CN221240653U - Backflow preventing device for improving unstable temperature in electric injection cavity - Google Patents
Backflow preventing device for improving unstable temperature in electric injection cavity Download PDFInfo
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- CN221240653U CN221240653U CN202322538248.0U CN202322538248U CN221240653U CN 221240653 U CN221240653 U CN 221240653U CN 202322538248 U CN202322538248 U CN 202322538248U CN 221240653 U CN221240653 U CN 221240653U
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- heat conduction
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- cavity
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- 238000002347 injection Methods 0.000 title claims abstract description 111
- 239000007924 injection Substances 0.000 title claims abstract description 111
- 229910052751 metal Inorganic materials 0.000 claims abstract description 48
- 239000002184 metal Substances 0.000 claims abstract description 48
- 239000000498 cooling water Substances 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 230000017525 heat dissipation Effects 0.000 claims description 40
- 230000002265 prevention Effects 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 239000005388 borosilicate glass Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 239000005368 silicate glass Substances 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 5
- GNKHOVDJZALMGA-UHFFFAOYSA-N [Y].[Zr] Chemical compound [Y].[Zr] GNKHOVDJZALMGA-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- BBTXSTYZFZSWQW-UHFFFAOYSA-N niobium(5+);pentasilicate Chemical compound [Nb+5].[Nb+5].[Nb+5].[Nb+5].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] BBTXSTYZFZSWQW-UHFFFAOYSA-N 0.000 claims description 5
- 239000005365 phosphate glass Substances 0.000 claims description 5
- 230000007306 turnover Effects 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 229910000166 zirconium phosphate Inorganic materials 0.000 claims description 5
- LEHFSLREWWMLPU-UHFFFAOYSA-B zirconium(4+);tetraphosphate Chemical compound [Zr+4].[Zr+4].[Zr+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O LEHFSLREWWMLPU-UHFFFAOYSA-B 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000000087 stabilizing effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 230000007246 mechanism Effects 0.000 abstract description 3
- 230000000903 blocking effect Effects 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 11
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a backflow preventing device for improving unstable temperature in an electric injection cavity, which comprises an electric injection assembly and an electric injection roll shaft, wherein a heat conducting part in the scheme is formed by combining high-efficiency heat conducting parts such as a metal heat conducting frame, a heat conducting silica gel pad and the like, so that the periphery of the inner wall of the electric injection cavity can be quickly radiated, and meanwhile, the situation that heat flows backwards into the electric injection cavity can be effectively prevented, so that the stability of the temperature in the electric injection cavity can be ensured, cooling water for heat conduction can be conveyed into the metal heat conducting frame through a metal heat conducting pipe and an inlet and outlet pipe orifice structure, and the cooling water in the metal heat conducting pipe can be circularly conveyed according to the use condition, so that the heat radiating effect of a heat radiating plate on the inside of the electric injection cavity is enhanced, and the heat radiating plate is matched with the combined structure of a blocking curtain, and a double backflow preventing protection mechanism can be formed, so that the practicability of the device in the technical field of electronics can be improved.
Description
Technical Field
The utility model relates to the technical field of electronics, in particular to a backflow preventing device for improving unstable temperature in an electric injection cavity.
Background
In today's electronic device manufacturing field, the electrical injection process is a critical process step for modulating the properties and characteristics of the material. However, temperature instability during electrical injection has been a concern. Temperature fluctuations of the electronic components may lead to reduced performance, reduced lifetime of the electronic components, and increased manufacturing costs. Conventional temperature control methods often fail to provide adequate accuracy and stability, which creates a need for more efficient, reliable temperature control schemes.
At present, many temperature control systems in the prior art are often too complex, expensive and inflexible to adapt to different process requirements, and in addition, some temperature control systems may not respond in time under rapidly changing process conditions, resulting in temperature instability. Accordingly, there is a need for a simple and efficient apparatus that accurately maintains a stable temperature within an electrical injection chamber in real time to ensure reliable operation of electronic devices and components in a variety of application environments.
Disclosure of utility model
This section is intended to outline some aspects of embodiments of the utility model and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section as well as in the description of the utility model and in the title of the utility model, which may not be used to limit the scope of the utility model.
Therefore, the utility model aims to provide the backflow preventing device for improving the instability of the temperature in the electric injection cavity, which can solve the problems of complexity, high cost, inflexibility, untimely response and the like of the traditional temperature control system and ensure the stable operation of electronic equipment in various application environments.
In order to solve the technical problems, the utility model provides a backflow prevention device for improving unstable temperature in an electric injection cavity, which adopts the following technical scheme: the electric injection device comprises an electric injection assembly and an electric injection roller shaft, wherein a plurality of groups of electric injection roller shafts are arranged at the bottom of the electric injection assembly, and a baffle is arranged at one end of the electric injection assembly;
The electric injection assembly comprises an electric injection cavity for stabilizing the temperature in the electric injection cavity and a plurality of groups of heat conduction components, wherein the heat conduction components are arranged around one end of the electric injection cavity.
By adopting the technical scheme, the anti-backflow device for electric injection processing mainly comprises an electric injection assembly, an electric injection roll shaft and a baffle curtain, wherein the baffle curtain is used as an important component of the whole device and is made of high-temperature-resistant soft glass materials, borosilicate glass, zirconium yttrium silicate glass, niobium silicate glass, aluminum borosilicate glass, zirconium phosphate glass and zirconium fluosilicate glass can be selected according to the actual situation of processing, and the arrangement of the baffle curtain can further isolate an electric injection discharge hole of an electric injection cavity, prevent the temperature from being interfered by external factors and ensure the stability of the internal temperature;
According to the scheme, the heat conduction component is additionally arranged around the discharge hole of the electric injection cavity and is formed by combining high-efficiency heat conduction parts such as a metal heat conduction frame and a heat conduction silica gel pad, so that the heat dissipation effect of the heat dissipation plate on the inside of the electric injection cavity can be enhanced, the situation of heat backflow into the inside of the electric injection cavity can be effectively prevented, the stability of the temperature inside the electric injection cavity can be ensured, the metal heat conduction pipes are additionally arranged inside the metal heat conduction frame, the inlet and outlet pipe orifices are additionally arranged at the two ends of the metal heat conduction pipes respectively, cooling water for heat conduction can be conveyed into the metal heat conduction frame, the cooling water inside the metal heat conduction pipes can be circularly conveyed according to the use condition, the heat dissipation effect of the heat dissipation plate on the inside of the electric injection cavity can be enhanced, the combined structure of the baffle is matched, and a dual backflow prevention protection mechanism can be formed, so that the practicability of the device in the electronic technical field can be improved;
This scheme is through the heat conduction board groove of seting up respectively all around in electric injection cavity one end to and the heat dissipation plate of installing additional in connection baffle one side, because of heat dissipation plate and heat conduction board groove structure assorted, can be with the spacing arrangement of a plurality of groups of heat dissipation plate around the inner wall of electric injection cavity, through the heat conduction silica gel pad of laying in metal heat conduction frame one side, because of being transition fit between heat dissipation plate and the heat conduction board groove, can promote and install connection stability between heat dissipation plate and the heat conduction board groove, this heat dissipation plate still can play good heat conduction effect to electric injection cavity inner wall, through the spacing cardboard of installing additional in limit side baffle one end side, and the spacing draw-in groove of seting up in limit baffle one end bottom, because of spacing draw-in groove and spacing cardboard structure assorted, can be with four groups of limit side baffle spacing equipment as a whole, the first fixed orifices of seting up respectively in four corners of electric injection cavity one end, and the second fixed orifices of seting up running through in limit side baffle one end, can be with the equipment for a plurality of holistic group of limit side baffle connection fix when electric injection cavity one end with the same time, can also install the heat conduction board and install the heat conduction plate and install the heat conduction device in the heat conduction device with the heat conduction board, can also install the heat conduction device through the connection on the heat conduction board and the connection device of filling up the heat conduction device and can be had the heat conduction device to the change the side through the heat conduction device to the side.
Optionally, the electricity is injected into the one end of cavity and is offered the electricity and pour into the discharge gate into, the electricity is injected into the one end that the cavity is close to the electricity and is poured into the discharge gate into all around and has been offered the heat-conducting plate groove into, the electricity is injected into the one end four corners that the cavity is close to the electricity and is poured into the discharge gate into and still offered first fixed orifices respectively.
Through adopting above-mentioned technical scheme, this scheme is through heat conduction board groove and first fixed orifices of seting up all around in electric injection cavity one end for the dismouting of heat conduction part is connected.
Optionally, the heat conduction part includes the connection baffle, the heat dissipation plate is installed to one side of connection baffle, heat dissipation plate and heat conduction plate groove structure phase-match, be transition fit between heat dissipation plate and the heat conduction plate groove.
