CN221239611U

CN221239611U - Signal terminal, power module shell, power module and electronic equipment

Info

Publication number: CN221239611U
Application number: CN202322785460.7U
Authority: CN
Inventors: 胡州; 顾以进; 汪彬彬; 李剑垒; 郭壮
Original assignee: Suzhou Huichuan United Power System Co Ltd
Current assignee: Suzhou Huichuan United Power System Co Ltd
Filing date: 2023-10-17
Publication date: 2024-06-28
Anticipated expiration: 2033-10-17

Abstract

The utility model discloses a signal terminal, a power module shell, a power module and electronic equipment. The signal terminal is at least partially wrapped on the shell and comprises pins and a welding platform, wherein the pins are arranged at an included angle, the pins are provided with limiting grooves, and the shell is provided with limiting protrusions matched with the limiting grooves; the welding platform is provided with a step structure, the shell is provided with an abutting structure, and the abutting structure and the step structure are mutually abutted in the facing direction of the bonding surface of the welding platform. According to the technical scheme, the connection strength between the signal terminal and the shell can be improved, so that ultrasonic energy loss during wire bonding is avoided, and bonding quality is improved.

Description

Signal terminal, power module shell, power module and electronic equipment

Technical Field

The present utility model relates to the field of power module packaging technologies, and in particular, to a signal terminal, a power module housing, a power module, and an electronic device.

Background

Since the advent of IGBT power modules, the use of ac/dc variation and power conversion has been important in the field of electronic power. The wire bonding realizes the connection of the signal terminal electrode and the chip circuit through the metal wire, and based on the process principle of wire bonding, ultrasonic energy can promote the high-frequency vibration friction of the bonding wire attached to the welding platform of the signal terminal, so that the bonding wire is deformed and effectively connected with the welding platform of the signal terminal. Therefore, avoiding ultrasonic energy loss in the bonding process is a precondition to achieving good bonding quality.

In the related art, signal electrons are generally wrapped in a housing, and due to different thermal expansion coefficients of a signal terminal material and a housing material, deformation trends between the signal terminal and the housing are different at high temperature (in the process of curing a sealant), so that layering phenomenon is easy to occur between the signal terminal and the housing, and connection strength between the signal terminal and the housing is affected, and ultrasonic energy loss is serious when wire bonding is caused, so that bonding quality is affected.

Disclosure of utility model

The utility model mainly aims to provide a signal terminal, which aims to improve the connection strength between the signal terminal and a shell so as to avoid ultrasonic energy loss during wire bonding and improve bonding quality.

In order to achieve the above object, the present utility model provides a signal terminal, at least partially wrapped in a housing, the signal terminal comprising:

The pin is provided with a limiting groove, and the shell is provided with a limiting protrusion matched with the limiting groove;

The welding platform is connected to the pins and is arranged at an included angle with the pins, the welding platform is provided with a step structure, the shell is provided with a butt structure, and the butt structure and the step structure are mutually butt-jointed in the facing direction of the bonding surface of the welding platform.

In an embodiment of the present utility model, the two opposite sides of the pin are respectively provided with the limiting groove, the housing is provided with two opposite limiting protrusions, and each of the limiting protrusions is matched with one of the limiting grooves.

In an embodiment of the utility model, the limiting groove is a waist-shaped groove.

In an embodiment of the present utility model, the two opposite sides of the welding platform are respectively provided with the step structures, the housing is provided with two opposite abutting structures, and each abutting structure is abutted with one step structure.

In an embodiment of the present utility model, the step structure is a right-angle step structure;

or the step structure is an oblique angle step structure.

In an embodiment of the utility model, the pin is connected to one side of the soldering platform, and a connection protrusion is disposed on one side of the soldering platform away from the pin, and the connection protrusion is used for being connected with a connection belt.

The utility model also proposes a power module housing comprising:

A housing;

The signal terminal is at least partially wrapped on the shell and comprises pins and a welding platform, wherein the pins are arranged at an included angle;

The pin is provided with a limiting groove, and the shell is provided with a limiting protrusion matched with the limiting groove; the welding platform is provided with a step structure, the shell is provided with an abutting structure, and the abutting structure and the step structure are mutually abutted in the facing direction of the bonding surface of the welding platform.

