CN221008222U - Water cooling type computer board card - Google Patents
Water cooling type computer board card Download PDFInfo
- Publication number
- CN221008222U CN221008222U CN202323039483.XU CN202323039483U CN221008222U CN 221008222 U CN221008222 U CN 221008222U CN 202323039483 U CN202323039483 U CN 202323039483U CN 221008222 U CN221008222 U CN 221008222U
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- CN
- China
- Prior art keywords
- water
- board card
- clamping plate
- cold head
- fixedly connected
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 238000001816 cooling Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 description 8
- 230000009471 action Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a water-cooling heat dissipation type computer board card, which comprises: the board card body and the water-cooling heat dissipation mechanism; the water cooling mechanism comprises a cold head fixedly connected to the board body, a water inlet of the cold head is communicated with a water inlet pipe, a water outlet of the cold head is communicated with a water outlet pipe, the top ends of the water inlet pipe and the water outlet pipe are communicated with a hollow shell, one side of the hollow shell is tightly adhered with a semiconductor refrigerating sheet, two sides of the hollow shell are respectively fixedly connected with a fixed clamping plate and a supporting plate, and one side of the supporting plate is fixedly connected with a spring through a connecting plate; according to the water-cooling heat-dissipation type computer board card, the water-cooling heat-dissipation mechanism is arranged on the board card body, so that after the board card body transmits heat to the cold head, the cold head can convey heat-carrying water to the hollow shell, and the semiconductor refrigerating sheet can rapidly cool the water in the hollow shell; through the arrangement, the working efficiency of the computer board card when the computer board card dissipates heat by using water cooling is effectively improved.
Description
Technical Field
The utility model relates to the technical field of computer boards, in particular to a water-cooling type computer board.
Background
As is well known, a board card is a kind of printed circuit board, and is manufactured with a core insert, and can be inserted into a slot of a main circuit board of a computer to control the operation of hardware, such as a display, an acquisition card and other devices, and after a driver is installed, the corresponding hardware function can be realized.
In the prior art, a computer board card is usually subjected to heat dissipation treatment in an air cooling and water cooling mode, but the existing water cooling heat dissipation mainly depends on a cold head to transfer heat to a fan for blowing, and the mode is inconvenient for further improving the working efficiency of the water cooling heat dissipation; for this purpose, we propose a water-cooled heat-dissipation type computer board card.
The above information disclosed in the background section is only for enhancement of understanding of the background of the disclosure and therefore it may include information that does not form the prior art that is already known to a person of ordinary skill in the art.
Disclosure of utility model
The utility model aims to provide a water-cooling heat-dissipation type computer board card so as to solve the problems in the background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a water cooled computer board card comprising: the board card body and the water-cooling heat dissipation mechanism;
The water cooling mechanism comprises a cold head fixedly connected to the board body, a water inlet pipe is communicated with a water inlet of the cold head, a water outlet of the cold head is communicated with a water outlet pipe, a hollow shell is communicated with the top ends of the water inlet pipe and the water outlet pipe, a semiconductor refrigerating sheet is tightly attached to one side of the hollow shell, two sides of the hollow shell are fixedly connected with a fixed clamping plate and a supporting plate respectively, a spring is fixedly connected to one side of the supporting plate through a connecting plate, a movable clamping plate is fixedly connected to one end of the spring, one side of the movable clamping plate is movably connected with the supporting plate, a first groove is formed in one side, adjacent to the fixed clamping plate, of the movable clamping plate, a second groove is formed in one side, adjacent to the movable clamping plate, of the fixed clamping plate, one side of the semiconductor refrigerating sheet is inserted into the first groove, and the other side of the semiconductor refrigerating sheet is inserted into the second groove.
Through adopting the technical scheme, after heat generated during operation of the board card body is transferred to the cold head, the water pump in the cold head can take water as a carrier to convey the heat to the inside of the hollow shell through the water outlet pipe, and the semiconductor refrigerating sheet can cool the water through the hollow shell after being started, and the cooled water can enter the cold head again through the water inlet pipe and cool the board card body; in addition, when the semiconductor refrigerating piece needs to be replaced, the clamping force on one side of the semiconductor refrigerating piece can be lost by pulling the movable clamping plate, so that the semiconductor refrigerating piece can be easily taken out, one side of the semiconductor refrigerating piece can be inserted into the second groove of the fixed clamping plate during installation, the movable clamping plate can clamp the semiconductor refrigerating piece under the reset action of the spring by loosening the movable clamping plate, and the semiconductor refrigerating piece can be stably attached to the surface of the hollow shell to cool water.
Preferably, a heat conduction silicone grease layer which is used for being clung to the board card body is fixedly arranged on one side of the cold head.
Through adopting above-mentioned technical scheme, can be convenient for the integrated circuit board body with heat transfer to cold head department.
Preferably, the outside fixedly connected with connecting block of cold head, the inside threaded connection of connecting block has the bolt, one side and the integrated circuit board body threaded connection of bolt.
Through adopting above-mentioned technical scheme, can be convenient for cold head dismouting on the integrated circuit board body through the mode of tightening or unscrewing the bolt.
Preferably, the outside fixedly connected with support of cold head, one side of support is fixed mounting has the fan.
By adopting the technical scheme, the heat discharged by the semiconductor refrigerating sheet can be conveniently blown away in time.
Preferably, a chute is formed in one side of the supporting plate, and the inner side wall of the chute is in sliding connection with the movable clamping plate.
By adopting the technical scheme, the supporting plate can be more stable in moving.
Preferably, the movable clamping plate is fixedly connected with a pull lug on one side opposite to the fixed clamping plate.
By adopting the technical scheme, the movable clamping plate can be pulled conveniently.
Preferably, a screw cap is screwed on one side of the hollow shell.
Through adopting above-mentioned technical scheme, can be convenient for change the water in cavity casing and the cold head.
In summary, the present application includes at least one of the following beneficial technical effects:
According to the water-cooling heat-dissipation type computer board card, the water-cooling heat-dissipation mechanism is arranged on the board card body, so that after the board card body transmits heat to the cold head, the cold head can convey heat-carrying water to the hollow shell, and the semiconductor refrigerating sheet can rapidly cool the water in the hollow shell; through the arrangement, the working efficiency of the computer board card when the computer board card dissipates heat by using water cooling is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a water-cooled computer board card according to the present utility model;
FIG. 2 is a schematic diagram of a semiconductor refrigeration sheet and a hollow housing in a water-cooled computer board card according to the present utility model;
FIG. 3 is a schematic diagram of a movable clamping plate and a first groove in a water-cooled computer board card according to the present utility model;
fig. 4 is a schematic structural diagram of a fixing clamping plate and a second groove in the water-cooled heat dissipation type computer board card of the utility model.
