CN221238326U - Three-dimensional imaging sensor and laser ranging system - Google Patents
Three-dimensional imaging sensor and laser ranging system Download PDFInfo
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- CN221238326U CN221238326U CN202323040628.8U CN202323040628U CN221238326U CN 221238326 U CN221238326 U CN 221238326U CN 202323040628 U CN202323040628 U CN 202323040628U CN 221238326 U CN221238326 U CN 221238326U
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Abstract
The utility model discloses a three-dimensional imaging sensor and a laser ranging system, wherein the three-dimensional imaging sensor comprises a SPAD array, at least two TDC arrays, data processing modules with the same number as the TCD arrays and power supply modules with the same number as the TCD arrays, the SPAD arrays are arranged between the TDC arrays and are electrically connected with the TDC arrays, the output ends of the TDC arrays are connected with the data processing modules, the TDC arrays and the data processing modules are also connected with a power supply module, and the distance between each SPAD in the SPAD arrays and the TDC arrays and the distance between the TDC arrays, the data processing modules and the power supply module are shortened by arranging the power supply modules, the TDC arrays and the data processing modules on two sides of the SPAD arrays, so that the TDC sampling consistency is good, the power supply is balanced, and the line routing is more uniform.
Description
Technical Field
The utility model relates to the technical field of laser ranging elements, in particular to a three-dimensional imaging sensor and a laser ranging system.
Background
The Single Photon Avalanche Diode (SPAD) array has the excellent characteristics of strong anti-interference performance, single photon level sensitivity, picosecond level response speed, high resolution, small volume, CMOS (Complementary Metal Oxide Semiconductor ) process manufacture and the like. The three-dimensional imaging sensor integrated with the SPAD array is widely applied to the fields of AR/VR (augmented reality technology/virtual reality technology), three-dimensional modeling, face recognition, unmanned, intelligent robots and the like.
As shown in fig. 1, three-dimensional imaging sensors for laser ranging correlation typically include SPAD arrays, busline (buses), TDC arrays, data processing circuits, data readout circuits, and associated configuration and control units. The configuration and control unit controls each module of the three-dimensional imaging sensor according to external configuration, after the SPAD array detects photon triggering, signals are transmitted through Busline, the triggering time of photons is obtained through the TDC array, multiple measurements are carried out in the exposure time, the distance information of an object is obtained through the data processing circuit, and finally the distance information is transmitted to the outside of the three-dimensional imaging sensor through the data reading circuit for distance measurement.
When the SPAD array area is small [ typically QVGA (quater VGA, which is a Quarter size of VGA, that is, the resolution of the output on the liquid crystal screen is 240×320 pixels) and WQVGA (Wide Quarter Video GRAPHICS ARRAY, which is one of the screen resolutions of the digital product, representing 400×240 screen resolution) ] scale or less ], the SPAD array can be placed on one side of the chip, and when the SPAD detects the trigger signal of the photon, as shown in fig. 2, the SPAD outputs the trigger signal uniformly from one side to the TDC array and the histogram statistics circuit (that is, the TDC array, the data processing circuit and the readout circuit on the lower side of fig. 2), and the layout mode has better consistency for the mode that the signal uniformly goes out from one direction. The data processing circuit comprises a plurality of storage units and is used for storing data of photon flight time data output by the TDC array during histogram statistics, the storage units are frequently read and written during the histogram statistics, and the power consumption is relatively high, so that stable power supply is required to be ensured.
However, when the SPAD array is increased, as shown in fig. 3, one side of the Busline bus receives the data output by the SPAD, the other side of the Busline bus is the TDC and the data processing circuit, and the memory cells of the data processing circuit are relatively far away from the power supplies on both sides, the problems of unbalanced power supply (i.e. unbalanced power supply to the TDC and the data processing circuit) and IR drop (a phenomenon that the voltage drops and rises on the power supply and the ground network in the integrated circuit) occur, so that the performance of the three-dimensional imaging sensor is affected, and when the Busline is outgoing from one direction, the line routing resources are also relatively crowded.
Disclosure of utility model
In view of the above-mentioned shortcomings of the prior art, the present utility model aims to provide a three-dimensional imaging sensor and a laser ranging system, so as to solve the above-mentioned problem of unbalanced power supply of a large area array SPAD.
In order to solve the technical problems, the utility model adopts the following technical scheme:
a three-dimensional imaging sensor, comprising:
the SPAD array comprises a plurality of SPAD;
The at least two TDC arrays comprise a plurality of TDC units and are used for converting photon information triggered by the SPAD into time information;
The data processing modules are the same in number as the TCD array, are used for carrying out histogram statistics on the time information, obtaining the distance of an object according to the histogram and carrying out three-dimensional imaging;
The number of the power supply modules is the same as that of the TCD arrays, and the power supply modules are used for supplying power to the TCD arrays and the data processing modules;
The SPAD array is arranged between the TDC arrays and is electrically connected with the TDC arrays, the output end of the TDC arrays is connected with the data processing module, and the TDC arrays and the data processing module are also connected with a power supply module.
Preferably, the SPAD is electrically connected to each TDC array through a bus.
Preferably, the SPADs are electrically connected to a TDC array through a bus, and bus traces of each SPAD array are staggered.
Preferably, in the SPAD array, each SPAD located at one side of the SPAD array is connected to the TDC unit located at the one side through a transmission line, and each SPAD located at the other side of the SPAD array is connected to the TDC unit located at the other side through a transmission line.
Preferably, the three-dimensional imaging sensor further comprises a configuration module, wherein the configuration module is connected with the SPAD array, the TDC array and the data processing module and is used for configuring working states of the SPAD array, the TDC array and the data processing module.
Preferably, a buffer is arranged on a transmission line exceeding a preset transmission length between the SPAD array and the TDC array, the SPAD array comprises a plurality of light receiving channels, the light receiving channels are formed by a plurality of SPADs, and each light receiving channel is connected through the same transmission line TDC array.
Preferably, the data processing module is further configured to calculate a correction value according to the deviation when the running distance between the SPAD and each TDC array has the deviation, and correct the time information output by the TDC array.
Preferably, the data processing module includes a histogram statistics unit and a storage unit, where the histogram statistics unit is configured to perform histogram statistics on time information output by the TDC array, and store the time information in the storage unit.
Preferably, the three-dimensional imaging sensor further comprises a reading module, and the reading module is connected with the data processing module and used for reading the distance information acquired by the data processing module.
The utility model also provides a laser ranging system which comprises a light emitter and a three-dimensional imaging sensor, wherein the light emitter is electrically connected with the three-dimensional imaging sensor.
Compared with the prior art, the three-dimensional imaging sensor and the laser ranging system provided by the utility model have the advantages that the power supply module, the TDC array and the data processing module are arranged on two sides of the SPAD array, so that the distance between each SPAD in the SPAD array and the TDC array and the distance between the TDC array, the data processing module and the power supply module are shortened, the TDC sampling consistency is good, the power supply is balanced, and the line routing is more uniform.
Drawings
Fig. 1 is a block diagram of a prior art three-dimensional imaging sensor.
Fig. 2 is a schematic diagram of a small area array three-dimensional imaging sensor in the prior art.
Fig. 3 is a schematic diagram of a prior art large area array three-dimensional imaging sensor.
Fig. 4 is a block diagram of a three-dimensional imaging sensor according to the present utility model.
Fig. 5 is a schematic diagram of a first embodiment of a three-dimensional imaging sensor according to the present utility model.
Fig. 6 is a schematic diagram of a second embodiment of the three-dimensional imaging sensor provided by the utility model.
Fig. 7 is a schematic diagram of a third embodiment of the three-dimensional imaging sensor provided by the utility model.
Fig. 8 is a schematic diagram of an application embodiment of the three-dimensional imaging sensor provided by the utility model.
