CN221239090U - Supporting device for microlens reflow and microlens reflow equipment - Google Patents

Abstract

The utility model discloses a supporting device for microlens reflow and microlens reflow equipment. The supporting device for the micro lens backflow comprises a base and a plurality of supporting frames, wherein the supporting frames are uniformly arranged on the base in a circumference, supporting blocks are movably arranged on the supporting frames, the supporting blocks of the supporting frames can jointly support a chip, and the supporting blocks can move on the supporting frames along the circumference in a radial direction so as to adjust the radial supporting space between the supporting blocks. According to the utility model, the supporting blocks are movably arranged on the supporting frame, and the radial length of the chip supported by the supporting blocks can be adjusted by moving the supporting blocks in the radial direction, so that the chips with different sizes can be supported, the applicability of the device is improved, and the cost is reduced.

Description

Supporting device for microlens reflow and microlens reflow equipment

Technical Field

The utility model relates to a supporting device for microlens reflow and microlens reflow equipment, and belongs to the technical field of semiconductor manufacturing equipment.

Background

Photoresist thermal reflow is an important step in the semiconductor process and is used to cure the photoresist during the chip fabrication process to form microstructures. Photoresist thermal reflow is a process of curing the photoresist using a high temperature heat treatment. In the chip manufacturing process, photoresist is coated on the surface of a chip, then the photoresist is exposed and developed by a photoetching machine to form photoresist columns, finally thermal reflux solidification is carried out, the photoresist columns are heated and melted, and the photoresist columns are refluxed to form hemispherical microlenses under the action of surface interfacial tension. During thermal reflow, the chemicals in the photoresist react to form a solid polymer, thereby forming a microstructure. Photoresist thermal reflow has wide application in the field of semiconductor manufacturing, and can be used for manufacturing microchips, optical devices, biochips, and the like.

In the existing microlens chip manufacturing process, a chip is supported and placed in a thermal reflow device by using a support, when the sizes of the support and the chip are not matched, the chip is easy to incline or deviate in the thermal reflow process, so that photoresist is formed unevenly, so that the support with different sizes is often needed to support the chip when the chips with different sizes are subjected to thermal reflow at present, the support stability of the chip is improved, but the method increases the cost of the chip for thermal reflow, and when the chips with different sizes are subjected to thermal reflow, the different supports are needed to be replaced, so that the working procedure is complicated easily, and the thermal reflow efficiency is reduced.

Disclosure of utility model

In view of the shortcomings of the prior art, the utility model aims to provide a supporting device for microlens reflow and a microlens reflow device.

In order to achieve the purpose of the utility model, the technical scheme adopted by the utility model comprises the following steps:

The present utility model provides a supporting device for microlens reflow, comprising: the base and a plurality of support frames, a plurality of the support frames are a circumference evenly set up on the base, the activity is provided with the supporting shoe on the support frame, a plurality of the supporting shoe of support frame can support the chip jointly, just the supporting shoe can be in on the support frame follow the radial movement of circumference is in order to be used for adjusting radial support space between the supporting shoe.

Further, a first slot is formed in the support frame in the radial direction of the circumference, the support block is movably arranged in the first slot, and a locking mechanism is further arranged on the support frame and used for locking the support block at a designated position in the first slot.

Further, a first scale extending along the length direction of the support block is arranged on the support block.

Further, the first slot extends on the support frame along the length direction of the support frame, so that the support block can move on the support frame along the length direction of the support frame.

Further, the support frame is provided with a second graduated scale extending along the length direction of the support frame at the first slotting position.

Further, the locking mechanism comprises a locking groove and a locking pin which are formed on the supporting frame, the locking groove extends on the supporting frame along the axis of the circumference, the locking groove is communicated with the first groove, the locking pin is movably arranged in the locking groove, and the locking pin moves in the locking groove to be abutted to or separated from the supporting block.

Further, one end of the supporting block supporting the chip is provided with an inclined triangular prism structure, a side edge of the triangular prism structure is opposite to the center of the base, and the side edge of the triangular prism structure is in point contact with the chip.

Further, the support frame is provided with a plurality of support blocks along the circumferential axial direction.

Further, at least one of the support frames is movably engaged with the base and is movable on the base in a radial direction of the circumference.

The utility model also provides a micro-lens reflow device, which comprises an oven and any one of the supporting devices for the micro-lens reflow, wherein the oven comprises an inner cavity for the lens reflow, and the base and the supporting frame are arranged in the inner cavity.

Compared with the prior art, the utility model has the advantages that:

(1) According to the utility model, the supporting blocks are movably arranged on the supporting frame, and the radial length of the chip supported by the supporting blocks can be adjusted by moving the supporting blocks in the radial direction, so that the chips with different sizes can be supported, the applicability of the device is improved, and the cost is reduced.

(2) The utility model realizes point contact with the chip through the triangular prism structure, can reduce the contact area between the chip surface and the supporting block to the greatest extent, effectively keeps the chip surface clean, and ensures the uniformity of backflow.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to the drawings without inventive effort to those skilled in the art.

FIG. 1 is a schematic view showing the structure of the apparatus in embodiment 1 of the present utility model;

FIG. 2 is a top view of the support chip in example 1;

Fig. 3 is a schematic view of the structure with a plurality of support blocks in embodiment 1;

FIG. 4 is a partial cross-sectional view of the base and support frame of example 1;

Fig. 5 is a partial cross-sectional view of the oven of example 2 of the present utility model.

Reference numerals illustrate:

100. A base; 200. a support frame; 201. a first shaft body; 202. a second shaft body; 203. a screw cap; 210. a support block; 211. a first scale; 212. a triangular prism structure; 220. a first slot; 230. a second scale; 240. a locking mechanism; 241. a locking groove; 242. a locking pin; 300. an oven; 310. an inner cavity; 320. a temperature display button; 330. a switch button; 400. and a chip.

Detailed Description

In view of the shortcomings in the prior art, the inventor of the present utility model has long studied and practiced in a large number of ways to propose the technical scheme of the present utility model. The technical scheme, the implementation process, the principle and the like are further explained as follows.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways than those described herein, and therefore the scope of the present utility model is not limited to the specific embodiments disclosed below.

In addition, in the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "horizontal", "vertical", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present specification, reference to the term "one embodiment," "an embodiment," "the embodiment," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The technical scheme, the implementation process and the principle thereof are further explained with reference to the attached drawings.

Example 1

Referring to fig. 1 to 4, a support device for reflow of a micro lens includes a base 100 and a plurality of support frames 200, wherein the plurality of support frames 200 are uniformly disposed on the base 100 along a circumference, support blocks 210 are movably disposed on the support frames 200, the support blocks 210 of the plurality of support frames 200 can jointly support a chip 400, and the support blocks 210 can move on the support frames 200 along a radial direction along the circumference, so as to adjust a radial support space between the support blocks 210.

In this embodiment, the base 100 may be a disc structure, when in use, the base 100 is placed along a horizontal direction, the plurality of supporting frames 200 are uniformly mounted on the top end surface of the base 100 in a circumferential shape, and the circumferential axis surrounded by the plurality of supporting frames 200 and the axis of the base 100 may be coaxially arranged, so that the base 100 is more stable for supporting the supporting frames 200, wherein the number of the supporting frames 200 may be three or four, the specific number of the supporting frames may be set according to factors such as thickness and weight of the supported chip 400, the implementation is illustrated by four supporting frames 200, the supporting frames 200 may be an axle structure, the supporting frames 200 are upwardly arranged along a vertical direction, the four supporting frames 200 enclose an accommodating space, when the chip 400 is supported by the supporting frames 400, the chip 400 is placed in the accommodating space along a horizontal direction, the supporting blocks 210 are movably arranged on each supporting frame 200, and a part of the supporting blocks 210 extend into the accommodating space, when the chip 400 is placed in the accommodating space, the supporting blocks 210 on the four supporting frames 200 may support the chip 400, so that the suspended chip 400 may be in the same plane as the accommodating space and the chip 400 is in a horizontal plane as the same as the supporting frame 400.

