this way, it is achieved that water is sprayed onto the wafer polishing pad 20 in advance before the wafer polishing pad 20 is cleaned, so that the cleaning process is facilitated to be completed, and the water spraying is completed during the switching process, that is, the cleaning cloth 100 provided on the rotary table 200 is not adhered to the surface 21 to be cleaned of the wafer polishing pad 20, so that the water W can be sprayed to the entire surface 21 to be cleaned, or the spraying of the water W is not disturbed or interfered by the cleaning cloth 100.

Although the cleaning cloth 100 is less susceptible to contamination by particles on the wafer polishing pad 20 than the brush as described above, contamination of the cleaning cloth 100 is still unavoidable, and thus the cleaning cloth 100 also suffers from a problem that the cleaning ability is lowered or that effective cleaning of the wafer polishing pad 20 is no longer possible. In this regard, in a preferred embodiment of the present utility model, referring to fig. 4, the apparatus 10 may further include a cleaning mechanism 400 for cleaning the cleaning cloth 100 disposed on the rotating platform 200 when the rotating platform 200 is rotated to the second position, and in particular, in fig. 4, the rotating platform 200 in the second position and the cleaning cloth 100 disposed on the rotating platform 200 are shown by solid lines, while the rotating platform 200 in the first position and the cleaning cloth 100 disposed on the rotating platform 200 are shown by broken lines.

By cleaning the cleaning cloth 100 by the cleaning mechanism 400, the problem that the cleaning ability of the cleaning cloth 100 is lowered or the cleaning of the wafer polishing pad 20 is not performed effectively is avoided, and the cleaning of the cleaning cloth 100 is performed while the rotating platform 200 is at the second position, that is, at a position away from the wafer polishing pad 20, so that the interference or the interference with the wafer polishing pad 20 can be avoided, or the cleaning liquid can be prevented from being sputtered to the wafer polishing pad 20, for example, in the case of cleaning the cleaning cloth 100 by the cleaning liquid, thereby causing damage to the wafer polishing pad 20.

In a preferred embodiment of the present utility model, still referring to fig. 4, the cleaning mechanism 400 described above may include:

a pressurizing container 410, the pressurizing container 410 being for accommodating the cleaning liquid CL and pressurizing the cleaning liquid CL;

A nozzle 420 provided on the pressurized container 410, the nozzle 420 for spraying the pressurized cleaning liquid CL to the cleaning cloth 100.

As described above, although the cleaning cloth 100 can be cleaned by the cleaning mechanism 400, after the cleaning cloth 100 cleans the wafer polishing pad 20 a plurality of times, the cleaning cloth 100 cannot be restored to the effect that the wafer polishing pad 20 can be cleaned effectively, or particles that pollute the cleaning cloth 100 are difficult to remove from the cleaning cloth 100 by cleaning. In this regard, in a preferred embodiment of the present utility model, referring to FIG. 5, the apparatus 10 may further comprise:

A weighing mechanism 500, the weighing mechanism 500 being used for weighing the cleaning cloth 100 which has been cleaned by the cleaning mechanism 400;

and a replacement mechanism 600, wherein the replacement mechanism 600 is used for replacing the overweight cleaning cloth 110 with a new cleaning cloth 120.

Because the cleaning cloth 100 is difficult to clean to be suitable for continued use, it is shown that a large amount of impurity particles remain after being cleaned, and the contained impurity particles cause an increase in the weight of the cleaning cloth 100, the following determination can be made by weighing the cleaning cloth 100: whether the cleaning cloth 100 is contaminated or not reaches a level at which the cleaning cloth 100 cannot be restored to enable effective cleaning of the wafer polishing pad 20 even if cleaning is performed.

Specifically, for example, in the case where the initial weight of the cleaning cloth 100 is 32.875, the above-mentioned reference weight may be set to be 20% larger than the initial weight of the cleaning cloth 100, that is, the reference weight is 32.875 × (1+20%) = 39.45, that is, when the actual weight of the cleaning cloth 100 weighed by the weighing mechanism 500 is greater than 39.45, the cleaning cloth is actually the above-mentioned overweight cleaning cloth 110, and the replacing mechanism 600 replaces the overweight cleaning cloth 110 with a new cleaning cloth 120.

In a preferred embodiment of the present utility model, the exchange mechanism 600 may comprise a conveyor belt, not shown in detail in the drawings, for transporting the overweight cleaning cloth 110 away from the rotating platform 200, and for transporting a new cleaning cloth 120 to the rotating platform 200, as will be readily appreciated in connection with fig. 5.

In a preferred embodiment of the utility model, the device 10 may also comprise a storage box, not shown in detail in the drawings, in which a new cleaning cloth 120 is stored.

In a preferred embodiment of the present utility model, referring to fig. 4, the nozzle 420 may be configured to spray the cleaning liquid CL in a scattering manner to spray the cleaning liquid CL to the entire cleaning cloth 100.

Referring to fig. 6, the embodiment of the present utility model further provides a wafer polishing apparatus 1, and the wafer polishing apparatus 1 may include:

a wafer polishing pad 20 for polishing the wafer W;

The device 10 according to the previous embodiments of the present utility model.

As shown in fig. 6, the wafer polishing apparatus 1 may further include: a polishing head 30 for holding a wafer W via a pad 40; and a rotary table 50 to which the wafer polishing pad 20 is attached. The polishing head 30 is provided with a rotation mechanism for rotating the polishing head 30, and a movement mechanism for translating the polishing head 30 relative to the rotation table 50, as schematically shown by a horizontal arrow in fig. 2. In the wafer polishing apparatus 1, the polishing head 30 presses the surface to be polished (i.e., the surface opposite to the polishing head 30) of the wafer W against the wafer polishing pad 20 attached to the upper surface of the rotary platen 50 while holding the wafer W, and as schematically shown by a vertical arrow in fig. 6, the polishing head 30 is rotated together with the rotary platen 50, whereby the polishing head 30 and the rotary platen 50 are relatively moved, and only the surface to be polished of the wafer W is subjected to chemical mechanical polishing while the polishing liquid PL is supplied from the polishing liquid supply member 60.

Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present utility model should be included in the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims (10)

1. An apparatus for cleaning a wafer polishing pad, the apparatus comprising:

A cleaning cloth;

The cleaning cloth is arranged on the rotating platform, the rotating platform is switched between a first position and a second position through rotation, the cleaning cloth arranged on the rotating platform is attached to the surface to be cleaned of the wafer grinding pad in the first position so as to clean the surface to be cleaned, and the rotating platform is away from the wafer grinding pad together with the cleaning cloth arranged on the rotating platform in the second position.

2. The apparatus of claim 1, wherein the wafer polishing pad is circular, and cleaning of the wafer polishing pad is achieved by rotation of the wafer polishing pad relative to the cleaning cloth, in the first position, a dimension of the cleaning cloth in a radial direction of the wafer polishing pad is equal to a radius of the wafer polishing pad.

3. The apparatus of claim 1, further comprising a water jet disposed on the rotating platform, the water jet configured to spray water onto the surface to be cleaned of the wafer polishing pad during switching of the rotating platform from the second position to the first position.

4. The apparatus of claim 1, further comprising a cleaning mechanism for cleaning the cleaning cloth disposed on the rotating platform when the rotating platform is rotated to the second position.

5. The apparatus of claim 4, wherein the cleaning mechanism comprises:

A pressurizing container for containing a cleaning liquid and pressurizing the cleaning liquid;

And a nozzle provided on the pressurized container for spraying the pressurized cleaning liquid to the cleaning cloth.

6. The apparatus of claim 4, wherein the apparatus further comprises:

a weighing mechanism for weighing the cleaning cloth which has been cleaned by the cleaning mechanism;

and a replacement mechanism for replacing the overweight cleaning cloth having a weight exceeding the reference weight with a new cleaning cloth.

7. The apparatus of claim 6, wherein the change mechanism comprises a conveyor belt for transporting the overweight cleaning cloth away from the rotating platform, the conveyor belt further for transporting the new cleaning cloth to the rotating platform.

8. The device of claim 7, further comprising a storage box in which the new cleaning cloth is stored.

9. The apparatus of claim 5, wherein the nozzle is configured to spray the cleaning liquid in a scattering manner to spray the cleaning liquid throughout the cleaning cloth.

10. A wafer polishing apparatus, characterized in that the wafer polishing apparatus comprises:

a wafer polishing pad for polishing a wafer;

the device according to any one of claims 1 to 9.