CN221225095U - High-power multichannel modulation light emitting module structure - Google Patents

Abstract

The utility model discloses a high-power multichannel modulation light emitting module structure, which relates to the technical field of light emission and comprises an emitting component carrier PCB board, wherein a light emitting component, a light splitting component, a light modulation component and a light conduction component are sequentially arranged at the top of the emitting component carrier PCB board, the light emitting component comprises a first metal conductive layer arranged at one side of the top of the emitting component carrier PCB board, a DFB chip heat sink is arranged at the top of the first metal conductive layer, and a DFB laser chip is arranged at the top of the DFB chip heat sink. According to the utility model, each component is assembled on the transmitting component carrier PCB board in an integrated packaging mode, so that the integration level of the product is greatly improved, and laser emitted by the high-power DFB laser chip is divided into four independent light paths through the light splitting component for modulation by the EA modulation chip, so that the number of modulation channels is increased.

Description

High-power multichannel modulation light emitting module structure

Technical Field

The utility model relates to the technical field of light emission, in particular to a high-power multichannel modulation light emitting module structure.

Background

In the cloud computing, AI, data center and other novel services and application modes, optical communication technology can be used, in optical communication, an optical module is a tool for realizing photoelectric signal mutual conversion, is one of key devices in optical communication equipment, the optical signal intensity input by the optical module into an external optical fiber directly influences the quality of optical fiber communication, and along with the rapid development of a 5G network, the optical module at the optical communication core position is developed in a long-term manner, and various optical modules are generated.

For the signal transmission of the optical module, an EML (electro-absorption modulation semiconductor laser) type signal transmission mode is adopted, and for the optical module adopting the EML signal transmission mode, the bandwidth is greater than 50GHz, the modulation rate reaches 80Gb/s-100Gb/s, and the optical module has a very wide development prospect in the development of optical communication. However, in the field of signal emission of optical modules, conventional packaging technology optical modules still have some drawbacks, which are mainly manifested in the following aspects:

1. Limitation of multichannel modulation: along with the requirement of the optical module for transmitting different modulation signals, more channel transmitting modules are required to be added, the number of the optical module transmitting sub-modules TOSA is also increased, the volume of the optical module is greatly increased, and the miniaturization trend of the optical module cannot be adapted.

2. Limitation of EML integrated chips: an integrated EML (Electro-absorption ModulatedLaser, electro-absorption modulation chip) is generally adopted as a light source chip for emitting and modulating, so that the preparation difficulty of the EML is high, and the EML integrated chip with the modulation rate of more than 50GB/S is particularly complex and cumbersome in process, high in technical barrier, low in yield and the like.

3. High power multi-channel limitation: the long-distance transmission needs a laser light source with higher power, and a plurality of laser chips are needed as the light source, so that the manufacturing difficulty and cost of the optical module are increased, and the reliability is also greatly reduced.

For the problems in the related art, no effective solution has been proposed at present.

Disclosure of utility model

The present utility model provides a high-power multi-channel modulation optical emission module structure to solve the above technical problems of the prior art.

For this purpose, the utility model adopts the following specific technical scheme:

The utility model provides a high-power multichannel modulation light emission module structure, includes emission subassembly carrier PCB board, and emission subassembly carrier PCB board's top has set gradually light emission subassembly, beam split subassembly, optical modulation subassembly and optical conduction subassembly.

Further, in order to enable the DFB laser chip to emit laser under the drive of the driving circuit, the light emitting component comprises a first metal conductive layer arranged on one side of the top of the carrier PCB of the light emitting component, a DFB chip heat sink is arranged on the top of the first metal conductive layer, and a DFB laser chip is arranged on the top of the DFB chip heat sink.

Further, in order to divide the laser beam into four beams, and then increase the quantity of beams, the beam splitting subassembly is including setting up at the top of transmission subassembly carrier PCB board and being located the lens one of DFB laser chip one side, one side both ends of lens one are provided with spectroscope one and reflector one respectively, one side that the spectroscope one kept away from lens one is provided with two sets of mirrors and two sets of reflectors, and two sets of mirrors all set up between two sets of reflectors, two sets of mirrors and the opposite side of two sets of reflectors all are provided with lens two.

