CN206931732U - Ultra-fine spacing integrated circuit connector - Google Patents
Ultra-fine spacing integrated circuit connector Download PDFInfo
- Publication number
- CN206931732U CN206931732U CN201720585538.2U CN201720585538U CN206931732U CN 206931732 U CN206931732 U CN 206931732U CN 201720585538 U CN201720585538 U CN 201720585538U CN 206931732 U CN206931732 U CN 206931732U
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- China
- Prior art keywords
- integrated circuit
- connector
- ultra
- fine spacing
- circuit board
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Abstract
The utility model discloses a kind of ultra-fine spacing integrated circuit connector, including printed circuit board, connector and surface-mounted integrated circuit, by sequentially stacking from bottom to up, connector realizes that the compression between surface-mounted integrated circuit pin and printed circuit board copper pad contacts conducting by applying fixed compression ratio for printed circuit board, connector, surface-mounted integrated circuit.The reliability of surface-mounted integrated circuit and printed circuit board conductive interconnection under the conditions of thin space can be realized using the technical solution of the utility model, reduce the package dimension of IC chip, thin space integrated circuit can be replaced to flow packaging technology again, reduce the manufacturing cost of assembly cost and IC chip, in addition to the cost of connector is greatly reduced, overall cost can also be greatly reduced.
Description
Technical field
It the utility model is related to microelectronics Packaging and surface interconnection package technique, more particularly to a kind of integrated electricity of ultra-fine spacing
Path connector, including printed circuit board, connector and surface-mounted integrated circuit.
Background technology
At present, the interconnection such as integrated circuit and circuit board is all to use Reflow Solder Technology, and tin cream was first both passed through mould printing
Onto the copper pad of printed circuit board；Then, integrated circuit is placed with tin cream by chip mounter；Finally, by flowing again
Scolding tin is melted in weldering, realizes that the conducting of circuit board and integrated circuit connects.
However, the development trend of raising and the miniaturization with the performance of integrated circuit, and mobile communication equipment are small
Type development trend so that the pin of integrated circuit becomes more and more, and pin spacing becomes less and less, and assembling also becomes close
Degree more and more higher, technology difficulty also become increasing, have been even up to interconnection manufacture and the limit of technique.
In the prior art, thin space refers to that the distance values of conductive layer and insulating barrier PH are：0.25mm, 0.18mm, 0.10mm,
0.05mm, 0.03mm etc., and the current limit pin spacing of integrated circuit is approximately 0.3mm, the printing of tin cream, chip be placed with
And it is difficult to complete in packaging technology that last flowing again, which is all, and often there is the defective workmanship in each stage, such as paste solder printing
Collapse, print it is imperfect, draw point and soldering paste it is too thin；In attachment and Reflow process the problems such as rosin joint, tin sweat(ing) and bridge joint failure.This
A little technological problemses can all cause the rise of hazard rate and the rise of manufacturing cost.
Utility model content
For above-mentioned the deficiencies in the prior art, the utility model solve technical problem be how to solve printed circuit board with
The integrity problem of surface-mounted integrated circuit conductive interconnection under the conditions of thin space.
In order to solve the above technical problems, technical scheme provided by the utility model is a kind of ultra-fine spacing integrated circuit connection
Device, including printed circuit board, connector and surface-mounted integrated circuit, the printed circuit board, connector, surface-mounted integrated circuit press from it is lower to
Upper order stacks, and the connector realizes the surface-mounted integrated circuit pin and the printed circuit by applying fixed compression ratio
Compression contact conducting between plate copper pad.
The connector realizes that compression contact conduction mode is divided into card pressure or reflow welding by applying fixed compression ratio.
As further improvement of the utility model, described card pressure is by being realized with pedestal connector and press box
's.The inner side with pedestal connector carries projection, can more stably limit compression ratio with the press box card press-fit,
Realize that the surface-mounted integrated circuit pin is conductively connected with the relatively reliable of the printed circuit board copper pad, use simultaneously
It is simpler and convenient.
The connector is flexible elastic conduction rubber, and its profile depends on being elastically compressed being connected to printed circuit board
Structure, can be overall back-shaped structure or monolithic isolating construction, can correspond to realize with the top of surface-mounted integrated circuit, side,
Bottom is conductively connected.
As further improvement of the utility model, the connector outer can also add insulation boundary layer, to ensure conduction
Property is relatively reliable.
As further improvement of the utility model, the connector, which is that conductive rubber is alternate with insulating barrier, is superimposed accumulation shape
Into PH spacing, longitudinal direction conducting is formed.
As further improvement of the utility model, to improve the radiating effect and function of integrated circuit board chip, in institute
State setting silica gel bed course between printed circuit board and the surface-mounted integrated circuit.
By the connector realize with the printed circuit board copper pad be conductively connected in addition to the surface-mounted integrated circuit,
It can also be elastomer connector, flexible PCB, hot sealing Elecrical connector.
Using the technical solution of the utility model surface-mounted integrated circuit can be realized with printed circuit board under the conditions of thin space
The reliability of conductive interconnection, reduce the package dimension of IC chip, can be flowed again instead of thin space integrated circuit packaging technology,
The manufacturing cost of assembly cost and IC chip is reduced, in addition to the cost of connector is greatly reduced, overall cost can also be big
Width reduces.
Brief description of the drawings
Fig. 1 is the utility model structure diagram；
Fig. 2 is the ultra-fine spacing integrated circuit connector structural representation of clamp-press type；
Fig. 3 is the band ultra-fine spacing integrated circuit connector structural representation of pedestal clamp-press type；
Fig. 4 is the joiner structure longitudinally turned on；
Fig. 5 is the joiner structure of increase insulation boundary layer.
Embodiment
The utility model is further described below in conjunction with drawings and examples, but is not to limit of the present utility model
It is fixed.
Fig. 1 shows the utility model structure diagram, a kind of ultra-fine spacing integrated circuit connector, including printed circuit
Plate 1, connector 2 and surface-mounted integrated circuit 3, the printed circuit board 1, connector 2, surface-mounted integrated circuit 3 are folded by order from bottom to up
Put, the compressive deformation of connector 2 can so as to realize the pin of surface-mounted integrated circuit 3 and the copper pad of printed circuit board 1
By being conductively connected.
Embodiment 1：
Fig. 2 show it is a kind of using clamp-press type turn on ultra-fine spacing integrated circuit connector, including printed circuit board 1,
Connector 2, surface-mounted integrated circuit 3 and press box 4, the printed circuit board 1, connector 2, surface-mounted integrated circuit 3 and press box 4 press from it is lower to
Upper order stacks, and the compressive deformation of connector 2 is so as to realizing the pin of surface-mounted integrated circuit 3 and the bronze medal of printed circuit board 1
The reliable conductive connection of pad.
Embodiment 2：
Fig. 3 shows another using the ultra-fine spacing integrated circuit connector with the conducting of pedestal clamp-press type, including printing
Circuit board 1, connector 2, surface-mounted integrated circuit 3 and press box 4, embodiment 2 and the difference of example 1 are exactly that the connector 2 carries base
Seat, its inner side can more stably limit compression ratio with projection and the card press-fit of the outer of press box 4, realize described integrated
The pin of circuit board 3 is conductively connected with the relatively reliable of the copper pad of printed circuit board 1, at the same use it is simpler and
It is convenient.
Fig. 4 shows the joiner structure longitudinally turned on, black conductive rubber layer and white insulating barrier, and superposition accumulation is formed
PH spacing, form longitudinal direction conducting.Black conductive rubber layer is formed by addition silica gel technical recipe, has superconduction low resistive energy,
For nanoscale metal material.
Fig. 5 shows the joiner structure of increase insulation boundary layer, can reach the conducting of protection connection integrated circuit board chip
Effect.
Using the technical solution of the utility model surface-mounted integrated circuit can be realized with printed circuit board under the conditions of thin space
The reliability of interconnection, reduce the package dimension of IC chip, flow packaging technology, reduction group again instead of thin space integrated circuit
The manufacturing cost of this and IC chip is dressed up, in addition to the cost of connector is greatly reduced, overall cost can also be greatly reduced.
Detailed description, but the utility model are made that to embodiment of the present utility model above in association with drawings and examples
It is not limited to described embodiment.To those skilled in the art, principle and essence of the present utility model are not being departed from
In the case of god, various change, modification, replacement and modification are carried out to these embodiments and still fall within protection model of the present utility model
In enclosing.
Claims (10)
1. a kind of ultra-fine spacing integrated circuit connector, including printed circuit board（1）, surface-mounted integrated circuit（3）, the printed circuit
Plate（1）, surface-mounted integrated circuit（3）By sequentially stacking from bottom to up, it is characterised in that：Also include being placed on the printed circuit board（1）、
Surface-mounted integrated circuit（3）Between connector（2）, the connector（2）The integrated electricity is realized by applying fixed compression ratio
Road plate（3）Pin and the printed circuit board（1）Compression contact conducting between copper pad.
2. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Pass through
Apply fixed compression ratio and realize that compression contact conduction mode is pressed for card.
3. ultra-fine spacing integrated circuit connector according to claim 2, it is characterised in that：The connector（2）Carry
Pedestal, its inner side carry projection.
4. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Pass through
Apply fixed compression ratio and realize that compression contact conduction mode is reflow welding.
5. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To be soft
Property elastic conduction rubber, for overall back-shaped structure.
6. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To be soft
The elastic conduction rubber of property, is monolithic isolating construction.
7. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）Outer
Insulation boundary layer can also be added.
8. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：The connector（2）To lead
Electric rubber is alternate with insulating barrier to be superimposed accumulation and forms PH spacing, forms longitudinal direction conducting.
9. ultra-fine spacing integrated circuit connector according to claim 1, it is characterised in that：It is additionally included in the printing electricity
Road plate（1）And the surface-mounted integrated circuit（3）Between the silica gel bed course that sets.
10. the ultra-fine spacing integrated circuit connector according to any one of claim 1 to 9, it is characterised in that：By described
Connector（2）Realize and the printed circuit board（1）What copper pad was conductively connected removes the surface-mounted integrated circuit（3）Outside, can be with
It is elastomer connector, flexible PCB, hot sealing Elecrical connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720585538.2U CN206931732U (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720585538.2U CN206931732U (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206931732U true CN206931732U (en) | 2018-01-26 |
Family
ID=61351671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720585538.2U Active CN206931732U (en) | 2017-05-24 | 2017-05-24 | Ultra-fine spacing integrated circuit connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206931732U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107069261A (en) * | 2017-05-24 | 2017-08-18 | 桂林恒昌电子科技有限公司 | Ultra-fine spacing integrated circuit connector |
-
2017
- 2017-05-24 CN CN201720585538.2U patent/CN206931732U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107069261A (en) * | 2017-05-24 | 2017-08-18 | 桂林恒昌电子科技有限公司 | Ultra-fine spacing integrated circuit connector |
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| GR01 | Patent grant |