Description of the reference numerals
SPAD array 11, TDC array 12, data processing module 13, power supply module 14, bus 15, configuration module 17, readout module 16, buffer 111
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Referring to fig. 4, the three-dimensional imaging sensor provided by the present utility model includes a SPAD array 11, at least two TDC arrays 12, data processing modules 13 with the same number as the TCD arrays, and power supply modules 14 with the same number as the TCD arrays, where the SPAD array 11 includes a plurality of SPADs (Single Photon Avalanche Diode, single photon avalanche diodes), and the SPADs form a SPAD array 11 with a large area array, such as a SPAD area array with a resolution of 400×240 or more.
The SPAD arrays 11 are disposed between the TDC arrays 12 and electrically connected to the TDC arrays 12, when the number of the TDC arrays 12 is two, the two TDC arrays 12 are located at two sides of the SPAD arrays 11, the TDC arrays 12 include a plurality of TDC units, which are located at the upper side and the lower side of the SPAD arrays 11 (as shown in fig. 5), and are simultaneously connected to the TDC arrays 12 at two sides, and the photon signals triggered by the SPAD arrays 11 are output to one TDC array 12.
When the number of the TDC arrays is two, the number of the data processing modules 13 and the number of the power supply modules 14 are also two, the output end of the TDC array 12 is connected with the data processing module 13, the TDC array 12 and the data processing module 13 are also connected with a power supply module 14, that is, the TDC array 12 and the data processing module 13 are powered by the power supply module 14 connected with the TDC array 12 and the data processing module 13, and the distance between the power supply module 14 and the TDC array 12 and the data processing module 13 is close.
In this embodiment, the SPAD of the SPAD array 11 detects photon triggering to generate a corresponding electrical signal, and transmits the electrical signal to the TDC unit closer to the SPAD array to convert the photon information triggered by the SPAD into time information, and then the data processing module 13 performs histogram statistics on the time information, acquires the distance of the object according to the histogram, and performs three-dimensional imaging. The SPAD array 11, the TDC array 12 and the data processing module 13 are all powered by the power supply module 14 when they are operating. According to the utility model, the power supply module 14, the TDC array 12 and the data processing module 13 are arranged on two sides of the SPAD array 11, so that the distance between each SPAD in the SPAD array 11 and the distance between the TDC array 12 and the data processing module 13 as well as the power supply module 14 are shortened, the TDC sampling consistency is good, the power supply is balanced, the wiring is more uniform, the wiring difficulty is reduced, and the working efficiency is improved.
Optionally, the SPAD is electrically connected to each TDC array 12 through a bus 15, as shown in fig. 5, so that the SPAD array 11 is disposed in the middle of the three-dimensional imaging sensor, data output by the SPAD are respectively transmitted from the upper and lower sides Busline (bus 15), the TDC arrays 12 and the data processing modules 13 are respectively disposed on the upper and lower sides of the SPAD array 11, the data of the SPAD array 11 can be respectively transmitted from two sides through the bus 15, or the data can be selectively transmitted from the side closer to the TDC array 12, and is supplied with power by the short-distance power supply module 14, so that the power supply is balanced, the IR Drop is smaller, and the routing between the modules is also uniform.
Of course, the TDC arrays 12 may be disposed on both left and right sides of the SPAD array 11, or three or four TDC arrays 12 may be disposed on each side of the SPAD array 11 according to the shape of the SPAD array 11, which is not limited in the present utility model.
The data processing module 13 includes a histogram statistics unit and a storage unit, where the histogram statistics unit is configured to perform histogram statistics on the time information output by the TDC array 12 to obtain distance information, and store the distance information in the storage unit. The storage unit is used for storing time information of TDC conversion, is used for writing the histogram statistics unit into the storage unit, and is used for reading subsequent data. In this embodiment, the memory cells include, but are not limited to, SRAM, SDRAM, flip-flop, etc.
Further, the three-dimensional imaging sensor provided by the utility model further comprises a reading module 16, wherein the reading module 16 is connected with the data processing module 13 and is used for reading the distance information acquired by the data processing module 13, namely, the distance information can be read from the storage unit.
Referring to fig. 6, in the second embodiment of the present utility model, the SPADs are electrically connected to a TDC array 12 through buses 15, the buses 15 of each SPAD array 11 are arranged in a staggered manner, as shown in fig. 6, the SPAD arrays 11 are located in the middle of the three-dimensional imaging sensor, the SPADs respectively transmit data from the buses 15 (Busline) staggered at the upper and lower sides, that is, adjacent columns of SPADs transmit data to the corresponding TDC array 12 in opposite directions, and each bus 15 can transmit data of n SPADs.
Referring to fig. 7, in a third embodiment of the present utility model, the SPAD array 11 is divided into two parts, and each SPAD located at one side of the SPAD array 11 is connected to a TDC unit located at the one side through a transmission line, and each SPAD located at the other side of the SPAD array 11 is connected to a TDC unit located at the other side through a transmission line.
That is to say busline adopts an independent wiring mode, for example, the SPAD array 11 with the resolution of 700×400 is arranged in the middle of the three-dimensional imaging sensor, the SPAD array 11 is divided into an upper part and a lower part, at this time, the SPAD of the upper part area array 700×200 transmits data through Busline on the upper side, the SPAD of the lower part area array 700×200 transmits data through Busline on the lower side, the wiring space of busline is enlarged by this mode, which is beneficial to signal wiring, the wiring of the TDC array 12 on the upper side and the data on the lower side of the SPAD is more balanced, and a data processing circuit is arranged outside the TDC array 12 on the upper side and the lower side, so that the TDC array 12 and the data processing circuit are very close to a power supply, and the IR Drop is smaller. Meanwhile, the upper edge and the lower edge of the SPAD array 11 are close to the power supply distance, and the power supply is balanced.
With continued reference to fig. 4, the three-dimensional imaging sensor of the present utility model further includes a configuration module 17, where the configuration module 17 is connected to the SPAD array 11, the TDC array 12, and the data processing module 13, and is used for configuring the working states of the SPAD array 11, the TDC array 12, and the data processing module 13, such as configuring which busline is used for transmitting data when each SPAD in the SPAD array 11 is configured, and configuring the timing of writing data in the memory unit by the TDC array 12.
Referring to fig. 8, in the SPAD array 11, when the SPAD area array is large, there may be loss when the SPAD far away is transmitted to the TDC module, and the buffer 111 is disposed on the transmission line between the SPAD array 11 and the TDC array 12 exceeding the preset transmission length, the buffer 111 is used for enhancing the trigger signal of the SPAD, so as to increase the signal transmission capability of busline, and when one buffer 111 is disposed on each busline, the buffer 111 may also be disposed.
Further, the SPAD array 11 includes a plurality of light receiving channels, and the light receiving channels are formed by a plurality of SPADs, and each light receiving channel is connected to the TDC array 12 through the same transmission line, for example: as shown in fig. 8, the SPAD array 11 includes three groups of calibrated SPAD, SPAD1, SPAD, and SPAD of the same column is connected to a bus, and the same references SPAD and SPAD2 are also connected to a line, that is, SPAD with the same reference number transmits data through the existing bus 15, so as to save routing area.
Further, the data processing module 13 is further configured to calculate a correction value according to the deviation when the running distance between the SPAD and each TDC array 12 deviates, so as to correct the time information output by the TDC array 12, so that when the data of the SPAD array 11 is output from two sides and the distances between the TDC samples are different and deviate due to inconsistent running lengths, the data processing module 13 can correct the deviation according to the calibration deviation value, and the data obtained by the data processing module 13 has no deviation.