Further, in order to carry out switch modulation to the light beam through the EA modulation chip, and then realize high-speed switch modulation, and produce the signal light with the switching frequency, the optical modulation subassembly is including setting up at the top of transmission subassembly carrier PCB board and being located the metal conducting layer two of lens two sides, the top of metal conducting layer two evenly is provided with a plurality of and lens two matched with EA modulation heat sinks, the top of EA modulation heat sink is provided with the EA modulation chip, one side that the EA modulation chip kept away from lens two is provided with the lens three that cooperatees with it, one side that the EA modulation chip was kept away from to lens three is provided with the optical isolator.

Further, in order to enable the modulated light beam to enter the optical fiber through the optical isolator, the optical module is conducted out of the optical fiber, the optical conduction assembly comprises a glass bottom plate which is arranged at the top of the transmission assembly carrier PCB and is positioned at one side of the optical isolator, a plurality of optical fibers matched with the optical isolator are arranged in the glass bottom plate in an inserted mode, and a glass cover plate is arranged at the top of the glass bottom plate.

The beneficial effects of the utility model are as follows:

1. According to the utility model, each component is assembled on the transmitting component carrier PCB board in an integrated packaging mode, so that the integration level of a product is greatly improved, and laser emitted by the high-power DFB laser chip is divided into four independent light paths through the light splitting component for modulation by the EA modulation chip, so that the number of modulation channels is increased, and the advantages of small volume, high integration level, high reliability and low cost are achieved.

2. The utility model can divide the same light source into a plurality of light sources, and independently modulate each light source through a plurality of independent EA modulation chips, thereby realizing the multi-channel modulation of a single light source, improving the product integration level, reducing the product volume, and simultaneously, compared with the method which uses a plurality of low-power EML chips to be integrated on the same optical module, the utility model can reduce the chip cost and the packaging cost.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a high-power multi-channel modulated light emitting module structure according to an embodiment of the present utility model;

FIG. 2 is a schematic view of another angle of a high-power multi-channel modulated light emitting module structure according to an embodiment of the present utility model;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

Fig. 4 is a partial enlarged view at B in fig. 2.

In the figure:

1. A launch assembly carrier PCB; 2. a light emitting assembly; 201. a first metal conductive layer; 202. a DFB chip heat sink; 203. a DFB laser chip; 3. a light splitting component; 301. a first lens; 302. a spectroscope I; 303. a first reflective mirror; 304. a spectroscope II; 305. a second reflector; 306. a second lens; 4. a light modulating component; 401. a second metal conductive layer; 402. EA modulation heat sink; 403. an EA modulation chip; 404. a third lens; 405. an optical isolator; 5. a light conducting component; 501. a glass bottom plate; 502. an optical fiber; 503. a glass cover plate.

Detailed Description

For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.

According to an embodiment of the present utility model, there is provided a high-power multi-channel modulated light emitting module structure.

The utility model is further described with reference to the accompanying drawings and the specific embodiments, as shown in fig. 1-4, a high-power multichannel modulation light emitting module structure according to an embodiment of the utility model includes an emitting component carrier PCB board 1, and a light emitting component 2, a light splitting component 3, a light modulating component 4 and a light conducting component 5 are sequentially arranged on the top of the emitting component carrier PCB board 1.

By means of the scheme, the utility model assembles each component onto the transmitting component carrier PCB 1 in an integrated packaging mode, the integration level of a product is greatly improved, and laser is divided into four independent light paths through the light splitting component 3, so that the number of modulation channels is increased, and the transmitting component carrier PCB has the advantages of small volume, high integration level, high reliability and low cost.

