CN209471934U - The heating dish modular structure of adjustment height - Google Patents

Abstract

The utility model is to provide a kind of heating dish modular structure of adjustment height comprising: heating dish disk body with heating surface and is equipped with multiple centre holes, is equipped with screw base inside each another centre hole；And multiple thimbles, the bottom of each thimble is equipped with spiro tooth part, each spiro tooth part is rotatable to be incorporated into screw base, and the top of each thimble protrudes heating surface and forms spacing when separately combining, and the adjustment of achievable spacing in turn is moved up and down by rotating multiple thimbles.By the implementation of the utility model, best spacing required for capable of can rapidly adjusting out makes different wafers obtain optimal heating efficiency.

Description

The heating dish modular structure of adjustment height

Technical field

The utility model is a kind of heating dish modular structure of adjustment height, especially a kind of applied to manufacture of semiconductor Etching machines or photoresist liquid solidify the heating dish modular structure of the adjustment height with wafer heating dish.

Background technique

With the continuous breakthrough of semiconductor processing technology, the size of electronic component has entered nanometer grade on wafer, makes It is stringenter to the manufacture process requirements of wafer, and for production efficiency, heating dish is usually used in accelerating in manufacture of semiconductor Reaction, such as etching reaction or photoresist liquid curing reaction etc., therefore, the rate of heat addition of heating dish and the hot uniformity are to wafer The quality of follow-up process has a certain impact.

In existing procedure for producing, mode one is placed directly within the heating surface in heating dish for wafer and is heated, this side Formula has optimal heating efficiency and the hot uniformity, however, wafer is directly contacted with heating surface, has the contact surface of wafer and is stained with The possibility of attached impurity, therefore, when more wafers piece is stacked, impurity can be fallen on other wafers.

In order to which the wafer for solving above-mentioned directly contacts and contaminated situation with heating dish, therefore heating dish generallys use Multiple thimbles are supported wafer, and in order to enable wafer to be in the plane of sustained height, multiple thimbles are commonly designed At fixed, however, different wafers, generally requires different heating efficiencies, therefore existing known skill on manufacture processing procedure Art needs replacing different thimbles, to generate different height, causes the inconvenience of production, and therefore, the thimble for improving heating dish is high The design of degree is a technical problem urgently to be resolved.

Summary of the invention

The purpose of the utility model is to overcome the defects of the prior art, and provide a kind of heating disk module of adjustment height Structure, when mainly heating heating dish to different wafers, optimum height required for capable of rapidly adjusting out makes difference Wafer obtain optimal heating efficiency.

It the purpose of this utility model and solves its technical problem and adopts the following technical solutions to realize.

According to the utility model proposes a kind of adjustment height heating dish modular structure comprising: heating dish disk body, With heating surface and multiple centre holes are equipped with, are equipped with screw base inside each another centre hole；And multiple thimbles, each The bottom of thimble is equipped with spiro tooth part, each spiro tooth part is rotatably engaged in screw base, each thimble when separately combining Top protrusion heating surface simultaneously forms spacing, and the adjustment of achievable spacing in turn is moved up and down by rotating multiple thimbles.

It the purpose of this utility model and solves its technical problem also following technical measures can be used to further realize.

The heating dish modular structure of adjustment height above-mentioned, wherein multiple centre hole and multiple thimble are to be set to together On one concentric circles.

The heating dish modular structure of adjustment height above-mentioned, wherein multiple centre hole and multiple thimble be respectively etc. between Away from setting.

The heating dish modular structure of adjustment height above-mentioned, wherein the side of each thimble is equipped at least two adjustment Jack.

The heating dish modular structure of adjustment height above-mentioned, wherein at least two adjustment jack is 180 degree relative to each other Setting.

The heating dish modular structure of adjustment height above-mentioned, wherein the spacing is in 0.05mm between 0.3mm.

The heating dish modular structure of adjustment height above-mentioned is wherein further provided with multiple positioning pins on the heating surface, separately Each positioning pin is to be set on concentric circles and be equally spaced relative to each other.