Through adopting above-mentioned technical scheme, this scheme is through the heat dissipation plate that installs additional in connection baffle one side, because of heat dissipation plate and heat-conducting plate groove structure assorted, can be with the spacing settling of a plurality of groups heat dissipation plate around the inner wall of electricity injection cavity.
Optionally, the connection retaining member includes the limit side shield, one side mid-mounting of limit side shield has two sets of spacing sleeves, the one end of side shield has still run through and has seted up the second fixed orifices, the second fixed orifices is the same with first fixed orifices structure.
Through adopting above-mentioned technical scheme, this scheme is through the second fixed orifices of seting up in limit side baffle one end run through, because of the second fixed orifices is the same with first fixed orifices structure, can be with the equipment be a holistic a plurality of groups limit side baffle connect fix in the electricity injection cavity one end simultaneously, can also play spacing baffle's effect to the heat dissipation plate of being connected at the heat conduction plate inslot portion of inserting.
Optionally, limit clamping plate is installed to one side of the one end that the limit side baffle is close to the second fixed orifices, limit clamping groove has been seted up to one end bottom that the limit side baffle kept away from the second fixed orifices, limit clamping groove and limit clamping plate structure phase-match, be joint cooperation between limit clamping groove and the limit clamping plate.
Through adopting above-mentioned technical scheme, this scheme is through the spacing cardboard of installing additional in limit side baffle one end one side to and the spacing draw-in groove of seting up in limit side baffle one end bottom, because of spacing draw-in groove and spacing cardboard structure assorted, can be with four limit side baffle spacing equipment as a whole.
Optionally, the heat dissipation plate includes metal heat conduction frame, heat conduction silica gel pad has been laid to one side of metal heat conduction frame.
Through adopting above-mentioned technical scheme, this scheme is through the heat conduction silica gel pad of laying in metal heat conduction frame one side, because of being transition fit between heat dissipation plate and the heat conduction board groove, when can promote to insert connection stability between heat dissipation plate and the heat conduction board groove, this heat dissipation plate can also play good heat conduction effect to the electric injection cavity inner wall.
Optionally, the inside of metal heat conduction frame has seted up the installation cavity, the internally mounted of installation cavity has the metal heat pipe, the business turn over mouth of pipe that is used for cooling water circulation is still installed respectively at the both ends of metal heat pipe, business turn over mouth of pipe and limit sleeve structure phase-match.
Through adopting above-mentioned technical scheme, this scheme is through the metal heat pipe that installs additional in metal heat conduction frame inside to and the business turn over mouth of pipe that installs additional respectively at metal heat conduction pipe both ends, can carry the inside to metal heat conduction frame with the cooling water that is used for heat conduction, can also carry out the circulation to the inside cooling water of metal heat pipe and carry out the transportation processing according to the service condition, so as to strengthen the radiating effect of radiating plate to the electricity injection cavity inside.
Optionally, the curtain is made of a high-temperature-resistant soft glass material, and the high-temperature-resistant soft glass material is borosilicate glass, zirconium yttrium silicate glass, niobium silicate glass, aluminum borosilicate glass, zirconium phosphate glass or zirconium fluosilicate glass.
Through adopting above-mentioned technical scheme, the curtain in this scheme is made by high temperature resistant soft glass material, and its material can select borosilicate glass, zirconium yttrium silicate glass, niobium silicate glass, aluminium borosilicate glass, zirconium phosphate glass and fluosilicate zirconium glass according to the actual conditions of processing, and the setting of curtain can further keep apart the electricity and pour into the electricity of electric injection cavity into the discharge gate into, prevents that the temperature from receiving external factor's interference, has guaranteed the stability of inside temperature.
In summary, the present utility model includes at least one of the following beneficial effects:
1. According to the scheme, the heat conduction component is additionally arranged around the discharge hole of the electric injection cavity and is formed by combining high-efficiency heat conduction parts such as a metal heat conduction frame and a heat conduction silica gel pad, so that the heat dissipation effect of the heat dissipation plate on the inside of the electric injection cavity can be enhanced, the situation of heat backflow into the inside of the electric injection cavity can be effectively prevented, the stability of the temperature inside the electric injection cavity can be ensured, the metal heat conduction pipes are additionally arranged inside the metal heat conduction frame, the inlet and outlet pipe orifices are additionally arranged at the two ends of the metal heat conduction pipes respectively, cooling water for heat conduction can be conveyed into the metal heat conduction frame, the cooling water inside the metal heat conduction pipes can be circularly conveyed according to the use condition, the heat dissipation effect of the heat dissipation plate on the inside of the electric injection cavity can be enhanced, the combined structure of the baffle is matched, and a dual backflow prevention protection mechanism can be formed, so that the practicability of the device in the electronic technical field can be improved;
2. This scheme is through the heat conduction board groove of seting up respectively all around in electric injection cavity one end to and the heat dissipation plate of installing additional in connection baffle one side, because of heat dissipation plate and heat conduction board groove structure assorted, can be with the spacing arrangement of a plurality of groups of heat dissipation plate around the inner wall of electric injection cavity, through the heat conduction silica gel pad of laying in metal heat conduction frame one side, because of being transition fit between heat dissipation plate and the heat conduction board groove, can promote and install connection stability between heat dissipation plate and the heat conduction board groove, this heat dissipation plate still can play good heat conduction effect to electric injection cavity inner wall, through the spacing cardboard of installing additional in limit side baffle one end side, and the spacing draw-in groove of seting up in limit baffle one end bottom, because of spacing draw-in groove and spacing cardboard structure assorted, can be with four groups of limit side baffle spacing equipment as a whole, the first fixed orifices of seting up respectively in four corners of electric injection cavity one end, and the second fixed orifices of seting up running through in limit side baffle one end, can be with the equipment for a plurality of holistic group of limit side baffle connection fix when electric injection cavity one end with the same time, can also install the heat conduction board and install the heat conduction plate and install the heat conduction device in the heat conduction device with the heat conduction board, can also install the heat conduction device through the connection on the heat conduction board and the connection device of filling up the heat conduction device and can be had the heat conduction device to the change the side through the heat conduction device to the side.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of an electrical injection assembly according to the present utility model;
FIG. 3 is a schematic view of the structure of the electric injection cavity of the present utility model;
FIG. 4 is a schematic view showing the separation of the heat conducting components of the present utility model;
FIG. 5 is a schematic view of a connecting block according to the present utility model;
FIG. 6 is a schematic view of a heat dissipating plate according to the present utility model;
fig. 7 is a schematic structural diagram of a metal heat conduction pipe according to the present utility model.
Reference numerals illustrate: 100. an electrical injection assembly; 101. an electric injection cavity; 101a, electric injection and discharge ports; 101b, a heat conducting plate groove; 101c, a first fixing hole; 102. a heat conductive member; 102a, a connection stop; 102a-1, side guards; 102a-1a, a limiting clamping plate; 102a-1b, a limit clamping groove; 102a-2, a limiting sleeve; 102a-3, a second fixing hole; 102b, a heat dissipating plate; 102b-1, a metal heat conducting frame; 102b-1a, a mounting cavity; 102b-1b, a metal heat pipe; 102b-1c, inlet and outlet nozzles; 102b-2, a thermally conductive silicone pad; 200. an electric injection roller shaft; 300. a curtain.
Detailed Description
The utility model is described in further detail below with reference to fig. 1-7.
Referring to fig. 1-3, the present utility model discloses a backflow prevention device for improving temperature instability in an electric injection cavity,
The electric injection device comprises an electric injection assembly 100 and an electric injection roll shaft 200, wherein a plurality of groups of electric injection roll shafts 200 are arranged at the bottom of the electric injection assembly 100, and a baffle 300 is arranged at one end of the electric injection assembly 100;
The electric injection assembly 100 comprises an electric injection cavity 101 for stabilizing the temperature in the electric injection cavity and heat conducting components 102, wherein a plurality of groups of heat conducting components 102 are arranged around one end of the electric injection cavity 101.
An electric injection discharging hole 101a is formed in one end of the electric injection cavity 101, heat conducting plate grooves 101b are formed in the periphery of one end, close to the electric injection discharging hole 101a, of the electric injection cavity 101, first fixing holes 101c are formed in four corners of one end, close to the electric injection discharging hole 101a, of the electric injection cavity 101, and the heat conducting plate grooves 101b and the first fixing holes 101c are formed in the periphery of one end of the electric injection cavity 101 and are used for dismounting and connecting of the heat conducting component 102.
