CN221087653U - Wafer cutting state distinguishing device of laser cutting machine - Google Patents
Wafer cutting state distinguishing device of laser cutting machine Download PDFInfo
- Publication number
- CN221087653U CN221087653U CN202322412550.1U CN202322412550U CN221087653U CN 221087653 U CN221087653 U CN 221087653U CN 202322412550 U CN202322412550 U CN 202322412550U CN 221087653 U CN221087653 U CN 221087653U
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- Prior art keywords
- cutting machine
- laser cutting
- wafer
- seal
- transmission device
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 37
- 238000005520 cutting process Methods 0.000 title claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims description 34
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 210000003128 head Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a device for distinguishing the cutting state of a wafer of a laser cutting machine, which comprises a support structure, a laser cutting machine and a laser cutting machine, wherein one side of the support structure is connected with an inner side frame of the laser cutting machine through a connecting bolt; the transmission device is arranged at one side of the supporting structure far away from the inner side frame of the laser cutting machine; the seal component is arranged at the bottom of the transmission device; a manipulator is arranged right below the seal component. The utility model adopts the supporting structure, the transmission device, the seal component and the manipulator to mark the seal component driven by the transmission device before the laser cut wafer is moved back to the material box by the manipulator; the following beneficial effects are achieved: the seal mark is added, so that whether the wafer is processed can be clearly distinguished, and whether the wafer is processed or not is judged manually without observation and cooperation experience; the sensor is arranged in the seal component, so that the problem of no seal trace caused by ink shortage is avoided; in the daily wafer processing operation process, the quality risk is avoided, and the workload of first-line staff is reduced.
Description
Technical Field
The utility model relates to the field of wafer processing, in particular to the technical field of wafer cutting state distinguishing in a laser cutting machine, and specifically relates to a wafer cutting state distinguishing device of the laser cutting machine.
Background
When the wafer is cut, a SDBG process is adopted, the wafer is processed by using laser, and the cutting mark is in the wafer and cannot be identified by naked eyes.
In the daily production process, because of various reasons, the wafer needs to be withdrawn, on-site operators cannot judge whether the wafer is cut by naked eyes, and the current control mode is as follows: at present, a management and control mode is not adopted, and the situation that the wafers which are not cut are mixed into subsequent processing and are caused to be processed is mainly judged by on-site personnel to carefully observe, record and experience.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a wafer cutting status distinguishing device of a laser cutting machine, which is used for solving the difficulties of the prior art.
To achieve the above and other related objects, the present utility model provides a wafer cutting status distinguishing device of a laser cutting machine, comprising:
the laser cutting machine comprises a supporting structure 1, wherein one side of the supporting structure 1 is connected with an inner side frame of the laser cutting machine through a connecting bolt 13;
the transmission device 2 is arranged on one side of the supporting structure 1 away from the inner side frame of the laser cutting machine;
The seal component 3 is arranged at the bottom of the transmission device 2;
and a manipulator 4 is arranged right below the seal component 3.
According to a preferred version, the support structure 1 comprises:
The laser cutting machine comprises an L-shaped plate 11, wherein positioning holes 12 are preset at equal intervals on the top of one side of the L-shaped plate 11, connecting bolts 13 penetrate through the positioning holes 12, the connecting bolts 13 are connected with an inner side frame of the laser cutting machine, and a boss 14 is arranged on the other side of the L-shaped plate 11;
The cushion block 15, the cushion block 15 sets up in the boss 14 one side of keeping away from locating hole 12, support locating hole 16 has been seted up all around to the cushion block 15, wear to be equipped with the bolt pole in the locating hole 12, bolt pole one side inlays and establishes in boss 14, and the opposite side inlays and establishes in transmission 2.
According to a preferred embodiment, the area of the spacer 15 on the side facing away from the transmission 2 is smaller than the area of the boss 14 on the side facing towards the transmission 2.
According to a preferred embodiment, the transmission 2 comprises: the cylinder arm 21 and cylinder pole 22, cylinder arm 21 one side links to each other with the cushion 15 through the bolt pole, cylinder arm 21 bottom wears to be equipped with cylinder pole 22, cylinder arm 21 drives cylinder pole 22 and moves down.
According to a preferred embodiment, the cylinder rod 22 has a length smaller than the length of the cylinder arm 21.
According to a preferred aspect, stamp assembly 3 comprises:
The ink box 31, the said ink box 31 couples to bottom of the cylinder pole 22 through welding, the top of the said ink box 31 has ink injection holes 32, the bottom of the said ink box 31 has ink outlet holes 33;
A seal head 34, wherein the seal head 34 is arranged right below the ink box 31, and the seal head 34 is connected with an ink outlet hole 33 of the ink box 31 through an oil pipe 35;
a sensor 36, the sensor 36 being disposed at the bottom end of the ink cartridge 31.