In an embodiment of the utility model, a protruding encapsulation structure is arranged at the front end of the shell, which is close to the connecting protrusion of the welding platform, and the connecting protrusion part is wrapped on the protruding encapsulation structure.

In an embodiment of the present utility model, the bottom of the raised encapsulation structure is provided with a relief slope.

The utility model also provides a power module, which comprises the power module shell.

The utility model also provides electronic equipment comprising the power module.

In the signal terminal provided by the utility model, when the signal terminal is at least partially wrapped in the shell, the pins of the signal terminal are provided with the limiting grooves, and the welding platform of the signal terminal is provided with the step structure; like this, in the injection molding process, after the plastic envelope material solidification, the position of spacing recess and step structure can be filled to molten soft plastic to be formed with the spacing arch of complex with it in the spacing recess, and be formed with the butt structure with it butt on the step structure, alright make signal terminal firmly wrapped up in the casing, effectively promoted the joint strength between signal terminal and the casing, ultrasonic energy loss when having avoided the wire bonding, thereby promoted bonding quality.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an embodiment of a power module housing according to the present utility model;

FIG. 2 is an enlarged view of a portion of an embodiment of a power module housing according to the present utility model;

FIG. 3 is a schematic diagram of a signal terminal in an embodiment of a power module housing according to the present utility model;

Fig. 4 is a schematic structural diagram of a signal terminal in another embodiment of a power module housing according to the present utility model.

Reference numerals illustrate:

Reference numerals	Name of the name	Reference numerals	Name of the name
				100	Power module housing	22	Welding platform
10	Shell body	22a	Bonding surface
				11	Raised rubber coating structure	221	Step structure
111	Avoidance ramp	221a	Right-angle step structure
				20	Signal terminal	221b	Bevel step structure
21	Pin	23	Connection protrusion
				211	Limiting groove

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present utility model, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.

In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.

The present utility model proposes a signal terminal 20, which aims to improve the connection strength between the signal terminal 20 and the housing 10, so as to avoid ultrasonic energy loss during wire bonding, thereby improving bonding quality.

The specific structure of the signal terminal 20 of the present utility model will be described below:

Referring to fig. 1 to 3 in combination, in an embodiment of the signal terminal 20 of the present utility model, the signal terminal 20 is at least partially wrapped around the housing 10, the signal terminal 20 includes a lead 21 and a soldering land 22 disposed at an angle, the lead 21 partially extends out of the housing 10, and a bonding surface 22a of the soldering land 22 is exposed out of the housing 10; wherein, the pin 21 is provided with a limit groove 211, and the shell 10 is provided with a limit protrusion (not shown) matched with the limit groove 211; the soldering land 22 is provided with a step structure 221, and the housing 10 is provided with an abutment structure (not shown), the abutment structure and the step structure 221 being in abutment with each other in the facing direction of the bonding surface 22a of the soldering land 22.

It can be understood that, in the signal terminal 20 according to the present utility model, when the signal terminal 20 is at least partially wrapped around the housing 10, since the pin 21 of the signal terminal 20 is provided with the limit groove 211, and the welding platform 22 of the signal terminal 20 is provided with the step structure 221; like this, in the injection molding process, after the plastic envelope material solidification, the molten soft plastic can fill to the position of spacing recess 211 and step structure 221 to be formed with the spacing arch of cooperation with it in the spacing recess 211, and be formed with the butt structure of butt with it on the step structure 221, alright make signal terminal 20 firmly wrap up in casing 10, effectively promoted the joint strength between signal terminal 20 and the casing 10, avoided the ultrasonic energy loss when wire bonding, thereby promoted bonding quality.

In the present embodiment, a portion of the pins 21 protruding out of the housing 10 is used for accessing the control circuit; the bonding surface 22a of the bonding pad 22 is used to interconnect with a wire through a wire bonding process.

In the practical application process, the pins 21 and the soldering lands 22 are vertically disposed, or may be disposed at an acute angle or an obtuse angle, which is not limited herein.

In some embodiments, the pin 21 may include a first connection section connected to the soldering lands 22 and wrapped in the housing 10, and a second connection section connected to an end of the first connection section remote from the soldering lands 22 and protruding out of the housing 10. In order to improve the connection strength between the pin 21 and the housing 10, the cross-sectional area of the first connection section may be larger than that of the second connection section, and the contact area between the first connection section and the housing 10 may be increased, so that the connection strength between the pin 21 and the housing 10 is improved.

In practical applications, the pin 21 may be provided with one or at least two limit grooves 211, and correspondingly, the housing 10 may be provided with one or at least two limit protrusions matching with the limit grooves.

In practical applications, the welding platform 22 may be provided with one or at least two step structures 221, and correspondingly, the housing 10 may be provided with one or at least two abutting structures abutting with the step structures.

In practical applications, the step structure 221 may be disposed on the bonding surface 22a of the welding platform 22, or may be disposed on a side surface of the welding platform 22 adjacent to the bonding surface 22a, so long as the abutment structure and the step structure 221 can abut against each other in the facing direction of the bonding surface 22 a.

Further, referring to fig. 3 and 4 in combination, in an embodiment of the signal terminal 20 of the present utility model, two opposite sides of the pin 21 are provided with a limiting groove 211, and the housing 10 is provided with two opposite limiting protrusions, each of which is matched with one of the limiting grooves 211.

So set up, all be provided with spacing recess 211 through the both sides at pin 21 back to, at the in-process of moulding plastics, after the plastic envelope material solidification, molten soft plastic can fill in the spacing recess 211 of pin 21 both sides to all be formed with the spacing arch with it in two spacing recesses 211, can make signal terminal 20 by more firmly wrap up in casing 10 under two spacing recess 211 and two spacing bellied cooperation, can further promote the joint strength between signal terminal 20 and the casing 10.

In the practical application process, the limiting groove 211 may be a rectangular groove, a waist-shaped groove, a right-angle groove, or the like.

Further, referring to fig. 3 and 4 in combination, in an embodiment of the signal terminal 20 of the present utility model, the limiting groove 211 is a waist-shaped groove; in this way, after the plastic packaging material is solidified in the injection molding process, the molten soft plastic can be better filled into the limit groove 211, so as to avoid the problem that the molten soft plastic is difficult to fill the limit groove 211, and the connection strength between the signal terminal 20 and the housing 10 is affected.

Further, referring to fig. 3 and 4 in combination, in an embodiment of the signal terminal 20 of the present utility model, two opposite sides of the soldering platform 22 are respectively provided with a step structure 221, and the housing 10 is provided with two opposite abutting structures, each abutting structure abuts against one step structure 221.

So set up, through all being provided with step structure 221 in the both sides that welding platform 22 was facing away from, in the in-process of moulding plastics, after the plastic envelope material solidification, molten soft plastic can fill to the step structure 221 of welding platform 22 both sides on to all be formed with the butt structure with it on two step structures 221, can make signal terminal 20 by more firmly parcel in casing 10 under the mutual butt of two step structures 221 and two butt structures, can further promote the joint strength between signal terminal 20 and the casing 10.

Further, referring to fig. 3 in combination, in one embodiment, the step structure 221 is a right-angle step structure 221a; in this way, after the plastic package material is solidified in the injection molding process, the molten soft plastic can be filled on the right-angle step structure 221a, so that a right-angle abutting structure abutting against the right-angle step structure 221a is formed on the right-angle step structure 221a, so that the right-angle abutting structure and the right-angle step structure 221a can better abut against each other in the facing direction of the bonding surface 22a, and the signal terminal 20 is firmly wrapped in the housing 10.

Or referring to fig. 4 in combination, in another embodiment, the step structure 221 is an angled step structure 221b; in this way, after the plastic package material is solidified in the injection molding process, the melted soft plastic can be filled on the bevel step structure 221b, so that the bevel step structure 221b is formed with a bevel abutting structure abutting against the bevel step structure, so that the bevel abutting structure and the bevel step structure 221b can better abut against each other in the facing direction of the bonding surface 22a, and the signal terminal 20 is firmly wrapped in the housing 10.

Further, referring to fig. 1, 3 and 4 in combination, in an embodiment of the signal terminal 20 of the present utility model, the pin 21 is connected to one side of the soldering land 22, and a connection protrusion 23 is disposed on a side of the soldering land 22 away from the pin 21, and the connection protrusion 23 is used for connection with a connection tape.

