CN117490670A - Hemispherical resonator gyroscope assembly method and hemispherical resonator gyroscope assembly device - Google Patents
Hemispherical resonator gyroscope assembly method and hemispherical resonator gyroscope assembly device Download PDFInfo
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- CN117490670A CN117490670A CN202311557357.5A CN202311557357A CN117490670A CN 117490670 A CN117490670 A CN 117490670A CN 202311557357 A CN202311557357 A CN 202311557357A CN 117490670 A CN117490670 A CN 117490670A
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 239000004568 cement Substances 0.000 claims abstract description 28
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 238000005498 polishing Methods 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000010409 thin film Substances 0.000 claims description 15
- 230000003746 surface roughness Effects 0.000 claims description 7
- 238000007689 inspection Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 16
- 230000008569 process Effects 0.000 abstract description 9
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000009467 reduction Effects 0.000 abstract description 4
- 230000035772 mutation Effects 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000010408 film Substances 0.000 description 6
- 239000005350 fused silica glass Substances 0.000 description 4
- 239000010453 quartz Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- -1 welding flux Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/567—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode
- G01C19/5691—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Gyroscopes (AREA)
Abstract
The invention discloses a hemispherical resonator gyroscope assembly method and device in the technical field of gyroscope assembly. The hemispherical resonator gyro assembly method comprises the following steps: polishing and surface type checking are carried out on the bottom surface of the center support column of the machined hemispherical harmonic oscillator; and (3) performing glue polishing assembly on the hemispherical harmonic oscillator and the gyro electrode base to assemble the hemispherical harmonic oscillator and gyro electrode base into the hemispherical harmonic oscillator gyro device. According to the hemispherical resonator gyro assembly method, the optical cement formula is applied to the assembly process of the hemispherical resonator gyro, firm assembly is achieved, no additional adhesive material is introduced between assembly surfaces, no physical parameter mutation layer exists, extra support loss caused by assembly is reduced to the greatest extent, and the Q value reduction rate of the harmonic oscillator after assembly is reduced.
Description
Technical Field
The invention relates to the technical field of gyroscope assembly, in particular to a hemispherical resonator gyroscope assembly method and device.
Background
With the rapid development of modern technologies such as deep space exploration, deep sea exploration, automatic driving and the like, the support of navigation technology is mostly needed, and under the condition of severe natural environment or satellite signal interference, an independent inertial navigation system is needed to realize autonomous navigation positioning and guidance control of weapon equipment. The core element of the inertial navigation system, namely a gyroscope, is a sensor for detecting angular movement of an object in an inertial space, and the accuracy of the sensor determines the overall accuracy of the inertial navigation system. Currently, high precision, high reliability, and small volume gyroscopes have been the focus of research in countries around the world. In particular, with the development of weaponry such as tactical missiles, ships, vehicles, and the like, there is an urgent need for a high-precision gyroscope with a large dynamic range, a small size and low power consumption. The resonance gyro has simple structure, small volume and light weight; the core element, namely the harmonic oscillator, is made of ultra-low-loss high-purity quartz material, and the extremely high quality factor (Q value) ensures that the harmonic oscillator has extremely little energy compensation and low power consumption in operation and has unique radiation resistance and power-off working characteristics. The resonance gyro has the unique advantages of small internal physical loss, few failure factors, high reliability, long service life and maintenance-free whole service life. Therefore, the resonant gyros have been widely used in various fields of the land, the sea and the air. The Q value of the harmonic oscillator is an important factor for limiting the precision of the resonance gyro, is a key index for measuring the good and bad vibration performance of the harmonic oscillator, and represents the self energy storage capacity of a vibration element. For a shell vibration gyro, the smaller the self energy dissipation of the harmonic oscillator is, the stronger the capability of maintaining the resonance amplitude is, and the less external energy compensation is required. Therefore, for high-precision resonator gyroscopes, the resonators inside them generally have an extremely high quality factor. Among the sources of the losses of the harmonic oscillator, the supporting loss of the harmonic oscillator is one of the main loss factors. The supporting loss is also called anchoring loss and anchor point damping, and refers to energy dissipation generated by transmitting self energy to the base in the form of vibration waves through the supporting part of the harmonic oscillator when the harmonic oscillator vibrates. In addition, a machining error of the harmonic oscillator and an assembly error in the assembly process of the harmonic oscillator may cause a standing wave node of a mode of n=2 of the harmonic oscillator to deviate from the center of the supporting portion.
The hemispherical resonant gyroscope is a high-precision novel solid-state vibrating gyroscope, and is the only one solid-state gyroscope capable of achieving navigation-level working performance except a laser gyroscope and a fiber-optic gyroscope at present. The core element of the hemispherical resonator gyroscope is a hemispherical shell harmonic oscillator in the gyroscope. For a resonator, the Q value represents the ratio of the energy loss for one vibration period to the total energy of vibration of the resonator. The Q value of the hemispherical harmonic oscillator is superior to that of other structural harmonic oscillators due to the structural advantage, and the Q value of the hemispherical harmonic oscillator processed by adopting fused quartz materials is broken through 2000 ten thousand at present. I.e. the displacement of the support part is not zero when the resonator vibrates, resulting in energy dissipation. The existing visible assembly modes of the resonance gyro have the problem that the Q value of the assembled harmonic oscillator is directly influenced, the Q value reduction rate of the assembled harmonic oscillator exceeds 30% -90%, and in the current report, the harmonic oscillator assembly is mainly used for fixing the harmonic oscillator and the gyro fixing base together through additional materials such as welding flux, glue and the like. The problem with such an assembly is that physical parameters such as young's modulus and coefficient of thermal expansion of additional materials such as solder and glue do not match with the resonators. These materials can lead to the presence of abrupt layers of parameters during gyro operation, resulting in energy loss.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a hemispherical resonator gyroscope assembly method and device, which solve the problems that physical parameters such as Young modulus, thermal expansion coefficient and the like of additional materials such as solder, glue and the like existing in the assembly of a harmonic oscillator in the prior art are not matched with the harmonic oscillator, and the materials can cause the existence of a parameter mutation layer to cause the technical problem of energy loss when the gyroscope works.
In order to achieve the above object, the technical scheme of the present invention is as follows:
the invention provides a hemispherical resonator gyro assembly method, which comprises the following steps:
s1, polishing and surface type inspection are carried out on the bottom surface of a center support column of the machined hemispherical harmonic oscillator;
s2, performing glue polishing assembly on the hemispherical harmonic oscillator and the gyro electrode base to assemble the hemispherical harmonic oscillator and gyro electrode base into the hemispherical harmonic oscillator gyro device.
Further, the step S1 includes the following steps:
s11, carrying out frosting and rough polishing on the bottom surface of the center support column of the machined hemispherical harmonic oscillator by using coarse sand;
s12, finely polishing the bottom surface of the center support column of the hemispherical resonator after rough polishing by using polishing powder;
s13, surface roughness inspection is carried out on the bottom surface of the center support column of the hemispherical resonator after fine polishing, and the surface structure is ensured to be sufficiently smooth.
Further, the surface roughness of the bottom surface of the central support column of the hemispherical resonator in the S13 is smaller than 160nm.
Further, the step S2 includes the following steps:
s21, attaching and pressurizing the hemispherical harmonic oscillator and the first gyro electrode base, and assembling the optical cement;
s22, performing optical cement assembly on the hemispherical harmonic oscillator and the second gyro electrode base;
s23, performing optical cement assembly on the hemispherical harmonic oscillator and the third gyro electrode base.
Further, the step S21 includes the following steps:
s211, polishing and surface type checking are carried out on the center boss part of the upper surface of the machined first gyro electrode base;
s212, cleaning, laminating and pressurizing the bottom surface of the central support column of the hemispherical resonator in S1 and the central boss part of the upper surface of the first gyro electrode base in S211, and performing optical cement to complete assembly.
The invention also provides a hemispherical resonator gyro device which is applied to the hemispherical resonator gyro assembly method and comprises a hemispherical resonator and a gyro electrode base, wherein the hemispherical resonator is connected with the gyro electrode base in a cementing way.
Further, the hemispherical resonator gyro device comprises a hemispherical resonator and a first gyro electrode base, wherein the inner surface of the hemispherical resonator, the lower lip edge of the hemispherical shell and the side surface of the inner center support column are plated with film electrodes which are mutually conducted, eight planar film electrodes and a first center boss part are arranged on the upper surface of the first gyro electrode base, and the upper half part of the first center boss part is connected with the bottom of the center support column through optical cement.
Further, the hemispherical resonator gyro device comprises a hemispherical resonator and a second gyro electrode base, wherein the inner surface of the hemispherical resonator and the side surface of the inner center support column are respectively provided with a thin film electrode, the upper part of the second gyro electrode base is provided with a second three-dimensional electrode and a second center boss part, and the upper half part of the second center boss part is in optical cement connection with the bottom of the center support column.
Further, the hemispherical resonator gyro device comprises a hemispherical resonator and a third gyro electrode base, wherein the outer surface of the hemispherical resonator and the side surface part of the outer center support column are plated with thin film electrodes; and a third three-dimensional electrode and a third central boss part are assembled on the upper part of the third gyro electrode base, and the upper half part of the third central boss part is connected with the bottom of the central support column through optical cement.
By adopting the technical scheme, the invention has the following advantages:
the invention provides a hemispherical resonator gyroscope assembly method and a hemispherical resonator gyroscope assembly device, wherein in the structures of hemispherical resonators and gyroscope bases in three embodiments, the resonators and the gyroscope bases are assembled together through an assembly method of optical cement, the assembly mode of the optical cement is to polish the contact surface of the resonators to be assembled and the bases made of the same material, and when the surface roughness is superior to a certain value, structural parts can be combined together through intermolecular force under certain pressure, so that firm assembly is realized. And no extra adhesive material is introduced between the assembly surfaces, no physical parameter mutation layer exists, the extra support loss caused by assembly is reduced to the maximum extent, and the Q value reduction rate of the harmonic oscillator after assembly is reduced. The 'lossless assembly' of the hemispherical harmonic oscillator and the gyro electrode base can be realized, namely the Q value of the harmonic oscillator after assembly is consistent with the Q value before assembly, and even the Q value after assembly is increased in a rigid assembly mode, so that the problem of Q value reduction can not occur.
Drawings
Fig. 1 is a schematic structural diagram of a hemispherical resonator according to the present invention;
FIG. 2 is a schematic view of the structure of the first gyro electrode base of the present invention;
FIG. 3 is a schematic diagram of a hemispherical resonator and a first gyro electrode base photoresist assembly according to the present invention;
FIG. 4 is a schematic view of the structure of a second gyro electrode base of the present invention;
FIG. 5 is a schematic cross-sectional view of a hemispherical resonator and a second gyroscopic electrode base photoresist assembly of the present invention;
FIG. 6 is a schematic view of the structure of a third gyro electrode base of the present invention;
FIG. 7 is a schematic cross-sectional view of a hemispherical resonator and third gyro electrode base photoresist assembly of the present invention;
FIG. 8 is a graph showing Q test results before assembly of a resonator;
fig. 9 is a Q test result after the assembly of the resonators.
Detailed Description
In the following detailed description of the embodiments of the present invention, reference is made to the accompanying drawings, in which it is to be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The hemispherical resonator gyroscope device comprises a hemispherical resonator and a gyroscope electrode base, wherein the hemispherical resonator is connected with the gyroscope electrode base in a cementing way.
Example 1
The hemispherical resonator gyro structure comprises a hemispherical resonator 1 and a first gyro electrode base 2, wherein as shown in fig. 1 and 2, the inner surface 11 of the hemispherical resonator 1, the lower lip edge 12 of the hemispherical shell and the side surface 15 of an inner center support column are plated with thin film electrodes, and are mutually conducted; eight planar thin film electrodes 21 are plated on the upper surface of the first gyro electrode base 2, the shape of the eight planar thin film electrodes can be flexibly adjusted according to gyro control logic, and the thin film electrodes 21 and the thin film electrodes plated on the lower lip edge 12 of the hemispherical shell resonator 1 jointly form electrostatic driving and detecting electrodes of the gyro; after finishing the optical cement assembly with the first gyro electrode base 2, the thin film electrode on the hemispherical resonator 1 is conducted with an external circuit through a lead wire and penetrates through a hole 22 on the first gyro electrode base 2; a thin film electrode plated on the upper surface 21 of the first gyro electrode base 2; can be conducted with an external circuit by means of an internal wiring or an external lead; the hemispherical resonator 1 and the first gyro electrode base 2 can be made of materials such as quartz, aluminum, copper, stainless steel, kovar alloy and the like, and fused quartz is preferably used as a manufacturing material; the bottom surface 13 of the central support column of the hemispherical resonator 1 is a photoresist surface; the first central boss portion 211 of the upper surface 21 of the first gyro electrode base 2 is a photo-adhesive surface; the hemispherical resonator 1 and the first gyro electrode base 2 form an assembly through the bottom surface 13 of the central support column and the first central boss portion 211 by adopting a process method of optical cement, and the assembly is specifically shown in fig. 3.
Example 2
The hemispherical resonator gyro structure comprises a hemispherical resonator 1 and a second gyro electrode base 3, wherein as shown in fig. 4, the inner surface 11 of the hemispherical resonator 1 and the side surface 15 of an inner center support column are plated with thin film electrodes; the upper part of the second gyro electrode base 3 is provided with 8 second stereo electrodes 31, and the number of the stereo electrodes 31 can be flexibly adjusted according to gyro control logic, including but not limited to 8-32 second stereo electrodes. The second three-dimensional electrode and a film electrode plated on the inner surface 11 of the hemispherical resonator 1 jointly form an electrostatic driving and detecting electrode of the gyroscope; after finishing the optical cement assembly with the first gyro electrode base 2, the film electrode plated on the hemispherical resonator 1 is conducted with an external circuit through a lead wire and penetrates through a hole 32 on the second gyro electrode base 3; a second stereo electrode 31 plated on the upper surface of the second gyro electrode base 3; can be conducted with an external circuit by means of an internal wiring or an external lead; the hemispherical resonator 1 and the second gyro electrode base 3 can be made of materials such as quartz, aluminum, copper, stainless steel, kovar alloy and the like, and fused quartz is preferably used as a manufacturing material; the bottom surface 13 of the central support column of the hemispherical resonator 1 is a photoresist surface; the second central boss part 311 of the upper surface of the second gyro electrode base 3 is a photoresist surface; the hemispherical resonator 1 and the second gyro electrode base 3 form an assembly body through the bottom surface 13 of the central support column and the second central boss portion 311 by adopting a process method of optical cement, and the section of the assembly body is shown in fig. 5.
Example 3
The hemispherical resonator gyro structure comprises a hemispherical resonator 1 and a third gyro electrode base 4, wherein as shown in fig. 6, the outer surface 14 of the hemispherical resonator 1 and the side surface 16 of an outer center support column are plated with thin film electrodes; the upper part of the third gyro electrode base 4 is equipped with 8 third stereo electrodes 41, and the number of the stereo electrodes 41 can be flexibly adjusted according to gyro control logic, including but not limited to 8-32 third stereo electrodes. The third three-dimensional electrode and a film electrode plated on the outer surface 14 of the hemispherical resonator 1 jointly form an electrostatic driving and detecting electrode of the gyroscope; after finishing the assembly with the first gyro electrode base 2 by the photoresist, then assembling the third stereo electrode 41; the third stereo electrode 41 may be assembled by bonding, brazing, etc.; the film electrode plated on the outer surface 14 of the hemispherical resonator 1 is conducted with an external circuit in a lead mode on the side surface 16 of the outer center support column of the hemispherical resonator; a three-dimensional electrode 41 mounted on the upper surface of the third gyro electrode base 4; can be conducted with an external circuit by means of an internal wiring or an external lead; the hemispherical resonator 1 and the third gyro electrode base 4 can be made of materials such as quartz, aluminum, copper, stainless steel, kovar alloy and the like, and fused quartz is preferably used as a manufacturing material; the bottom surface 13 of the central support column of the hemispherical resonator 1 is a photoresist surface; the third central boss portion 411 of the upper surface of the third gyro electrode base 4 is a photo-adhesive surface; the hemispherical resonator 1 and the third gyro electrode base 4 form an assembly body through the bottom surface 13 of the central support column and the third central boss part 411 by adopting a process method of optical cement. The cross section of the assembly is shown in particular in figure 7.
