TWM628841U - Wafer Frame Cleaning System - Google Patents

Abstract

This new creation is about a wafer frame cleaning system. The new creation is mainly based on the cleaning of the wafer frame by using a water jet cutter. At the same time, the spraying range of the water jet can be adjusted to a larger extent due to the nozzle adjustment. The adjustment range can eliminate many dead spots, and at the same time, under moderate pressure adjustment, the wafer frame will not be deformed or damaged by "hardness". And it can save the cumbersome configuration and process of scraping with a scraper, which is more economical and convenient, and the powerful cleaning through water jet is cleaner. And with a brush cleaning unit, through the balance of softness and cleaning degree, for example, the material of the brush can be one or more of cloth wheel, brush wheel, grinding wheel or sponge, to improve cleaning and cleaner.

Description

Wafer Frame Cleaning System

This novel creation relates to an auxiliary equipment for wafer process, especially a wafer frame cleaning system.

In the semiconductor wafer manufacturing process, a wafer frame (Wafer Frame) will be used to place and fix the wafer during the wafer cutting and grinding process, and a support tape (or film) will be attached to prevent the wafer from being cut. , slip off during the grinding process, and after use, the support tape can be cleaned through the cleaning process before it can be used again.

For such cleaning of the wafer frame, the applicant once proposed a "wafer frame retrieval and cleaning system and method" on November 22, 2017, which was approved as an invention patent No. I628731. At that time, the applicant stated in the specification regarding the prior art that "because the planning of the dicing route is usually to obtain rectangular or square dies, the diced wafer will have excess dicing residues, such as those located on the edge of the wafer. Irregular shapes. In consideration of material recovery, these excess remnants must be recovered for reuse in wafer fabrication. Therefore, wafer dicing remnants adhered to support tape must first be separated from the wafer frame and then self-supporting The tape is removed for packaging and recycling. In addition, the separated wafer frame can also be cleaned and reused. Regarding... the separation of the support tape and the wafer frame is generally performed manually.... This method is very inefficient, And it is quite labor-intensive and cost-intensive....Most of the process is manually removed, and the hands of such removal are The segment is also very inefficient, and also consumes manpower and costs.”

In response to the aforementioned problems, the applicant further developed the patent for invention No. I628731, and in the patent for invention I628731, according to the description, the cleaning work referred to is performed by a cleaning mechanism, and the cleaning mechanism includes a first platform, There is a horizontal support surface for supporting the wafer frame; a scraper has a blade edge and is configured so that the blade edge part is close to the horizontal support surface of the first platform, so that the blade edge part can properly contact the wafer the surface of the frame for scraping work.

Although the invention has substantial effects, the applicant, based on continuous research and development, believes that other alternative works and systems can also be adopted to avoid the scraping work when the blade is brought into contact with the surface of the wafer frame at the same time. Hard damage occurs to the wafer frame.

In view of the foregoing, the inventors of the present invention believe that there should be an improved system, and provide a wafer frame cleaning system for cleaning a wafer frame, including a machine main body, and the machine main body includes a frame loading a unit for receiving the wafer frame; a frame conveying unit for forming a conveying connection with the frame loading unit for receiving the wafer frame; a cleaning unit for cleaning the wafer frame, the cleaning unit The frame conveying unit is allowed to pass through, and a first water jet cleaning unit and a second water jet cleaning unit are arranged at intervals along the path of the frame conveying unit; a frame retrieval unit forms a conveying connection with the cleaning unit , which is characterized in that a brush cleaning unit is arranged between the first water jet cleaning unit and the second water jet cleaning unit in the path of the frame conveying unit. Thereby, the wafer frame is placed in the frame loading unit; then the wafer frame is transported to the frame transporting unit through the transportable connection between the frame loading unit and the frame transporting unit; then the wafer frame is transported to the frame transporting unit. The circular frame passes through the first water jet cleaning unit of the cleaning unit In the step of cleaning, most of the barcode and residual glue on the wafer frame can be stripped first; the wafer frame is further cleaned by the wheel brush cleaning unit of the cleaning unit, so as to improve the cleaning and make it cleaner. And cooperate with a brush cleaning unit, through the balance between softness and cleaning degree, for example, the material of the brush can be one or more combination of cloth wheel, brush wheel, grinding wheel or sponge to improve cleaning and cleaner. The wafer frame is cleaned again by the second water jet cleaning unit of the cleaning unit; air-dried or dried; and then the frame retrieval unit and the cleaning unit form a conveying connection to retrieve the wafer frame.

The new model adopts the wheel brush cleaning unit itself to rotate at high speed, generate more friction to contact the surface of the wafer frame, and at the same time cooperate with the water flow to increase cutting force, dirt metabolism and maintain working temperature. glue residue on the surface. For example, the wafer frame is made of stainless steel, and the glue is a soft resin. The material of the brush wheel can be selected from a material that is harder than the glue but softer than the frame.

The principle of the new creation through the water jet cutter is to squeeze the water flow with high pressure, so it has a strong cleaning effect. Although the water jet technology is not unique to this case (and this case is not purely based on water jet), it can be used for wafer frame cleaning under proper process configuration. At the same time, the spray range of water jet can be adjusted due to nozzle adjustment. The large adjustment range can eliminate many dead spots, and at the same time, under moderate pressure adjustment, the wafer frame will not be deformed or damaged by "hardness". And it can save the cumbersome configuration and process of scraping with a scraper, which is more economical and convenient, and the powerful cleaning through water jet is cleaner.

And through the cleaning of the first water jet cleaning unit and the second water jet cleaning unit, the effect of the bar code set on the wafer frame that can be recognized by the sensor can not only avoid manual removal during the recycling process, but also cooperate with the wheel. The brush cleaning unit can further overcome the hardness of the glue residue after drying and remove the glue residue.

(1): The main body of the machine

(2): Frame loading unit

(3): Frame conveying unit

(31): Working section

(311): Turn the wheel

(4): Cleaning unit

(41): The first water jet cleaning unit

(42): Wheel brush cleaning unit

(43): Second water jet cleaning unit

(5): Frame retrieval unit

(6): Wafer frame

The first picture is a schematic diagram of the new creative structure

The second figure is a three-dimensional view of the new creative structure

The third figure is a schematic side view of the new creation

The fourth figure is a three-dimensional schematic diagram of the wafer frame

The fifth figure is a schematic diagram of the new creative work section

The sixth figure is the flow chart of the new creation

The following describes the structure, features and embodiments of the novel creation with the help of the drawings, so that your reviewers can have a further understanding of the novel creation.

Please refer to the first figure, in conjunction with the second and third figures, the present invention relates to a wafer frame cleaning system, which is used for cleaning the wafer frame (6) as shown in the fourth figure, and the cleaning operation is mainly It is the work of removing the support tape attached to the wafer frame (6).

The new creation system mainly includes a machine main body (1), the machine main body (1) includes: a frame loading unit (2); for receiving the wafer frame (6); press, the wafer frame ( 6) Mainly in the semiconductor packaging process, it can be used to carry and frame wafers, while providing handling. After use, the wafer frame (6) can be cleaned according to a consistent automated process, or taken over by the frame loading unit (2). A frame conveying unit (3): forms a conveying connection with the frame loading unit (2) to receive the wafer frame (6); the conveying connection can be automatically moved by a conveyor belt or a robotic arm. equipment to be carried out. A cleaning unit (4): used for cleaning the wafer frame (6), the cleaning unit (4) allows the frame conveying unit (3) to pass through, and is provided with first water at intervals in the path of the frame conveying unit A knife cleaning unit (41), a wheel brush cleaning unit (42), the wheel brush cleaning unit (42) considers the balance between softness and cleaning degree, and the wheel brush material can be one of cloth wheel, brush wheel, grinding wheel or sponge Or a combination of two or more to enhance cleaning and make it cleaner. and a second water jet cleaning unit (43); the new model adopts the wheel brush cleaning unit (42) itself to perform high-speed rotation, generate more frictional force to contact the surface of the wafer frame, and at the same time cooperate with water flow to increase cutting force, Dirt metabolism and maintenance of working temperature take advantage of the characteristics of different materials to take away the residual glue on the surface. For example, the wafer frame is made of stainless steel, and the glue is a soft resin. The material of the brush wheel can be selected from a material that is harder than the glue but softer than the frame.

