CN221162094U - Circuit board assembly, compressor, air conditioner and vehicle - Google Patents

Abstract

The utility model provides a circuit board assembly, a compressor, an air conditioner and a vehicle, wherein the circuit board assembly is used for the compressor, the compressor comprises a shell, and the circuit board assembly comprises: an insulating mounting portion; the power device is at least partially arranged in the insulating installation part and is installed on the shell through the insulating installation part; and the circuit board is connected with the power device.

Description

Circuit board assembly, compressor, air conditioner and vehicle

Technical Field

The utility model relates to the technical field of household appliances, in particular to a circuit board assembly, a compressor, an air conditioner and a vehicle.

Background

In the related art, power devices within the circuit board assembly of the compressor are secured to a mounting plate or housing by threaded fasteners. However, the power device, the threaded fastener and the mounting plate or the shell are conducted by current due to insufficient insulation electric clearance, so that the power device is easily broken down by the current to be damaged, and the use safety is poor.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art or related art.

To this end, a first aspect of the utility model provides a circuit board assembly.

The second aspect of the present utility model also provides a compressor.

The third aspect of the present utility model also provides an air conditioner.

A fourth aspect of the utility model also provides a vehicle.

In view of this, a first aspect of the present utility model proposes a circuit board assembly for a compressor, the compressor comprising a housing, the circuit board assembly comprising: an insulating mounting portion; the power device is at least partially arranged in the insulating installation part and is installed on the shell through the insulating installation part; and the circuit board is connected with the power device.

The circuit board assembly provided by the utility model is applied to a compressor, and comprises an insulating mounting part, a power device and a circuit board, wherein the power device is connected with the circuit board, and is at least partially arranged in the insulating mounting part, so that the power device is not required to be connected with the insulating mounting part by using other connecting pieces, and is arranged on a shell of the compressor through the insulating mounting part.

The circuit board assembly provided by the utility model can also have the following additional technical characteristics:

In some possible designs, a pin is provided on the power device, at least a portion of the power device is encased in an insulative mounting portion, and the pin is connected to the circuit board.

In the design, the pins are arranged on the power device, at least one part of the power device is wrapped in the insulating installation part, so that the connection strength between the power device and the insulating installation part is improved, and the power device can be prevented from being broken down. The pins are connected with the circuit board, so that the electric connection between the power device and the circuit board is realized.

Optionally, the power device and the insulating mounting portion are injection molded as a unitary structure. Specifically, an insulating mounting part is injection molded outside the power device through an injection molding process, so that the insulating mounting part is wrapped outside the power device. In the related art, the mounting plate for mounting the power device is generally formed by metal machining, so that the overall cost is high, and the manufacturing cost is reduced.

In some possible designs, a portion of the pin extends beyond the insulative mounting portion to connect with the circuit board.

In this design, the pin stretches out insulating installation department to realize the electricity with the circuit board and be connected, need not with the help of other parts, the cost is reduced, also can avoid the risk that the device portion breaks down.

In some possible designs, a mounting portion is provided on the circuit board, the mounting portion being disposed in correspondence with and connected to the pins.

In the design, the circuit board is provided with a mounting part corresponding to the pin, and the pin is connected with the mounting part to realize the connection of the power device and the circuit board.

In some possible designs, the insulative mounting portion is a plastic piece.

In the design, the insulating installation part is a plastic part, so that the safety performance of the power device is improved, and the manufacturing cost is reduced on the basis of avoiding breakdown of the power device.

In some possible designs, the insulative mounting portion is a bulk molding compound.

In the design, the insulating installation part is a bulk molding compound part, the bulk molding compound part is made of bulk molding compound and is thermosetting plastic, and various inert fillers, fiber reinforced materials, catalysts, stabilizers and pigments are mixed in the thermosetting plastic, so that the flame retardant requirement can be met, and the heat resistance and the insulating property are good.

Optionally, the thickness between one side of the insulating installation part, facing the shell, of the power device and the shell to be protected is set to be less than or equal to 1mm, so that the heat dissipation requirement of the power device is guaranteed.

In some possible designs, the circuit board assembly further comprises: and the insulating heat conducting piece is at least partially wrapped in the insulating installation part and is positioned between the power device and the shell.