According to the preferred scheme, the outside that oil pipe 35 is close to seal 34 is provided with blotter 37, the cover is equipped with the spring between blotter 37 top and the ink cartridge 31.
According to a preferred scheme, a tray 41 is arranged on one side, close to the seal head 34, of the manipulator 4, and a wafer 5 is placed on the top end of the tray 41.
The utility model adopts a supporting structure, a transmission device, a seal component and a manipulator to mark the seal component driven by the transmission device before the laser cut wafer is moved back to the material box by the manipulator; the following beneficial effects are achieved:
(1) The seal mark is added, so that whether the wafer is processed can be clearly distinguished, and whether the wafer is processed or not is judged manually without observation and cooperation experience;
(2) The sensor is arranged in the seal component, so that the problem of no seal trace caused by ink shortage is avoided;
(3) In the daily wafer processing operation process, the quality risk is avoided, and the workload of first-line staff is reduced.
Preferred embodiments for carrying out the present utility model will be described in more detail below with reference to the attached drawings so that the features and advantages of the present utility model can be easily understood.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic perspective view of another view of the present utility model;
FIG. 3 is an enlarged schematic view showing a three-dimensional structure of a pad according to the present utility model;
Description of the reference numerals
1. A support structure; 11. an L-shaped plate; 12. positioning holes; 13. a connecting bolt; 14. a boss; 15. a cushion block; 16. a supporting and positioning hole; 2. a transmission device; 21. a cylinder arm; 22. a cylinder rod; 3. a stamp assembly; 31. an ink cartridge; 32. an ink injection hole; 33. an ink outlet hole; 34. a stamp head; 35. an oil pipe; 36. a sensor; 37. a cushion pad; 4. a manipulator; 41. a tray; 5. a wafer;
Detailed Description
In order to make the objects, technical solutions and advantages of the technical solutions of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings of specific embodiments of the present utility model. Like reference numerals in the drawings denote like parts. It should be noted that the described embodiments are some, but not all embodiments of the present utility model. All other embodiments, which can be made by a person skilled in the art without creative efforts, based on the described embodiments of the present utility model fall within the protection scope of the present utility model.
Possible embodiments within the scope of the utility model may have fewer components, have other components not shown in the drawings, different components, differently arranged components or differently connected components, etc. than the examples shown in the drawings. Furthermore, two or more of the elements in the figures may be implemented in a single element or a single element shown in the figures may be implemented as multiple separate elements.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. The terms "first," "second," and the like in the description and in the claims, are not used for any order, quantity, or importance, but are used for distinguishing between different elements. Likewise, the terms "a" or "an" and the like do not necessarily denote a limitation of quantity. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
The utility model provides a device for distinguishing the cutting state of a wafer of a laser cutting machine, which is used in a laser cutting process, the type of the laser cutting machine is not limited by the device, but the structure of a seal component is particularly suitable for distinguishing whether the wafer is processed or not clearly in a wafer cutting machine of SDBG processes.
In general, the device for distinguishing the wafer cutting state of the laser cutting machine mainly comprises a supporting structure 1, a transmission device 2, a seal assembly 3 and a manipulator 4, wherein, referring to fig. 1, the arrangement relationship of the supporting structure 1, the transmission device 2, the seal assembly 3 and the manipulator 4 is shown.
The device is arranged in a laser cutting machine through a supporting structure, is positioned after the cutting process of the laser cutting machine, and marks a seal component 3 driven by a transmission device 2 before a wafer subjected to laser cutting is moved back to a material box through a manipulator 4, so that a technician can distinguish whether the wafer is processed or not through naked eyes.
The above-mentioned bearing structure 1 one side links to each other with laser cutting machine inboard frame through connecting bolt 13, and the opposite side is provided with transmission 2, and bearing structure 1 includes: l template 11 and cushion 15, wherein equidistant locating hole 12 of predetermining in L template 11 one side top, wear to be equipped with connecting bolt 13 in the locating hole 12, connecting bolt 13 links to each other with laser cutting machine inboard frame, laser cutting machine inboard frame is not totally drawn and is not necessary technical structure, L template 11 opposite side is provided with boss 14, boss 14 is kept away from the one side of locating hole 12 and is connected with cushion 15 through the bolt, cushion 15 is equipped with support locating hole 16 in advance all around, wear to be equipped with the bolt shank in the support locating hole 16, bolt shank one side inlays and establishes in boss 14, the opposite side inlays and establishes in transmission 2.