In addition, the supporting blocks 210 on each supporting frame 200 can move along the radial direction of the circumference enclosed by the four supporting frames 200 (namely the radial direction of the supported chip 400 or the radial direction of the base 100) so as to adapt to supporting chips 400 with different sizes, when the chip 400 with larger size needs to be supported, the supporting blocks 210 on the supporting frames 200 are moved outwards along the radial direction of the base 100, so that the parts of the supporting blocks 210 extending into the accommodating space are reduced, and therefore, the chip 400 with larger size can be supported. When it is required to support the chip 400 of a smaller size, the support blocks 210 on the support frame 200 are moved inward in the radial direction of the base 100, thereby increasing the portion of the support blocks 210 protruding into the receiving space, and thus the chip 400 of a smaller size can be supported. When the support blocks 210 support the chip 400, the support blocks 210 of the four support frames 200 may clamp side edges of the chip 400 to clamp and support the chip 400 in the receiving space, or directly put the chip 400 above the support blocks 210 so that the support blocks 210 contact with bottom edges of the chip 400 to support the chip 400.

In the above-mentioned structure, through being provided with supporting shoe 210 on support frame 200 activity, radial length that supporting shoe 210 supported chip 400 can be adjusted to radial removal supporting shoe 210 to can support not unidimensional chip 400, improve the device suitability, use a device can support different chips 400, greatly reduced the cost, in addition, through being circumference distribution with a plurality of support frames 200, improved the stability to chip 400 support, avoid appearing the phenomenon of slope or skew at chip 400, improve the backward flow effect.

Specifically, a first slot 220 is formed in the support frame 200 along a circumferential radial direction, the support block 210 is movably disposed in the first slot 220, the support frame 200 is further provided with a locking mechanism 240, and the locking mechanism 240 is used for locking the locking support block 210 at a specified position in the first slot 220. The supporting block 210 may be a rectangular parallelepiped structure, the supporting frame 200 is provided with a first slot 220, the first slot 220 is a rectangular parallelepiped through slot matched with the supporting block 210, the first slot 220 extends along a radial direction of a circumference enclosed by the supporting frames 200, and the supporting block 210 is inserted into the first slot 220 and can move along the first slot 220. The support frame 200 is further provided with a locking mechanism 240, which can lock the support block 210 in the first slot 220, when the support block 210 needs to be moved, the locking mechanism 240 can close the locking of the support block 210, so that the support block 210 can be moved in the first slot 220 at will, when the support block 210 moves to a corresponding position, the locking mechanism 240 can open the locking of the locking mechanism 240 to the locking block, and the support block 210 can be locked in the corresponding position, so that the support block 210 supports the chip 400 with a corresponding size. In this structure, the supporting block 210 is movably disposed in the first slot 220, and the first slot 220 can also play a role in guiding and limiting the supporting block 210, so that the phenomenon that the supporting block 210 is deviated when the supporting block 210 is moved is effectively avoided, and further the supporting of the chip 400 is affected.

In addition, the first slot 220 extends along the circumferential axial direction on the support frame 200, the first slot 220 is a waist-shaped through slot structure formed on the support frame 200, the length extending direction of the first slot is consistent with the axial direction of the support frame 200, the support block 210 can also move along the axial direction of the base 100 while moving along the radial direction of the base 100, so that the support block 210 can move in the vertical direction, the height of the support chip 400 can be adjusted, and when the chip 400 is subjected to thermal reflow, the thermal air circulation effect on the chip 400 can be adjusted by adjusting the height of the support chip 400, thereby improving the reflow surface type effect. In addition, the supporting block 210 can be moved and adjusted in the vertical direction, and can adapt to chips 400 with different thicknesses, thereby further improving the applicability of the device.

Specifically, the locking mechanism 240 includes a locking groove 241 and a locking pin 242 formed on the support frame 200, wherein the locking groove 241 extends on the support frame 200 along a circumferential axis, the locking groove 241 is consistent with the length of the first slot 220, the depth direction of the locking groove 241 is perpendicular to the depth direction of the first slot 220, the locking groove 241 is communicated with the first slot 220, the locking pin 242 is movably disposed in the locking groove 241, and the locking pin 242 moves in the locking groove 241 to abut against or separate from the support block 210, thereby locking and unlocking the support block 210. The support block 210 may move in the axial direction of the base 100 in the first slot 220, and the corresponding locking pin 242 may also move in the axial direction of the base 100 in the locking slot 241, so that the support block 210 may be locked at different heights of the support frame 200. When the support block 210 needs to be moved, the locking pin 242 is moved outwards, so that the locking pin 242 is separated from the support block 210, and unlocking of the support block 210 is achieved. When it is desired to lock the support block 210, the lock pin 242 is moved in the opposite direction so that the lock pin 242 abuts against the support block 210, thereby locking the support block 210. The locking mechanism 240 has a simple structure and is convenient to operate, and can effectively lock the supporting block 210.

Further, since the supporting block 210 can move along the radial direction of the base 100 relative to the supporting frame 200 to adjust the chips 400 adapting to different radial dimensions, the supporting block 210 can also move along the axial direction of the base 100 relative to the supporting frame 200 to adjust the height of the supporting chip 400, so that in order to make the adjustment more accurate, the supporting block 210 is provided with a first scale 211 extending along the length direction thereof, that is, the length direction of the supporting block 210 is provided with a first scale 211, the first scale 211 is provided with a corresponding radial dimension of the chip 400, for example, the first scale 211 is provided with 2 inch, 4 inch, 6 inch, 8 inch scales, etc., and when the chips 400 with different dimensions need to be supported, the supporting block 210 is moved to a corresponding position according to the first scale 211. A second scale 230 extending along the length direction of the support frame 200 is further provided at the first slot 220 of the support frame 200, and the support block 210 can be precisely moved in the vertical direction according to the height of the second scale 230.

Further, the supporting frame 200 is provided with a plurality of supporting blocks 210 in the circumferential axial direction. As shown in fig. 3, the plurality of supporting blocks 210 on each supporting frame 200 are movably disposed in the first slot 220, so that the device can simultaneously support a plurality of chips 400, and the supporting blocks 210 on each plane can be movably adjusted, and can simultaneously support chips 400 with different sizes, thereby greatly improving the heat reflow efficiency of the chips 400 and meeting the requirement of mass production.

Specifically, in the structure in which the support block 210 supports the chip 400, one end of the support block 210 supporting the chip 400 is provided with an inclined triangular prism structure 212, the side edges of the triangular prism structure 212 face the center of the base 100, and the side edges of the triangular prism structure 212 are in point contact with the chip 400. This triangular prism structure 212 is put to one side at supporting shoe 210 to one side, when supporting chip 400, the side edge of triangular prism can block the side periphery department of chip 400 for it is more stable when supporting chip 400, phenomenon such as chip 400 is difficult to take place slope or position deviation, guaranteed the backward flow effect, and supporting shoe 210 realizes the point contact through triangular prism structure 212 and chip 400, can reduce chip 400 surface and supporting shoe 210's area of contact to the maximum extent, the effectual chip 400 surface that keeps is clean, guarantee the homogeneity of backward flow, in addition, the triangular prism structure 212 of putting to one side can also be used for supporting chip 400 of different sizes, the commonality of the device has also been improved.

In addition, at least one support 200 is movably coupled to the base 100 and is movable in a circumferential radial direction on the base 100. In a specific structure, as shown in fig. 4, in the corresponding position of the base 100, a waist-shaped groove extending along the radial direction of the base 100 is formed, the support frame 200 is movably arranged in the waist-shaped groove, the support frame 200 comprises a first shaft body 201 and a second shaft body 202 which are sequentially connected, wherein the diameter of the first shaft body 201 is larger than that of the second shaft body 202, the support block 210 is movably arranged on the first shaft body 201, the second shaft body 202 is movably arranged in the waist-shaped groove of the base 100, the width of the opening of the waist-shaped groove is smaller than that of the first shaft body 201, so that the first shaft body 201 cannot enter the waist-shaped groove, the limiting effect is achieved on the support frame 200, an external thread structure is arranged on the outer surface of the second shaft body 202, a nut 203 is further arranged on the support frame 200, and when the second shaft body 202 passes through the waist-shaped groove of the base 100, the nut 203 is in threaded connection with the second shaft body 202 from below the base 100 and is screwed tightly, so that the support frame 200 is fixed on the base 100. When the support frame 200 needs to be moved, the nut 203 is rotated so that the nut 203 is separated from the base 100, thereby facilitating the movement of the support frame 200. When four support frames 200 on the base 100 support the chip 400, the first support frame 200 is firstly moved outwards along the radial direction of the base 100, the chip 400 is placed on the support blocks 210 of the other three support frames 200, and the support blocks 210 on the support frames 200 and the support blocks 210 on the other three support frames 200 are moved reversely to clamp the chip 400 together, so that the chip 400 is supported more stably, the support frames 200 are arranged in a movable mode, the chip 400 can be more conveniently taken and placed, and the phenomenon that the chip 400 is scratched by the support blocks 210 which are easy to occur when the chip 400 is taken and placed is avoided.

