CN220999917U - Electroless copper plating conductive device - Google Patents
Electroless copper plating conductive device Download PDFInfo
- Publication number
- CN220999917U CN220999917U CN202323059580.5U CN202323059580U CN220999917U CN 220999917 U CN220999917 U CN 220999917U CN 202323059580 U CN202323059580 U CN 202323059580U CN 220999917 U CN220999917 U CN 220999917U
- Authority
- CN
- China
- Prior art keywords
- box body
- copper plating
- electroless copper
- conductive
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 32
- 239000010949 copper Substances 0.000 title claims abstract description 32
- 238000007747 plating Methods 0.000 title claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000002699 waste material Substances 0.000 claims description 7
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 13
- 229910001431 copper ion Inorganic materials 0.000 abstract description 13
- 230000008021 deposition Effects 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 14
- 238000000151 deposition Methods 0.000 description 12
- 229910052763 palladium Inorganic materials 0.000 description 7
- 238000006555 catalytic reaction Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000003814 drug Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000009388 chemical precipitation Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000002910 solid waste Substances 0.000 description 2
- 238000005844 autocatalytic reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
The application relates to the technical field of PCB processing equipment, in particular to a electroless copper plating conductive device, which comprises a box body, a pair of conductive rollers rotatably arranged in the box body and a power supply piece for supplying direct current to the conductive rollers of the box body, wherein an anode plate electrically connected with the power supply piece is also arranged in the box body. The application has the effect of reducing the non-uniform deposition thickness of copper ions or the occurrence of local cavities and the like.
Description
Technical Field
The application relates to the technical field of PCB processing equipment, in particular to a electroless copper plating conductive device.
Background
In the PCB manufacturing industry, the hole wall of a non-conductive plate after drilling must be metallized (Metallization) before conducting electricity, so that thickening of electroplated copper can be performed. The purpose of the horizontal chemical copper is to build a layer of compact and firm copper metal on the walls of non-conductor walls as a conductor, which serves as the basis for copper electroplating. During the initial reaction time of horizontal chemical copper (about 5-20 sec), copper ions undergo a reduction reaction directly on the surface of palladium and form a first molecular copper layer on the palladium, after which the palladium will be completely covered with copper atoms. In the subsequent autocatalytic reaction process, copper ions are subjected to a reduction reaction on an initial copper layer (Virgin Cu-layer). In the traditional horizontal chemical copper process, the deposition thickness of copper ions is often uneven or local hollows are caused in the subsequent automatic catalytic reaction due to uneven adhesion of a molecular copper layer in the initial reaction, so that holes are broken, and backlight detection is failed.
Disclosure of utility model
In order to solve the above technical problems, the present application provides an electroless copper plating conductive device, which has the advantages of reducing the occurrence of uneven deposition thickness of copper ions or local voids.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
The utility model provides a chemical copper deposition conductive device, includes the box, rotates a pair of conductive roller that sets up in the box and is used for the conductive roller of box to supply into the power supply piece of direct current, still be provided with in the box with power supply piece electric connection's anode plate.
According to the technical scheme, the power supply piece is provided with direct current through the conductive roller (cathode), the deposition rate of the initial molecular copper layer is accelerated, copper ions can be fully and uniformly attached to the surface of palladium, copper ion deposition in the subsequent automatic catalytic reaction is compact and uniform, the problems of copper thickness non-uniformity and plating hollowness are solved, and the product quality of the PCB is improved.
As a preferable scheme of the application, the power supply part comprises a rectifier and a connecting rod connected with a rotating shaft of the lead roller, wherein a single-stage slip ring is arranged at the end part of the connecting rod, one output electrode of the rectifier is connected with the single-stage slip ring, and the other output electrode of the rectifier is connected with the anode plate.
The technical scheme is realized, so that the rectifier can be communicated with the cathode roller, and the normal rolling of the conductive roller is not influenced.
As a preferable scheme of the application, the anode plate is arranged below the conductive roller, and the anode plate is provided with water holes.
The technical scheme is realized, so that the conveying device can pass through the water through holes after driving water flow to flow, and further, the situations of crystallization, precipitation and the like are reduced on the anode plate.
As a preferable scheme of the application, the side edge of the box body is communicated with a waste box, and a guide plate for asking the waste box to incline is arranged in the box body.
The technical scheme is realized, so that solid wastes such as liquid medicine crystallization, chemical precipitation and the like in the box body can be discharged, the cleanliness of the liquid medicine is ensured, and the copper plating effect is ensured.
In summary, the present application includes at least one of the following beneficial technical effects:
1. The power supply piece applies direct current to the surface of the PCB through the conductive roller (cathode), so that the deposition rate of an initial molecular copper layer is accelerated, copper ions are fully and uniformly attached to the surface of palladium, the copper ion deposition in the subsequent automatic catalytic reaction is compact and uniform, the problems of uneven copper thickness and coating hollowness are solved, and the product quality of the PCB is improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic overall structure of an embodiment of the present application.
Fig. 2 is a schematic view of the internal structure of the case according to the embodiment of the present application.
Reference numerals: 1. a case; 2. a conveying wheel set; 3. a conductive roller; 4. an anode plate; 41. a water through hole; 5. a rectifier; 6. a connecting rod; 7. a slip ring; 8. a waste bin; 9. and a guide plate.
Detailed Description
The application is described in further detail below with reference to fig. 1-2.
The embodiment of the application discloses a electroless copper plating conductive device. Referring to fig. 1, a copper electrokinetic device for electroless deposition comprises a box body 1, wherein a conveying device for conveying a PCB board is arranged in the box body 1, and the conveying device comprises a row of conveying wheel sets 2 which are rotatably arranged in the box body 1, namely, a board is placed between the two conveying wheel sets 2, so that the board can be conveyed to move forwards when the conveying wheel sets 2 rotate. A pair of conductive rollers 3 and a power supply member for supplying direct current to the conductive rollers 3 are rotatably arranged in the box body 1, and an anode plate 4 electrically connected with the power supply member is also arranged in the box body 1. The conductive rollers 3 are arranged between the conveying wheel sets 2, so that the plate can pass through the two conductive rollers 3 when conveyed forwards through the conveying device, and the upper end face and the lower end face of the plate are in contact with the conductive rollers 3, so that a power supply piece applies direct current to the PCB surface through the conductive rollers 3 (cathodes), and the deposition rate of an initial molecular copper layer is accelerated. Copper ions are uniformly attached to the surface of palladium, so that copper ion deposition in a subsequent automatic catalytic reaction is compact and uniform, the problems of uneven copper thickness and plating hollowness are solved, and the product quality of a PCB is improved.
The power supply piece comprises a rectifier 5, a connecting rod 6 connected with the rotating shaft of the lead roller, a single-stage slip ring 7 is arranged at the end part of the connecting rod 6, one output electrode of the rectifier 5 is connected with the single-stage slip ring 7, and the other output electrode is connected with the anode plate 4. The single-stage slip ring 7 is fixed on one side of the connecting rod 6 and is connected with the conductive roller 3 through a wire, so that the rectifier 5 can be communicated with the cathode roller, and the normal rolling of the conductive roller 3 is not influenced.
In order to avoid the situation that the chemical substances are deposited on the surface of the sunlight plate to influence the normal current transmission of the anode plate 4 after the sunlight plate reacts for a long time, the anode plate 4 is arranged below the conductive roller 3, and the water through holes 41 are formed in the anode plate 4, so that the water can pass through the water through holes 41 after the conveying device drives water flow, and the situations such as crystallization precipitation and the like are reduced on the anode plate 4.
The waste bin 8 is communicated with the side edge of the box body 1, and the guide plate 9 for requesting the waste bin 8 to incline is arranged in the box body 1, so that solid wastes such as liquid medicine crystals, chemical precipitation and the like in the box body 1 can be discharged, the cleanliness of the liquid medicine is ensured, and the copper plating effect is ensured.
The implementation principle of the electroless copper plating conductive device provided by the embodiment of the application is as follows: the rectifier 5 applies direct current to the surface of the PCB through the conductive roller 3 (cathode) to accelerate the deposition rate of the initial molecular copper layer. Copper ions are uniformly attached to the surface of palladium, so that copper ion deposition in a subsequent automatic catalytic reaction is compact and uniform, the problems of uneven copper thickness and plating hollowness are solved, and the product quality of a PCB is improved.
The above embodiments are not intended to limit the scope of the present application, so: all equivalent changes in structure, shape and principle of the application should be covered in the scope of protection of the application.
Claims (4)
1. An electroless copper plating conductive device, which is characterized in that: the electric power box comprises a box body (1), a pair of conductive rollers (3) rotatably arranged in the box body (1) and a power supply piece for supplying direct current to the conductive rollers (3), wherein an anode plate (4) electrically connected with the power supply piece is further arranged in the box body (1).
2. The electroless copper plating electroconductive device according to claim 1, wherein: the power supply piece comprises a rectifier (5), a connecting rod (6) connected with a rotating shaft of the lead roller, a single-stage slip ring (7) is arranged at the end part of the connecting rod (6), one output electrode of the rectifier (5) is connected with the single-stage slip ring (7), and the other output electrode is connected with the anode plate (4).
3. The electroless copper plating electroconductive device according to claim 1, wherein: the anode plate (4) is arranged below the conductive roller (3), and a water through hole (41) is formed in the anode plate (4).
4. The electroless copper plating electroconductive device according to claim 1, wherein: the side of the box body (1) is communicated with a waste box (8), and a guide plate (9) for requesting the waste box (8) to incline is arranged in the box body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323059580.5U CN220999917U (en) | 2023-11-13 | 2023-11-13 | Electroless copper plating conductive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323059580.5U CN220999917U (en) | 2023-11-13 | 2023-11-13 | Electroless copper plating conductive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220999917U true CN220999917U (en) | 2024-05-24 |
Family
ID=91086468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323059580.5U Active CN220999917U (en) | 2023-11-13 | 2023-11-13 | Electroless copper plating conductive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220999917U (en) |
-
2023
- 2023-11-13 CN CN202323059580.5U patent/CN220999917U/en active Active
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