CN213635938U

CN213635938U - Automatic marking system for defective chips

Info

Publication number: CN213635938U
Application number: CN202022806611.9U
Authority: CN
Inventors: 王岩
Original assignee: MICA TECHNOLOGY(SUZHOU)CO Ltd
Current assignee: MICA TECHNOLOGY(SUZHOU)CO Ltd
Priority date: 2020-11-27
Filing date: 2020-11-27
Publication date: 2021-07-06
Anticipated expiration: 2030-11-27

Abstract

The utility model relates to a defect chip automatic marking system, which is used for automatically marking the position of a defect chip on a carrier tape, and comprises a punching device and a conveying and positioning mechanism; the conveying positioning mechanism comprises a conveying rack with a conveying channel and a feeding mechanism; through punching device and conveying positioning mechanism's cooperation setting, can treat the defect chip of mark position to a lot on the carrier band and carry out automatic mark, in the mark process, need not through other positioning device, directly just can be with the carrier band and the accurate transport of chip on it to the inside established position of punching device through conveying positioning mechanism, and the location is in this position, avoid the carrier band and chip on it to take place the skew in the front and back direction, satisfy and carry and fix a position two kinds of demands, reduce equipment input cost, and improve the operating efficiency.

Description

Automatic marking system for defective chips

Technical Field

The utility model relates to an automatic mark system of defect chip.

Background

At present, during chip sealing, the surface of a chip on a carrier tape is generally absolutely not allowed to have scratches, stains, ink, handprints and the like, so that the chip on the carrier tape needs to be detected, marks need to be made after the defects are found, and the defective chip is removed in the subsequent chip cutting process. All detect through artifical naked eye among the prior art, detection efficiency is low, and operation personnel fatigue strength is big, the wrong judgement easily appears, operate, cause subsequent bigger loss, the chip that carries on the belt among the prior art has multirow (generally three rows) adjacent two rows of chip distance near usually, after discovering the defect on the chip, if adopt artifical manual marking, then inefficiency, with high costs, personnel fatigue strength is big, how carry out automatic mark to the chip on the belt, and improve marking efficiency and become the technical problem that technical staff in the field await a great deal with promptly to solve.

Disclosure of Invention

The utility model aims to solve the technical problem that overcome prior art not enough, provide an automatic mark system of defect chip.

In order to solve the technical problem, the utility model discloses the technical scheme who takes as follows:

an automatic marking system for defective chips is used for automatically marking the positions of the defective chips on a carrier tape, and comprises a punching device and a conveying and positioning mechanism for gradually and accurately conveying batch chips on the carrier tape to the punching device for punching; the conveying positioning mechanism comprises a conveying rack with a conveying channel and a feeding mechanism which drives a carrier tape in the conveying channel to move and enables chips on the carrier tape to enter the punching device and be accurately positioned.

Preferably, the feeding mechanism is located downstream of the punching device in the moving direction of the carrier tape.

Preferably, the feeding mechanism comprises a first support frame, a rotating shaft rotatably arranged on the first support frame, two gears fixed on the periphery of the rotating shaft and distributed at intervals, and a stepping motor driving the rotating shaft to rotate.

Preferably, the punching device comprises a second support frame, a template which is fixedly arranged on the second support frame and provided with punched holes, a stripper plate which is fixedly arranged on the second support frame and positioned above the template, a plurality of punches which move up and down relative to the template, and a driving mechanism which is arranged on the second support frame and used for driving the punches to move up and down.

Preferably, the die plate is provided with three punched holes, and the three punches include a first punch, a second punch and a third punch which are respectively arranged corresponding to the punched holes.

Preferably, the driving mechanism comprises a first cylinder, a second cylinder and a third cylinder which are used for driving the first punch, the second punch and the third punch to move independently.

Preferably, the first cylinder is located above the stripper plate, and the second cylinder and the third cylinder are located below the die plate.

Preferably, the output shaft of the first cylinder is connected to the first ram.

Preferably, the output shaft of the second cylinder and the output shaft of the third cylinder are respectively butted with the second punch and the third punch through a transmission assembly.

Preferably, the second cylinder and the third cylinder are arranged side by side in a horizontal direction perpendicular to a moving direction of the carrier tape.

Preferably, the transmission assembly comprises a first cylinder body and a first transmission block, the lower end part of the first cylinder body is fixedly connected with the output shaft of the second cylinder, the upper end part of the first cylinder body penetrates upwards to the position above the stripper plate, the first transmission block is fixedly connected with the upper end part of the first cylinder body, and the upper end part of the second punch head is fixedly connected with the first transmission block; the transmission assembly further comprises a second cylinder and a second transmission block, the lower end portion of the second cylinder is fixedly connected with an output shaft of the third cylinder, the upper end portion of the second cylinder penetrates upwards to the position above the stripper plate, the second transmission block is fixedly connected with the upper end portion of the second cylinder, and the upper end portion of the third punch is fixedly connected with the second transmission block.

