CN221010218U - L-shaped movement mounting frame and camera sensor movement - Google Patents
L-shaped movement mounting frame and camera sensor movement Download PDFInfo
- Publication number
- CN221010218U CN221010218U CN202322405465.2U CN202322405465U CN221010218U CN 221010218 U CN221010218 U CN 221010218U CN 202322405465 U CN202322405465 U CN 202322405465U CN 221010218 U CN221010218 U CN 221010218U
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- sensor
- vertical plate
- heat dissipation
- movement
- mounting
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 26
- 238000003860 storage Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 22
- 239000011093 chipboard Substances 0.000 claims description 16
- 238000001931 thermography Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 description 4
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
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Abstract
The utility model relates to an L-shaped movement mounting frame and a camera sensor movement, which comprise a mounting vertical plate and a horizontal heat dissipation support fixedly connected with the side surface of the lower end of the mounting vertical plate; the top surface of the horizontal heat dissipation support is provided with a concave cavity, and a heat dissipation fin is arranged in the concave cavity; the lower end of the mounting vertical plate is provided with a first perforation which is communicated with the concave cavity. The utility model is small and compact, and can still reliably work under the impact vibration environment; the sensor is connected with the main control board and the storage board in a lamination mode, the metal support frames are added at the edge parts between the circuit boards, so that the reliable connection of the connectors between the circuit boards is ensured, meanwhile, the force support of impact can be realized, impact force is prevented from acting on the connectors and components, and meanwhile, heat generated in the working process of the movement is conducted out through the metal frames; the drive and signal processing circuit board is placed in the rear of the product by lamination.
Description
Technical Field
The utility model relates to the technical field of camera shooting, in particular to an L-shaped movement mounting frame and a camera sensor movement.
Background
The main control board, chip and other core hardware parts in the structural design of the existing camera movement are mostly consistent with the axis of the imaging system, the shock resistance is weak, the occupied axial size space is large, the structure is not compact, the fixing structure adopts common modes of screw holes, gluing and the like, the heat dissipation area is limited, and the heating influence is large.
Disclosure of utility model
The utility model aims to overcome the defects of the existing movement structure, such as compact structure, small heat dissipation area, untimely heat dissipation and weak axial impact resistance.
In order to achieve the purpose, the utility model provides an L-shaped movement installation frame which comprises an installation vertical plate and a horizontal heat dissipation support fixedly connected with the side surface of the lower end of the installation vertical plate;
The top surface of the horizontal heat dissipation support is provided with a concave cavity, and a heat dissipation fin is arranged in the concave cavity;
The lower end of the mounting vertical plate is provided with a first perforation which is communicated with the concave cavity.
As a further refinement, the inner side of the recess concerned is provided with a depression which communicates with the first bore.
As further optimization, the transverse two sides of the upper end of the related installation vertical plate are respectively provided with a first installation hole;
and the four corners of the horizontal heat dissipation support are respectively provided with a second mounting hole.
As a further optimization, a side vertical plate is respectively arranged on two lateral sides of the lower end of the related installation vertical plate, the lower end of the side vertical plate is fixedly connected with the outer side part of the second installation hole of the inner side top surface of the horizontal heat dissipation support, and the width of the side vertical plate is reduced from bottom to top.
The camera sensor core comprises the L-shaped core mounting frame, an SOC chip board is clamped in the concave cavity and is arranged on the top surface of the radiating fin, and a first shielding frame and a second shielding frame are stacked on the top surface of the horizontal radiating support from bottom to top;
The inner ends of the first shielding frame and the second shielding frame are respectively provided with a second through hole, and are sleeved on the connector on the SOC chip board;
A storage plate and a WIFI plate are respectively clamped in top surface cavities of the first shielding frame and the second shielding frame;
The sensor integrated board is fixed on the outer side face of the installation vertical plate, the sensor flexible flat cable is fixed between the sensor integrated board and the outer side face of the installation vertical plate, and the lower end of the sensor flexible flat cable penetrates through the first perforation and then is connected with the SOC chip board.
As further optimization, the related display screen flexible flat cable is connected with the SOC chip board and then bends upwards after penetrating out from the gap between the first shielding frame and the SOC chip board.
As a further optimization, the sensor integrated board is integrated with a thermal imaging sensor and an image sensor, and the thermal imaging sensor and the image sensor are arranged side by side.
