CN221202838U

CN221202838U - Circuit board heat radiation structure

Info

Publication number: CN221202838U
Application number: CN202322731010.XU
Authority: CN
Inventors: 罗奇; 黄奕钊; 李秋梅; 张飞龙
Original assignee: Kinwong Electronic Technology Longchuan Co Ltd
Current assignee: Kinwong Electronic Technology Longchuan Co Ltd
Priority date: 2023-10-11
Filing date: 2023-10-11
Publication date: 2024-06-21
Anticipated expiration: 2033-10-11

Abstract

The application relates to the technical field of printed circuit boards and discloses a circuit board radiating structure which comprises a first sub-board and a radiating plate which are arranged in a stacked mode, wherein the first sub-board is provided with a first circuit layer which is used for being connected with a heating element, the radiating plate is provided with a first heat conducting part which is used for being connected with the heating element, a liquid cooling cavity is formed in the radiating plate, and circulating cooling liquid is arranged in the liquid cooling cavity. The circuit board heat radiation structure provided by the application can meet the heat radiation requirement of high-power high-heat-density semiconductor heating components.

Description

Circuit board heat radiation structure

Technical Field

The application relates to the technical field of printed circuit boards, in particular to a circuit board heat dissipation structure.

Background

With the continuous development of the electronic communication industry and the vehicle-mounted electronic industry, related circuit board products are required to be higher and higher, and the requirements on heat dissipation performance are higher as the circuit board products gradually tend to be miniaturized and multifunctional.

The traditional circuit board heat radiation structure generally comprises a daughter board and a heat radiation plate attached to one side of the daughter board, wherein heating elements are arranged on the daughter board, when the circuit board heat radiation structure is used, heat generated by the daughter board and the heating elements is conducted away by the heat radiation plate, and the heat radiation requirement of the circuit board heat radiation structure cannot be met for the heating elements with high power and high heat density.

Disclosure of utility model

The application provides a circuit board heat dissipation structure which can meet the heat dissipation requirement of a high-power high-heat-density semiconductor heating element.

The embodiment of the application provides a circuit board radiating structure, which comprises a first sub-board and a radiating plate which are arranged in a stacked manner, wherein the first sub-board is provided with a first circuit layer, the first circuit layer is used for being connected with a heating element, the radiating plate is provided with a first heat conducting part used for being connected with the heating element, a liquid cooling cavity is arranged in the radiating plate, and circulating cooling liquid is arranged in the liquid cooling cavity.

In some embodiments, the first sub-board is provided with a first accommodating hole for accommodating the heat generating component, and the first heat conducting part defines a bottom surface of the first accommodating hole.

In some embodiments, the first sub-board is provided with a first avoidance hole, the first heat conduction part is located in the first avoidance hole, and the first heat conduction part is in contact with the first circuit layer.

In some embodiments, a portion of the liquid cooling chamber is located inside the first thermally conductive portion.

In some embodiments, the heat dissipation plate comprises a first plate adjacent to the first sub-plate and a second plate distant from the first sub-plate, and the liquid cooling cavity is located between the first plate and the second plate; and a supporting piece is further arranged in the heat dissipation plate, and two opposite ends of the supporting piece are respectively connected with the first plate and the second plate.

In some embodiments, the support is a support column, the support column is provided with a plurality of support columns and the plurality of support columns are distributed at intervals.

In some of these embodiments, the support member is a support bar, and the length direction of the support bar is perpendicular to the arrangement direction of the first plate and the second plate.

In some of these embodiments, the support bar extends along a curvilinear path along the length of the support bar.

In some embodiments, a plurality of the support bars are provided, and a plurality of the support bars are provided at intervals.

In some embodiments, the material of the first plate and the material of the support member are both copper, and the material of the second plate is aluminum.