In this design, circuit board subassembly still includes insulating heat conduction spare, and insulating heat conduction spare at least a portion parcel is in insulating installation department, does not need other parts to connect, has reduced the use of spare part, also can avoid leading to the power device to break down by the electric current and damage the condition emergence after increasing the spare part of connecting usefulness, and insulating heat conduction spare is located between power device and the casing for power device exchanges heat and dispels the heat through between insulating heat conduction spare and the casing, ensures that power device has better radiating effect.

In some possible designs, where a portion of the thermally insulating member is wrapped within the thermally insulating mounting portion, a first side of the thermally insulating member is attached to the power device and a second side of the thermally insulating member is exposed outside the thermally insulating mounting portion, wherein the second side of the thermally insulating member is connected to the housing.

In this design, the partly parcel of insulating heat conduction spare is in insulating installation department, and insulating heat conduction spare's first side and power device laminating, and insulating heat conduction spare's opposite side exposes insulating installation department and is connected with the casing, and then derives the heat that power device produced, promotes power device's radiating effect.

It is understood that the second side of the insulating and heat conducting member may be flush with the surface of the insulating and mounting portion, or may protrude from the insulating and mounting portion, so that the second side of the insulating and heat conducting member is exposed from the insulating and mounting portion.

In a specific application, the insulating and heat conducting member is placed on one side of the power device, and then injection molding is performed on the insulating and heat conducting member and the outer part of the power device through an injection molding process to form an insulating mounting portion, so that at least one part of the insulating and heat conducting member and at least one part of the power device are wrapped by the insulating mounting portion.

Specifically, the insulating and heat conducting member is placed under the power device.

In some possible designs, a thermally conductive silicone grease or a thermally conductive glue is provided between the insulating thermally conductive member and the housing.

In this design, through heat conduction silicone grease or heat conduction glue heat conduction between insulating heat conduction spare and the casing, improved the heat conductivility between insulating heat conduction spare and the casing, simultaneously, coating heat conduction silicone grease or heat conduction glue between casing and the insulating heat conduction spare can fill the gap between insulating heat conduction spare and the casing for insulating heat conduction spare is tightly laminated on the casing through heat conduction silicone grease or heat conduction glue, has increased the area of contact between insulating heat conduction spare and the casing, has promoted the heat conductivility between insulating heat conduction spare and the casing.

In some possible designs, the thickness between the first side of the thermally insulating and conductive member and the second side of the thermally insulating and conductive member is less than or equal to 1mm.

In this design, the heat dissipation of power device can be influenced to the too big thickness of insulating heat conduction spare, consequently, sets the thickness of insulating heat conduction spare to 1mm or less, has guaranteed power device's heat dissipation demand.

In some possible designs, the insulating and thermally conductive member is a ceramic spacer.

In the design, the insulating heat conducting piece is a ceramic gasket, and the ceramic gasket has insulating property and can realize heat conduction, so that the power device can be prevented from being broken down by current, and the heat conducting property of the power device can be improved.

In some possible designs, the insulative mounting portion is an insulative injection molded piece that is overmolded over all or a portion of the outer surface of the power device.

In this design, insulating installation department is insulating injection molding, and insulating injection molding package is moulded at the whole surface or the partial surface of power device for insulating injection molding and power device integrated into one piece have improved the joint strength between insulating injection molding and the power device, have also improved insulating injection molding's parcel effect to power device.

Optionally, all of the power devices are overmolded inside the insulating injection molding.

According to a second aspect of the present utility model, there is also provided a compressor comprising: a housing; and the circuit board assembly as set forth in any one of the first aspects, wherein the circuit board assembly is disposed in the housing, and the insulative mounting portion is connected to the housing.

The compressor provided by the second aspect of the utility model comprises the circuit board assembly provided by any one of the above technical schemes, so that the compressor has all the beneficial effects of the circuit board assembly. Meanwhile, the insulating installation part is installed on the shell, and heat dissipation of the power device can be achieved through the shell.

In some possible designs, the insulative mounting portion is connected to the housing by a connector or the insulative mounting portion is bonded to the housing.

In this design, insulating installation department passes through the connecting piece to be connected with the casing, has guaranteed the joint strength and the compactness of connection between insulating installation department and the casing, and then has promoted power device's radiating effect. The insulating installation department also can bond on the casing, specifically, insulating installation department can bond on the casing through insulating glue, or bond on the casing through heat conduction glue, or bond on the casing through insulating heat conduction glue, and then promote power device's radiating effect.

In some possible designs, the thickness of the portion of the insulative mounting portion between the housing-facing wall of the power device and the housing is 1mm or less.

In this design, the thickness of the portion between the wall surface of the insulating mounting portion, which is in contact with the housing, and the wall surface of the power device, which faces the housing, is too large, and heat dissipation of the power device is affected, and therefore, the thickness of the portion between the wall surface of the insulating mounting portion, which faces the housing, of the power device, and the housing is set to be 1mm or less, and heat dissipation requirements of the power device are ensured.

In some possible designs, a compression chamber and an electrical chamber are provided within the housing, the electrical chamber is located outside the compression chamber, an insulated mounting is provided within the electrical chamber, and the insulated mounting is located on a side of the electrical chamber that is adjacent to the compression chamber.

In this design, a compression chamber and an electrical chamber are provided within the housing, the electrical chamber being located outside the compression chamber. The compression chamber is used for holding compression mechanism to realize the corresponding function of compressor, insulating installation department sets up in the electric cavity, in order to avoid compression mechanism during operation to produce the influence to the circuit board subassembly, wherein, insulating installation department sets up in electric cavity one side that is close to compression chamber, can promote power device's radiating effect.

In some possible designs, the compressor further comprises: the motor is arranged in the compression cavity and comprises a crankshaft; and the compression mechanism is arranged in the compression cavity and connected with the crankshaft, and the motor is positioned on one side of the compression mechanism, which is close to the insulating installation part.

In this design, the compressor also includes motor and the compression mechanism of setting up in compressing the intracavity, and the compression mechanism is connected to the bent axle, and the during operation of motor passes through bent axle drive compression mechanism operation to realize compressing the compression of the medium in the compression mechanism. The motor is positioned on one side of the compression mechanism, which is close to the insulation installation part, namely the insulation installation part is close to the motor, so that the heat dissipation of the power device is prevented from being influenced by high temperature when the compression mechanism works.

According to a third aspect of the present utility model, there is also provided an air conditioner, comprising: a circuit board assembly as claimed in any one of the first aspects, or a compressor as claimed in any one of the second aspects.

The air conditioner provided in the third aspect of the present utility model, because of comprising the circuit board assembly as set forth in any one of the first aspects or the compressor as set forth in any one of the second aspects, has all the advantages of the circuit board assembly or the compressor, and will not be described herein.

According to a fourth aspect of the present utility model, there is also provided a vehicle comprising: a circuit board assembly as set forth in any one of the first aspects, or a compressor as set forth in any one of the second aspects, or an air conditioner as set forth in any one of the third aspects.

The vehicle provided in the fourth aspect of the present utility model, because of comprising the circuit board assembly as set forth in any one of the first aspects, or the compressor as set forth in any one of the second aspects, or the air conditioner as set forth in any one of the third aspects, has all the advantages of the circuit board assembly, or the compressor or the air conditioner, and will not be described herein.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 shows one of the structural schematic diagrams of a compressor according to an embodiment of the present utility model;

FIG. 2 shows one of the schematic structural diagrams of a circuit board assembly according to one embodiment of the present utility model;

FIG. 3 illustrates an exploded view of a circuit board assembly according to one embodiment of the present utility model;

FIG. 4 shows a second schematic diagram of a circuit board assembly according to an embodiment of the utility model;

FIG. 5 shows a third schematic diagram of a circuit board assembly according to an embodiment of the utility model;

FIG. 6 shows a second schematic structural view of a compressor according to an embodiment of the present utility model;

FIG. 7 shows a third schematic diagram of a circuit board assembly according to an embodiment of the utility model

FIG. 8 shows an enlarged schematic view at A of the embodiment shown in FIG. 7;

FIG. 9 is a schematic view showing a partial structure of a compressor according to an embodiment of the present utility model;

Fig. 10 is a schematic block diagram of an air conditioner according to an embodiment of the present utility model;

FIG. 11 shows a schematic block diagram of a vehicle of an embodiment of the utility model.

The correspondence between the reference numerals and the component names in fig. 1 to 11 is:

1 insulating installation department, 2 power device, 22 pins, 3 circuit board, 4 casings, 40 electric air chambers, 42 compression chambers, 5 insulating heat conducting members, 50 first sides, 52 second sides, 54 ceramic gaskets, 56 heat conducting silicone grease, 6 compression mechanisms, 7 motors, 8 crankshafts, 100 compressors, 200 air conditioners and 300 vehicles.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways than those described herein, and therefore the scope of the present utility model is not limited to the specific embodiments disclosed below.

A circuit board assembly, a compressor 100, an air conditioner, and a vehicle according to some embodiments of the present utility model are described below with reference to fig. 1 to 11.

As shown in fig. 1, according to an embodiment of the present utility model, the present utility model proposes a circuit board assembly for a compressor 100, the compressor 100 including a housing 4, the circuit board assembly comprising: an insulating mounting portion 1, a power device 2, and a circuit board 3.

Specifically, the power device 2 is at least partially disposed in the insulating mounting portion 1, and the power device 2 is mounted to the housing 4 through the insulating mounting portion 1; the circuit board 3 is connected to the power device 2.

The circuit board assembly provided by the utility model is applied to a compressor 100, the compressor 100 comprises a shell 4, the circuit board assembly comprises an insulating installation part 1, a power device 2 and a circuit board 3, the power device 2 is connected with the circuit board 3, and the power device 2 is at least partially arranged in the insulating installation part 1, so that the power device 2 is installed on a piece to be installed through the insulating installation part 1, the power device 2 and the insulating installation part 1 are connected without using other connecting pieces, the structure is simple, and the power device 2 is installed on the shell 4 through the insulating installation part 1, so that the condition that the power device 2 is broken down due to insufficient electric clearance between the power device 2 and other structural parts can be avoided, the service life and safety performance of the power device 2 are improved, the protection structure for increasing withstand voltage around the power device 2 or on other structural parts is not needed, and the manufacturing cost is reduced.

It is understood that the insulative mounting portion 1 is a structure made of an insulative material. Specifically, the insulative mounting portion 1 is wrapped around the outside of the power device 2, and has a plate shape as a whole. The power device 2 refers to a semiconductor device capable of withstanding high voltage and current.

Optionally, the insulating mounting portion 1 comprises a mounting cavity within which at least a portion of the power device 2 is disposed. Or the insulating mounting part 1 is wrapped on at least part of the outer wall surface of the power device 2 through injection molding, so that the insulating mounting part 1 is tightly attached to the power device 2.

It will be appreciated that the power device 2 is at least partially disposed within the insulative mounting portion 1, including a portion of the power device 2 being encased within the insulative mounting portion 1, and the entirety of the power device 2 being encased within the insulative mounting portion 1.

Alternatively, all of the power device 2 is wrapped inside the insulative mounting portion 1.

As shown in fig. 1 and 5, according to some embodiments of the present application, optionally, a pin 22 is provided on the power device 2, at least a portion of the power device 2 is wrapped in the insulating mounting portion 1, and the pin 22 is connected to the circuit board 3.

In this embodiment, the pins 22 are disposed on the power device 2, and at least a part of the power device 2 is wrapped in the insulating mounting portion 1, so that breakdown of the power device 2 can be avoided. The pins 22 are connected with the circuit board 3, and the power device 2 is electrically connected with the circuit board 3.

Alternatively, the power device 2 is injection molded with the insulative mounting portion 1 as a unitary structure. Specifically, the insulating mounting part 1 is injection-molded outside the power device 2 through an injection molding process, so that the insulating mounting part 1 is wrapped outside the power device 2.

It can be understood that at least a part of the power device 2 is wrapped in the insulating installation part 1, so that the wall surface of the power device 2 is attached to the insulating installation part 1, and therefore the limit of the power device 2 is realized, the power device 2 is not required to be connected with the insulating installation part 1 by using other connecting pieces, the use of parts is reduced, and meanwhile, the cost is also reduced.

In a specific application, the pins 22 may directly extend out of the insulating mounting portion 1 to be connected with the circuit board 3, or the pins 22 may be electrically connected with the circuit board 3 through other connectors, or a connecting wire on the circuit board 3 extends into the insulating mounting portion 1 to be connected with the pins 22.

As shown in fig. 2, 3, 4 and 5, optionally, a portion of the pin 22 extends out of the insulative mounting portion 1 to connect with the circuit board 3, according to some embodiments of the present application.

In this embodiment, the pins 22 extend out of the insulating mounting portion 1 to make electrical connection with the circuit board 3, without the aid of other components, reducing costs and avoiding the risk of breakdown of the device portion 20.