The utility model has the advantages that: the device is small and compact, and can still reliably work under the impact vibration environment; the sensor is connected with the main control board and the storage board in a lamination mode, the metal support frames are added at the edge parts between the circuit boards, so that the reliable connection of the connectors between the circuit boards is ensured, meanwhile, the force support during impact can be realized, impact force is prevented from acting on the connectors and components, and meanwhile, heat generated in the working process of the movement is conducted out through the metal frames; the double-camera component adopts a similar structure, the double-sensor and the lens are arranged at the front end of the camera in parallel, and the driving and signal processing circuit board is arranged at the rear part of the product through lamination. Also plays a role in miniaturization.
Drawings
Fig. 1 is a schematic structural view of an L-shaped deck mounting frame.
Fig. 2 is a perspective view of a camera sensor cartridge.
Fig. 3 is an exploded view of the camera sensor cartridge.
Fig. 4 is an isometric view of the camera sensor cartridge.
Fig. 5 is a cross-sectional view of the camera sensor cartridge.
Reference numerals illustrate:
1. Installing a vertical plate; 2. a horizontal heat dissipation support; 3. a cavity; 4. a heat sink; 5. a first perforation; 6. a low-lying cavity; 7. a first mounting hole; 8. a second mounting hole; 9. a side vertical plate; 10. an L-shaped movement mounting frame; 11. an SOC chip board; 12. a first shielding frame; 13. a second shielding frame; 14. a second perforation; 15. a connector; 150. a first spherical recess; 151. a second spherical recess; 16. a storage plate; 17. a WIFI board; 18. a sensor board; 19. sensor flexible flat cable; 20. and the display screen is in flexible flat cable.
Detailed Description
The following detailed description, structural features and functions of the present utility model are provided with reference to the accompanying drawings and examples in order to further illustrate the technical means and effects of the present utility model to achieve the predetermined objects.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "aligned," "overlapping," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operate in a specific orientation, and therefore should not be construed as limiting the present utility model.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second" may include one or more such features, either explicitly or implicitly; in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In order to overcome the defects of the existing movement structure, such as incompact structure, small heat dissipation area, untimely heat dissipation and weak axial impact resistance, the embodiment provides an L-shaped movement installation frame and a camera sensor movement shown in fig. 1 and 2, wherein the L-shaped movement installation frame comprises an installation vertical plate 1 shown in fig. 1 and a horizontal heat dissipation support 2 fixedly connected with the side surface of the lower end of the installation vertical plate 1; the top surface of the horizontal heat dissipation support 2 is provided with a concave cavity 3, and a heat dissipation fin 4 is arranged in the concave cavity 3; the lower end of the installation vertical plate 1 is provided with a first perforation 5, the first perforation 5 is communicated with the concave cavity 3, the inner side of the concave cavity 3 is provided with a low-lying cavity 6, and the low-lying cavity 6 is communicated with the first perforation 5. The L-shaped machine core mounting frame can be used for laminating devices such as a main control board, a communication board and a storage board of the machine core, so that the impact resistance is enhanced, and heat can be effectively conducted outwards timely through the arranged heat dissipation part, so that the heat dissipation capacity is enhanced.
In order to further enhance the impact resistance of the element, the transverse two sides of the upper end of the installation vertical plate 1 provided by the embodiment are respectively provided with a first installation hole 7; the four corners of the horizontal heat dissipation support 2 are respectively provided with a second mounting hole 8, in particular, a side vertical plate 9 is respectively arranged on two lateral sides of the lower end of the mounting vertical plate 1, the lower end of the side vertical plate 9 is fixedly connected with the outer side part of the second mounting hole 8 on the inner side top surface of the horizontal heat dissipation support 2, and the width of the side vertical plate 9 is reduced from bottom to top. The fastening of each component is realized through each mounting hole of screw cooperation, carries out the horizontal centre gripping of wholeness to each component of range upon range of with the help of side riser 9 simultaneously, produces the staple bolt effect to the steadiness and the shock resistance of the equipment of each component have further been promoted.
The camera sensor core shown in fig. 2 comprises an L-shaped core mounting frame 10 (see fig. 3, 4 and 5) shown in fig. 1, an SOC chip board 11 is clamped in the concave cavity 3 and is arranged on the top surface of the cooling fin 4, and a first shielding frame 12 and a second shielding frame 13 are stacked from bottom to top and are arranged on the top surface of the horizontal cooling support 2; the inner ends of the first shielding frame 12 and the second shielding frame 13 are respectively provided with a second through hole 14 which are sleeved on a connector 15 on the SOC chip board 11; a storage plate 16 and a WIFI plate 17 are respectively clamped in the top surface cavities of the first shielding frame 12 and the second shielding frame 13; the sensor integrated board 18 is fixed on the outer side surface of the installation vertical board 1, the sensor flexible flat cable 19 is fixed between the sensor integrated board 18 and the outer side surface of the installation vertical board 1, and the lower end of the sensor flexible flat cable 19 passes through the first through hole 5 and then is connected with the SOC chip board 11, so that the electrical connection and communication between the sensor integrated board 18 and the SOC chip board 11 are completed. And a display screen flexible flat cable 20 is connected with the SOC chip board 11, and then is bent upwards after passing out from the gap between the first shielding frame 12 and the SOC chip board 11. Wherein the sensor integrated board 18 has a thermal imaging sensor and an image sensor integrated thereon, and the thermal imaging sensor and the image sensor are disposed side by side.
Through the structure, the camera sensor movement provided by the structure is small and compact, and can still reliably work under the impact vibration environment; the sensor is connected with the main control board and the storage board in a lamination mode, the metal support frames are added at the edge parts between the circuit boards, so that the reliable connection of the connectors between the circuit boards is ensured, meanwhile, the force support during impact can be realized, impact force is prevented from acting on the connectors and components, and meanwhile, heat generated in the working process of the movement is conducted out through the metal frames; the double-camera assembly adopts a similar structure, the double-sensor and the lens are arranged at the front end of the camera in parallel (namely, the outer side of the mounting vertical plate 1 is the front end of the camera), and the driving and signal processing circuit board is arranged at the rear part of the product through lamination. Also plays a role in miniaturization.
Claims (7)
1. An L type core installation frame, its characterized in that: comprises a mounting vertical plate (1) and a horizontal heat dissipation support (2) fixedly connected with the side surface of the lower end of the mounting vertical plate (1);
The top surface of the horizontal heat dissipation support (2) is provided with a concave cavity (3), and a heat dissipation fin (4) is arranged in the concave cavity (3);
The lower end of the mounting vertical plate (1) is provided with a first perforation (5), and the first perforation (5) is communicated with the concave cavity (3).
2. The L-shaped movement mounting frame of claim 1, wherein: the inner side of the concave cavity (3) is provided with a low-lying cavity (6), and the low-lying cavity (6) is communicated with the first perforation (5).
3. An L-shaped movement mounting frame according to claim 1 or 2, wherein: a first mounting hole (7) is respectively formed in two lateral sides of the upper end of the mounting vertical plate (1);
The four corners of the horizontal heat dissipation support (2) are respectively provided with a second mounting hole (8).
4. An L-shaped movement mounting frame according to claim 1 or 2, wherein: the horizontal both sides of lower extreme of installation riser (1) respectively set up one side riser (9), the lower extreme of this side riser (9) with the second mounting hole (8) lateral part fixed connection of the inboard top surface of horizontal heat dissipation support (2), and the width of this side riser (9) reduces from bottom to top.
5. The camera sensor movement is characterized by comprising the L-shaped movement mounting frame (10) of claim 1, wherein an SOC chip board (11) is clamped in the concave cavity (3) and is arranged on the top surface of the radiating fin (4), and a first shielding frame (12) and a second shielding frame (13) are stacked on the top surface of the horizontal radiating support (2) from bottom to top;
The inner ends of the first shielding frame (12) and the second shielding frame (13) are respectively provided with a second perforation (14) which are sleeved on a connector (15) on the SOC chip board (11);
a storage plate (16) and a WIFI plate (17) are respectively clamped in top surface cavities of the first shielding frame (12) and the second shielding frame (13);
the sensor integrated plate (18) is fixed on the outer side surface of the installation vertical plate (1), the sensor flexible flat cable (19) is fixed between the sensor integrated plate (18) and the outer side surface of the installation vertical plate (1), and the lower end of the sensor flexible flat cable (19) passes through the first perforation (5) and then is connected with the SOC chip plate (11).
6. The camera sensor movement according to claim 5, characterized in that a display screen flexible flat cable (20) is connected with the SOC chip board (11) and then bends upwards after passing out from the gap between the first shielding frame (12) and the SOC chip board (11).
7. Camera sensor cartridge according to claim 6 or 5, characterized in that the sensor integrated board (18) has integrated thereon a thermal imaging sensor and an image sensor, and that the thermal imaging sensor and the image sensor are arranged side by side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322405465.2U CN221010218U (en) | 2023-09-05 | 2023-09-05 | L-shaped movement mounting frame and camera sensor movement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322405465.2U CN221010218U (en) | 2023-09-05 | 2023-09-05 | L-shaped movement mounting frame and camera sensor movement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221010218U true CN221010218U (en) | 2024-05-24 |
Family
ID=91114775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322405465.2U Active CN221010218U (en) | 2023-09-05 | 2023-09-05 | L-shaped movement mounting frame and camera sensor movement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221010218U (en) |
-
2023
- 2023-09-05 CN CN202322405465.2U patent/CN221010218U/en active Active
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