The circuit board heat radiation structure provided by the embodiment of the application has the beneficial effects that: because circuit board heat radiation structure is including the first daughter board and the heating panel of range upon range of setting, first daughter board is provided with first circuit layer, first circuit layer is used for being connected with the components and parts that generate heat, and the heating panel is provided with the first heat conduction portion that is used for being connected with the components and parts that generate heat, the inside of heating panel is provided with the liquid cooling chamber, but the liquid cooling intracavity is equipped with the coolant liquid of circulation, so the heat that the components and parts that generate heat can directly conduct to the coolant liquid in the liquid cooling chamber through first heat conduction portion to take away by the coolant liquid that flows, thereby can improve circuit board heat radiation structure's radiating effect, the semiconductor that has satisfied high-power high heat density generates heat the heat requirement of components and parts.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a sectional view of a heat dissipation structure of a circuit board according to a first embodiment of the present application;

FIG. 2 is a top view of the internal structure of the circuit board heat dissipation structure shown in FIG. 1;

FIG. 3 is a cross-sectional view of a circuit board heat dissipation structure in a second embodiment of the application;

FIG. 4 is a cross-sectional view of a circuit board heat dissipation structure in a third embodiment of the application;

FIG. 5 is a cross-sectional view of a circuit board heat dissipation structure in a fourth embodiment of the application;

FIG. 6 is a cross-sectional view of a circuit board heat dissipation structure in a fifth embodiment of the application;

fig. 7 is a sectional view of a circuit board heat dissipation structure in a sixth embodiment of the present application;

FIG. 8 is a top view showing the internal structure of a circuit board heat dissipating structure according to a seventh embodiment of the present application;

FIG. 9 is a top view showing the internal structure of a circuit board heat dissipating structure according to an eighth embodiment of the present application;

fig. 10 is a top view showing an internal structure of a circuit board heat dissipation structure according to a ninth embodiment of the present application.

The meaning of the labels in the figures is:

10. A first sub-board;

11. a first circuit layer; 12. a first insulating dielectric layer; 13. a first accommodation hole;

20. A heat dissipation plate;

21. A first heat conduction part; 22. a cooling liquid; 23. a first plate; 24. a second plate; 25. a support; 26. a second heat conduction part; 27. a liquid inlet; 28. a liquid outlet;

30. A second sub-board;

31. A second circuit layer; 32. and a second insulating dielectric layer.

Detailed Description

The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Reference in the specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

In order to describe the technical scheme of the application, the following description is made with reference to specific drawings and embodiments.

The heat radiation structure of the traditional circuit board generally comprises a daughter board and a heat radiation plate attached to one side of the daughter board, heating components are often arranged on the substrate, and the heat radiation plate conducts heat generated by the first daughter board and the heating components.

The heat dissipation plate is welded to the daughter board through a welding process, when the high-heat-density heating element is used, heat is required to be conducted from the circuit layer of the daughter board to the insulating medium layer of the daughter board, and then is conducted to the heat dissipation plate through the welding layer.

The embodiment of the application provides a circuit board heat dissipation structure and a manufacturing method thereof, which can solve the problems.

Embodiment one:

Referring to fig. 1 and 2, an embodiment of the present application provides a circuit board heat dissipation structure, which includes a first sub-board 10 and a heat dissipation board 20 that are stacked, wherein the first sub-board 10 is provided with a first circuit layer 11, the first circuit layer 11 is used for being connected with a heat generating component, the heat dissipation board 20 is provided with a first heat conducting portion 21 used for being connected with the heat generating component, a liquid cooling cavity is arranged inside the heat dissipation board 20, and a cooling liquid 22 capable of circulating is arranged in the liquid cooling cavity.

It will be appreciated that the first wiring layer 11 is used to make wiring. The first heat conduction portion 21 has heat conduction, and the material of the first heat conduction portion 21 may be a heat conduction metal material such as copper or aluminum, or a non-heat conduction metal material such as ceramic. The cooling liquid 22 may be water or the like.

It should be noted that, the heat dissipation plate 20 may further be provided with a liquid inlet 27 and a liquid outlet 28, both the liquid inlet 27 and the liquid outlet 28 are communicated with the liquid cooling cavity, the cooling liquid 22 is introduced into the liquid cooling cavity through the liquid inlet 27, and the cooling liquid 22 in the liquid cooling cavity is discharged through the liquid outlet 28, so as to realize circulation of the cooling liquid 22 in the liquid cooling cavity. In this embodiment, the liquid inlet 27 and the liquid outlet 28 are disposed on opposite sides of the heat dissipation plate 20.