The hemispherical resonant gyroscope assembly method comprises the following steps:
s1, polishing and surface type inspection are carried out on the bottom surface of a center support column of the machined hemispherical harmonic oscillator;
s1 comprises the following steps:
s11, carrying out frosting and rough polishing on the bottom surface of the center support column of the machined hemispherical harmonic oscillator by using coarse sand;
s12, finely polishing the bottom surface of the center support column of the hemispherical resonator after rough polishing by using polishing powder;
s13, surface roughness inspection is carried out on the bottom surface of the center support column of the hemispherical resonator after fine polishing, and the surface structure is ensured to be sufficiently smooth. The surface roughness of the bottom surface of the central support column of the hemispherical harmonic oscillator is less than 160nm.
S2, performing glue polishing assembly on the hemispherical harmonic oscillator and the gyro electrode base to assemble the hemispherical harmonic oscillator and gyro electrode base into the hemispherical harmonic oscillator gyro device.
S2 comprises the following steps:
s21, attaching and pressurizing the hemispherical harmonic oscillator and the first gyro electrode base, and assembling the optical cement;
s21 comprises the following steps:
s211, polishing and surface type checking are carried out on the center boss part of the upper surface of the machined first gyro electrode base;
s212, cleaning, laminating and pressurizing the bottom surface of the central support column of the hemispherical resonator in S1 and the central boss part of the upper surface of the first gyro electrode base in S211, and performing optical cement to complete assembly.
S22, performing optical cement assembly on the hemispherical harmonic oscillator and the second gyro electrode base, wherein the process methods of the S22 and the S21 are the same.
S23, performing optical cement assembly on the hemispherical harmonic oscillator and the third gyro electrode base. The process method of step S22 and S21 is the same.
For the 'optical cement' assembly mode disclosed by the invention, verification tests have been carried out, the test data of the Q value of the harmonic oscillator before and after assembly is shown in fig. 9, the harmonic oscillator is fixed by adopting a rigid clamp before the assembly of the harmonic oscillator, the measurement result shows that the Q value is 1141906, the measurement result shows that the Q value is 1229745 after the assembly, the Q value of the harmonic oscillator is not reduced after the assembly, and the Q value is improved by 7.69% compared with that before the assembly. The data show that the harmonic oscillator is better fixed in the 'optical cement' assembly mode, and the lossless assembly of the Q value of the harmonic oscillator is realized.
Finally, it is pointed out that while the invention has been described with reference to a specific embodiment thereof, it will be understood by those skilled in the art that the above embodiments are provided for illustration only and not as a definition of the limits of the invention, and various equivalent changes or substitutions may be made without departing from the spirit of the invention, therefore, all changes and modifications to the above embodiments shall fall within the scope of the appended claims.
Claims (9)
1. The hemispherical resonant gyroscope assembly method is characterized by comprising the following steps of:
s1, polishing and surface type inspection are carried out on the bottom surface of a center support column of the machined hemispherical harmonic oscillator;
s2, performing glue polishing assembly on the hemispherical harmonic oscillator and the gyro electrode base to assemble the hemispherical harmonic oscillator and gyro electrode base into the hemispherical harmonic oscillator gyro device.