Referring to fig. 4-5, in order to solve the problems of complexity, high cost, inflexibility, untimely response, and the like of the existing temperature control system and ensure stable operation of the electronic device in various application environments in this embodiment, based on the same concept as that of the first embodiment, the backflow prevention device for improving temperature instability in the electric injection cavity further includes:
The heat conducting part 102 comprises a connecting baffle 102a, a heat radiating plate 102b is installed on one side of the connecting baffle 102a, the heat radiating plate 102b is matched with the structure of the heat conducting plate groove 101b, the heat radiating plate 102b is in transition fit with the heat conducting plate groove 101b, and a plurality of groups of heat radiating plates 102b can be limited and arranged around the inner wall of the electric injection cavity 101 due to the fact that the heat radiating plate 102b is matched with the structure of the heat conducting plate groove 101b through the heat radiating plate 102b additionally installed on one side of the connecting baffle 102 a.
The connecting baffle 102a comprises a side baffle plate 102a-1, two groups of limiting sleeves 102a-2 are arranged in the middle of one side of the side baffle plate 102a-1, one end of the side baffle plate 102a-1 is also provided with a second fixing hole 102a-3 in a penetrating mode, the second fixing hole 102a-3 is identical to the first fixing hole 101c in structure, and the second fixing hole 102a-3 is provided with the second fixing hole 102a-3 in a penetrating mode at one end of the side baffle plate 102a-1, and the second fixing hole 102a-3 is identical to the first fixing hole 101c in structure, so that a plurality of groups of side baffle plates 102a-1 assembled into a whole can be connected and fixed at one end of the electric injection cavity 101, and meanwhile, the limiting baffle plate 102b connected inside the heat conducting plate groove 101b in an inserting mode can be further achieved.
The side baffle 102a-1 is provided with a limit clamping plate 102a-1a at one side close to one end of the second fixing hole 102a-3, the bottom of one end of the side baffle 102a-1 far away from the second fixing hole 102a-3 is provided with a limit clamping groove 102a-1b, the limit clamping groove 102a-1b is matched with the limit clamping plate 102a-1a in structure, the limit clamping groove 102a-1b is matched with the limit clamping plate 102a-1a in a clamping way, and the limit clamping plate 102a-1a additionally arranged at one side of one end of the side baffle 102a-1 and the limit clamping groove 102a-1b arranged at the bottom of one end of the side baffle 102a-1 can limit and assemble the four groups of side baffles 102a-1 into a whole due to the fact that the limit clamping groove 102a-1b is matched with the limit clamping plate 102a-1a in structure.
Referring to fig. 6-7, in order to solve the problems of complexity, high cost, inflexibility, untimely response, and the like of the existing temperature control system and ensure stable operation of the electronic device in various application environments in this embodiment, based on the same concept as that of the first embodiment, the backflow prevention device for improving temperature instability in the electric injection cavity further includes:
The heat dissipation plate 102b comprises a metal heat conduction frame 102b-1, a heat conduction silica gel pad 102b-2 is laid on one side of the metal heat conduction frame 102b-1, and the heat conduction silica gel pad 102b-2 laid on one side of the metal heat conduction frame 102b-1 has a transition fit with the heat conduction plate groove 101b, so that the heat dissipation plate 102b can achieve good heat conduction effect on the inner wall of the electric injection cavity 101 while improving the connection stability of the heat dissipation plate 102b and the heat conduction plate groove 101 b.
The metal heat conduction frame 102b-1 is internally provided with a mounting cavity 102b-1a, the metal heat conduction pipe 102b-1b is arranged in the mounting cavity 102b-1a, two ends of the metal heat conduction pipe 102b-1b are respectively provided with an inlet pipe outlet 102b-1c for cooling water circulation, the inlet pipe outlet 102b-1c is matched with the limit sleeve 102a-2 in structure, cooling water for heat conduction can be conveyed into the metal heat conduction frame 102b-1 through the metal heat conduction pipe 102b-1b additionally arranged in the metal heat conduction frame 102b-1 and the inlet pipe outlet 102b-1c additionally arranged at two ends of the metal heat conduction pipe 102b-1b, and cooling water in the metal heat conduction pipe 102b-1b can be circularly conveyed according to the use condition, so that the heat dissipation effect of the heat dissipation plate 102b on the inside of the electric injection cavity 101 is enhanced.
The baffle 300 in the scheme is made of high-temperature-resistant soft glass materials, and the materials can be borosilicate glass, zirconium yttrium silicate glass, niobium silicate glass, aluminum borosilicate glass, zirconium phosphate glass and zirconium fluosilicate glass according to the actual conditions of processing, and the baffle can further isolate the electric injection discharge port 101a of the electric injection cavity 101, so that the temperature is prevented from being interfered by external factors, and the stability of the internal temperature is ensured.
The above embodiments are not intended to limit the scope of the present utility model, so: all equivalent changes in structure, shape and principle of the utility model should be covered in the scope of protection of the utility model.