The heating dish modular structure of adjustment height above-mentioned, wherein the heating dish disk body is further provided with multiple lift pins, Each another lift pin is to be set on concentric circles and be equally spaced relative to each other.

The utility model has clear advantage and beneficial effect compared with prior art.Through the above technical solution, root According to the utility model proposes adjustment height heating dish modular structure, can reach comparable technical progress and practicability, and With the extensive utility value in industry, have at least the following advantages:

1, the spacing of wafer and heating dish can be adjusted on demand.

2, the heating efficiency to wafer can be increased.

3, the thread-changing efficiency of different wafers more exchange device processing procedure can be increased.

The above description is merely an outline of the technical solution of the present invention, in order to better understand the skill of the utility model Art means, and being implemented in accordance with the contents of the specification, and in order to allow the above and other purpose, feature of the utility model It can be more clearly understood with advantage, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.

Detailed description of the invention

Fig. 1 is the embodiment schematic diagram of the heating dish modular structure of the utility model adjustment height；

Fig. 2 is the cross-sectional view of the A-A ' hatching line of Fig. 1；

Fig. 3 is the schematic diagram of the thimble of the heating dish modular structure of the utility model adjustment height；

Fig. 4 A is the thimble of the heating dish modular structure of the utility model adjustment height and the space D 1 that heating dish generates Schematic diagram；And

Fig. 4 B is the thimble of the heating dish modular structure of the utility model adjustment height and the space D 2 that heating dish generates Schematic diagram.

[symbol description]

The heating dish modular structure of 100 adjustment heights

10 heating dish disk bodies

110 heating surfaces

120 centre holes

130 screw bases

140 positioning pins

150 lift pins

20 thimbles

210 spiro tooth parts

220 adjustment jacks

30 wafers

Specific embodiment

Further to illustrate that the utility model is the technical means and efficacy reaching predetermined purpose and being taken, below in conjunction with Attached drawing and preferred embodiment, to according to the utility model proposes adjustment height heating dish modular structure, specific embodiment party Formula, structure, method, step and feature, detailed description is as follows.

Aforementioned and other technology contents, feature and effect in relation to the utility model, following cooperation with reference to schema compared with It can be clearly appeared from the detailed description of good embodiment.By the explanation of specific embodiment, when can be to the utility model up to The technical means and efficacy taken at predetermined purpose more deeply and specifically understand, however institute's accompanying drawings are only to provide reference With purposes of discussion, not it is used to limit the utility model.

As shown in Figure 1, the present embodiment is to provide the heating of the etching machine or photoresist liquid curing reaction machine of a kind of adjustment height Disk module structure 100 comprising: heating dish disk body 10；And multiple thimbles 20.

As shown in Fig. 2, heating dish disk body 10, with heating surface 110 and is equipped with multiple centre holes 120, each another top Screw base 130 is equipped with inside pin hole 120, heating surface 110 mainly heats wafer 30, makes the etching on wafer 30 The curing reaction of reaction or photoresist liquid can accelerate to complete.

Screw base 130, screw base 130 are equipped with female thread, mainly allow thimble 20 can be with spiral combination firmly It is fixed in screw base 130, and has enough female thread length that can allow thimble 20 that can lock, and then thimble 20 is enable to adjust With the spacing between heating surface 110.

As shown in figure 3, multiple thimbles 20, the bottom of each thimble 20 is equipped with the spiro tooth part 210 of public thread, it is another each Spiro tooth part 210 can be rotatably engaged by way of rotation in screw base 130.

In order to facilitate the height for locking and adjusting thimble 20 of thimble 20, at least two separately are equipped in the side of thimble 20 and is adjusted Whole jack 220, and two adjustment jacks 220 are 180 degree relative to each other settings, and the forked work of double teeth can be allowed by adjusting jack 220 Tool insertion is reversed.

As shown in fig. 4 a and 4b, when the spiro tooth part 210 of thimble 20 is incorporated into screw base 130, each thimble 20 Top protrusion heating surface 110 simultaneously forms spacing, according to the different process requirements of different wafers 30.