The transmission device 2 is arranged on one side of the supporting structure 1 far away from the inner side frame of the laser cutting machine, and the transmission device 2 comprises: the cylinder arm 21 and cylinder pole 22, wherein cylinder arm 21 one side links to each other with cushion 15 through the bolt pole, and cylinder arm 21 bottom wears to be equipped with cylinder pole 22, and cylinder arm 21 drive cylinder pole 22 moves down.
The seal assembly 3 is disposed at the bottom of the transmission device 2, and the seal assembly 3 includes: the ink box 31, seal head 34 and sensor 36, wherein ink box 31 links to each other with the bottom of cylinder pole 22 through the welding, the filling hole 32 has been seted up on ink box 31 top, ink outlet 33 has been seted up to ink box 31 bottom, be provided with seal head 34 under ink box 31, seal head 34 links to each other with ink outlet 33 of ink box 31 through oil pipe 35, ink box 31 bottom is provided with sensor 36, when manipulator 4 transmits wafer 5 to seal assembly 3 under, whether the wafer 5 has been taken on the manipulator 4 is discerned to sensor 36, transmission 2 drive seal head 34 is stamped the mark at wafer 5 top after the discernment is accomplished, sensor 36 discernment wafer 5 top has the ink seal, if sensor 36 does not discern the ink seal then can report to the police, prevent seal head 34 because in the ink box 31 lack the ink and lead to follow-up engineer erroneous judgement.
The manipulator 4 is disposed under the stamp assembly 3, the manipulator 4 in the device is not necessarily a technical structure because the modules in the laser cutting machine are not all drawn, a tray 41 is disposed on one side of the manipulator 4 near the stamp 34, and a wafer 5 is disposed on the top of the tray 41.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (5)
1. The utility model provides a laser cutting machine wafer cutting state distinguishing device which characterized in that includes:
The laser cutting machine comprises a supporting structure (1), wherein one side of the supporting structure (1) is connected with an inner side frame of the laser cutting machine through a connecting bolt (13);
The transmission device (2) is arranged on one side of the supporting structure (1) away from the inner side frame of the laser cutting machine;
The seal component (3) is arranged at the bottom of the transmission device (2);
And the manipulator (4) is arranged right below the seal component (3).
2. The device according to claim 1, characterized in that said support structure (1) comprises:
the laser cutting machine comprises an L-shaped plate (11), wherein positioning holes (12) are formed in the top of one side of the L-shaped plate (11) at equal intervals, connecting bolts (13) are arranged in the positioning holes (12) in a penetrating mode, the connecting bolts (13) are connected with an inner side frame of the laser cutting machine, and a boss (14) is arranged on the other side of the L-shaped plate (11);
the cushion block (15), cushion block (15) set up in boss (14) one side of keeping away from locating hole (12), support locating hole (16) have been seted up all around to cushion block (15), wear to be equipped with the bolt pole in locating hole (12), bolt pole one side inlays and establishes in boss (14), and the opposite side inlays and establishes in transmission (2).
3. The device for distinguishing the cutting states of the wafers of the laser cutting machine according to claim 2, wherein the transmission device (2) comprises: the cylinder arm (21) and the cylinder rod (22), one side of the cylinder arm (21) is connected with the cushion block (15) through a bolt rod, the cylinder rod (22) is arranged at the bottom end of the cylinder arm (21) in a penetrating mode, and the cylinder arm (21) drives the cylinder rod (22) to move downwards.
4. A device for distinguishing between cutting states of a wafer in a laser cutting machine according to claim 3, wherein the stamp assembly (3) comprises:
The ink box (31), the ink box (31) is connected with the bottom of the cylinder rod (22) through welding, the top end of the ink box (31) is provided with an ink injection hole (32), and the bottom of the ink box (31) is provided with an ink outlet hole (33);
The seal head (34) is arranged right below the ink box (31), and the seal head (34) is connected with an ink outlet hole (33) of the ink box (31) through an oil pipe (35);
And the sensor (36) is arranged at the bottom end of the ink box (31).
5. The device for distinguishing the wafer cutting states of the laser cutting machine according to claim 4, wherein a tray (41) is arranged on one side, close to the seal head (34), of the manipulator (4), and a wafer (5) is placed on the top end of the tray (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322412550.1U CN221087653U (en) | 2023-09-06 | 2023-09-06 | Wafer cutting state distinguishing device of laser cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322412550.1U CN221087653U (en) | 2023-09-06 | 2023-09-06 | Wafer cutting state distinguishing device of laser cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221087653U true CN221087653U (en) | 2024-06-07 |
Family
ID=91319058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322412550.1U Active CN221087653U (en) | 2023-09-06 | 2023-09-06 | Wafer cutting state distinguishing device of laser cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221087653U (en) |
-
2023
- 2023-09-06 CN CN202322412550.1U patent/CN221087653U/en active Active
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