In addition, the principle of the water jet cutter is to squeeze the water flow with high pressure, so it has a strong cleaning effect. Although the water jet technology is not unique to this case (and this case is not purely based on water jet), it can be used to clean the wafer frame under proper process configuration. At the same time, the spray range of the water jet can be adjusted by the nozzle. It has a large adjustment range and can eliminate many dead spots. At the same time, under the moderate pressure adjustment, the wafer frame will not be deformed or damaged by "hardness". Thereby, the chance of replacing the wafer frame can be reduced and the speed relative to the throughput can be improved. A frame retrieving unit (5) forms a conveying connection with the cleaning unit (3) for receiving the wafer frame (6).

Please refer to Fig. 5, which is a better embodiment of the present invention. Since the main body of the wafer frame (6) is a hollow ring body, the frame conveying unit (3) can be used in the corresponding cleaning unit (4). each working area (the first water jet cleaning unit (41), the wheel brush cleaning unit (42) and the first water jet cleaning unit (41) Two water jet cleaning units (43)), each of which can form a working section (31), and each working section (31) is provided with a plurality of locking rollers (311) along the ring body of the wafer frame (6). , the plurality of locking rollers (311) can be set up and down, and the wafer frame (6) is clamped and locked. And the wafer frame (6) is partially corresponding to the flushing or brushing of the first water jet cleaning unit (41), the wheel brush cleaning unit (42) and the second water jet cleaning unit (43).

The operation steps of the new creation, as shown in the sixth figure, at least include the following steps:

1. Place the wafer frame (6) on the frame loading unit (2);

2. By means of the transportable connection between the frame loading unit (2) and the frame transporting unit (3), the wafer frame (6) is transported to the frame transporting unit (3):

3. The wafer frame (6) is preliminarily cleaned by the first water-jet cleaning unit (41) of the cleaning unit (4); and based on the consideration of solubility and cleaning degree, the first water-jet cleaning unit of the novel creation (41) Tap water, pure water or various acid-base agents or solvents can be added to the water jet in (41), and most of the barcodes and residual glue on the wafer frame (6) can be peeled off first;

4. The wafer frame (6) is further cleaned by the wheel brush cleaning unit (42) of the cleaning unit (4); the wheel brush cleaning unit (42) considers the balance between softness and cleaning degree, and the wheel brush material can be cloth. One or more of wheel, brush wheel, grinding wheel or sponge are combined to improve cleaning and cleanliness.

5. The wafer frame (6) is cleaned again through the second water jet cleaning unit (43) of the cleaning unit (4); similarly and based on the consideration of cleaning at the final end to ensure no contamination and no residue, the The water jet in the second water jet cleaning unit (43) can be cleaned with tap water, pure water, or by adding various acid-base agents or solvents for the second cleaning;

6. After air drying or drying;

7. The frame retrieval unit (5) and the cleaning unit (3) form a transportable connection to retrieve the crystal. Round frame (6).

To sum up, the new creation does meet the positive requirements for patentability, and there are no negative requirements for non-patentability, so a patent application can be filed in accordance with the law. However, all the equal changes made according to the scope of the patent application for this new type of creation belong to the scope of the subject matter of this case.

(1): The main body of the machine

(2): Frame loading unit

(3): Frame conveying unit

(4): Cleaning unit

(41): The first water jet cleaning unit

(42): Wheel brush cleaning unit

(43): Second water jet cleaning unit

(5): Frame retrieval unit

Claims (4)

A wafer frame cleaning system is used for cleaning a wafer frame, including a machine main body, the machine main body includes a frame loading unit for receiving the wafer frame; a frame conveying unit, and the frame carrying unit The input unit forms a conveying connection for receiving the wafer frame; a cleaning unit is used for cleaning the wafer frame, the cleaning unit allows the frame conveying unit to pass through, and is arranged at intervals in the path of the frame conveying unit There are a first water jet cleaning unit and a second water jet cleaning unit; a frame retrieval unit, which forms a conveying connection with the cleaning unit, characterized in that the first water jet cleaning unit in the path of the frame conveying unit is connected to the A brush cleaning unit is arranged between the second water jet cleaning units. The wafer frame cleaning system according to claim 1, wherein the frame conveying unit forms a working section in each working area corresponding to the cleaning unit, and each working section is along the ring of the wafer frame The body is provided with multiple control wheels. The wafer frame cleaning system as described in item 2 of the claimed scope, wherein the plurality of control rollers are one set up and one down. According to the wafer frame cleaning system described in item 1 of the claimed scope, the brush material of the brush cleaning unit can be selected from one or a combination of a cloth wheel, a brush wheel, a grinding wheel or a sponge or a combination thereof.

Images