After the another tool insertion adjustment jack 220 forked by double teeth, the rotation of force each thimble 20 is balanced in turn It moves up and down, and then spacing adjustment can be quickly completed, the 0.05mm that may range from D1 of another spacing adjustment is to D2's Spacing adjustment between 0.3mm.

In order to keep the wafer 30 firm and same level height is placed on heating surface 110, above-mentioned multiple centre holes 120 and multiple thimbles 20 design position, be can be set on the same concentric circles, and any two centre hole 120 or appoint It anticipates between two thimbles 20 as spaced set.

Multiple positioning pins 140, in order to enable wafer 30 to be placed exactly in the position on heating surface 110, in heating surface 110 On can be further provided with multiple positioning pins 140, same wafer 30 for convenience is placed in the center of heating dish disk body 10, above-mentioned Multiple positioning pins 140 design position, also can be set on the same concentric circles, and between any two positioning pin 140 For spaced set.

Multiple lift pins 150, it is brilliant on heating dish disk body 10, extracting or placing in order to facilitate wafer posting robotic arm Disk 30 can be further provided with multiple lift pins 150 in heating dish disk body 10, and according to the service condition extracted or heated, be promoted Pin 150 can stretch out heating surface 110 or retraction lower than heating surface 110.

Same wafer posting robotic arm for convenience extracts or places wafer 30, above-mentioned multiple lift pins 150 design position, can also be on the same concentric circles, and is spaced set between any two lift pin 150.

The technological innovation of the heating dish modular structure for the utility model adjustment height that above structure is constituted, for same now Many saving graces are all had for the technical staff of industry, and there is technical progress really.In the technology of the utility model In field, as long as having most basic knowledge, other operable embodiments of the utility model can be improved.At this Patent protection request is proposed to Substantial technical scheme in utility model, protection scope should include having above-mentioned technical characterstic All variation patterns.

The above descriptions are merely preferred embodiments of the present invention, not makees in any form to the utility model Limitation be not intended to limit the utility model although the utility model has been disclosed with preferred embodiment as above, it is any ripe Professional and technical personnel is known, is not being departed within the scope of technical solutions of the utility model, when in the technology using the disclosure above Hold the equivalent embodiment made a little change or be modified to equivalent variations, but all without departing from technical solutions of the utility model Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still It is within the scope of the technical solutions of the present invention.

Claims (8)

1. a kind of heating dish modular structure of adjustment height characterized by comprising

Heating dish disk body with heating surface and is equipped with multiple centre holes, is equipped with screw base inside each another centre hole； And

The bottom of multiple thimbles, each thimble is equipped with spiro tooth part, each spiro tooth part is rotatably engaged in spiral base Seat, the top of each thimble protrudes the heating surface and forms spacing when separately combining, by rotating on multiple thimble, Lower movement and then the adjustment of the achievable spacing.

2. the heating dish modular structure of adjustment height as described in claim 1, which is characterized in that multiple centre hole and this is more A thimble is set on the same concentric circles.

3. the heating dish modular structure of adjustment height as claimed in claim 2, which is characterized in that multiple centre hole and this is more A thimble is difference spaced set.

4. the heating dish modular structure of adjustment height as described in claim 1, which is characterized in that the side of each thimble Equipped at least two adjustment jacks.

5. the heating dish modular structure of adjustment height as claimed in claim 4, which is characterized in that at least two adjustment jack It is 180 degree setting relative to each other.

6. the heating dish modular structure of adjustment height as claimed in claim 3, which is characterized in that the spacing be 0.05mm extremely Between 0.3mm.

7. the heating dish modular structure of adjustment height as described in claim 1, which is characterized in that further set on the heating surface There are multiple positioning pins, each another positioning pin is to be set on concentric circles and be equally spaced relative to each other.

8. the heating dish modular structure of adjustment height as described in claim 1, which is characterized in that the heating dish disk body is further Equipped with multiple lift pins, each another lift pin is to be set on concentric circles and be equally spaced relative to each other.