In one embodiment, for the light emitting component 2, the light emitting component 2 includes a first metal conductive layer 201 disposed on a top side of the emitting component carrier PCB board 1, a DFB chip heat sink 202 is disposed on top of the first metal conductive layer 201, and a DFB laser chip 203 is disposed on top of the DFB chip heat sink 202, so that laser light can be emitted through the DFB laser chip 203 and be provided under the drive of the driving circuit.

Specifically, the transmitting component carrier PCB board 1 is used for fixing the first metal conductive layer 201 and the second metal conductive layer 401, and is used for conducting a heat sink to provide current and heat dissipation for the DFB laser chip 203 and the EA modulation chip 403.

Specifically, before the DFB chip heat sink 202 is fixed, the DFB laser chip 203 may be first adsorbed and placed at a die bonding position of the heat sink by using an automatic eutectic chip mounter, then the DFB chip heat sink 202 is heated and cooled, after the heat sink solder is cooled and solidified, the DFB laser chip 203 and the DFB chip heat sink 202 are welded together, and then the DFB laser chip 203 and the corresponding metal conductive layer 201 of the DFB chip heat sink 202 are connected by using an automatic wire bonder, so as to realize electrical connection, and gold wires may be used for bonding wires.

Specifically, the DFB chip heat sink 202 is fixed on the first metal conductive layer 201, and may be fixed by high-temperature solder, and the DFB chip heat sink 202 may be made of copper, oxygen-free copper, diamond, silicon carbide, aluminum oxide, or other materials with high thermal conductivity.

In one embodiment, for the above-mentioned light splitting component 3, the light splitting component 3 includes a first lens 301 disposed on the top of the emission component carrier PCB 1 and located on one side of the DFB laser chip 203, two ends of one side of the first lens 301 are respectively provided with a first beam splitter 302 and a first beam splitter 303, one side of the first beam splitter 302 away from the first lens 301 is provided with a second two-component mirror 304 and a second two-component mirror 305, the second two-component mirror 304 is disposed between the second two-component mirrors 305, and two sides of the second two-component mirror 304 and the second two-component mirror 305 are respectively provided with a second lens 306, so that the laser beam can be split into four beams, and the number of beams is increased.

Specifically, the first lens 301 is fixed to the lens base, and then the lens base is fixed to the transmitting component carrier PCB 1, and the position where the lens base is to be fixed can be determined according to the coupling between the light emitted by the DFB laser chip 203 and the first lens 301.

Specifically, the first beam splitter 302 and the second beam splitter 304 have the same structure, and are both fixed with the beam splitter base, and then the beam splitter base is fixed with the transmitting component carrier PCB board 1, and the position to be fixed of the beam splitter base can be determined according to the position of the laser path through epoxy resin glue or UV glue.

Specifically, the first reflective mirror 303 and the second reflective mirror 304 have the same structure, are both fixed with the reflective mirror base, and then the reflective mirror base and the transmitting component carrier PCB board 1 are fixed, and the position to be fixed of the reflective mirror base can be determined according to the position of the laser path through epoxy resin glue or UV glue.

Specifically, the second lens 306 is fixed to the lens base, and then the lens base is fixed to the transmitting component carrier PCB 1, and the position to be fixed by the lens base can be determined according to the position of the laser light path and the coupling of the second lens 306.

In one embodiment, for the optical modulation assembly 4, the optical modulation assembly 4 includes a second metal conductive layer 401 disposed on the top of the emission assembly carrier PCB board 1 and located on one side of the second lens 306, a plurality of EA modulation heat sinks 402 matched with the second lens 306 are uniformly disposed on the top of the second metal conductive layer 401, an EA modulation chip 403 is disposed on the top of the EA modulation heat sink 402, a third lens 404 matched with the second lens 306 is disposed on a side of the EA modulation chip 403 away from the second lens 306, and an optical isolator 405 is disposed on a side of the third lens 404 away from the EA modulation chip 403, so that the light beam is switched and modulated by the EA modulation chip 403, thereby realizing high-speed switching modulation and generating signal light with the same switching frequency.