In order to obtain a good positional relationship of the signal terminals 20, the signal terminals 20 are generally arranged in a pin structure, that is, after a plurality of signal terminals 20 are connected together, they are wrapped in the housing 10, so that the connecting protrusions 23 are disposed on the side of the soldering platform 22 away from the pins 21, so that the connecting protrusions 23 are connected with a connecting strip, that is, the plurality of signal terminals 20 can be connected together by using the connecting strip, so as to obtain a good positional relationship of the signal terminals 20.

After the plurality of signal terminals 20 are wrapped around the housing 10, the connection tape needs to be removed by punching.

Referring to fig. 1 to 3, the present utility model further provides a power module housing 100, where the power module housing 100 includes a housing 10 and the signal terminals 20 described above, and the specific structure of the signal terminals 20 refers to the above embodiment, and since the power module housing 100 adopts all the technical solutions of all the embodiments described above, at least the beneficial effects brought by the technical solutions of the embodiments described above are all provided, and will not be described in detail herein.

The signal terminal 20 includes a pin 21 and a welding platform 22, wherein the pin 21 is disposed at an included angle, a portion of the pin 21 extends out of the housing 10, and a bonding surface 22a of the welding platform 22 is exposed out of the housing 10; wherein, the pin 21 is provided with a limit groove 211, and the shell 10 is provided with a limit protrusion (not shown) matched with the limit groove 211; the soldering land 22 is provided with a step structure 221, and the housing 10 is provided with an abutment structure (not shown) which abuts against the step structure 221 in the facing direction of the bonding surface 22 a.

It can be understood that, in the power module housing 100 according to the present utility model, when the signal terminal 20 is at least partially wrapped in the housing 10, since the pin 21 of the signal terminal 20 is provided with the limiting groove 211, the housing 10 is provided with the limiting protrusion matched with the limiting groove 211, the welding platform 22 of the signal terminal 20 is provided with the step structure 221, and the housing 10 is further provided with the abutting structure abutting against the step structure 221; like this, in the injection molding process, after the plastic envelope material solidification, the molten soft plastic can fill to the position of spacing recess 211 and step structure 221 to be formed with the spacing arch of cooperation with it in the spacing recess 211, and be formed with the butt structure of butt with it on the step structure 221, alright make signal terminal 20 firmly wrap up in casing 10, effectively promoted the joint strength between signal terminal 20 and the casing 10, avoided the ultrasonic energy loss when wire bonding, thereby promoted bonding quality.

Further, referring to fig. 3 and 4 in combination, in an embodiment of the power module housing 100 of the present utility model, two opposite sides of the pin 21 are provided with a limiting groove 211, and the housing 10 is provided with two opposite limiting protrusions, each of which is matched with one of the limiting grooves 211.

Further, referring to fig. 3 and 4 in combination, in an embodiment of the power module housing 100 of the present utility model, two opposite sides of the welding platform 22 are provided with step structures 221, and the housing 10 is provided with two opposite abutting structures, each abutting structure abuts against one step structure 221.

Since the plurality of signal terminals 20 are wrapped on the housing 10 and the connecting belt is required to be taken out by punching, in the punching process, the front ends of the signal terminals 20 (the ends of the welding platforms 22 far away from the pins 21) are subjected to shearing stress when the grinding tool is pressed down, so that the front ends of the housing 10 close to the connecting protrusions 23 are subjected to larger stress, and delamination is easy to occur between the front ends of the signal terminals 20 and the housing 10.

Based on this, referring to fig. 1 and 2 in combination, in an embodiment of the power module case 100 of the present utility model, a protrusion encapsulation structure 11 may be provided at a front end of the connection protrusion 23 of the housing 10 near the soldering land 22, so that the connection protrusion 23 is partially wrapped around the protrusion encapsulation structure 11; like this, protruding rubber coating structure 11 can make the extension that casing 10 is close to the front end of connecting protruding 23, can effectively expand the parcel length to signal terminal 20 under the prerequisite of not widening and accept signal terminal 20 crossbeam, help promoting the overall rigidity of casing 10, and the joint strength between casing 10 and the signal terminal 20, in addition, protruding rubber coating structure 11's setting still makes the length of the connecting protruding 23 of signal terminal 20 front end be lengthened, help reducing the stress between signal terminal 20 and the casing 10 in the punching process to the connecting band, can effectively reduce the risk of producing the layering between signal terminal 20 front end and the casing 10, in order to avoid the loss of ultrasonic energy when wire bonding, off-line when wire bonding in the prior art, the virtual weld scheduling anomaly problem has been solved, bonding quality has been promoted.

