CN221223819U - Bonding device of hemispherical harmonic oscillator - Google Patents
Bonding device of hemispherical harmonic oscillator Download PDFInfo
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- CN221223819U CN221223819U CN202323331908.4U CN202323331908U CN221223819U CN 221223819 U CN221223819 U CN 221223819U CN 202323331908 U CN202323331908 U CN 202323331908U CN 221223819 U CN221223819 U CN 221223819U
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- pipe clamp
- hemispherical shell
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- 238000000034 method Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Abstract
The utility model discloses a bonding device of a hemispherical resonator, which comprises an upper jig and a lower jig, wherein the top of the lower jig is provided with a spherical shell accommodating part matched with the outer surface of the hemispherical shell, the upper jig is sleeved on the upper part of the lower jig, the middle part of the upper jig is provided with a hemispherical shell limiting part for limiting the hemispherical shell in the spherical shell accommodating part when the upper jig is sleeved on the upper part of the lower jig, the upper jig is internally provided with a pipe clamp assembly, the middle part of the pipe clamp assembly is provided with a pipe position, the pipe position is coaxially arranged and communicated with the spherical shell accommodating part and is used for limiting a middle column of the hemispherical resonator, and the lower end of the middle column is abutted with the hemispherical shell in the spherical shell accommodating part after passing through the pipe position. The hemispherical resonator is convenient to assemble, the hemispherical shell cannot shake in the bonding process, and the forming efficiency and the precision of the hemispherical resonator can be ensured.
Description
Technical Field
The utility model relates to a hemispherical resonator gyroscope, in particular to a bonding device of a hemispherical resonator.
Background
The hemispherical resonator gyro is a high-precision vibrating gyro and has the characteristics of high precision, high stability, high reliability, good impact resistance, excellent radiation resistance and long service life. According to literature data, the hemispherical resonator gyro can continuously work for more than 15 years, maintains reliability higher than 99%, and is applied to the fields of navigation, satellites, missiles, aviation and the like.
The hemispherical resonator gyro mainly comprises a hemispherical resonator and an electrode plate, wherein the hemispherical resonator comprises a hemispherical shell and supporting columns, two common structures are adopted, one of the structures is an umbrella-shaped structure formed on the inner surface of the hemispherical shell by the supporting columns, and the other structure is a wine glass-shaped structure formed on the outer surface of the hemispherical shell by the supporting columns. The hemispherical harmonic oscillator is usually made of fused quartz materials, and is integrally formed in the traditional processing, and the manufacturing accuracy requirement is high, the manufacturing difficulty is high, and the processing technology mainly comprises the mechanical processing flows of fusion forming, rough grinding, fine grinding, polishing, accurate leveling, detection and the like, and the processing cycle is long, the cost is high, and the efficiency is low. In addition, as the hemispherical resonator belongs to a hard, brittle and thin-wall special-shaped structure, a large number of microcracks are generated on the surface of the hemispherical resonator under the influence of residual stress, so that the surface roughness is more than 50 nanometers, the sub-damage layer is close to 100 nanometers, the stress balance of a structural member can be damaged by the damage of the deformation layer, the internal resistance is increased, and the energy storage and isotropy of the hemispherical resonator are reduced.
At present, researchers try to prepare hemispherical shells and support columns separately and then bond the hemispherical shells to form hemispherical resonators, but specific bonding modes, particularly processes and tools, are not reported.
Disclosure of utility model
In order to facilitate the bonding and forming of the hemispherical resonator, the utility model provides a bonding device of the hemispherical resonator.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The bonding device of the hemispherical resonator comprises an upper jig and a lower jig, wherein the top of the lower jig is provided with a spherical shell accommodating part matched with the outer surface of a hemispherical shell, the upper jig is sleeved on the upper part of the lower jig, and the middle part of the upper jig is provided with a hemispherical shell limiting part for limiting the hemispherical shell in the spherical shell accommodating part when the upper jig is sleeved on the upper part of the lower jig; the upper jig is internally provided with a pipe clamp assembly, the middle part of the pipe clamp assembly is provided with a pipe position, and the pipe position is coaxially arranged and communicated with the spherical shell accommodating part and is used for limiting the middle column of the hemispherical resonator; the lower end of the middle column passes through the pipe position and then is abutted with the semispherical shell in the spherical shell accommodating part.
Preferably, the outer wall of the lower jig is provided with a guide part, the upper jig is provided with a through hole matched with the guide part, and the lower part of the through hole is sleeved into the upper part of the lower jig along the guide part.
Preferably, the upper part of the inner wall of the through hole extends towards the center of the through hole to form the hemispherical shell limiting part, the depth of the hemispherical shell accommodating part is smaller than the radius of the hemispherical shell, and the lower surface of the hemispherical shell limiting part is abutted with the lip edge of the hemispherical shell in the hemispherical shell accommodating part.
Preferably, the pipe clamp assembly comprises an upper pipe clamp and a lower pipe clamp, wherein the upper surface of the hemispherical shell limiting part forms a middle column upper limiting part for installing the upper pipe clamp, and the end part of the hemispherical shell limiting part extends downwards towards the center again to form a middle column lower limiting part for installing the lower pipe clamp.
Preferably, the lower jig is provided with an exhaust hole communicated with the spherical shell accommodating part.
Preferably, the lower part of the lower jig is provided with a cavity, and the exhaust hole is communicated with the cavity.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the matching design of the upper jig and the lower jig, the hemispherical shell can be conveniently installed in the lower jig, and the hemispherical shell is limited by the hemispherical shell limiting part of the upper jig, so that the hemispherical shell can not shake in the bonding process, and the molding efficiency and the molding precision of the hemispherical harmonic oscillator are further ensured.
2. The upper and lower jigs are made of the racing steel (polyformaldehyde), and have high rigidity, good elasticity and small friction coefficient, so that the contact surfaces of the hemispherical shells and the upper and lower jigs are not easy to damage in the bonding stress process.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a cross-sectional view of a bonding apparatus for hemispherical resonators according to the present utility model.
Fig. 2 is a diagram showing an exploded structure of a bonding apparatus for hemispherical resonators according to the present utility model.
Fig. 3 is a diagram showing a second exploded structure of the bonding apparatus of the hemispherical resonator according to the present utility model.
Fig. 4 is a cross-sectional structure diagram of the upper jig.
Fig. 5 is a cross-sectional structure diagram of the lower jig.
Detailed Description
The utility model is further described below in connection with specific preferred embodiments, but it is not intended to limit the scope of the utility model.
In the description of the present utility model, it should be noted that the positional or positional relationship indicated by the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-5, an embodiment of a bonding device for hemispherical resonators of the present utility model includes an upper jig 3 and a lower jig 4, wherein a spherical shell accommodating portion 41 matching with an outer surface of a hemispherical shell 5 is provided at a top of the lower jig 4, the upper jig 3 is sleeved at an upper portion of the lower jig 4, and a hemispherical shell limiting portion 31 is provided at a middle portion of the upper jig 3 for limiting the hemispherical shell 5 in the spherical shell accommodating portion 41 when the upper jig 3 is sleeved at an upper portion of the lower jig 4; the upper jig 3 is internally provided with a pipe clamp assembly, the middle part of the pipe clamp assembly is provided with a pipe position 2, and the pipe position 2 is coaxially arranged and communicated with the spherical shell accommodating part 41 and is used for limiting the middle column of the hemispherical resonator; the lower end of the middle column passes through the pipe position 2 and then is abutted with the semispherical shell 5 in the spherical shell accommodating part 41.
The outer wall of the lower jig 4 is provided with a guide part 42, the middle part of the upper jig 3 is provided with a through hole 34 matched with the guide part 42, and the lower part of the through hole 34 is sleeved into the upper part of the lower jig 4 along the guide part 42.
The upper part of the inner wall of the through hole 34 extends towards the center of the through hole 34 to form a hemispherical shell limiting part 31, and the depth of the hemispherical shell accommodating part 41 is smaller than the radius of the hemispherical shell 5, so that when the hemispherical shell 5 is placed in the hemispherical shell accommodating part 41, the lip edge of the hemispherical shell 5 protrudes out of the hemispherical shell accommodating part 41 and is abutted by the hemispherical shell limiting part 31 of the upper jig 3, and the hemispherical shell 5 is kept in a stable state in the bonding process.
The pipe clamp assembly comprises an upper pipe clamp 6 and a lower pipe clamp 7, wherein the upper surface of the hemispherical shell limiting part 31 is provided with a middle column upper limiting part 32 for installing the upper pipe clamp 6, and the end part of the hemispherical shell limiting part 31 extends downwards and downwards towards the center to form a middle column lower limiting part 33 for installing the lower pipe clamp 7.
The upper pipe clamp 6 is installed on the upper limit part 32 of the middle column of the upper jig 3, the lower pipe clamp 7 is installed on the lower limit part 33 of the middle column, the upper pipe clamp 6 and the middle part of the lower pipe clamp 7 are respectively provided with a pipe position 2, and the pipe position 2 and the spherical shell accommodating part 41 are coaxially arranged so as to ensure the coaxial connection of the middle column 1 and the hemispherical shell 5 in the bonding process and ensure the precision of the hemispherical resonator.
The lower jig 4 is provided with an exhaust hole 43 communicated with the spherical shell accommodating portion 41. The lower part of the lower jig 4 is provided with a cavity 44, and the exhaust hole 43 is communicated with the cavity 44.
The middle column 1 applicable to the utility model can be solid or hollow, when the middle column 1 is solid, bonding liquid is firstly dripped to the center part of the inner surface of the semispherical shell 5 through the pipe position 2, and then the branch column 1 sequentially passes through the pipe positions 2 on the upper pipe clamp 6 and the lower pipe clamp 7 to be abutted with the center of the inner surface of the semispherical shell 5, so that bonding can be completed. When the middle column 1 is hollow, the middle column 1 can firstly pass through the pipe positions 2 on the upper pipe clamp 6 and the lower pipe clamp 7 in sequence and then is abutted against the center of the inner surface of the hemispherical shell 5, and then the bonding liquid is poured into the central hole of the middle column 1.
When the utility model is used, firstly, the hemispherical shell 5 is placed in the spherical shell accommodating part 41 of the lower jig 4, then the upper jig 3 is sleeved on the upper part of the lower jig 4, the upper edge of the hemispherical shell 5 is attached to the hemispherical shell limiting part 31 of the upper jig 3 by the self weight of the upper jig 3, then the upper pipe clamp 6 is arranged on the middle column upper limiting part 32 of the upper jig 3, the lower pipe clamp 7 is arranged on the middle column lower limiting part 33, and finally the bonding of the middle column 1 and the hemispherical shell 5 is carried out by adopting the method according to the structure of the middle column 1.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present utility model shall fall within the scope of the technical solution of the present utility model.
Claims (6)
1. The bonding device of the hemispherical resonator is characterized by comprising an upper jig (3) and a lower jig (4), wherein a spherical shell accommodating part (41) matched with the outer surface of a hemispherical shell (5) is arranged at the top of the lower jig (4), the upper jig (3) is sleeved at the upper part of the lower jig (4), and a hemispherical shell limiting part (31) is arranged at the middle part of the upper jig (3) and used for limiting a hemispherical shell in the spherical shell accommodating part (41) when the upper jig (3) is sleeved at the upper part of the lower jig (4); the upper jig (3) is internally provided with a pipe clamp assembly, the middle part of the pipe clamp assembly is provided with a pipe position (2), and the pipe position (2) is coaxially arranged and communicated with the spherical shell accommodating part (41) and is used for limiting the middle column of the hemispherical resonator; the lower end of the middle column passes through the pipe position (2) and then is abutted with the semispherical shell in the spherical shell accommodating part (41).
2. The bonding device of hemispherical resonators according to claim 1, characterized in that the outer wall of the lower jig (4) is provided with a guide part (42), the upper jig (3) is provided with a through hole (34) matched with the guide part (42), and the lower part of the through hole (34) is sleeved into the upper part of the lower jig (4) along the guide part (42).
3. The bonding device of hemispherical resonators according to claim 2, characterized in that the upper part of the inner wall of the through hole (34) extends towards the center of the through hole (34) to form the hemispherical shell limiting part (31), the depth of the hemispherical shell accommodating part (41) is smaller than the radius of the hemispherical shell (5), and the lower surface of the hemispherical shell limiting part (31) is abutted with the lip edge of the hemispherical shell in the hemispherical shell accommodating part (41).
4. A bonding apparatus for hemispherical resonators according to claim 3, characterized in that the pipe clamp assembly comprises an upper pipe clamp (6) and a lower pipe clamp (7), the upper surface of the hemispherical shell limiting part (31) forms a middle post upper limiting part (32) for mounting the upper pipe clamp (6), and the end part of the hemispherical shell limiting part (31) extends downwards towards the center again to form a middle post lower limiting part (33) for mounting the lower pipe clamp (7).
5. The bonding apparatus of hemispherical resonator according to any one of claims 1-4, wherein the lower jig (4) is provided with a vent hole (43) communicating with the spherical shell accommodating portion (41).
6. The bonding device of hemispherical resonators according to claim 5, characterized in that the lower part of the lower jig (4) is provided as a cavity (44), and the exhaust hole (43) is communicated with the cavity (44).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323331908.4U CN221223819U (en) | 2023-12-07 | 2023-12-07 | Bonding device of hemispherical harmonic oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323331908.4U CN221223819U (en) | 2023-12-07 | 2023-12-07 | Bonding device of hemispherical harmonic oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221223819U true CN221223819U (en) | 2024-06-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323331908.4U Active CN221223819U (en) | 2023-12-07 | 2023-12-07 | Bonding device of hemispherical harmonic oscillator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221223819U (en) |
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2023
- 2023-12-07 CN CN202323331908.4U patent/CN221223819U/en active Active
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