Specifically, the EA modulation chip 403 is mounted on the EA modulation heat sink 402 (including the capacitor component), specifically, the EA modulation chip 403 is adsorbed and placed on the die bonding position of the EA modulation heat sink 402, then the EA modulation heat sink 402 is heated and cooled, after the solder is cooled and solidified, the EA modulation chip 403 and the EA modulation heat sink 402 are welded together, and then the EA modulation chip 403 and the second metal conductive layer 401 of the EA modulation heat sink 402 are connected by an automatic wire bonding machine, so that electrical connection is realized, and gold wires can be adopted for bonding wires.

Specifically, the third lens 404 is fixed to the lens base, and then the lens base is fixed to the emission component carrier PCB1, and the positions where the lens base is to be fixed can be fixed by epoxy resin glue or UV glue, and are determined according to the coupling between the laser path and the third lens 404, so that the third lens 404 is used to collect the light beam or generate parallel light, so that the light beam can be conducted according to the required path.

Specifically, the optical isolator 405 is fixed to the transmitting component carrier PCB 1, and the position where the optical isolator 405 is to be fixed is located between the third lens 404 and the glass substrate 501, and is determined according to alignment between the light emitting position of the third lens 404 and the light receiving position of the optical fiber 502.

In one embodiment, for the above-mentioned light conduction component 5, the light conduction component 5 includes a glass bottom plate 501 disposed on the top of the emission component carrier PCB board 1 and located on one side of the optical isolator 405, a plurality of optical fibers 502 matched with the optical isolator 405 are inserted into the glass bottom plate 501, and a glass cover plate 503 is disposed on the top of the glass bottom plate 501, so that a modulated light beam can enter the optical fibers 502 through the optical isolator 405, and is conducted out of the light module by the optical fibers 502.

Specifically, the glass bottom plate 501 is a quartz glass bottom plate with a V-shaped groove, and the glass bottom plate 501 is fixed with the transmitting component carrier PCB board 1, and may be fixed by epoxy resin glue or UV glue.

Specifically, the optical fibers 502 are fixed along the V-groove of the glass base plate 501, and may be fixed by epoxy glue or UV glue, and the number of the optical fibers 502 is 4.

Specifically, the glass cover plate 503 is a quartz glass cover plate, and covers the glass base plate 501, and may be fixed by epoxy resin glue or UV glue.

According to the utility model, each component is assembled on the transmitting component carrier PCB 1 in an integrated packaging mode, so that the integration level of a product is greatly improved, unlike a traditional module, a light-emitting chip is required to be made into an independent TOSA light-emitting tube, then the TOSA is led out through an optical fiber, the capacity of the TOSA in the chip and an optical channel is limited, and generally, 1 TOSA light-emitting unit can only accommodate 1 modulatable chip, namely, the size of the TOSA light-emitting unit is equal to 1 channel, and the utility model has obvious advantages in the aspect of product size.

Specifically, in general, two modes of signal modulation are adopted, one mode is to use an integrated optical chip with modulation EA, which is equivalent to integration of a DFB chip and an EA modulation chip, but the manufacturing cost is high, the yield is low, especially, the chip with high power and high speed of more than 50G is very high, and the other mode is to use a separate modulation module to connect light emitted by the DFB chip to an external modulator through an optical fiber, notify the modulator to modulate and output the light from the optical fiber of the modulator, so that the switch with different frequencies of signals is realized, but the external modulator has the defects of large volume and high cost.

Based on the above-mentioned defects, the high-power multi-channel modulation light emitting module structure provided by the utility model can split the same light source into a plurality of light sources, and then each light source is independently modulated by a plurality of independent EA modulation chips 403, so that the multi-channel modulation of a single light source is realized, the product integration level is improved, the product volume is reduced, and meanwhile, compared with the use of a plurality of low-power DFB chips, the high-power multi-channel modulation light emitting module structure provided by the utility model is integrated on the same light module, the chip cost is reduced, and the packaging cost is reduced.