Further, referring to fig. 2 in combination, in an embodiment of the power module housing 100 of the present utility model, the bottom of the raised encapsulation structure 11 is provided with a relief slope 111.

Because the bottom of protruding encapsulation structure 11 is provided with structures such as chip circuit generally, consequently, through being provided with at the bottom of protruding encapsulation structure 11 and dodging inclined plane 111, can effectively avoid protruding encapsulation structure 11 to interfere with structures such as chip circuit of below.

The utility model also provides a power module, which comprises the power module housing 100 as described above, and the specific structure of the power module housing 100 refers to the above embodiment, and since the power module adopts all the technical solutions of all the embodiments, at least has all the beneficial effects brought by the technical solutions of the embodiments, and will not be described in detail herein.

In some embodiments, the power module may further include a substrate disposed in the power module housing 100, a power device chip disposed in the power module housing 100 and secured to the substrate, a solder structure (e.g., wire or solder) disposed in the power module housing 100 and electrically connecting at least a portion of the signal terminals 20 with the power module chip and/or the substrate, and a cover plate covering the power module housing 100.

Alternatively, the substrate may include a heat dissipation substrate and a copper-clad insulating ceramic substrate fixedly disposed on the heat dissipation substrate; the power device chip is fixedly arranged on the copper-clad insulating ceramic substrate.

Alternatively, the power device chip may be at least one of an insulated gate bipolar transistor (IGBT, insulated Gate Bipolar Transistor) chip, a diode chip, and a MOS transistor chip.

The utility model also provides an electronic device, which comprises the power module, and the specific structure of the power module refers to the above embodiment, and because the electronic device adopts all the technical schemes of all the above embodiments, the electronic device at least has all the beneficial effects brought by the technical schemes of the above embodiments, and the detailed description is omitted herein.

The electronic equipment can be equipment such as new energy automobiles, industrial motors, cameras, mobile phones and the like.

The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.

Claims

1. A signal terminal at least partially encased in a housing, the signal terminal comprising:

2. The signal terminal of claim 1, wherein the opposite sides of the pin are provided with the limit grooves, the housing is provided with two opposite limit protrusions, and each limit protrusion is matched with one limit groove.

3. The signal terminal of claim 1, wherein the limit groove is a waist-shaped groove.

4. The signal terminal of claim 1, wherein the step structures are disposed on opposite sides of the solder land, and the housing is provided with two oppositely disposed abutment structures, each of the abutment structures abutting one of the step structures.

5. The signal terminal of claim 1, wherein the step structure is a right-angle step structure;

or the step structure is an oblique angle step structure.

6. The signal terminal according to any one of claims 1 to 5, wherein the pin is connected to a side of the soldering land, and a side of the soldering land remote from the pin is provided with a connection protrusion for connection with a connection tape.

7. A power module enclosure, comprising:

A housing;

The signal terminal of any one of claims 1 to 6, at least partially wrapped around the housing and comprising pins arranged at an angle and a solder land;

8. The power module housing of claim 7, wherein the opposite sides of the pins are provided with the limit grooves, the housing is provided with two opposite limit protrusions, and each limit protrusion is matched with one limit groove.

9. The power module enclosure of claim 7, wherein the step structures are disposed on opposite sides of the soldering land, and the housing is provided with two oppositely disposed abutment structures, each of the abutment structures abutting one of the step structures.

10. The power module enclosure of claim 7, wherein the front end of the housing adjacent to the attachment boss of the solder platform is provided with a boss encapsulated structure, the attachment boss portion being encapsulated in the boss encapsulated structure.

11. The power module enclosure of claim 10, wherein the bottom of the raised encapsulation structure is provided with a relief ramp.

12. A power module comprising a power module housing as claimed in any one of claims 7 to 11.

13. An electronic device comprising the power module of claim 12.