Example 2

Referring to fig. 5, a microlens reflow apparatus includes an oven 300 and a supporting device for reflowing a microlens, the oven 300 includes an inner cavity 310 for reflowing a lens, and a base 100 and a supporting frame 200 are disposed in the inner cavity 310. Through setting up oven 300 and adopting the mode of air heat transfer to flow back for the temperature is more even, has improved the backward flow effect, can avoid adopting the hot plate backward flow in traditional mode because hot plate temperature controllability is relatively poor, the inhomogeneous and low problem of production efficiency of reflow surface type that leads to. When the chip 400 is reflowed, the chip 400 is supported by the supporting blocks 210 on the supporting frame 200, and then the base 100, the supporting frame 200 and the chip 400 are placed together in the inner cavity 310 of the oven 300 for reflow. In addition, the oven 300 is further provided with a temperature display button 320 and a switch button 330, wherein the temperature display button 320 can display the reflux temperature in the inner cavity 310, and can also adjust the temperature, and the switch button 330 controls the start and the stop of the reflux operation.

It should be understood that the above embodiments are merely for illustrating the technical concept and features of the present utility model, and are intended to enable those skilled in the art to understand the present utility model and implement the same according to the present utility model without limiting the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.

Claims (10)

1. A support device for microlens reflow, comprising: the base and a plurality of support frames, a plurality of the support frames are a circumference evenly set up on the base, the activity is provided with the supporting shoe on the support frame, a plurality of the supporting shoe of support frame can support the chip jointly, just the supporting shoe can be in on the support frame follow the radial movement of circumference is in order to be used for adjusting radial support space between the supporting shoe.

2. A support device for microlens reflow as in claim 1, wherein: the support frame is gone up along the radial of circumference is equipped with first fluting, the supporting shoe activity sets up in the first fluting, the support frame still is equipped with locking mechanism, locking mechanism is used for with the supporting shoe locks the appointed position in the first fluting.

3. A support device for microlens reflow as in claim 2, wherein: the support block is provided with a first scale extending along the length direction of the support block.

4. A support device for microlens reflow as in claim 2, wherein: the first slot extends on the support frame along the length direction of the support frame, so that the support block can move on the support frame along the length direction of the support frame.

5. A support device for microlens reflow as in claim 4, wherein: the support frame is equipped with the second scale that extends along the length direction of support frame in first fluting department.

6. A support device for microlens reflow as in any one of claims 2-5, wherein: the locking mechanism comprises a locking groove and a locking pin which are formed on the supporting frame, the locking groove extends on the supporting frame along the axis of the circumference, the locking groove is communicated with the first groove, the locking pin is movably arranged in the locking groove, and the locking pin moves in the locking groove to be propped against or separated from the supporting block.

7. A support device for microlens reflow as in claim 1, wherein: the support block supports the one end of chip is equipped with the triangular prism structure of slope, the side edge of triangular prism structure just right the center of base, just the side edge of triangular prism structure with the chip point contact.

8. A support device for microlens reflow as in claim 1, wherein: the support frame is provided with a plurality of along circumference axial support piece.

9. A support device for microlens reflow as in claim 1, wherein: at least one of the support frames is movably matched with the base and can move on the base along the radial direction of the circumference.

10. A microlens reflow apparatus, comprising: an oven and a support device for microlens reflow of any one of claims 1 to 9, the oven including an interior cavity for lens reflow, the base and the support frame being disposed in the interior cavity.