In order to facilitate understanding of the above technical solutions of the present utility model, the following describes in detail the working principle or operation manner of the present utility model in the actual process.

In practical application, the DFB laser chip 203 is used to emit laser under the driving of the driving circuit, and the laser beam is divided into four groups of beams by the first lens 301, the first beam splitter 302, the second beam splitter 304, the first beam splitter 303, the second beam splitter 305 and the second lens 306, so that the number of beams is increased, each beam is switched and modulated by the corresponding EA modulation chip 403, and finally the modulated light enters the optical fiber 502 through the third lens 404 and the optical isolator 405, and is conducted out of the optical module by the optical fiber 502.

In summary, by means of the above technical solution of the present utility model, each component is assembled on the transmitting component carrier PCB board 1 in an integrated package manner, so that the integration level of the product is greatly improved, and the laser emitted by the high-power DFB laser chip 203 is divided into four separate optical paths by the beam splitting component 3 for the EA modulation chip 403 to modulate, so that the number of modulation channels is increased, and the advantages of small volume, high integration level, high reliability and low cost are achieved; the utility model can split the same light source into a plurality of light sources, and independently modulate each light source through a plurality of independent EA (advanced optical module) modulation chips 403, so as to realize multi-channel modulation of a single light source, improve the product integration level, reduce the product volume, and simultaneously, compared with the method which uses a plurality of low-power EML (electronic component module) chips to be integrated on the same optical module, the utility model can reduce the chip cost and the packaging cost.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (6)

1. The utility model provides a high-power multichannel modulation light emission module structure, includes emission subassembly carrier PCB board (1), its characterized in that, the top of emission subassembly carrier PCB board (1) has set gradually light emission subassembly (2), beam split subassembly (3), optical modulation subassembly (4) and optical conduction subassembly (5).

2. The high-power multichannel modulated light emitting module structure according to claim 1, characterized in that the light emitting component (2) comprises a first metal conductive layer (201) arranged on one side of the top of the emitting component carrier PCB board (1), a DFB chip heat sink (202) is arranged on the top of the first metal conductive layer (201), and a DFB laser chip (203) is arranged on the top of the DFB chip heat sink (202).

3. The high-power multi-channel modulated light emitting module structure according to claim 2, wherein the light splitting assembly (3) comprises a first lens (301) arranged on the top of the emitting assembly carrier PCB board (1) and located at one side of the DFB laser chip (203), and a first beam splitter (302) and a first reflector (303) are respectively arranged at two ends of one side of the first lens (301).

4. A high-power multi-channel modulated light emitting module according to claim 3, wherein a side of the first beam splitter (302) away from the first lens (301) is provided with two groups of second beam splitters (304) and two groups of second beam splitters (305), and the two groups of second beam splitters (304) are disposed between the two groups of second beam splitters (305), and the other sides of the two groups of second beam splitters (304) and the two groups of second beam splitters (305) are provided with second lenses (306).

5. The high-power multichannel modulated light emitting module structure according to claim 4, wherein the light modulating component (4) comprises a second metal conducting layer (401) arranged on the top of the emitting component carrier PCB board (1) and located on one side of the second lens (306), a plurality of EA modulating heat sinks (402) matched with the second lens (306) are uniformly arranged on the top of the second metal conducting layer (401), an EA modulating chip (403) is arranged on the top of the EA modulating heat sink (402), a third lens (404) matched with the EA modulating chip is arranged on the side, away from the second lens (306), of the EA modulating chip (403), and an optical isolator (405) is arranged on the side, away from the EA modulating chip (403), of the third lens (404).

6. The high-power multichannel modulated light emitting module structure according to claim 5, characterized in that the light conducting component (5) comprises a glass bottom plate (501) arranged on the top of the emitting component carrier PCB board (1) and located on one side of the optical isolator (405), a plurality of optical fibers (502) matched with the optical isolator (405) are inserted into the glass bottom plate (501), and a glass cover plate (503) is arranged on the top of the glass bottom plate (501).