According to some embodiments of the application, the insulating mount 1 is optionally a plastic piece.

In this embodiment, the insulating mounting portion 1 is a plastic member, and on the basis of improving the safety performance of the power device 2 and avoiding breakdown of the power device 2, the manufacturing cost is reduced.

In a specific application, the insulating mounting portion 1 comprises a polyethylene sheet, a polyvinyl chloride sheet, a polypropylene sheet, or the like.

According to some embodiments of the application, the insulating mount 1 is optionally a bulk moulding compound.

In this embodiment, the insulating mounting part 1 is a bulk molding compound, and the bulk molding compound is made of bulk molding compound and is a thermosetting plastic, and various inert fillers, fiber reinforcing materials, catalysts, stabilizers and pigments are mixed therein, so that the flame retardant requirement can be met, and the heat resistance and the insulating property are good.

As shown in fig. 6, 7 and 8, the circuit board 3 assembly optionally further comprises: and the insulating heat conducting piece 5, at least one part of the insulating heat conducting piece 5 is wrapped in the insulating mounting part 1, and the insulating heat conducting piece 5 is positioned between the power device 2 and the shell 4.

In this embodiment, the circuit board 3 assembly further includes an insulating heat conducting member 5, at least a portion of the insulating heat conducting member 5 is wrapped in the insulating mounting portion 1, no other components are needed for connection, use of components is reduced, the situation that the power device 2 is damaged due to current breakdown caused by adding components for connection can be avoided, and the insulating heat conducting member 5 is located between the power device 2 and the housing 4, so that the power device 2 exchanges heat and dissipates heat through between the insulating heat conducting member 5 and the housing 4, and a good heat dissipation effect of the power device 2 is ensured.

Alternatively, the insulating and heat conducting member 5 is a material having both insulating properties and heat conducting properties. The material may be ceramic material or other material such as glass fiber.

As shown in fig. 8 and 9, optionally, in a case where a portion of the insulating and heat conducting member 5 is wrapped in the insulating mounting portion 1, a first side 50 of the insulating and heat conducting member 5 is attached to the power device 2, and a second side 52 of the insulating and heat conducting member 5 is exposed outside the insulating mounting portion 1, wherein the second side 52 of the insulating and heat conducting member 5 is connected with the housing 4, according to some embodiments of the present application.

In this embodiment, a part of the insulating and heat-conducting member 5 is wrapped in the insulating and mounting portion 1, and the first side 50 of the insulating and heat-conducting member 5 is attached to the power device 2, and the other side of the insulating and heat-conducting member 5 exposes out of the insulating and mounting portion 1 and is connected to the housing 4, so that heat generated by the power device 2 is led out, and the heat dissipation effect of the power device 2 is improved.

It is understood that the second side 52 of the insulating and heat conducting member 5 may be flush with the surface of the insulating and mounting portion 1, or may protrude from the insulating and mounting portion 1, so that the second side 52 of the insulating and heat conducting member 5 is exposed from the insulating and mounting portion 1.

In a specific application, the insulating and heat conducting member 5 is placed on one side of the power device 2, and then injection molding is performed on the insulating and heat conducting member 5 and the outside of the power device 2 through an injection molding process to form the insulating mounting portion 1, so that the insulating mounting portion 1 wraps at least a portion of the insulating and heat conducting member 5 and at least a portion of the power device 2.

Specifically, the insulating and heat conducting member 5 is placed below the power device 2.

As shown in fig. 9, optionally, a thermally conductive silicone grease 56 or a thermally conductive glue is provided between the insulating and thermally conductive member 5 and the housing 4, according to some embodiments of the present application.

In this embodiment, heat conduction is performed between the insulating and heat conducting member 5 and the housing 4 through the heat conducting silicone grease 56 or the heat conducting glue, so that the heat conducting performance between the insulating and heat conducting member 5 and the housing 4 is improved, and meanwhile, the heat conducting silicone grease 56 or the heat conducting glue is coated between the housing 4 and the insulating and heat conducting member 5, so that gaps between the insulating and heat conducting member 5 and the housing 4 can be filled, the insulating and heat conducting member 5 is tightly attached to the housing 4 through the heat conducting silicone grease 56 or the heat conducting glue, the contact area between the insulating and heat conducting member 5 and the housing 4 is increased, and the heat conducting performance between the insulating and heat conducting member 5 and the housing 4 is improved.