Claims (8)
1. The utility model provides an improve electric injection intracavity temperature unstable prevent flowing backward device, includes electric injection subassembly (100) and electric injection roller (200), and a plurality of groups of electric injection roller (200) are installed to the bottom of electric injection subassembly (100), its characterized in that: one end of the electric injection assembly (100) is also provided with a baffle curtain (300);
The electric injection assembly (100) comprises an electric injection cavity (101) for stabilizing the temperature in the electric injection cavity and heat conduction components (102), wherein a plurality of groups of heat conduction components (102) are arranged around one end of the electric injection cavity (101).
2. The backflow prevention device for improving temperature instability in an electrical injection cavity according to claim 1, wherein: an electric injection discharging hole (101 a) is formed in one end of the electric injection cavity (101), heat-conducting plate grooves (101 b) are formed in the periphery of one end, close to the electric injection discharging hole (101 a), of the electric injection cavity (101), and first fixing holes (101 c) are formed in four corners, close to the electric injection discharging hole (101 a), of one end of the electric injection cavity (101).
3. The backflow prevention device for improving temperature instability in an electrical injection cavity according to claim 2, wherein: the heat conduction component (102) comprises a connection baffle (102 a), a heat dissipation plate (102 b) is installed on one side of the connection baffle (102 a), the heat dissipation plate (102 b) is matched with the heat conduction plate groove (101 b) in structure, and the heat dissipation plate (102 b) is in transition fit with the heat conduction plate groove (101 b).
4. A backflow prevention device for improving temperature instability in an electrical injection chamber according to claim 3, wherein: the connecting baffle (102 a) comprises an edge baffle (102 a-1), two groups of limiting sleeves (102 a-2) are mounted in the middle of one side of the edge baffle (102 a-1), one end of the edge baffle (102 a-1) is further provided with a second fixing hole (102 a-3) in a penetrating mode, and the second fixing hole (102 a-3) and the first fixing hole (101 c) are identical in structure.
5. The backflow prevention device for improving temperature instability in an electrical injection chamber of claim 4, wherein: the limit clamping plate (102 a-1 a) is installed on one side of one end, close to the second fixing hole (102 a-3), of the side baffle (102 a-1), a limit clamping groove (102 a-1 b) is formed in the bottom of one end, far away from the second fixing hole (102 a-3), of the side baffle (102 a-1), the limit clamping groove (102 a-1 b) is matched with the limit clamping plate (102 a-1 a) in structure, and the limit clamping groove (102 a-1 b) is in clamping fit with the limit clamping plate (102 a-1 a).
6. The backflow prevention device for improving temperature instability in an electrical injection chamber of claim 5, wherein: the heat dissipation plate (102 b) comprises a metal heat conduction frame (102 b-1), and a heat conduction silica gel pad (102 b-2) is laid on one side of the metal heat conduction frame (102 b-1).
7. The backflow prevention device for improving temperature instability in an electrical injection chamber of claim 6, wherein: the inside of metal heat conduction frame (102 b-1) has seted up installation cavity (102 b-1 a), the internally mounted of installation cavity (102 b-1 a) has metal heat pipe (102 b-1 b), business turn over mouth of pipe (102 b-1 c) that are used for the cooling water circulation are still installed respectively at the both ends of metal heat pipe (102 b-1 b), business turn over mouth of pipe (102 b-1 c) and limit sleeve (102 a-2) structure phase-match.
8. The backflow prevention device for improving temperature instability in an electrical injection chamber of claim 7, wherein: the curtain (300) is made of high-temperature-resistant soft glass material, and the high-temperature-resistant soft glass material is borosilicate glass, zirconium yttrium silicate glass, niobium silicate glass, aluminum borosilicate glass, zirconium phosphate glass or zirconium fluosilicate glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322538248.0U CN221240653U (en) | 2023-09-19 | 2023-09-19 | Backflow preventing device for improving unstable temperature in electric injection cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322538248.0U CN221240653U (en) | 2023-09-19 | 2023-09-19 | Backflow preventing device for improving unstable temperature in electric injection cavity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221240653U true CN221240653U (en) | 2024-06-28 |
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ID=91598035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322538248.0U Active CN221240653U (en) | 2023-09-19 | 2023-09-19 | Backflow preventing device for improving unstable temperature in electric injection cavity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221240653U (en) |
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2023
- 2023-09-19 CN CN202322538248.0U patent/CN221240653U/en active Active
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