CN221050344U

CN221050344U - Semiconductor chip box

Info

Publication number: CN221050344U
Application number: CN202322895955.5U
Authority: CN
Inventors: 庞晓辉
Original assignee: Shanghai Yiyi Electronic Technology Co ltd
Current assignee: Shanghai Yiyi Electronic Technology Co ltd
Priority date: 2023-10-27
Filing date: 2023-10-27
Publication date: 2024-05-31
Anticipated expiration: 2033-10-27

Abstract

The utility model relates to the technical field of semiconductor chips and discloses a semiconductor chip box which comprises a base, wherein the top of the base is fixedly connected with a placement box, the top of the inner side of the placement box is fixedly connected with an outlet plate, the periphery of the inner side of the placement box is provided with a movable groove, the inner sides of a plurality of movable grooves are respectively and slidably connected with a sliding block, the adjacent sides of the sliding blocks are respectively and fixedly connected with a placement plate, the four corners of the top of the placement plate are respectively and fixedly connected with a limiting plate, the top of the placement plate is provided with a chip plate, the top of the placement plate is provided with a fixing assembly, and the top of the placement box is provided with a sealing mechanism. According to the utility model, the chip board is fixed through the placing board, the limiting board and the clamping board, the placing board is jacked up through the supporting board, so that the chip boards with different sizes can be conveniently fixed, meanwhile, the chip boards can be conveniently taken out, and the quality of chips is prevented from being influenced by moisture through the cover board, the clamping column and the drying board.

Description

Semiconductor chip box

Technical Field

The utility model relates to the technical field of semiconductor chips, in particular to a semiconductor chip box.

Background

Semiconductor chips are an integrated circuit component widely used in electronic devices and can realize the functions of storing, processing and transmitting electric signals, and semiconductor chip boxes are shells for packaging and protecting semiconductor chips, and because semiconductor chips are very fragile and sensitive components, the semiconductor chips need to be protected in the use process, and meanwhile, a proper interface is also needed to be provided for facilitating connection with other electronic devices.

Through retrieval, chinese patent publication number is: CN218827012U discloses a chip box convenient to clamp and get chip, comprising a base plate, the top fixedly connected with chip box of bottom plate, the export has been seted up on the surface of chip box, press down the hole has been seted up to the both sides on the top of chip box, the interior bottom fixedly connected with fixed plate of chip box, the top fixedly connected with bracing piece of fixed plate, the surface of bracing piece is provided with the pivot, the surface of pivot is provided with the rotation plate. This chip box convenient to press from both sides and get chip sets up through chip box, export, press the hole, pivot, rotor plate, chip and the cooperation of pressing the board, and during the use, the staff will press the pressing the hole on the board alignment chip box and press, and the rotor plate is through pressing down simultaneously, and the pivot can make the rotor plate rotate, and the chip on the rotor plate jack-up upwards, until the chip top is to the export surface to the export can be aimed at to the chip and take out, easy operation, the staff of being convenient for uses. However, in actual use, when the device is not used for taking out the chip, a certain distance exists between the inside of the chip box and the outlet, and the chip in the chip box can be unstable and shaky in the transportation process, so that the chip is easy to damage.

Disclosure of utility model

In order to make up for the defects, the utility model provides a semiconductor chip box, which aims to solve the problems that in the prior art, a chip still has a distance between the inside of the chip box and an outlet, unstable and disordered shaking of the chip can occur in the transportation process, and the chip is easy to damage.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a semiconductor chip box, includes the base, the top fixedly connected with of base places the case, the inboard top fixedly connected with export board of placing the case, the inside of placing the case all has been seted up around and has been removed the groove, a plurality of the equal sliding connection in inboard that removes the groove has the slider, a plurality of the equal fixedly connected with in adjacent one side of slider places the board, the equal fixedly connected with limiting plate in four corners in top of placing the board, the top of placing the board is provided with the chip board, the top of placing the board is provided with fixed subassembly, the top of placing the case is provided with sealing mechanism.

Through the technical scheme: placing the board through placing the incasement places the chip board, uses a plurality of limiting plates on the board of placing simultaneously to carry out spacingly to the chip board, and the convenience is fixed at the back, then carries out the upward movement with the chip on the chip board and conveniently takes out through the export board.

As a further description of the above technical solution:

Sealing mechanism includes two C shape buckles and lifting unit, two the equal fixed connection of front and back side of C shape is detained in the front and back side of placing the case, lifting unit sets up the left and right sides of placing the case, spout one has all been seted up to the left and right sides of placing the case, a plurality of the inboard equal sliding connection of spout one has the connecting plate, and is a plurality of the equal rotation in top of connecting plate is connected with the connecting block, and is a plurality of the equal fixedly connected with apron in top of connecting block, two the sliding tray has all been seted up at the top of apron, the inboard sliding connection of sliding tray has the card post, the bottom fixedly connected with reset spring of card post.

Through the technical scheme: the connecting plates and the connecting blocks on two sides of the placing box are used for connecting and fixing the two cover plates, the cover plates are opened to two sides by rotating the cover plates, and the cover plates are fixed by the C-shaped buckles and the clamping columns when the cover plates are closed.

As a further description of the above technical solution:

The fixing component comprises a plurality of clamping plates, the bottoms of the clamping plates are all rotationally connected to the periphery of the top of the placing plate, the left side and the right side of each clamping plate are fixedly connected with torsion springs, and clamping grooves are formed in the periphery of the chip plate.

Through the technical scheme: the clamping plate on the placing plate is aligned with the clamping groove on the chip plate to be fixed, and the clamping plate is rotated and fixed through the reset spring on the clamping plate.

As a further description of the above technical solution:

The lifting assembly comprises two sliding grooves II, the two sliding grooves II are respectively arranged on the left side and the right side of the placement box, and the inner sides of the two sliding grooves II are respectively connected with a supporting plate in a rotating mode.

Through the technical scheme: through opening two apron, use the apron to extrude the backup pad simultaneously, upwards jack-up is carried out placing the board through the other end of backup pad simultaneously, conveniently takes the chip.

As a further description of the above technical solution:

Handles are fixedly connected to the tops of the two cover plates.

Through the technical scheme: the handles on two sides of the top of the cover plate can conveniently open the cover plate, so that the cover plate can accurately fold and move towards two sides.

As a further description of the above technical solution:

The top of placing the board is all fixedly connected with the rubber pad.

Through the technical scheme: the stability of placing the chip board can be improved through the rubber pads placed on two sides of the top of the board.

As a further description of the above technical solution:

The bottom four corners of base all fixedly connected with support column, a plurality of the bottom of support column is all fixedly connected with slipmat.

Through the technical scheme: the support column through the base bottom is fixed placing the case, improves the stability of device, and the slipmat can prevent that the bottom of support column from taking place wearing and tearing simultaneously, influences the supporting force.

As a further description of the above technical solution:

The front side fixedly connected with hygrometer of placing the case, the bottom fixedly connected with desiccator of placing the case.

Through the technical scheme: the hygrometer through placing the case front side can help observing the temperature of placing in the case, and the desiccator board can avoid placing the humidity in the case and cause the damage to the chip simultaneously.

The utility model has the following beneficial effects:

1. According to the utility model, the chip board is fixed through the placing board, the limiting board and the clamping board, and the placing board is jacked up through the cover board and the supporting board, so that the chip boards with different sizes can be conveniently fixed, and the chip can be conveniently taken out when being opened.

2. According to the utility model, the cover plate is connected through the first chute, the connecting plate and the connecting block, the cover plate is fixed through the clamping column, the C-shaped buckle and the reset spring, and meanwhile, the quality of the chip is prevented from being influenced by moisture through the drying plate and the hygrometer, so that the chip is convenient for workers to observe.

Drawings

Fig. 1 is a perspective view of a semiconductor chip case according to the present utility model;

FIG. 2 is a split view of a semiconductor chip case according to the present utility model;

Fig. 3 is a schematic view showing a partial structure of a fixing device of a semiconductor chip case according to the present utility model;

fig. 4 is a cross-sectional view of a semiconductor chip case according to the present utility model.

Legend description:

1. A base; 2. a sealing mechanism; 201. c-shaped buckles; 202. a first chute; 203. a connecting plate; 204. a connecting block; 205. a cover plate; 206. a sliding groove; 207. a clamping column; 208. a return spring; 209. a second chute; 210. a support plate; 211. a drying plate; 212. a handle; 3. placing a box; 4. an outlet plate; 5. a moving groove; 6. a slide block; 7. placing a plate; 8. a limiting plate; 9. a chip board; 10. a clamping groove; 11. a clamping plate; 12. a torsion spring; 13. a rubber pad; 14. a support column; 15. an anti-slip pad; 16. a hygrometer.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, 2 and 3, one embodiment provided by the present utility model is: the semiconductor chip box comprises a base 1, wherein a placement box 3 is fixedly connected to the top of the base 1, an outlet plate 4 is fixedly connected to the top of the inner side of the placement box 3, movable grooves 5 are formed in the periphery of the inner side of the placement box 3, sliding blocks 6 are slidably connected to the inner sides of the movable grooves 5, placement plates 7 are fixedly connected to adjacent sides of the sliding blocks 6, limiting plates 8 are fixedly connected to four corners of the top of the placement plates 7, and chip plates 9 are arranged on the top of the placement plates 7;

Specifically, the placing box 3 is fixed through the base 1, meanwhile, the placing plate 7 in the placing box 3 moves up and down through the sliding block 6, the chip plate 9 is placed on the placing plate 7, and the chip plate 9 is limited and fixed through the limiting plates 8 at four corners of the placing plate 7.

Referring to fig. 3, a fixing assembly is provided at the top of the placement plate 7, and a sealing mechanism 2 is provided at the top of the placement box 3; the fixing assembly comprises a plurality of clamping plates 11, the bottoms of the clamping plates 11 are all rotationally connected to the periphery of the top of the placing plate 7, torsion springs 12 are fixedly connected to the left side and the right side of the clamping plates 11, and clamping grooves 10 are formed in the periphery of the chip plate 9; the top of the placing plate 7 is fixedly connected with a rubber pad 13;

Specifically, through fixing the clamping grooves 10 on the chip boards 9 with a plurality of clamping plates 11 on the placing plate 7, the torsion springs 12 are fixed on the clamping plates 11, and the chip boards 9 with different sizes can be fixed and detached easily.

Referring to fig. 1 and 2, the sealing mechanism 2 includes two C-shaped buckles 201 and a lifting assembly, the front and rear sides of the two C-shaped buckles 201 are fixedly connected to the front and rear sides of the placement box 3, the lifting assembly is arranged on the left and right sides of the placement box 3, the left and right sides of the placement box 3 are provided with first sliding grooves 202, the inner sides of the first sliding grooves 202 are slidably connected with connecting plates 203, the tops of the connecting plates 203 are rotatably connected with connecting blocks 204, the tops of the connecting blocks 204 are fixedly connected with cover plates 205, and sliding grooves 206 are formed in the tops of the two cover plates 205; handles 212 are fixedly connected to the tops of the two cover plates 205;

Specifically, the first sliding grooves 202 on two sides of the placement box 3 are used for connecting and sliding the connecting plates 203, meanwhile, the top of the connecting plates 203 is connected with the connecting blocks 204, and the handle 212 can be pulled to drive the cover plates 205 on the top of the connecting blocks 204 to open towards two sides.

Referring to fig. 1 and 4, a clamping column 207 is slidably connected to the inner side of the sliding groove 206, and a return spring 208 is fixedly connected to the bottom of the clamping column 207; the lifting assembly comprises two sliding grooves II 209, the two sliding grooves II 209 are respectively arranged on the left side and the right side of the placement box 3, and the inner sides of the two sliding grooves II 209 are respectively and rotatably connected with a supporting plate 210; the front side of the placement box 3 is fixedly connected with a hygrometer 16, and the bottom of the placement box 3 is fixedly connected with a drying plate 211;

Specifically, the C-shaped buckle 201 can be fixed through the clamping column 207, and meanwhile, the clamping column 207 is pressed to drive the reset spring 208 in the sliding groove 206 to squeeze, so that the fixed clamping column 207 is released, and the cover plate 205 is conveniently opened.

Referring to fig. 1, support columns 14 are fixedly connected to four corners of the bottom of the base 1, and anti-slip pads 15 are fixedly connected to the bottoms of the support columns 14;

Specifically, the whole device can be fixed by the plurality of support columns 14 fixed at the bottom of the base 1, so that the whole device is more stable, and the anti-slip pads 15 at the bottom of the support columns 14 are arranged at the same time.

Working principle: firstly when fixing the chip, place on placing the board 7 through placing the board 9, simultaneously place the board 7 and slide from top to bottom through placing the inboard movable tank 5 of case 3, then place the board 9 through the limiting plate 8 on placing the board 7, cardboard 11 on will placing the board 7 simultaneously is fixed to draw-in groove 10 on the board 9, cardboard 11 is connected through torsion spring 12 simultaneously, finally when taking the chip, through opening apron 205, let apron 205 extrude backup pad 210 downwards, upwards jack-up will place the board 7 through backup pad 210, so not only can conveniently fix the board 9 of equidimension not, also open also very convenience when taking out the chip, and when sealed to placing the board 9 of case 3, spout 202 of placing case 3 both sides is fixed to connecting block 204 through connecting plate 203, the top of connecting block 204 is fixed with apron 205 simultaneously, the card post 207 through on the apron 205 is fixed to C shape knot 201, press the reset spring 208 in the card post 207 to drive slide groove 206 simultaneously and squeeze 212, the inside humidity meter can be avoided placing the inside the case 3 through the apron to the inside humidity meter that the inside is opened to the inside of case 211, the inside can be avoided placing the humidity meter 3 to the inside is kept in the case 3.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. A semiconductor chip case comprising a base (1), characterized in that: the utility model discloses a novel structure of a mobile device, including base (1), base, fixed connection, limiting plate (8) in the top of base (1), the inboard top fixedly connected with export board (4) of placing case (3), movable groove (5) have all been seted up around the inside of placing case (3), a plurality of the inboard equal sliding connection of movable groove (5) has slider (6), a plurality of adjacent one side of slider (6) is fixedly connected with places board (7), the top of placing board (7) is four equal fixedly connected with limiting plate (8), the top of placing board (7) is provided with chip board (9), the top of placing board (7) is provided with fixed subassembly, the top of placing case (3) is provided with sealing mechanism (2).

2. A semiconductor die cartridge as recited in claim 1, wherein: sealing mechanism (2) are including two C shape buckles (201) and lifting unit, two the equal fixed connection in front and back side of placing case (3) of front and back side of C shape knot (201), lifting unit sets up the left and right sides of placing case (3), spout one (202) has all been seted up to the left and right sides of placing case (3), a plurality of the inboard of spout one (202) is all sliding connection has connecting plate (203), a plurality of the equal rotation in top of connecting plate (203) is connected with connecting block (204), a plurality of the equal fixedly connected with apron (205) in top of connecting block (204), two sliding tray (206) have all been seted up at the top of apron (205), the inboard sliding connection of sliding tray (206) has card post (207), the bottom fixedly connected with reset spring (208) of card post (207).

3. A semiconductor die cartridge as recited in claim 1, wherein: the fixing assembly comprises a plurality of clamping plates (11), the bottoms of the clamping plates (11) are all rotationally connected to the periphery of the top of the placing plate (7), torsion springs (12) are fixedly connected to the left side and the right side of the clamping plates (11), and clamping grooves (10) are formed in the periphery of the chip plate (9).

4. A semiconductor die cartridge as recited in claim 2, wherein: the lifting assembly comprises two sliding grooves II (209), the two sliding grooves II (209) are respectively arranged on the left side and the right side of the placement box (3), and the inner sides of the two sliding grooves II (209) are respectively and rotatably connected with a supporting plate (210).

5. A semiconductor die cartridge as recited in claim 2, wherein: handles (212) are fixedly connected to the tops of the two cover plates (205).

6. A semiconductor die cartridge as recited in claim 1, wherein: the top of placing board (7) all fixedly connected with rubber pad (13).

7. A semiconductor die cartridge as recited in claim 1, wherein: the base is characterized in that support columns (14) are fixedly connected to four corners of the bottom of the base (1), and anti-slip pads (15) are fixedly connected to the bottoms of the support columns (14).

8. A semiconductor die cartridge as recited in claim 1, wherein: the front side of placing case (3) fixedly connected with hygrometer (16), the bottom of placing case (3) fixedly connected with desiccation board (211).