CN221102023U - Wafer cleaning carrier - Google Patents
Wafer cleaning carrier Download PDFInfo
- Publication number
- CN221102023U CN221102023U CN202322906941.9U CN202322906941U CN221102023U CN 221102023 U CN221102023 U CN 221102023U CN 202322906941 U CN202322906941 U CN 202322906941U CN 221102023 U CN221102023 U CN 221102023U
- Authority
- CN
- China
- Prior art keywords
- silica gel
- carrier body
- gel suction
- carrier
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000741 silica gel Substances 0.000 claims abstract description 37
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer cleaning carrier, which relates to the field of wafer cleaning devices and comprises a carrier body, a silica gel suction head, an air outlet pipe and a one-way valve, wherein the carrier body is arranged into a hollow cavity, the silica gel suction head is arranged at the top of the carrier body, the air outlet pipe is arranged at the bottom of the carrier body, the central through holes of the silica gel suction head and the air outlet pipe are communicated with the hollow cavity, and the one-way valve is arranged on the air outlet pipe. The utility model protects the main surface and the boundary area of the wafer and solves the problem that the wafer is contacted with the carrier in the processing process.
Description
Technical Field
The present utility model relates to wafer cleaning devices, and more particularly to a wafer cleaning carrier.
Background
The Epi-ready wafer processed by the wafer manufacturer has high surface requirements, and clients also put higher requirements on the edge of the wafer, the boundary area of the wafer is gradually tightened, and even based on certain special applications, the wafer is required to have a borderless area;
According to the existing wafer processing mode, the wafer cannot be prevented from being contacted with the carrier in the processing process, and a certain influence is caused on the main surface of the wafer, so that the wafer cannot meet the use requirement.
Therefore, how to provide a wafer cleaning carrier, protect the main surface and the boundary area of the wafer, and solve the problem that the wafer contacts with the carrier during the processing process, is a technical problem to be solved by those skilled in the art.
Disclosure of utility model
The utility model aims to provide a wafer cleaning carrier, which protects the main surface and the boundary area of a wafer and solves the problem that the wafer is contacted with the carrier in the processing process.
In order to solve the technical problems, the utility model adopts the following technical scheme:
The utility model relates to a wafer cleaning carrier which comprises a carrier body, a silica gel suction head, an air outlet pipe and a one-way valve, wherein the carrier body is arranged into a hollow cavity, the silica gel suction head is arranged at the top of the carrier body, the air outlet pipe is arranged at the bottom of the carrier body, the central through holes of the silica gel suction head and the air outlet pipe are communicated with the hollow cavity, and the one-way valve is arranged on the air outlet pipe.
Preferably, the air inlet end of the one-way valve is connected with the air outlet end of the air outlet pipe, and the air outlet end of the one-way valve is communicated with the vacuum pump through a vacuum air pipe.
Preferably, the side wall of the air outlet pipe is communicated with an air inlet pipe, the air inlet pipe is positioned above the one-way valve, and a valve is arranged on the air inlet pipe.
Preferably, the top of silica gel suction head sets up to open loudspeaker shape, the bottom of silica gel suction head sets up to cylindrically, the inside of silica gel suction head is provided with central through-hole and with hollow cavity is linked together.
Preferably, the number of the silica gel suction heads is one or more, the silica gel suction heads are arranged at the center of the carrier body in one time, the silica gel suction heads are circumferentially and uniformly distributed on the carrier body in a plurality of times, and the circle centers of the central annular lines in a plurality of times are concentric with the carrier body.
Preferably, a plurality of support legs are further arranged on the side edge of the carrier body.
Compared with the prior art, the utility model has the beneficial technical effects that:
1) The arrangement of the silica gel suction head not only plays a role in assisting in fixing the wafer, but also can protect the wafer and avoid the wafer from being damaged due to the fact that the wafer is directly contacted with the carrier body;
2) The one-way valve plays a role in maintaining the vacuum environment of the cavity of the carrier body, so that the convenience of the device is improved;
3) The air inlet pipe and the valve are arranged, when the wafer processing is finished, the valve is opened, and air enters the cavity of the carrier body from the air inlet pipe, so that the wafer and the carrier body can be separated conveniently;
4) The support legs are arranged, so that the support legs not only play a role in stably supporting the carrier body, but also play a certain role in protecting the air outlet pipe, the air inlet pipe and the one-way valve.
In general, the wafer cleaning carrier protects the main surface and the boundary area of the wafer and solves the problem that the wafer is contacted with the carrier in the processing process.
Drawings
The utility model is further described with reference to the following description of the drawings.
FIG. 1 is a cross-sectional view of an overall structure of a wafer cleaning carrier according to the present utility model;
FIG. 2 is a schematic view of the present utility model in use.
Reference numerals illustrate: 1. a carrier body; 2. silica gel suction head; 3. an air outlet pipe; 4. a one-way valve; 5. an air inlet pipe; 6. a valve; 7. and (5) supporting legs.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1-2, a wafer cleaning carrier comprises a carrier body 1, a silica gel suction head 2, an air outlet pipe 3 and a one-way valve 4, wherein the carrier body 1 is arranged as a hollow cavity, the silica gel suction head 2 is installed at the top of the carrier body 1, the air outlet pipe 3 is arranged at the bottom of the carrier body 1, central through holes of the silica gel suction head 2 and the air outlet pipe 3 are communicated with the hollow cavity, and the one-way valve 4 is installed on the air outlet pipe 3.
Specifically, the air inlet end of the one-way valve 4 is connected with the air outlet end of the air outlet pipe 3, and the air outlet end of the one-way valve 4 is communicated with the vacuum pump through a vacuum air pipe. Specifically, when the device is used, the air outlet end of the one-way valve is externally connected with a vacuum air pipe, and the vacuum air pipe is communicated with a vacuum pump to provide a vacuum environment for the hollow cavity; specifically, the one-way valve can play a role in maintaining the vacuum environment of the hollow cavity, and the convenience of the device is improved.
Specifically, the side wall of the air outlet pipe 3 is communicated with an air inlet pipe 5, the air inlet pipe 5 is located above the one-way valve 4, and a valve 6 is arranged on the air inlet pipe 5. Specifically, after the wafer processing is completed, the valve is opened, and air enters the cavity of the carrier body from the air inlet pipe, so that the separation work of the wafer and the carrier body is facilitated.
Specifically, the top of silica gel suction head 2 sets up to open loudspeaker shape, the bottom of silica gel suction head 2 sets up to cylindrically, the inside of silica gel suction head 2 is provided with central through-hole and with hollow cavity is linked together.
Specifically, the number of the silica gel suction heads 2 is one or more, the silica gel suction heads are arranged at the center of the carrier body 1 in one time, the silica gel suction heads are circumferentially and uniformly distributed on the carrier body 1 in a plurality of times, and the circle center of the central annular line in a plurality of times is concentric with the carrier body 1. Specifically, the arrangement of the silica gel suction head not only plays a role in assisting in fixing the wafer, but also can protect the wafer, and the wafer is prevented from being directly contacted with the carrier body to cause damage to the wafer; specifically, the user can set different numbers of silica gel suction heads according to the size of the wafer, so as to ensure the adsorption and fixation effects of the wafer and the carrier body; specifically, the user can arrange the plurality of silica gel suction heads in a round shape, a square shape or other shapes according to different shapes of the wafer.
Specifically, the side of the carrier body 1 is further provided with a plurality of supporting legs 7. Specifically, the setting of supporting leg not only plays the effect of firm support carrier body, can also play certain guard action to outlet duct, intake pipe, check valve.
The application process of the utility model is as follows:
Firstly, placing a pre-processed wafer on the upper part of a silica gel suction head; secondly, an external vacuum pump is communicated with the air outlet end of the one-way valve through a vacuum air pipe, and the valve on the air inlet pipe is ensured to be in a closed state; thirdly, after the external vacuum pump provides a vacuum environment with a proper degree for the hollow cavity of the carrier body, the connection between the vacuum air pipe and the one-way valve is disconnected, and at the moment, the wafer is adsorbed and fixed on the upper part of the silica gel suction head; then, the device and the wafer are processed together; finally, when the wafer processing is finished, the valve is opened, air enters the hollow cavity of the carrier body from the air inlet pipe, and the separation work of the wafer and the device is finished.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The above embodiments are only illustrative of the preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model, and various modifications and improvements made by those skilled in the art to the technical solutions of the present utility model should fall within the protection scope defined by the claims of the present utility model without departing from the design spirit of the present utility model.
Claims (6)
1. The wafer cleaning carrier is characterized in that: including carrier body (1), silica gel suction head (2), outlet duct (3) and check valve (4), carrier body (1) sets up to the cavity, silica gel suction head (2) are installed the top of carrier body (1), the bottom of carrier body (1) is provided with outlet duct (3), the center through-hole of silica gel suction head (2), outlet duct (3) all with cavity intercommunication, check valve (4) are installed on outlet duct (3).
2. The wafer cleaning carrier of claim 1, wherein: the air inlet end of the one-way valve (4) is connected with the air outlet end of the air outlet pipe (3), and the air outlet end of the one-way valve (4) is communicated with the vacuum pump through a vacuum air pipe.
3. The wafer cleaning carrier of claim 2, wherein: the side wall of the air outlet pipe (3) is communicated with an air inlet pipe (5), the air inlet pipe (5) is located above the one-way valve (4), and a valve (6) is arranged on the air inlet pipe (5).
4. The wafer cleaning carrier of claim 1, wherein: the top of silica gel suction head (2) sets up to open tubaeform, the bottom of silica gel suction head (2) sets up to cylindrically, the inside of silica gel suction head (2) is provided with central through-hole and with hollow cavity is linked together.
5. The wafer cleaning carrier of claim 4, wherein: the number of the silica gel suction heads (2) is one or more, the silica gel suction heads are arranged at the center of the carrier body (1) in one time, the silica gel suction heads are circumferentially and uniformly distributed on the carrier body (1) in a plurality of times, and the circle centers of the central annular lines in the plurality of times are concentric with the carrier body (1).
6. The wafer cleaning carrier of claim 1, wherein: the side of the carrier body (1) is also provided with a plurality of supporting legs (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322906941.9U CN221102023U (en) | 2023-10-30 | 2023-10-30 | Wafer cleaning carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322906941.9U CN221102023U (en) | 2023-10-30 | 2023-10-30 | Wafer cleaning carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221102023U true CN221102023U (en) | 2024-06-07 |
Family
ID=91312258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322906941.9U Active CN221102023U (en) | 2023-10-30 | 2023-10-30 | Wafer cleaning carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221102023U (en) |
-
2023
- 2023-10-30 CN CN202322906941.9U patent/CN221102023U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |