CN221151631U - Circuit board bonding pad structure - Google Patents
Circuit board bonding pad structure Download PDFInfo
- Publication number
- CN221151631U CN221151631U CN202322745194.5U CN202322745194U CN221151631U CN 221151631 U CN221151631 U CN 221151631U CN 202322745194 U CN202322745194 U CN 202322745194U CN 221151631 U CN221151631 U CN 221151631U
- Authority
- CN
- China
- Prior art keywords
- bonding pad
- circuit board
- solder paste
- pad structure
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 229910000831 Steel Inorganic materials 0.000 claims description 14
- 239000010959 steel Substances 0.000 claims description 14
- 238000003466 welding Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000006071 cream Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The application relates to a circuit board bonding pad structure. The circuit board bonding pad structure comprises: PCB board, first pad and second pad, first pad sets up on the PCB board, and first pad has the bulge, and the second pad sets up on the PCB board, and the second pad has the recess, and bulge and recess are parallel and level each other. The scheme provided by the application can replace a 0 ohm resistor, thereby reducing the production cost and simplifying the process of connecting the resistor with other parts.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a bonding pad structure of a circuit board.
Background
The 0 ohm resistor is also called a crossover resistor, the resistance value of the 0 ohm resistor is not zero, and the resistance value of the 0 ohm resistor is small in practice, so that the 0 ohm resistor is usually used for connecting lines.
In the related art, the number of 0 ohm resistors in the circuit board is large, so that on one hand, the production cost is increased, on the other hand, the number of processes for connecting the resistors with other parts is increased due to excessive resistors, and the connection reject ratio is naturally increased.
Disclosure of utility model
The utility model aims to overcome the defects in the prior art and provide a circuit board bonding pad structure which can replace a 0 ohm resistor, thereby reducing the production cost and simplifying the process of connecting the resistor with other parts.
The aim of the utility model is realized by the following technical scheme:
The first aspect of the present application provides a circuit board pad structure, comprising: a PCB board; the first bonding pad is arranged on the PCB and is provided with a protruding part; the second bonding pad is arranged on the PCB and is provided with a concave part, and the convex part and the concave part are mutually flush.
The first bonding pad is provided with a first side edge and a second side edge, and the first side edge is connected with the second side edge to form the protruding part.
The second bonding pad is provided with a third side edge and a fourth side edge, and the third side edge is connected with the fourth side edge to form the concave part.
A first gap is provided between the first side and the third side.
A second gap is arranged between the second side edge and the fourth side edge, and the first gap is communicated with the second gap.
The first side edge and the third side edge are parallel to each other, and the second side edge and the fourth side edge are parallel to each other.
And a first steel mesh area is arranged on the first bonding pad and used for welding first solder paste.
And a second steel mesh area is arranged on the second bonding pad and used for welding second solder paste.
The first solder paste is connected with the second solder paste.
The first solder paste and the second solder paste are parallel to each other.
Compared with the prior art, the utility model has at least the following advantages:
Through set up the bulge at first pad and set up the recess at the second pad, be in order to increase two pads tin back, area of contact between two tin cream, and after the tin cream heats, can appear liquid form, the tin cream can follow the bulge and go deep into the inside of second pad liquid tin cream, carry out abundant contact, the surface tension of the liquid tin cream in the second pad can promote its to middle diffusion, and then make two tin creams link to each other, form a zero ohm resistance, thereby reduce manufacturing cost and simplify the technology that resistance and other spare parts are connected.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described.
Fig. 1 is a schematic structural diagram of a circuit board pad structure according to an embodiment of the utility model.
Detailed Description
Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While embodiments of the present application are illustrated in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art.
It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited by these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the application. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected or detachably connected or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
At present, the 0 ohm resistor is widely applied to the circuit board, but the use amount of the 0 ohm resistor is large, so that the cost is increased, the process for connecting the resistor with other parts is increased, and the connection reject ratio is naturally increased.
Aiming at the problems, the embodiment of the application provides a bonding pad structure of a circuit board, which can replace a 0 ohm resistor, thereby reducing the production cost and simplifying the process of connecting the resistor with other parts.
The following describes the technical scheme of the embodiment of the present application in detail with reference to the accompanying drawings.
Referring to fig. 1, a circuit board pad structure includes: a PCB board 100; the first bonding pad 200, the first bonding pad 200 is disposed on the PCB board 100, the first bonding pad 200 has a protrusion 210; the second bonding pad 300, the second bonding pad 300 is disposed on the PCB board 100, the second bonding pad 300 has a concave portion 310, and the convex portion 210 and the concave portion 310 are flush with each other.