The utility model also provides a laser ranging system which comprises a light emitter and a three-dimensional imaging sensor, wherein the light emitter is electrically connected with the three-dimensional imaging sensor, laser emitted by the light emitter is reflected by a target object, and the distance of the target object is received and calculated by the three-dimensional imaging sensor. Since the three-dimensional imaging sensor of the three-dimensional imaging sensor has been described in detail above, it will not be described in detail here.
In summary, in the utility model, when the SPAD array is laid out, the SPAD data is placed in the middle of the sensor, the SPAD data is output from two sides of the SPAD array, the data is transmitted to the TDC array and the data processing module through busline, and the power supply module, the TDC array and the data processing module are arranged on two sides of the SPAD array, so that the distance between each SPAD in the SPAD array and the TDC array and the distance between the TDC array and the data processing module and the power supply module are shortened, the consistency of TDC sampling is good, the power supply is balanced, the IR drop of the digital processing module is reduced, the line routing is uniform, the wiring difficulty is reduced, and the wiring efficiency is improved.
It will be understood that equivalents and modifications will occur to those skilled in the art in light of the present utility model and their spirit, and all such modifications and substitutions are intended to be included within the scope of the present utility model as defined in the following claims.
Claims (10)
1. A three-dimensional imaging sensor, comprising:
the SPAD array comprises a plurality of SPAD;
The at least two TDC arrays comprise a plurality of TDC units and are used for converting photon information triggered by the SPAD into time information;
The data processing modules are the same in number as the TCD array, are used for carrying out histogram statistics on the time information, obtaining the distance of an object according to the histogram and carrying out three-dimensional imaging;
The number of the power supply modules is the same as that of the TCD arrays, and the power supply modules are used for supplying power to the TCD arrays and the data processing modules;
The SPAD array is arranged between the TDC arrays and is electrically connected with the TDC arrays, the output end of the TDC arrays is connected with the data processing module, and the TDC arrays and the data processing module are also connected with a power supply module.
2. The three-dimensional imaging sensor of claim 1, wherein the SPAD is electrically connected to each TDC array by a bus.
3. The three-dimensional imaging sensor of claim 1, wherein the SPADs are electrically connected to a TDC array by a bus, the bus traces of each SPAD array being staggered.
4. The three-dimensional imaging sensor of claim 1, wherein in the SPAD array, each SPAD on one side of the SPAD array is connected to a TDC unit on the one side by a transmission line, and each SPAD on the other side of the SPAD array is connected to a TDC unit on the other side by a transmission line.
5. The three-dimensional imaging sensor of any of claims 1-4, further comprising a configuration module coupled to the SPAD array, the TDC array, and the data processing module for configuring an operational state of the SPAD array, the TDC array, and the data processing module.
6. The three-dimensional imaging sensor according to claim 4, wherein a buffer is provided on a transmission line exceeding a preset transmission length between the SPAD array and the TDC array, the SPAD array includes a plurality of light receiving channels, the light receiving channels are composed of a plurality of SPADs, and each light receiving channel is connected through the same transmission line TDC array.
7. A three-dimensional imaging sensor according to any one of claims 1 to 4, wherein the data processing module is further configured to, when the SPAD has a deviation from the line distance of each TDC array, calculate a correction value according to the deviation, and correct the time information output from the TDC array.
8. The three-dimensional imaging sensor according to any one of claims 1 to 4, wherein the data processing module includes a histogram statistics unit for making histogram statistics of time information output from the TDC array and a storage unit, and is stored in the storage unit.
9. The three-dimensional imaging sensor of any of claims 1-4, further comprising a readout module coupled to the data processing module for reading out distance information acquired by the data processing module.
10. A laser ranging system comprising a light emitter and a three-dimensional imaging sensor according to any one of claims 1-9, the light emitter being electrically connected to the three-dimensional imaging sensor.
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| CN202323040628.8U CN221238326U (en) | 2023-11-10 | 2023-11-10 | Three-dimensional imaging sensor and laser ranging system |
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| CN202323040628.8U CN221238326U (en) | 2023-11-10 | 2023-11-10 | Three-dimensional imaging sensor and laser ranging system |
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