It can be further understood that the heat generated by the heat generating component can be directly conducted to the cooling liquid 22 in the liquid cooling cavity through the first heat conducting portion 21 and is carried away by the flowing cooling liquid 22, so that the heat is not required to be conducted from the first circuit layer 11 of the first daughter board 10 to the heat dissipating plate 20, and the heat dissipating effect is better.

In the circuit board heat dissipation structure provided by the embodiment of the application, the first sub-board 10 and the heat dissipation plate 20 can be stacked and placed at first, and then the first sub-board 10 and the heat dissipation plate 20 are pressed together.

According to the circuit board radiating structure provided by the embodiment of the application, the circuit board radiating structure comprises the first sub-board 10 and the radiating plate 20 which are arranged in a stacked manner, the first sub-board 10 is provided with the first circuit layer 11, the first circuit layer 11 is used for being connected with a heating element, the radiating plate 20 is provided with the first heat conducting part 21 used for being connected with the heating element, the liquid cooling cavity is arranged in the radiating plate 20, and the circulating cooling liquid 22 is arranged in the liquid cooling cavity, so that heat generated by the heating element can be directly conducted to the cooling liquid 22 in the liquid cooling cavity through the first heat conducting part 21 and taken away by the flowing cooling liquid 22, a heat conduction path is reduced, thermal resistance is reduced, two-dimensional surface heat conduction is realized, and therefore, the radiating effect of the circuit board radiating structure can be improved, and the radiating requirement of a high-power high-heat density semiconductor heating element is met.

The heat dissipation plate 20 provided by the embodiment of the application can be manufactured through working procedures such as cutting, browning, prestack to be pressed and the like.

Cutting: the heat dissipation plate 20 is cut according to the design size.

Brown chemical: the surface of the heat dissipation plate 20 combined with the first sub-plate 10 is pre-treated to increase the bonding force of the lamination.

Prestack: prestack is to be combined.

The first daughter board 10 provided by the embodiment of the application can be manufactured through working procedures such as material cutting, drilling, prestack and pressing.

Cutting: cutting RCC (Resin Coated Copper foil, resin-coated copper foil) according to the designed size;

Drilling: and (5) drilling a pressing positioning hole.

Prestack: prestack is to be combined.

Alternatively, the first sub-board 10 is provided with a first insulating medium layer 12 between the first wiring layer 11 and the heat dissipation plate 20. The material of the first circuit layer 11 may be copper, and the material of the first insulating dielectric layer 12 may be PP (Polypropylene), or may be other insulating heat-conducting glue.

The circuit board heat dissipation structure provided by the embodiment of the application can be manufactured through the working procedures of pressing, sticking a protective film, wiring, etching, AOI (Automated Optical Inspection, automatic optical detection), laser etching an insulating layer, (plasma photoresist removal), welding prevention, characters, testing, OSP (Organic Solderability Preservatives, organic solder mask), FQC (Final Quality Control, finished product inspection), packaging and the like.

Wherein, the first daughter board 10 is RCC, the first circuit layer 11 is copper foil, and the first insulating medium layer 12 is resin pure glue.

Pressing: the first daughter board 10 and the heat dissipation plate 20 are pressed fast, so that the copper foil is combined with the heat dissipation plate 20 into a whole through the resin pure glue, and the pressing parameters are required to be controlled during pressing, so that the heat dissipation plate 20 and the RCC are fully combined, and meanwhile, the problems of bursting of the heat dissipation plate 20 and the like are prevented.

Sticking a protective film: a protective film is attached to the surface of the heat sink 20 away from the RCC, i.e., the bottom surface, to prevent the bottom surface of the heat sink 20 from rubbing and to prevent etching corrosion.

And (3) line: the outer layer wiring is formed on the first wiring layer 11 by conventional coating (i.e., wet film), exposure, and development.

Etching: the developed first wiring layer 11 is wired by etching in a conventional manner, and the copper foil corresponding to the first heat conductive portion 21 is etched away.

AOI: the quality of the etched line is detected by optics.

Laser lithography first insulating dielectric layer 12: the first insulating medium layer 12 on the first heat conduction portion 21 is etched by CO ₂ laser and fiber laser, exposing the first insulating medium layer 12.

Plasma: and cleaning the board surface by a plasma treatment mode.

Characters: characters are printed according to the conventional method.

Drilling: drilling by a conventional method.

Welding prevention: the first insulating dielectric layer 12 is not shielded from solder by a conventional fabrication process.

Characters: characters are printed according to the conventional method.

And (3) testing: and testing the open circuit and the short circuit of the circuit.

OSP: the copper surface treatment prevents copper oxidation.

FQC: the product was checked for FQC.

Packaging and delivering: and packaging and delivering the qualified products according to the requirements.

It is understood that the first daughter board 10 may be a single layer board, or may be a multi-layer board that is not limited to a single layer circuit and a single dielectric layer.

Referring to fig. 2, optionally, the first sub-board 10 is provided with a first accommodating hole 13 for accommodating a heat generating component, and the first heat conducting part 21 defines a bottom surface of the first accommodating hole 13. By the arrangement, the heating components can be directly placed in the first accommodating hole 13, so that the heating components can be conveniently installed, and heat generated by the heating components can be directly conducted to the cooling liquid 22 in the liquid cooling cavity through the first heat conducting part 21.

It can be appreciated that the first accommodating hole 13 may be manufactured by windowing, and the first accommodating hole 13 may be set according to the number of heating components, or may be a plurality of the first accommodating holes, specifically, may be set according to a product design.

Optionally, the heat dissipation plate 20 includes a first plate 23 close to the first sub-plate 10 and a second plate 24 far from the first sub-plate 10, and the liquid cooling cavity is located between the first plate 23 and the second plate 24; the heat dissipation plate 20 is further provided at an inside thereof with a supporting member 25, and opposite ends of the supporting member 25 are respectively connected to the first plate 23 and the second plate 24.

Through adopting above-mentioned scheme, can avoid when being in the same place first daughter board 10 and heating panel 20 pressfitting, be cavity structure pressfitting atress owing to be in the middle of the heating panel 20 and lead to whole board pressurized uneven, and then lead to the not good and make first daughter board 10 and heating panel 20 have the problem of the tight layering of pressfitting cohesion after the pressfitting.

On the other hand, the supporting member 25 can play a role of guiding flow during use, and increase the contact area between the heat dissipation plate 20 and the cooling liquid 22, thereby further improving the heat dissipation effect.

It will be appreciated that the liquid inlet 27 and the liquid outlet 28 may be disposed on two side walls of the heat dissipation plate 20, or may be disposed on two sides or one side of the heat dissipation plate 20 facing away from the first sub-plate 10, and may be specifically disposed according to the product design and the structure of the matching support 25. The interface between the liquid inlet 27 and the liquid outlet 28 may be threaded, or may be an interface such as a socket, which is not limited herein.

Optionally, the material of the supporting member 25 is a heat conductive metal, such as copper or aluminum. The material of the first plate 23 and the material of the second plate 24 may be a heat conductive metal, such as copper or aluminum. Specifically, the material of the first plate 23 and the material of the second plate 24 may be copper, aluminum, or copper, respectively, for the first plate 23, the second plate 24, and the second plate 24.

In this embodiment, the supporting members 25 are supporting columns, and a plurality of supporting columns are disposed and spaced apart from each other. By the arrangement, the first sub-board 10 and the heat dissipation board 20 can be pressed together, and the first board 23 and the second board 24 corresponding to the liquid cooling cavity can be effectively supported.

Alternatively, the material of the first plate 23 and the material of the supporting member 25 are both copper, and the material of the second plate 24 is aluminum. In this way, the first plate 23 can be directly contacted with the heating element, the heat of the heating element is guided to the cooling liquid 22 in the liquid cooling cavity of the heat dissipation plate 20 by the characteristic of high heat conductivity of copper, and then the heat is taken away by the flowing of the cooling liquid 22.

The second plate 24 is made of aluminum, and the second plate is not required to be in contact with the heating element, and the second plate is made of aluminum with lower cost, so that the cost input can be directly reduced, and the cost reduction is realized.

It will be appreciated that the material of the second plate 24 may be selected from other low cost metallic materials that may be composited with copper.

Embodiment two:

Referring to fig. 3, unlike the embodiment, in the present embodiment, the circuit board heat dissipation structure further includes a second sub-board 30, the first sub-board 10 and the second sub-board 30 are respectively stacked on opposite sides of the heat dissipation board 20, the second sub-board 30 is provided with a second circuit layer 31, the second circuit layer 31 is used for being connected with a heat generating component, and the heat dissipation board 20 is provided with a second heat conduction portion 26 used for being connected with the heat generating component.

Through adopting above-mentioned scheme, can dispel the heat through heating panel 20 to the heating element on the first daughter board 10 and the heating element on the second daughter board 30 simultaneously, and the radiating effect is better.

In the circuit board heat dissipation structure provided by the embodiment of the application, the first sub-board 10, the heat dissipation board 20 and the second sub-board 30 can be stacked and placed, and then the first sub-board 10, the heat dissipation board 20 and the second sub-board 30 are pressed together.

It is understood that the structure of the second sub-board 30 may be similar to that of the first sub-board 10, for example, in the present embodiment, the second sub-board 30 is provided with the second insulating medium layer 32 between the second wiring layer 31 and the heat dissipation plate 20.

It is further understood that the second daughter board 30 may be a single layer board, or a multi-layer board that is not limited to a single layer circuit and a single dielectric layer.

Embodiment III:

Referring to fig. 4, unlike the embodiment, in the present embodiment, the first daughter board 10 is provided with a first avoidance hole (not shown), the first heat conduction portion 21 is located in the first avoidance hole, and the first heat conduction portion 21 contacts the first circuit layer 11.

Through adopting above-mentioned scheme, can enough improve circuit board heat radiation structure's radiating effect, also conveniently be connected first heat conduction portion 21 with the radiating components and parts, also can limit the relative position of first daughter board 10 and heating panel 20 through first heat conduction portion 21 and first position hole of keeping away simultaneously.

Alternatively, the first heat conducting portion 21 is flush with a side of the first sub-board 10 facing away from the heat dissipation plate 20. This arrangement makes it easier to connect the first heat conducting portion 21 with the heat dissipating component.

Embodiment four:

Referring to fig. 5, in the present embodiment, the circuit board heat dissipation structure further includes a second sub-board 30, the first sub-board 10 and the second sub-board 30 are respectively stacked on opposite sides of the heat dissipation board 20, the second sub-board 30 is provided with a second circuit layer 31, the second circuit layer 31 is used for being connected with a heat generating component, and the heat dissipation board 20 is provided with a second heat conduction portion 26 for being connected with the heat generating component.

Fifth embodiment:

Referring to fig. 6, unlike the third embodiment, in the present embodiment, a part of the liquid cooling chamber is located inside the first heat conducting portion 21.

Through adopting above-mentioned scheme, can make the distance of coolant liquid 22 and heating element more nearer, and area of contact is bigger to can make circuit board heat radiation structure's radiating effect better.

Alternatively, the shape of the liquid cooling chamber located inside the first heat conduction portion 21 corresponds to the shape of the outer surface of the first heat conduction portion 21. By the arrangement, the distance between the cooling liquid 22 and the heating element can be further shortened, the contact area is larger, and therefore the heat dissipation effect of the circuit board heat dissipation structure is better.

Example six:

Referring to fig. 7, in the present embodiment, the circuit board heat dissipation structure further includes a second sub-board 30, the first sub-board 10 and the second sub-board 30 are respectively stacked on opposite sides of the heat dissipation board 20, the second sub-board 30 is provided with a second circuit layer 31, the second circuit layer 31 is used for being connected with a heat generating component, and the heat dissipation board 20 is provided with a second heat conduction portion 26 for being connected with the heat generating component.

Embodiment seven:

Referring to fig. 8, unlike the first embodiment, in the present embodiment, the supporting member 25 is a supporting bar, and the length direction of the supporting bar is perpendicular to the arrangement direction of the first plate 23 and the second plate 24.

Through adopting above-mentioned scheme, can enough avoid when being in the same place first daughter board 10 and heating panel 20 pressfitting, be cavity structure pressfitting owing to be in the middle of the heating panel 20 and not lead to whole board pressurized uneven owing to the atress, and then lead to the not good and make first daughter board 10 of cohesion and heating panel 20 have the layering problem behind the pressfitting, also can make support piece 25 play the water conservancy diversion effect in the use, with better messenger's coolant liquid 22 circulation flow and take away the heat, and increase heating panel 20 and coolant liquid 22's area of contact, thereby further improve the radiating effect.

It is understood that a plurality of support bars may be provided, and a plurality of support bars may be provided at intervals. The support bar can separate the liquid inlet 27 and the liquid outlet 28, so that the cooling liquid 22 can enter the liquid cooling cavity from the liquid inlet 27, naturally flows to the liquid outlet 28 in the liquid cooling cavity, and further can realize the circulation function of the cooling liquid 22, and the purpose of taking away the heat conducted by the heating components to the first heat conducting part 21 is achieved.

It will be appreciated that the support bars may extend along a straight path, but may also extend along other linear paths. In this embodiment, the liquid inlet 27 and the liquid outlet 28 are disposed on the same side of the heat dissipation plate 20.

Example eight:

Referring to fig. 9, in the present embodiment, the liquid inlet 27 and the liquid outlet 28 are disposed at a side of the heat dissipation plate 20 away from the first sub-plate 10.

Through adopting above-mentioned scheme, be convenient for to let in coolant liquid 22 to the liquid cooling intracavity, and conveniently flow out coolant liquid 22 from the liquid cooling intracavity.

Example nine:

referring to fig. 10, unlike the seventh embodiment, in some of the embodiments, the support bar extends along a curved path in the length direction of the support bar.

By adopting the scheme, the contact area between the cooling liquid 22 and the supporting strips can be enlarged, so that a better heat dissipation effect is realized.

The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims

1. The circuit board heat dissipation structure is characterized by comprising a first sub-board and a heat dissipation plate which are arranged in a stacked mode, wherein the first sub-board is provided with a first circuit layer, the first circuit layer is used for being connected with a heating element, the heat dissipation plate is provided with a first heat conduction part used for being connected with the heating element, a liquid cooling cavity is formed in the heat dissipation plate, and circulating cooling liquid is arranged in the liquid cooling cavity;

The first daughter board is provided with a first accommodating hole for accommodating the heating element, and the first heat conduction part defines the bottom surface of the first accommodating hole;

Or the first daughter board is provided with a first avoidance hole, the first heat conduction part is positioned in the first avoidance hole, and the first heat conduction part is contacted with the first circuit layer.

2. The circuit board heat dissipation structure according to claim 1, wherein the first sub-board is provided with a first avoidance hole, the first heat conduction portion is located in the first avoidance hole, and the first heat conduction portion is in contact with the first circuit layer; and part of the liquid cooling cavity is positioned in the first heat conduction part.

3. The circuit board heat dissipation structure according to claim 1 or 2, wherein the heat dissipation plate includes a first plate close to the first sub-plate and a second plate distant from the first sub-plate, the liquid cooling chamber being located between the first plate and the second plate; and a supporting piece is further arranged in the heat dissipation plate, and two opposite ends of the supporting piece are respectively connected with the first plate and the second plate.

4. The circuit board heat dissipation structure of claim 3, wherein the support member is a support column, and the support column is provided with a plurality of support columns and a plurality of support columns are distributed at intervals.

5. The circuit board heat dissipation structure according to claim 4, wherein the supporting member is a supporting bar, and a length direction of the supporting bar is perpendicular to an arrangement direction of the first board and the second board.

6. The circuit board heat dissipating structure of claim 5, wherein the support bar extends along a curvilinear path along a length of the support bar.

7. The circuit board heat dissipation structure of claim 6, wherein a plurality of the support bars are provided and a plurality of the support bars are provided at intervals.

8. The circuit board heat dissipation structure according to claim 3, wherein the material of the first plate and the material of the supporting member are both copper, and the material of the second plate is aluminum.