As shown in fig. 9, optionally, the thickness H2 between the first side 50 of the thermally insulating and conductive member 5 and the second side 52 of the thermally insulating and conductive member 5 is 1mm or less, according to some embodiments of the present application.

In this embodiment, too large a thickness of the insulating and heat conducting member 5 affects heat dissipation of the power device 2, and therefore, setting the thickness H2 of the insulating and heat conducting member 5 to 1mm or less ensures heat dissipation requirements of the power device 2.

Alternatively, the thickness H2 of the insulating and heat conducting member 5 is equal to any value of 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9 mm.

According to some embodiments of the application, the insulating and thermally conductive member 5 is optionally a ceramic spacer 54.

In this embodiment, the insulating and heat conducting member 5 is a ceramic pad 54, and the ceramic pad 54 has both insulating properties and is capable of conducting heat, so that it is possible to avoid the power device 2 from being broken down by current and to improve the heat conducting properties of the power device 2.

According to some embodiments of the application, the insulating mounting portion 1 is optionally an insulating injection molded part that is over-molded on all or part of the outer surface of the power device 2.

In this embodiment, the insulating mounting portion 1 is an insulating injection molding piece, that is, the insulating mounting portion 1 is injection molded, and the insulating injection molding piece is molded on all or part of the outer surface of the power device 2, that is, the insulating injection molding piece and the power device 2 are integrally molded, so that the connection strength between the insulating injection molding piece and the power device 2 is improved, and the wrapping effect of the insulating injection molding piece on the power device 2 is also improved.

Optionally, the entirety of the power device 2 is overmolded inside the insulating injection molding.

According to an embodiment of the present utility model, there is also provided a compressor 100 including: a housing 4; and the circuit board assembly as set forth in any of the above embodiments, the circuit board assembly is provided in the housing 4, and the insulating mounting portion 1 is connected to the housing 4.

As shown in fig. 1, the compressor 100 provided by the present utility model includes the circuit board assembly according to any of the above embodiments, and thus has all the advantages of the circuit board assembly. At the same time, the insulating mounting portion 1 is mounted on the housing 4, and heat dissipation of the power device 2 can be achieved by the housing 4.

According to some embodiments of the application, the insulating mount 1 is optionally connected to the housing 4 by a connector, or the insulating mount 1 is glued to the housing 4.

In this embodiment, the insulating mounting portion 1 is connected with the housing 4 through the connecting piece, so that the connection strength between the insulating mounting portion 1 and the housing 4 and the connection tightness are ensured, and the heat dissipation effect of the power device 2 is further improved. The insulating mounting portion 1 may also be adhered to the housing 4, specifically, the insulating mounting portion 1 may be adhered to the housing 4 by insulating glue, or adhered to the housing 4 by heat conducting glue, or adhered to the housing 4 by insulating heat conducting glue, so as to improve the heat dissipation effect of the power device 2.

In a specific application, the connecting piece comprises a connecting piece such as a screw, a bolt and the like, and can also be a connecting piece formed by a connecting structure such as a bulge, a buckle and the like.

According to some embodiments of the present application, optionally, a thickness H1 of a portion of the insulative mounting portion 1 located between a wall surface of the power device 2 facing the housing 4 and the housing 4 is 1mm or less.

In this embodiment, the thickness of the portion between the wall surface of the insulating mounting portion 1 connected to the housing 4 and the wall surface of the power device 2 facing the housing 4 is too large, and heat dissipation of the power device 2 is affected, and therefore, the thickness H1 of the portion of the insulating mounting portion 1 between the wall surface of the power device 2 facing the housing 4 and the housing 4 is set to 1mm or less, ensuring heat dissipation requirements of the power device 2.

In a specific application, the thickness H1 of the portion of the insulative mounting portion 1 located between the wall surface of the power device 2 facing the housing 4 and the housing 4 is any one of 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9 mm.

As shown in fig. 6, according to some embodiments of the present application, optionally, a compression chamber 42 and an electrical chamber 40 are provided in the housing 4, the electrical chamber 40 is located outside the compression chamber 42, the insulative mounting portion 1 is provided in the electrical chamber 40, and the insulative mounting portion 1 is located on a side of the electrical chamber 40 adjacent to the compression chamber 42.

In this embodiment, a compression chamber 42 and an electrical chamber 40 are provided within the housing 4, the electrical chamber 40 being located outside the compression chamber 42. The compression chamber 42 is used for holding the compression mechanism 6 to realize the corresponding function of compressor 100, and insulating installation department 1 sets up in electric chamber 40, in order to avoid compression mechanism 6 during operation to exert an influence to the circuit board subassembly, and wherein, insulating installation department 1 sets up in electric chamber 40 one side that is close to compression chamber 42, can promote the radiating effect of power device 2.

As shown in fig. 6, according to some embodiments of the present application, optionally, the compressor 100 further includes: a motor 7 provided in the compression chamber 42, the motor 7 including a crankshaft 8; the compression mechanism 6 is arranged in the compression cavity 42, and the compression mechanism 6 is connected with the crankshaft 8, wherein the motor 7 is positioned on one side of the compression mechanism 6 close to the insulating mounting part 1.

In this embodiment, the compressor 100 further includes a motor 7 and a compression mechanism 6 disposed in the compression chamber 42, the crankshaft 8 is connected to the compression mechanism 6, and the motor 7 drives the compression mechanism 6 to operate through the crankshaft 8 when in operation, so as to compress a medium in the compression mechanism 6. The motor 7 is located at one side of the compression mechanism 6 close to the insulation mounting portion 1, that is, the insulation mounting portion 1 is located close to the motor 7, so that heat dissipation of the power device is prevented from being affected by high temperature when the compression mechanism 6 works.

Optionally, the housing 4 includes a housing body including the compression chamber 42 and a cover connected to the housing body and enclosing the electrical chamber 40 with the housing body.

Optionally, the compressor 100 further includes a connector, a part of which is disposed outside the housing 4 and a part of which protrudes into the electric cavity 40 to be connected to the circuit board 3.

As shown in fig. 10, according to an embodiment of the present utility model, there is also provided an air conditioner 200 including: a circuit board assembly as set forth in any of the embodiments above, or a compressor 100 as set forth in any of the embodiments above.

The air conditioner 200 provided by the present utility model, because of comprising the circuit board assembly as set forth in any of the above embodiments or the compressor 100 as set forth in any of the above embodiments, has all the beneficial effects of the circuit board assembly or the compressor 100, and will not be described herein.

As shown in fig. 11, according to an embodiment of the present utility model, there is also provided a vehicle 300 including: a circuit board assembly as set forth in any of the above embodiments, or a compressor 100 as set forth in any of the above embodiments, or an air conditioner 200 as set forth in any of the above embodiments.

The vehicle 300 provided by the present utility model, because of comprising the circuit board assembly as set forth in any of the embodiments, or the compressor 100 as set forth in any of the embodiments, or the air conditioner 200 as set forth in any of the embodiments, has all the advantages of the circuit board assembly, or the compressor 100, or the air conditioner 200, and will not be described herein.

In a specific application, the compressor 100 according to the present utility model comprises: housing 4, PCB (Printed Circuit Board, PCB) assembly. The PCB subassembly is located the holding chamber in the casing 4, and the circuit board subassembly includes: a PCB board, a power device 2, and a mounting board (e.g., an insulating mounting portion 1) for fixing the power device 2 and heat dissipation.

The mounting plate is made of network bulk molding compound (Bulk Moulding Compound, BMC) materials or plastic materials, the power device 2 is placed in the mounting plate, and the mounting plate wraps the power device 2. The compressor 100 according to the present application has a simple structure and low manufacturing cost.

Optionally, the mounting plate encloses the power device 2.

Optionally, the power device 2 has pins 22, and the pins 22 extend out of the mounting board and are soldered to the PCB.

Alternatively, the thickness H of the plane of the side of the power device 2 facing the housing 4 and the plane of the mounting plate facing the housing 4 is less than or equal to 1mm.

Alternatively, the plane of the side of the mounting plate facing the housing 4 is in contact with the housing 4.

The application has the characteristics of low production and manufacturing cost of the PCB assembly, improves the voltage-resistant insulation characteristic, effectively avoids the damage of the power device 2 caused by breakdown, and has good insulation effect and low production cost.

For example, the compressor 100 may be a PCB assembly integrated motor compressor 100.

Specifically, be formed with casing 4 in the casing 4 and hold the chamber, PCB subassembly locates the chamber that holds of casing 4, PCB subassembly includes the PCB board, power device 2 and mounting panel, power device 2 locates in the mounting panel, the mounting panel adopts BMC material or plastic material to constitute, the mounting panel contacts with casing 4 each other towards the plane of one side of casing 4, ensure that power device 2 has better radiating effect, and avoid fixing power device 2 on casing 4 or sheet metal component through threaded fastener in the correlation technique and cause the poor scheduling problem of withstand voltage, be favorable to reduction in production cost, ensure that power device 2 is connected reliably with the mounting panel, can not take place the skew. Meanwhile, the problems that the power device 2 is damaged due to the fact that the fastening torque of the threaded fastener is too large, the power device 2 is loosened or displaced due to the fact that the fastening torque is too small, and the like are avoided.

Alternatively, the mounting plate covers only a part of the power device 2, not the whole power device 2.

Optionally, the mounting plate is fastened and connected with the shell 4 by adopting a screw, so that the mounting plate is favorable for being closely attached to the plane of the shell 4 and the shell 4, the temperature of the mounting plate is favorable for being reduced, and the power device 2 dissipates heat.

In the present utility model, the term "plurality" means two or more, unless explicitly defined otherwise. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (17)

1. A circuit board assembly for a compressor, the compressor comprising a housing, the circuit board assembly comprising:

an insulating mounting portion;

The power device is at least partially arranged in the insulating installation part and is installed on the shell through the insulating installation part;

and the circuit board is connected with the power device.

2. The circuit board assembly of claim 1, wherein the power device is provided with pins, at least a portion of the power device is wrapped in the insulating mounting portion, and the pins are connected to the circuit board.

3. The circuit board assembly of claim 2, wherein a portion of the pin extends beyond the insulative mounting portion to connect with the circuit board.

4. A circuit board assembly according to any one of claims 1 to 3, wherein the insulative mounting portion is a plastic piece.

5. The circuit board assembly of claim 4, wherein the insulative mounting portion is a bulk molding compound.

6. A circuit board assembly according to any one of claims 1 to 3, further comprising:

and the insulating heat conduction piece is at least partially wrapped in the insulating installation part and is positioned between the power device and the shell.

7. The circuit board assembly of claim 6, wherein a first side of the thermally conductive member is attached to the power device with a portion of the thermally conductive member wrapped within the thermally conductive mounting portion, a second side of the thermally conductive member is exposed outside the thermally conductive mounting portion,

Wherein the second side of the insulating heat conducting member is connected with the housing.

8. The circuit board assembly of claim 7, wherein a thermally conductive silicone grease or a thermally conductive adhesive is disposed between the thermally conductive member and the housing.

9. The circuit board assembly of claim 7, wherein a thickness between the first side of the thermally insulating member and the second side of the thermally insulating member is 1mm or less.

10. The circuit board assembly of claim 6, wherein the insulating and thermally conductive member is a ceramic spacer.

11. A circuit board assembly according to any one of claims 1 to 3, wherein the insulative mounting portion is an insulative injection molded part over all or part of the outer surface of the power device.

12. A compressor, comprising:

a housing; and

The circuit board assembly according to any one of claims 1 to 11, provided within the housing, the insulative mounting portion being connected to the housing.

13. The compressor of claim 12, wherein,

The insulating installation part is connected with the shell through a connecting piece, or the insulating installation part is bonded with the shell.

14. The compressor of claim 12, wherein a compression chamber and an electrical chamber are provided within the housing, the electrical chamber being located outside the compression chamber, the insulative mounting portion being disposed within the electrical chamber, and the insulative mounting portion being located on a side of the electrical chamber proximate the compression chamber.

15. The compressor of claim 14, further comprising:

the motor is arranged in the compression cavity and comprises a crankshaft;

the compression mechanism is arranged in the compression cavity and is connected with the crankshaft,

Wherein the motor is located at one side of the compression mechanism near the insulating mounting portion.

16. An air conditioner, comprising:

A circuit board assembly according to any one of claims 1 to 11, or

A compressor as claimed in any one of claims 12 to 15.

17. A vehicle, characterized by comprising:

A circuit board assembly according to any one of claims 1 to 11, or

A compressor as claimed in any one of claims 12 to 15; or (b)

The air conditioner as set forth in claim 16.