Due to the implementation of the above technical scheme, compared with the prior art, the utility model have the following advantage:

the utility model discloses an automatic mark system of defect chip, cooperation through punching device and transport positioning mechanism sets up, can carry out automatic mark to a lot of defect chips of treating the mark position on the carrier band, in the mark process, need not through other positioning device, direct through carrying positioning mechanism just can be with the carrier band and the accurate transport of chip on it to the inside established position of punching device, and fix a position at this position, avoid the carrier band and chip on it to take place the skew in the front and back direction, satisfy and carry and fix a position two kinds of demands, reduce the equipment input cost, and improve the operating efficiency.

Drawings

Fig. 1 is a schematic perspective view of the automatic marking system of the present invention;

fig. 2 is a schematic perspective view of the punching device of the present invention;

fig. 3 is a schematic perspective view of the feeding mechanism of the present invention;

wherein: 10. a second support frame; 11. a first cylinder; 101. a first punch; 12. a second cylinder; 102. a second punch; 13. a third cylinder; 103. a third punch; 14. a template; 15. a material removing plate; 16. a material guide block; 17. a material leaking pipe; 18. a material receiving box; a1, a first transmission block; a2, a first column; b1, a second transmission block; b2, a second column; 20. a second support frame; 21. a stepping motor; 22. a rotating shaft; 23. a gear.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1 to 3, an automatic marking system for defective chips is used for automatically marking the positions of the defective chips on a carrier tape; the automatic marking system comprises a punching device and a conveying and positioning mechanism, wherein the conveying and positioning mechanism is used for conveying batch chips on a carrier tape to the punching device step by step accurately for punching; the conveying positioning mechanism comprises a conveying rack with a conveying channel and a feeding mechanism which drives a carrier tape in the conveying channel to move and enables a chip on the carrier tape to enter the punching device and be accurately positioned; after the feeding mechanism pulls the carrier tape to enable the chips on the carrier tape to enter the punching device, the punching device punches holes at corresponding positions on the carrier tape beside the defective chips (instead of punching the chips), lower marks are made, and in the subsequent work, the defective chips can be judged by observing punched holes on the carrier tape, so that the defective chips are removed.

In this case, the feeding mechanism is located downstream of the punching device in the moving direction of the carrier tape. The feeding mechanism comprises a first support frame 20, a rotating shaft 22 rotatably arranged on the first support frame 20, two gears 23 fixed on the periphery of the rotating shaft 22 and distributed at intervals, and a stepping motor 21 driving the rotating shaft 22 to rotate. The two sides of the carrier tape are provided with a plurality of positioning holes which are uniformly distributed at intervals, the teeth of the gear 23 are matched with the positioning holes and can be inserted into the positioning holes, when the gear 23 is driven by the stepping motor 21 to rotate, the gear 23 drags the carrier tape to move forwards, and after the gear 23 stops rotating, the teeth of the gear 23 are still inserted into the corresponding positioning holes, so that the carrier tape is prevented from moving forwards and backwards and deviating, the carrier tape is stabilized to be punched, the stepping distance of the carrier tape can be accurately controlled by controlling the rotating angle of the gear 23, and the accuracy of the punching position is ensured.

Further, the punching device comprises a second support frame 10, a die plate 14 which is fixedly arranged on the second support frame 10 and is provided with a punched hole, a stripper plate 15 which is fixedly arranged on the second support frame 10 and is positioned above the die plate 14, a plurality of punches which move up and down relative to the die plate 14, and a driving mechanism which is arranged on the second support frame 10 and is used for driving the punches to move up and down. The multiple punches penetrate through the stripper plate 15 in the thickness direction of the stripper plate 15, and when the carrier tape moves and drives the chips on the carrier tape to move between the template 14 and the stripper plate 15, the driving mechanism can respectively and independently drive the multiple punches to punch holes on the carrier tape. Specifically, the die plate 14 has three punched holes, and the three punches include a first punch 101, a second punch 102, and a third punch 103, which are provided corresponding to the respective punched holes. The driving mechanism comprises a first air cylinder 11, a second air cylinder 12 and a third air cylinder 13 which respectively drive a first punch 101, a second punch 102 and a third punch 103 to independently move. The first cylinder 11 is positioned above the stripper plate 15, and the second cylinder 12 and the third cylinder 13 are positioned below the template 14; the second cylinder 12 and the third cylinder 13 are arranged side by side in a horizontal direction perpendicular to the moving direction of the carrier tape.

The output shaft of the first cylinder 11 is connected to the first ram 101. An output shaft of the second cylinder 12 and an output shaft of the third cylinder 13 are respectively in butt joint with a second punch 102 and a third punch 103 through transmission assemblies; the transmission assembly comprises a first cylinder a2 with the lower end fixedly connected with the output shaft of the second cylinder 12 and the upper end upwards penetrating to the upper part of the stripper plate 15, and a first transmission block a1 fixedly connected with the upper end of the first cylinder a2, and the upper end of the second punch 102 is fixedly connected with the first transmission block a 1; the transmission assembly further comprises a second cylinder b2 with the lower end fixedly connected with the output shaft of the third cylinder 13 and the upper end upwards penetrating above the stripper plate 15, a second transmission block b1 fixedly connected with the upper end of the second cylinder b2, and the upper end of the third punch 103 is fixedly connected with the second transmission block b 1. In addition, the punching device further comprises a receiving mechanism for receiving the punched waste, and the receiving mechanism comprises a material guide block 16 positioned below the punched hole of the template 14, a material leaking pipe 17 communicated with the material guide block 16, and a material receiving box 18 arranged below the material leaking pipe 17. The material receiving box 18 is positioned below the second cylinder 12 and the third cylinder 13. The material receiving box 18 is in a drawer type, and after the waste material is filled, the material receiving box 18 can be drawn out from the lower part of the support frame.

Because the chip on the carrier band generally has three rows, the chip on every row all has the defect possibility, consequently need independently punch a hole to the carrier band of the corresponding position of the defect chip in every row of chips, the utility model discloses punching device, through the structural design of position overall arrangement and drive assembly that each cylinder is in, effectively guarantee in narrow and small space range that each drift can independent motion, provide the prerequisite basis for the automatic mark of automatic defect chip.

To sum up, the utility model discloses an automatic mark system of defect chip, cooperation through punching device and transport positioning mechanism sets up, can treat the defect chip of mark position to a lot on the carrier band and carry out automatic mark, the mark in-process, need not through other positioning device, direct through carrying positioning mechanism just can be with the carrier band and the accurate transport of chip on it to the inside set position of punching device, and fix a position at this position, avoid the carrier band and chip on it to take place the skew in the front and back direction, satisfy and carry and fix a position two kinds of demands, reduce the equipment input cost, and improve the operating efficiency.

The present invention has been described in detail, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the same, and the protection scope of the present invention should not be limited thereby, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. The utility model provides a defect chip automated marking system which is used for carrying out automatic mark to defect chip position on the carrier band which characterized in that: the automatic marking system comprises a punching device and a conveying and positioning mechanism, wherein the conveying and positioning mechanism is used for gradually and accurately conveying batch chips on a carrier tape to the punching device for punching; the conveying and positioning mechanism comprises a conveying rack with a conveying channel and a feeding mechanism which drives a carrier tape in the conveying channel to move and enables chips on the carrier tape to enter the punching device and be accurately positioned.

2. The automated defective chip marking system of claim 1, wherein: the feeding mechanism is located downstream of the punching device in the moving direction of the carrier tape.

3. The automated defective chip marking system of claim 2, wherein: the feeding mechanism comprises a first support frame, a rotating shaft, two gears and a stepping motor, wherein the rotating shaft is rotatably arranged on the first support frame, the two gears are fixed on the periphery of the rotating shaft and are distributed at intervals, and the stepping motor drives the rotating shaft to rotate.

4. The automated defective chip marking system of claim 1, wherein: the punching device comprises a second support frame, a template which is fixedly arranged on the second support frame and provided with punched holes, a stripper plate which is fixedly arranged on the second support frame and positioned above the template, a plurality of punches which move up and down relative to the template, and a driving mechanism which is arranged on the second support frame and used for driving the punches to move up and down.

5. The automated defective chip marking system of claim 4, wherein: the template is provided with three punched holes, and the three punches comprise a first punch, a second punch and a third punch which are respectively arranged corresponding to the punched holes.

6. The automated defective chip marking system of claim 5, wherein: the driving mechanism comprises a first air cylinder, a second air cylinder and a third air cylinder which respectively drive the first punch, the second punch and the third punch to independently move.

7. The automated defective chip marking system of claim 6, wherein: the first cylinder is located above the stripper plate, and the second cylinder and the third cylinder are located below the template.

8. The automated defective chip marking system of claim 7, wherein: an output shaft of the first cylinder is connected with the first punch.

9. The automated defective chip marking system of claim 7, wherein: and the output shaft of the second cylinder and the output shaft of the third cylinder are respectively butted with the second punch and the third punch through a transmission assembly.

10. The automated defective chip marking system of claim 7, wherein: and the second cylinder and the third cylinder are distributed side by side in the horizontal direction perpendicular to the moving direction of the carrier tape.