2. The hemispherical resonator gyro assembly method of claim 1, wherein the S1 comprises the steps of:
s11, carrying out frosting and rough polishing on the bottom surface of the center support column of the machined hemispherical harmonic oscillator by using coarse sand;
s12, finely polishing the bottom surface of the center support column of the hemispherical resonator after rough polishing by using polishing powder;
s13, surface roughness inspection is carried out on the bottom surface of the center support column of the hemispherical resonator after fine polishing, and the surface structure is ensured to be sufficiently smooth.
3. The hemispherical resonator gyro assembly method according to claim 2, wherein the surface roughness of the bottom surface of the center support column of the hemispherical resonator in S13 is less than 160nm.
4. The hemispherical resonator gyro assembly method of claim 1, wherein the S2 includes the steps of:
s21, attaching and pressurizing the hemispherical harmonic oscillator and the first gyro electrode base, and assembling the optical cement;
s22, performing optical cement assembly on the hemispherical harmonic oscillator and the second gyro electrode base;
s23, performing optical cement assembly on the hemispherical harmonic oscillator and the third gyro electrode base.
5. The hemispherical resonator gyro assembly method of claim 4, wherein the S21 includes the steps of:
s211, polishing and surface type checking are carried out on the center boss part of the upper surface of the machined first gyro electrode base;
s212, cleaning, laminating and pressurizing the bottom surface of the central support column of the hemispherical resonator in S1 and the central boss part of the upper surface of the first gyro electrode base in S211, and performing optical cement to complete assembly.
6. The hemispherical resonator gyroscope device is characterized by comprising a hemispherical resonator and a gyroscope electrode base, wherein the hemispherical resonator is connected with the gyroscope electrode base in a cementing way.
7. The hemispherical resonator gyro device according to claim 6, comprising a hemispherical resonator and a first gyro electrode base, wherein the inner surface of the hemispherical resonator, the lower lip edge of the hemispherical shell and the side surface of the inner center support column are all plated with thin film electrodes which are mutually conducted, eight planar thin film electrodes and a first center boss portion are arranged on the upper surface of the first gyro electrode base, and the upper half of the first center boss portion is in optical cement connection with the bottom of the center support column.
8. The hemispherical resonator gyro device according to claim 6, comprising a hemispherical resonator and a second gyro electrode base, wherein the inner surface of the hemispherical resonator and the side surface of the inner center support column are respectively provided with a thin film electrode, the upper part of the second gyro electrode base is provided with a second three-dimensional electrode and a second center boss part, and the upper half part of the second center boss part is in optical cement connection with the bottom of the center support column.
9. The hemispherical resonator gyro device according to claim 6, comprising a hemispherical resonator and a third gyro electrode base, wherein the outer surface of the hemispherical resonator and the side surface of the outer center support post are both plated with thin film electrodes; and a third three-dimensional electrode and a third central boss part are assembled on the upper part of the third gyro electrode base, and the upper half part of the third central boss part is connected with the bottom of the central support column through optical cement.
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| CN202311557357.5A CN117490670A (en) | 2023-11-21 | 2023-11-21 | Hemispherical resonator gyroscope assembly method and hemispherical resonator gyroscope assembly device |
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| CN202311557357.5A CN117490670A (en) | 2023-11-21 | 2023-11-21 | Hemispherical resonator gyroscope assembly method and hemispherical resonator gyroscope assembly device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117723037A (en) * | 2024-02-08 | 2024-03-19 | 四川图林科技有限责任公司 | Manufacturing method and system of hemispherical resonator gyroscope based on full-angle mode |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117723037A (en) * | 2024-02-08 | 2024-03-19 | 四川图林科技有限责任公司 | Manufacturing method and system of hemispherical resonator gyroscope based on full-angle mode |
| CN117723037B (en) * | 2024-02-08 | 2024-04-19 | 四川图林科技有限责任公司 | Manufacturing method and system of hemispherical resonator gyroscope based on full-angle mode |
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