In the figure: 1. a board card body; 2. a water-cooling heat dissipation mechanism; 20. a cold head; 21. a water inlet pipe; 22. a water outlet pipe; 23. a hollow housing; 24. a semiconductor refrigeration sheet; 25. a fixed clamping plate; 26. a movable clamping plate; 27. a support plate; 28. a spring; 29. a connecting plate; 201. a screw cap; 202. pulling lugs; 203. a chute; 204. a bracket; 205. a fan; 206. a connecting block; 207. a bolt; 208. a first groove; 209. and a second groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: a water cooled computer board card comprising: the board card comprises a board card body 1 and a water-cooling heat dissipation mechanism 2;
Firstly, after heat generated during operation of the board body 1 is transferred to the cold head 20, a water pump in the cold head 20 can take water as a carrier to convey the heat into the hollow shell 23 through the water outlet pipe 22, and after the semiconductor refrigerating sheet 24 is started, the water can be cooled through the hollow shell 23, and the cooled water can enter the cold head 20 again through the water inlet pipe 21 and cool the board body 1; in addition, in order to make the semiconductor refrigeration piece 24 change, the clamping force of one side of the semiconductor refrigeration piece 24 can be lost by pulling the movable clamping plate 26, so that the semiconductor refrigeration piece 24 can be easily taken out, and one side of the semiconductor refrigeration piece 24 can be inserted into the second groove 209 of the fixed clamping plate 25 at the time of installation, and then the movable clamping plate 26 can clamp the semiconductor refrigeration piece 24 under the reset action of the spring 28 by loosening the movable clamping plate 26, so that the semiconductor refrigeration piece 24 can be stably attached to the surface of the hollow shell 23 to cool down water; the water cooling mechanism 2 comprises a cold head 20 fixedly connected to the board body 1, a water inlet of the cold head 20 is communicated with a water inlet pipe 21, a water outlet of the cold head 20 is communicated with a water outlet pipe 22, the top ends of the water inlet pipe 21 and the water outlet pipe 22 are communicated with a hollow shell 23, one side of the hollow shell 23 is closely attached with a semiconductor refrigerating sheet 24, two sides of the hollow shell 23 are respectively fixedly connected with a fixed clamping plate 25 and a supporting plate 27, one side of the supporting plate 27 is fixedly connected with a spring 28 through a connecting plate 29, one end of the spring 28 is fixedly connected with a movable clamping plate 26, one side of the movable clamping plate 26 is movably connected with the supporting plate 27, a first groove 208 is formed in one side of the movable clamping plate 26 adjacent to the fixed clamping plate 25, a second groove 209 is formed in one side of the fixed clamping plate 25 adjacent to the movable clamping plate 26, one side of the semiconductor refrigerating sheet 24 is inserted into the first groove 208, and the other side of the semiconductor refrigerating sheet 24 is inserted into the second groove 209;
it should be noted that: the circulation pump and the water for heat conduction are arranged in the cold head 20, so that the liquid in the cold head 20 can be conveniently conveyed to the hollow shell 23 after being heated under the action of the heat of the plate body;
Secondly, in order to be convenient for the board card body 1 to transfer heat to the cold head 20, one side of the cold head 20 is fixedly provided with a heat-conducting silicone grease layer which is tightly attached to the board card body 1; in order to facilitate the disassembly and assembly of the cold head 20 on the board clamp body 1 by screwing or unscrewing the bolt 207, a connecting block 206 is fixedly connected to the outer side of the cold head 20, the bolt 207 is connected to the inner thread of the connecting block 206, and one side of the bolt 207 is in threaded connection with the board clamp body 1; in order to be convenient for timely blowing off the heat discharged by the semiconductor refrigerating sheet 24, a bracket 204 is fixedly connected to the outer side of the cold head 20, and a fan 205 is fixedly arranged on one side of the bracket 204; in order to enable the support plate 27 to be more stable in moving, one side of the support plate 27 is provided with a sliding groove 203, and the inner side wall of the sliding groove 203 is in sliding connection with the movable clamping plate 26; in order to facilitate the pulling of the movable clamping plate 26, a pull lug 202 is fixedly connected to one side of the movable clamping plate 26 opposite to the fixed clamping plate 25; in order to facilitate replacement of the hollow housing 23 and water in the coldhead 20, a screw cap 201 is screw-coupled to one side of the hollow housing 23.
According to the technical scheme, the working steps of the scheme are summarized and carded: when the integrated circuit board is used, after heat generated during operation of the integrated circuit board body 1 is transferred to the cold head 20, a water pump in the cold head 20 can take water as a carrier to convey the heat into the hollow shell 23 through the water outlet pipe 22, the semiconductor refrigerating sheet 24 can cool the water through the hollow shell 23 after being started, and the cooled water can enter the cold head 20 again through the water inlet pipe 21 and cool the integrated circuit board body 1; in addition, when the semiconductor cooling plate 24 needs to be replaced, the clamping force on one side of the semiconductor cooling plate 24 can be lost by pulling the movable clamping plate 26, so that the semiconductor cooling plate 24 can be easily taken out, one side of the semiconductor cooling plate 24 can be inserted into the second groove 209 of the fixed clamping plate 25 during installation, and then the movable clamping plate 26 can clamp the semiconductor cooling plate 24 under the reset action of the spring 28 by loosening the movable clamping plate 26, so that the semiconductor cooling plate 24 can be stably attached to the surface of the hollow shell 23 to cool water.
To sum up: the water-cooling heat dissipation type computer board card has the advantages that the water-cooling heat dissipation mechanism 2 is arranged on the board card body 1, so that after the board card body 1 transfers heat to the cold head 20, the cold head 20 can convey the water carrying the heat to the hollow shell 23, and the semiconductor refrigerating sheet 24 can quickly cool the water in the hollow shell 23; through the arrangement, the working efficiency of the computer board card when the computer board card dissipates heat by using water cooling is effectively improved.
None of the utility models are related to the same or are capable of being practiced in the prior art. Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Water-cooling heat dissipation formula computer board card, its characterized in that includes: the board card comprises a board card body (1) and a water cooling mechanism (2);
The water cooling mechanism (2) comprises a cold head (20) fixedly connected to the board body (1), a water inlet of the cold head (20) is communicated with a water inlet pipe (21), a water outlet of the cold head (20) is communicated with a water outlet pipe (22), a hollow shell (23) is communicated with the top end of the water inlet pipe (21) and the top end of the water outlet pipe (22), a semiconductor refrigerating sheet (24) is tightly adhered to one side of the hollow shell (23), a fixed clamping plate (25) and a supporting plate (27) are fixedly connected to two sides of the hollow shell (23) respectively, a spring (28) is fixedly connected to one side of the supporting plate (27) through a connecting plate (29), a movable clamping plate (26) is fixedly connected to one end of the spring (28), one side of the movable clamping plate (26) is movably connected with the supporting plate (27), a first groove (208) is formed in one side of the movable clamping plate (26) adjacent to the fixed clamping plate (25), a second groove (209) is formed in one side of the fixed clamping plate (25) adjacent to the movable clamping plate (26), one side of the second groove (209), and one side of the semiconductor refrigerating sheet (24) is inserted into the first groove (24).
2. The water cooled heat dissipating computer board of claim 1, wherein: one side of the cold head (20) is fixedly provided with a heat conduction silicone grease layer which is tightly attached to the board card body (1).
3. The water cooled computer board card of claim 2, wherein: the cold head is characterized in that a connecting block (206) is fixedly connected to the outer side of the cold head (20), a bolt (207) is connected to the inner thread of the connecting block (206), and one side of the bolt (207) is in threaded connection with the board card body (1).
4. A water cooled heat dissipating computer board according to claim 3, wherein: the outside fixedly connected with support (204) of cold head (20), one side fixed mounting of support (204) has fan (205).
5. The water cooled heat dissipating computer board of claim 1, wherein: a sliding groove (203) is formed in one side of the supporting plate (27), and the inner side wall of the sliding groove (203) is in sliding connection with the movable clamping plate (26).
6. The water cooled heat dissipating computer board of claim 1, wherein: one side of the movable clamping plate (26) opposite to the fixed clamping plate (25) is fixedly connected with a pull lug (202).
7. The water cooled heat dissipating computer board of claim 1, wherein: a screw cap (201) is connected to one side of the hollow shell (23) in a screw mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323039483.XU CN221008222U (en) | 2023-11-10 | 2023-11-10 | Water cooling type computer board card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323039483.XU CN221008222U (en) | 2023-11-10 | 2023-11-10 | Water cooling type computer board card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221008222U true CN221008222U (en) | 2024-05-24 |
Family
ID=91116487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323039483.XU Active CN221008222U (en) | 2023-11-10 | 2023-11-10 | Water cooling type computer board card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221008222U (en) |
-
2023
- 2023-11-10 CN CN202323039483.XU patent/CN221008222U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |