CN221081620U - Printed circuit board structure - Google Patents
Printed circuit board structure Download PDFInfo
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- CN221081620U CN221081620U CN202322723759.XU CN202322723759U CN221081620U CN 221081620 U CN221081620 U CN 221081620U CN 202322723759 U CN202322723759 U CN 202322723759U CN 221081620 U CN221081620 U CN 221081620U
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- signal transmission
- circuit board
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- 230000008054 signal transmission Effects 0.000 claims abstract description 91
- 230000005540 biological transmission Effects 0.000 claims abstract description 47
- 238000005253 cladding Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 14
- 230000005855 radiation Effects 0.000 abstract description 11
- 238000013461 design Methods 0.000 abstract description 5
- 230000003313 weakening effect Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model relates to a printed circuit board structure comprising: a printed circuit top layer, a printed circuit bottom layer disposed parallel to the printed circuit top layer, and an inner transmission layer disposed parallel between the printed circuit top layer and the printed circuit bottom layer. The inner transmission layer is provided with a high-frequency signal transmission line and a first grounding line. The high frequency signal transmission lines are laid out in differential form. The first grounding wire is arranged around the outer periphery of the high-frequency signal transmission wire to form a surrounding area. The printed circuit board structure is characterized in that the high-frequency signal transmission lines are intensively arranged in the inner transmission layer in a differential wiring mode, and meanwhile, the first grounding wire is utilized to carry out surrounding ground treatment on the high-frequency signal transmission lines in the inner transmission layer, so that the built-in and surrounding ground shielding of the high-frequency signal transmission lines are realized. Through the design, the high-frequency signal transmission line is prevented from being exposed on the top layer or the bottom layer of the printed circuit board, a good shielding effect is achieved, an EMC radiation weakening effect is achieved, and therefore the problem that EMC radiation exceeds standard is solved.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board structure.
Background
In printed circuit board designs, wiring problems involving high frequency signal transmission lines are often encountered. The high-frequency signal transmission line is a connection line for transmitting a high-frequency signal. When transmitting high-frequency signals, compared with the common signal transmission line, the high-frequency signal transmission line can generate relatively large electromagnetic interference, and electronic products can not pass EMC (English is totally called electromagnetic compatibility and Chinese name is electromagnetic compatibility) test easily, so that shielding treatment is required to be carried out on the high-frequency signal transmission line during circuit design.
In the conventional printed circuit board structure, the high-frequency signal transmission lines are often inserted back and forth between the top layer, the inner layer and the bottom layer of the board, so when the high-frequency signal transmission lines are exposed on the surface areas of the printed circuit board such as the top layer and the bottom layer, the problem of exceeding EMC radiation is easily generated.
Disclosure of utility model
Based on the structure, the printed circuit board structure provided by the utility model can prevent the high-frequency signal transmission line from being exposed on the top layer or the bottom layer of the printed circuit board, has a good shielding effect and can weaken EMC radiation, thereby solving the problem of exceeding EMC radiation.
A printed circuit board structure comprising:
A top layer of printed circuit;
A printed circuit bottom layer disposed parallel to the printed circuit top layer; and
An inner transmission layer arranged in parallel between the top layer and the bottom layer of the printed circuit; the inner transmission layer is provided with a high-frequency signal transmission line and a first grounding wire; the high-frequency signal transmission lines are laid out in a differential form; the first grounding wire is arranged around the outer periphery of the high-frequency signal transmission wire to form a surrounding area.
The printed circuit board structure is characterized in that the high-frequency signal transmission lines are intensively arranged in the inner transmission layer in a differential wiring mode, and meanwhile, the first grounding wire is utilized to carry out surrounding ground treatment on the high-frequency signal transmission lines in the inner transmission layer, so that the built-in and surrounding ground shielding of the high-frequency signal transmission lines are realized. Through the design, the high-frequency signal transmission line is prevented from being exposed on the top layer or the bottom layer of the printed circuit board, a good shielding effect is achieved, an EMC radiation weakening effect is achieved, and therefore the problem that EMC radiation exceeds standard is solved.
In one embodiment, the printed circuit board structure further comprises: a first packet layer disposed in parallel between the inner transmission layer and the printed circuit substrate layer; the first package layer is provided with a second grounding wire; the projection of the second grounding wire along the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission wire and the first grounding wire. And the bottom surface of the high-frequency signal transmission line is covered by the second grounding wire of the first covering layer, so that the shielding effect is further enhanced.
In one embodiment, the printed circuit board structure further comprises: a second cladding layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the second cladding layer is provided with a third grounding wire; the projection of the third grounding wire along the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission wire and the first grounding wire. And covering the top surface of the high-frequency signal transmission line by using a third grounding wire of the second cladding layer, so that the first grounding wire, the second grounding wire and the third grounding wire form an omnibearing surrounding shield for the high-frequency signal transmission line.
In one embodiment, the top layer of the printed circuit is provided with a fourth ground line; the projection of the fourth ground line in a direction perpendicular to the inner transmission layer at least partially covers the high frequency signal transmission line and the first ground line. And covering the top surface of the high-frequency signal transmission line by using a fourth grounding wire on the top layer of the printed circuit in a covering way, so that the first grounding wire, the second grounding wire and the fourth grounding wire form a multidirectional surrounding shielding for the high-frequency signal transmission line.
In one embodiment, the printed circuit board structure further comprises: a third packet layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the third package layer is provided with a fifth grounding wire; the projection of the fifth ground line in the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission line and the first ground line. And covering the top surface of the high-frequency signal transmission line by using a fifth grounding wire of the third covering layer, so as to further strengthen the shielding effect.
In one embodiment, the printed circuit board structure further comprises: a fourth packet layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the fourth package layer is provided with a sixth grounding wire; the projection of the sixth ground line in the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission line and the first ground line. And covering the top surface of the high-frequency signal transmission line by using a sixth grounding wire of the fourth covering layer, so that the first grounding wire, the fifth grounding wire and the sixth grounding wire form an omnibearing surrounding shield for the high-frequency signal transmission line.
In one embodiment, the top layer of the printed circuit is provided with a seventh ground line; the projection of the seventh ground line in the direction perpendicular to the inner transmission layer at least partially covers the high-frequency signal transmission line and the first ground line. And covering the bottom surface of the high-frequency signal transmission line by using a seventh grounding wire at the bottom layer of the printed circuit in a covering way, so that the first grounding wire, the fifth grounding wire and the seventh grounding wire form a multidirectional surrounding shielding for the high-frequency signal transmission line.
In one embodiment, the printed circuit board structure further comprises: and the blank signal layer is arranged between the top layer of the printed circuit and the bottom layer of the printed circuit in parallel. The blank signal layers are used for counting, so that the sum of the layers of the printed circuit board is even, and the effects of reducing the manufacturing cost and balancing the structure are achieved.
Drawings
FIG. 1 is a perspective view of a printed circuit board structure according to one embodiment of the present utility model;
FIG. 2 is a perspective view of the printed circuit board structure shown in FIG. 1 from another perspective;
FIG. 3 is an exploded view of the printed circuit board structure shown in FIG. 1;
FIG. 4 is a schematic view of an inner transmission layer in the printed circuit board structure shown in FIG. 3;
fig. 5 is a schematic view of a first package layer in the printed circuit board structure shown in fig. 3.
The meaning of the reference numerals in the drawings are:
100-a printed circuit board structure;
10-top layer of printed circuit;
20-a printed circuit substrate;
30-an inner transmission layer, 31-a high-frequency signal transmission line, 32-a first ground line;
40-first packet layer, 41-second ground line.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
As shown in fig. 1 to 5, a printed circuit board structure 100 according to an embodiment of the present utility model is shown.
As shown in fig. 1 to 3, the printed circuit board structure 100 includes: a printed circuit top layer 10, a printed circuit bottom layer 20 disposed parallel to the printed circuit top layer 10, and an inner transmission layer 30 disposed parallel between the printed circuit top layer 10 and the printed circuit bottom layer 20. Wherein the printed circuit top layer 10 corresponds to the upper surface of the printed circuit board and the printed circuit bottom layer 20 corresponds to the lower surface of the printed circuit board. Both the printed circuit top layer 10 and the printed circuit bottom layer 20 are used to carry electronics and general signal transmission lines (without high frequency signal transmission lines). The inner transmission layer 30 is for carrying a high-frequency signal transmission line 31, and a shielding structure is provided for the high-frequency signal transmission line 31.
Hereinafter, the above-mentioned printed circuit board structure 100 will be further described with reference to fig. 1 to 5.
As shown in fig. 4, the inner transmission layer 30 is provided with a high-frequency signal transmission line 31 and a first ground line 32 (see a hatched area in fig. 4). The high-frequency signal transmission lines 31 are arranged in a differential mode, and the first grounding lines 32 are arranged around the outer periphery of the high-frequency signal transmission lines 31 to form a surrounding area.
Further, as shown in fig. 4, the number of the high-frequency signal transmission lines 31 may be plural, and the plural high-frequency signal transmission lines 31 are each provided to form a high-frequency signal transmission region. Meanwhile, the first ground line 32 is surrounded on the outer periphery of the high-frequency signal transmission line 31, so that the entire high-frequency signal transmission area is surrounded on the inner side of the first ground line 32, thereby playing an EMC radiation shielding effect of surrounding areas on the high-frequency signal transmission line 31.
To further enhance the EMC radiation shielding effect on the high frequency signal transmission line 31, the high frequency signal transmission line 31 may be subjected to a multi-directional packet processing:
Example 1: as shown in fig. 2 and 4, in the present embodiment, the printed circuit board structure 100 further includes: a first packet layer 40 disposed in parallel between the inner transmission layer 30 and the printed circuit substrate 20. The first packet layer 40 is provided with a second ground line 41 (see a hatched area in fig. 5). The projection of the second ground line 41 in the direction perpendicular to the inner transmission layer 30 covers the high-frequency signal transmission line 31 and the first ground line 32. The bottom surface of the high-frequency signal transmission line 31 is covered with the second ground line 41 of the first covering layer 40, thereby further enhancing the shielding effect.
Since the first ground line 32 and the second ground line 41 form a surrounding and bottom surface of the high-frequency signal transmission line 31, the processing can be also performed for the top surface of the high-frequency signal transmission line 31:
In one aspect, the printed circuit board structure 100 further comprises: a second cladding layer disposed in parallel between the inner transmission layer 30 and the printed circuit top layer 10. Wherein the second cladding layer is provided with a third ground line, and a projection of the third ground line in a direction perpendicular to the inner transmission layer 30 covers the high-frequency signal transmission line 31 and the first ground line 32. The top surface of the high-frequency signal transmission line 31 is covered with the third ground line of the second cladding layer so that the first ground line 32, the second ground line 41, and the third ground line form an omnibearing surrounding shield for the high-frequency signal transmission line 31.
In the second top clamping mode, the printed circuit top layer 10 may be provided with a fourth ground line. The projection of the fourth ground line in a direction perpendicular to the inner transmission layer 30 at least partially covers the high frequency signal transmission line 31 and the first ground line 32. The top surface of the high-frequency signal transmission line 31 is covered with the fourth ground line of the printed circuit top layer 10 so that the first ground line 32, the second ground line 41, and the fourth ground line form a multi-azimuth enclosure shield for the high-frequency signal transmission line 31.
The first top surface clamping mode and the second top surface clamping mode are different in that the first top surface clamping mode has the advantages of better shielding effect, and the disadvantage is that a new layer structure needs to be introduced, so that the sum of the layers of the printed circuit board is not beneficial to control. The top surface clamping method has the advantages of no need of introducing a new layer structure, contribution to controlling the sum of the layers of the printed circuit board, and the disadvantage of considering the residual space of the printed circuit top layer 10 after the layout of electronic devices and other signal transmission lines, large wiring pressure and difficulty in completely covering the top surface of the high-frequency signal transmission line 31. The two arrangements may be selected according to the specific circuit layout of the actual printed circuit board.
Example 2: similar to the idea of example 1. The printed circuit board structure 100 may further include: a third packet layer disposed in parallel between the inner transmission layer 30 and the printed circuit top layer 10. Wherein the third packet layer is provided with a fifth ground line, and a projection of the fifth ground line in a direction perpendicular to the inner transmission layer 30 covers the high-frequency signal transmission line 31 and the first ground line 32. The top surface of the high-frequency signal transmission line 31 is covered with the fifth ground line of the third covering layer, thereby further enhancing the shielding effect.
Since the first ground line 32 and the fifth ground line form a surrounding and top-face covering for the high-frequency signal transmission line 31 only, it is also possible to process for the bottom-face covering notch of the high-frequency signal transmission line 31:
In one embodiment, the printed circuit board structure 100 further comprises: a fourth packet layer disposed in parallel between the inner transmission layer 30 and the printed circuit top layer 10. Wherein the fourth packet layer is provided with a sixth ground line, and a projection of the sixth ground line in a direction perpendicular to the inner transmission layer 30 covers the high-frequency signal transmission line 31 and the first ground line 32. The top surface of the high-frequency signal transmission line 31 is covered with the sixth ground line of the fourth covering layer so that the first ground line 32, the fifth ground line, and the sixth ground line form an omnibearing enclosure shield for the high-frequency signal transmission line 31.
In the second bottom clamping mode, the top layer 10 of the printed circuit is provided with a seventh ground line. The projection of the seventh ground line in the direction perpendicular to the inner transmission layer 30 at least partially covers the high frequency signal transmission line 31 and the first ground line 32. The bottom surface of the high-frequency signal transmission line 31 is covered with the seventh ground line of the printed circuit substrate 20 so that the first ground line 32, the fifth ground line, and the seventh ground line form a multi-azimuth surrounding shield for the high-frequency signal transmission line 31.
The first bottom surface clamping mode and the second bottom surface clamping mode are different in that the first bottom surface clamping mode has the advantages of better shielding effect, and the disadvantage is that a new layer structure needs to be introduced, so that the sum of the layers of the printed circuit board is not beneficial to control. The second bottom clamping method has the advantages of no need of introducing a new layer structure, contribution to controlling the sum of layers of the printed circuit board, consideration of the remaining space of the printed circuit bottom layer 20 after the layout of electronic devices and other signal transmission lines, high wiring pressure and difficulty in completely covering the top surface of the high-frequency signal transmission line 31. The two arrangements may be selected according to the specific circuit layout of the actual printed circuit board.
In printed circuit board designs, it is often necessary to control the sum of the layers of the printed circuit board to an even number for reasons including: cost reasons and structural reasons.
Cost reasons: for the printed circuit board with the odd number of layers, the processing cost is obviously higher than that of the printed circuit board with the even number of layers. The processing cost of the inner layer is the same, but the foil/core structure significantly increases the processing cost of the outer layer.
The structural reasons are as follows: printed circuit boards with an odd number of layers in total are easily bendable. When the printed circuit board cools after the multi-layer circuit bonding process, the different lamination tensions of the core structure and foil structure may cause the printed circuit board to bend as it cools. As the thickness of the printed circuit board increases, the risk of the composite printed circuit board having two different structures bending increases. The key to eliminating the bending of the printed circuit board is to use balanced lamination. Although a printed circuit board bent to some extent meets the specification requirements, the subsequent processing efficiency will be reduced, resulting in an increase in cost. Quality is compromised because of the reduced accuracy of placement of the electronic devices due to the particular equipment and process required for assembly.
Thus, to control the sum of the layers of the printed circuit board, in some embodiments, the printed circuit board structure 100 may further include: and a blank signal layer disposed in parallel between the printed circuit top layer 10 and the printed circuit bottom layer 20. The blank signal layers are used for counting, so that the sum of the layers of the printed circuit board is even, and the effects of reducing the manufacturing cost and balancing the structure are achieved.
The working principle is briefly described:
As shown in fig. 4, in this embodiment, the high-frequency signal transmission lines 31 are concentrated in the inner transmission layer 30 in the form of differential wirings. Meanwhile, the high-frequency signal transmission line 31 is subjected to surrounding package treatment by the first grounding line 32 in the inner transmission layer 30, so that the high-frequency signal transmission line 31 is built-in and surrounding package shielding is realized.
The printed circuit board structure 100 prevents the high frequency signal transmission line 31 from being exposed on the top layer or the bottom layer of the printed circuit board, and has a good shielding effect, and a function of weakening EMC radiation, thereby solving the problem of exceeding EMC radiation.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The foregoing examples only represent preferred embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (8)
1. A printed circuit board structure comprising:
A top layer of printed circuit;
A printed circuit bottom layer disposed parallel to the printed circuit top layer; and
An inner transmission layer arranged in parallel between the printed circuit top layer and the printed circuit bottom layer; the inner transmission layer is provided with a high-frequency signal transmission line and a first grounding line; the high-frequency signal transmission lines are laid out in a differential form; the first grounding wire is arranged around the outer periphery of the high-frequency signal transmission wire in a surrounding mode to form a surrounding area.
2. The printed circuit board structure of claim 1, further comprising: a first packet layer disposed in parallel between the inner transmission layer and the printed circuit substrate layer; the first package layer is provided with a second grounding wire; the projection of the second grounding wire along the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission wire and the first grounding wire.
3. The printed circuit board structure of claim 2, further comprising: a second cladding layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the second cladding layer is provided with a third grounding wire; the projection of the third grounding wire along the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission wire and the first grounding wire.
4. The printed circuit board structure of claim 2, wherein the printed circuit top layer is provided with a fourth ground line; the projection of the fourth ground line in a direction perpendicular to the inner transmission layer at least partially covers the high-frequency signal transmission line and the first ground line.
5. The printed circuit board structure of claim 1, further comprising: a third packet layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the third package stratum is provided with a fifth grounding wire; the projection of the fifth grounding wire in the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission wire and the first grounding wire.
6. The printed circuit board structure of claim 5, further comprising: a fourth packet layer disposed in parallel between the inner transmission layer and the top layer of the printed circuit; the fourth package stratum is provided with a sixth grounding wire; the projection of the sixth ground line in the direction perpendicular to the inner transmission layer covers the high-frequency signal transmission line and the first ground line.
7. The printed circuit board structure of claim 5, wherein the printed circuit top layer is provided with a seventh ground line; the projection of the seventh grounding wire in the direction perpendicular to the inner transmission layer at least partially covers the high-frequency signal transmission wire and the first grounding wire.
8. The printed circuit board structure of any of claims 1 to 7, further comprising: and the blank signal layer is arranged between the printed circuit top layer and the printed circuit bottom layer in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322723759.XU CN221081620U (en) | 2023-10-11 | 2023-10-11 | Printed circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322723759.XU CN221081620U (en) | 2023-10-11 | 2023-10-11 | Printed circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221081620U true CN221081620U (en) | 2024-06-04 |
Family
ID=91254889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322723759.XU Active CN221081620U (en) | 2023-10-11 | 2023-10-11 | Printed circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221081620U (en) |
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- 2023-10-11 CN CN202322723759.XU patent/CN221081620U/en active Active
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