Specifically, the first pad 200 has a first side 220 and a second side 230, the first side 220 is connected to the second side 230 to form the protrusion 210, the second pad 300 has a third side 320 and a fourth side 330, the third side 320 is connected to the fourth side 330 to form the recess 310, and the first side 220 is parallel to the third side 320, and the second side 230 is parallel to the fourth side 330.
More specifically, a first gap 400 is provided between the first side 220 and the third side 320, a second gap 500 is provided between the second side 230 and the fourth side 330, and the first gap 400 communicates with the second gap 500.
It should be noted that, by providing the convex portion 210 on the first pad 200 and providing the concave portion 310 on the second pad 300, the contact area between the two solder pastes is increased after the two pads are soldered. Under normal conditions, the bonding pad is a linear gap, the length is equivalent to the right-angle side of a right triangle, and when the bonding pad is set to be a protruding part, the length is equivalent to the hypotenuse of a right triangle, and in a right triangle, the hypotenuse length is larger than the right-angle side, so that the area of solder paste can be larger. And after the solder paste is heated, the solder paste is in a liquid state, and the solder paste can extend into the second bonding pad 300 from the protruding part 210 to fully contact the inside of the liquid solder paste, and the surface tension of the liquid solder paste in the second bonding pad 300 can promote the liquid solder paste to diffuse towards the middle, so that the two solder pastes are connected to form a zero ohm resistor, thereby reducing the production cost and simplifying the process of connecting the resistor with other parts.
Referring to fig. 1, in an embodiment, a first steel mesh area is formed on the first bonding pad 200, and the first steel mesh area is used for soldering a first solder paste. The second bonding pad 300 is provided with a second steel mesh area for welding a second solder paste.
It should be noted that, when the first solder paste and the second solder paste need to be connected, the window opening area of the first steel mesh area and the second steel mesh area needs to be increased, so that the first solder paste and the second solder paste are connected. When the first solder paste and the second solder paste are required to be parallel to each other, that is, the first solder paste and the second solder paste are not required to be connected together, and other parts are required to be welded independently, the window opening areas of the first steel mesh area and the second steel mesh area are required to be reduced correspondingly, and the first steel mesh area is required to be far away from the protruding part.
The aspects of the present application have been described in detail hereinabove with reference to the accompanying drawings. In the foregoing embodiments, the descriptions of the embodiments are focused on, and for those portions of one embodiment that are not described in detail, reference may be made to the related descriptions of other embodiments. Those skilled in the art will also appreciate that the acts and modules referred to in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application may be sequentially adjusted, combined and pruned according to actual needs, and the modules in the device of the embodiment of the present application may be combined, divided and pruned according to actual needs.
The foregoing description of embodiments of the application has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the improvement of technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A circuit board bonding pad structure, comprising:
a PCB board;
The first bonding pad is arranged on the PCB and is provided with a protruding part; and
The second bonding pad is arranged on the PCB and is provided with a concave part, and the convex part and the concave part are mutually flush.
2. The circuit board bonding pad structure according to claim 1, wherein the first bonding pad has a first side and a second side, and the first side is connected to the second side to form the protruding portion.
3. The circuit board bonding pad structure according to claim 2, wherein the second bonding pad has a third side and a fourth side, and the third side is connected to the fourth side to form the recess.
4. The circuit board pad structure of claim 3, wherein a first gap is provided between the first side and the third side.
5. The circuit board bonding pad structure according to claim 4, wherein a second gap is provided between the second side and the fourth side, the first gap being in communication with the second gap.
6. The circuit board bonding pad structure according to claim 4, wherein the first side and the third side are parallel to each other, and the second side and the fourth side are parallel to each other.
7. The circuit board bonding pad structure according to claim 1, wherein a first steel mesh area is formed on the first bonding pad, and the first steel mesh area is used for welding a first solder paste.
8. The circuit board bonding pad structure according to claim 7, wherein a second steel mesh area is provided on the second bonding pad, and the second steel mesh area is used for soldering a second solder paste.
9. The circuit board pad structure of claim 8, wherein the first solder paste is connected to the second solder paste.
10. The circuit board bonding pad structure according to claim 8, wherein the first solder paste and the second solder paste are parallel to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322745194.5U CN221151631U (en) | 2023-10-12 | 2023-10-12 | Circuit board bonding pad structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322745194.5U CN221151631U (en) | 2023-10-12 | 2023-10-12 | Circuit board bonding pad structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221151631U true CN221151631U (en) | 2024-06-14 |
Family
ID=91387032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322745194.5U Active CN221151631U (en) | 2023-10-12 | 2023-10-12 | Circuit board bonding pad structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221151631U (en) |
-
2023
- 2023-10-12 CN CN202322745194.5U patent/CN221151631U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |