CN117545194A - Circuit board hole metallization method and circuit board - Google Patents
Circuit board hole metallization method and circuit board Download PDFInfo
- Publication number
- CN117545194A CN117545194A CN202311423828.3A CN202311423828A CN117545194A CN 117545194 A CN117545194 A CN 117545194A CN 202311423828 A CN202311423828 A CN 202311423828A CN 117545194 A CN117545194 A CN 117545194A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hole
- copper
- electroplating
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000001465 metallisation Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 92
- 229910052802 copper Inorganic materials 0.000 claims abstract description 90
- 239000010949 copper Substances 0.000 claims abstract description 90
- 238000009713 electroplating Methods 0.000 claims abstract description 61
- 238000000151 deposition Methods 0.000 claims abstract description 27
- 230000008021 deposition Effects 0.000 claims abstract description 25
- 239000000126 substance Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 230000003213 activating effect Effects 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000005137 deposition process Methods 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 238000009832 plasma treatment Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 8
- 229910000365 copper sulfate Inorganic materials 0.000 description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000003929 acidic solution Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910001432 tin ion Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a circuit board hole metallization method and a circuit board, wherein the circuit board hole metallization method is applied to the circuit board made of a hollow filler plate, and comprises the steps of carrying out copper deposition treatment on the circuit board with holes so as to deposit a layer of chemical copper on the wall of the holes; performing hole filling electroplating treatment on the circuit board with low current for a long time to electroplate a first copper layer on the pit in the hole; and carrying out through hole electroplating treatment on the circuit board according to the preset copper thickness and the hole aspect ratio of the circuit board, so that a second copper layer is electroplated on the hole wall. According to the circuit board hole metallization method provided by the embodiment of the invention, the copper layer is plated in the hole of the circuit board, and good hole electroplating quality is realized.
Description
Technical Field
The invention relates to the technical field of circuit board processing and production, in particular to a circuit board hole metallization method and a circuit board.
Background
At present, the board for manufacturing the circuit board is a copper-clad plate and is commonly formed by taking epoxy resin as a main raw material. In order to reduce the dielectric constant value, the filling of the hollow filler is usually added in the insulating layer of the board, but due to the addition of the hollow filler, pits with different sizes are inevitably generated on the hole wall after the circuit board drilling process, and part of the positions in the pits cannot be electroplated with copper, so that the conductivity of the circuit board is affected.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the circuit board hole metallization method and the circuit board, which can ensure that pits in holes can be electroplated with copper and ensure the conduction reliability of the circuit board.
According to the circuit board hole metallization method provided by the embodiment of the invention. The method comprises the following steps:
carrying out copper deposition treatment on the circuit board with the holes so as to deposit a layer of chemical copper on the wall of the holes;
performing hole filling electroplating treatment with low current for a long time on the circuit board, so that a first copper layer is electroplated on the pit in the hole;
and carrying out through hole electroplating treatment on the circuit board according to the preset copper thickness and the hole aspect ratio of the circuit board, so that a second copper layer is electroplated on the hole wall.
The circuit board hole metallization method provided by the embodiment of the invention has at least the following technical effects: firstly, carrying out copper deposition treatment on a circuit board, and depositing a layer of chemical copper on the hole wall of the circuit board to enable the originally non-conductive hole to have conductivity so as to facilitate subsequent electroplating treatment; the hole filling electroplating treatment with low current and long time can fill hemispherical pits on the hole wall, and a first copper layer is electroplated on the pits in the hole; after the filled circuit board is subjected to through hole electroplating treatment, a second copper layer is electroplated on the hole wall of the circuit board, and pits on the circuit board can be fully electroplated after being filled, so that copper can be electroplated on pits in the holes, and the conduction reliability of the circuit board is ensured.
According to the circuit board metallization method provided by the embodiment of the invention, the hole filling electroplating treatment specifically comprises the following steps: and (3) placing the circuit board into a hole filling electroplating solution, and electroplating the circuit board, wherein the electroplating current is 4ASF-5ASF, the electroplating time is 60min, and the temperature of a copper cylinder for loading the hole filling electroplating solution is 21-27 ℃.
According to the circuit board metallization method provided by the embodiment of the invention, the through hole electroplating treatment specifically comprises the following steps: and placing the circuit board into through hole electroplating liquid, and performing secondary electroplating on the circuit board, wherein the electroplating current is 15ASF-18ASF, the electroplating time is 50min, and the temperature of a copper cylinder for loading the through hole electroplating liquid is 21-27 ℃.
According to the circuit board metallization method provided by the embodiment of the invention, the thickness of the first copper layer is 3 micrometers-5 micrometers.
According to the circuit board metallization method provided by the embodiment of the invention, before the step of carrying out copper deposition treatment on the circuit board after drilling, the method further comprises the following steps: and carrying out plasma treatment on the circuit board.
According to the circuit board metallization method provided by the embodiment of the invention, the plasma treatment of the circuit board specifically comprises the following steps: firstly, controlling the total flow of gas to be 2.5SLM under the working power of 8.0KW by using a plasma machine, wherein the circuit board is subjected to gumming residue removal treatment for 30min by using 2.0SLM of oxygen and 0.5SLM of nitrogen, then, controlling the circuit board to be treated for 8min by using 2.0SLM of oxygen, 0.25SLM of nitrogen and 0.25SLM of carbon tetrafluoride under the working power of 5.0KW by using the plasma machine, and finally, treating the circuit board for 15min by using 2.5SLM of oxygen.
According to the circuit board metallization method provided by the embodiment of the invention, the copper deposition treatment comprises a first copper deposition and a second copper deposition, wherein the first copper deposition comprises degreasing, microetching, presoaking, activating, chemical copper deposition and discharging; the second copper deposition comprises presoaking, activating, chemical copper and discharging.
In the circuit board provided by the embodiment of the second aspect of the present invention, the hole of the circuit board is metallized by using the circuit board metallization method described in the embodiment of the first aspect.
The circuit board provided by the embodiment of the invention has at least the following beneficial effects: the circuit board is processed by the circuit board metallization method, firstly, copper deposition treatment is carried out on the circuit board, and a layer of chemical copper is deposited on the hole wall of the circuit board, so that the originally non-conductive hole has conductivity, and the subsequent electroplating treatment is facilitated; the hole filling electroplating treatment with low current and long time can fill hemispherical pits on the hole wall, and a first copper layer is electroplated on the pits in the hole; after the filled circuit board is subjected to through hole electroplating treatment, a second copper layer is electroplated on the hole wall of the circuit board, and pits on the circuit board can be fully electroplated after being filled, so that copper can be electroplated on pits in the holes, and the conduction reliability of the circuit board is ensured.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart of the steps of a circuit board hole metallization method according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of a hollow filler sheet material according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a perforated circuit board according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a circuit board after hole-filling electroplating treatment according to an embodiment of the present invention;
fig. 5 is a schematic diagram of a circuit board after through-hole plating treatment according to an embodiment of the invention.
Reference numerals:
copper foil 100; an insulating layer 200; pit 201; a first copper layer 300; a second copper layer 400.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the description of the present invention, a number means one or more, a number means two or more, and greater than, less than, exceeding, etc. are understood to not include the present number, and above, below, within, etc. are understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
At present, the board for manufacturing the circuit board is a copper-clad plate and is commonly formed by taking epoxy resin as a main raw material. In order to reduce the dielectric constant value, the filling of the hollow filler is usually added in the insulating layer of the board, but due to the addition of the hollow filler, pits with different sizes are inevitably generated on the hole wall after the circuit board drilling process, and the pits can generate a single-point hole breaking phenomenon with high probability after the normal electroplating process, namely copper cannot be completely covered in the pits through electroplating, and the larger single-point hole breaking does not meet the quality requirement of circuit board manufacturing and can bring serious quality reliability problems.
To this end, an embodiment of the first aspect of the present invention proposes a circuit board hole metallization method, specifically referring to fig. 1 to 5 of the drawings in the specification.
Referring to fig. 1 to 5, the circuit board hole metallization method of the embodiment of the present invention is applied to a circuit board of a hollow filler board, the circuit board of the hollow filler board including a copper foil 100 and an insulating layer 200, the circuit board hole metallization method including the steps of:
s1, carrying out copper deposition treatment on a circuit board with holes, so as to deposit a layer of chemical copper on the wall of each hole;
s2, performing hole filling electroplating treatment on the circuit board with low current for a long time, so that the first copper layer 300 is electroplated on the pit 201 in the hole;
s3, carrying out through hole electroplating treatment on the circuit board according to the preset copper thickness and the hole aspect ratio of the circuit board, and electroplating a second copper layer 400 on the hole wall.
It will be appreciated that the insulating layer 200 of the circuit board is non-conductive, and the copper deposition process is capable of depositing a layer of chemical copper on the hole wall, which is capable of conducting, so that the originally non-conductive hole has conductivity, and is ready for the subsequent electroplating process; the low-current and long-time hole-filling electroplating process has good filling property, so that the pit 201 can be filled, the low-current and long-time hole-filling electroplating process can be used for filling hemispherical pit 201 on the hole wall, and the first copper layer 300 is electroplated on the pit 201 in the hole; after the filled circuit board is subjected to through hole electroplating treatment, the hole wall of the circuit board is electroplated with the second copper layer 400, the pits 201 on the circuit board can ensure that the through holes are fully electroplated after being filled, the pits 201 in the holes can be electroplated with copper, and the conduction reliability of the circuit board is ensured.
In some embodiments of the present invention, the first copper layer 300 has a thickness of 3 microns to 5 microns.
In some embodiments of the present invention, before the copper deposition treatment is performed on the circuit board with holes in step S1, the method further includes the following steps: and carrying out plasma treatment on the circuit board. Wherein, the plasma treatment specifically comprises the following steps: firstly, controlling the total flow of gas to be 2.5SLM under 8.0KW working power by using a plasma machine, wherein the circuit board is treated by using 2.0SLM of oxygen and 0.5SLM of nitrogen for 30min in the process of removing glue residues, then, controlling the circuit board to be treated by using 2.0SLM of oxygen, 0.25SLM of nitrogen and 0.25SLM of carbon tetrafluoride for 8min under 5.0KW working power by using the plasma machine, and finally, treating the circuit board by using 2.5SLM of oxygen for 15min. It can be appreciated that after the impurities on the surface of the circuit board are removed by plasma treatment, the pit 201 in the hole can be fully deposited with copper, so that the electroplating quality of the subsequent circuit board is improved.
In some embodiments of the present invention, the hole-filling electroplating treatment for the circuit board specifically includes: and (3) placing the circuit board into a hole filling electroplating solution, and electroplating the circuit board, wherein the electroplating current is 4ASF-5ASF, the electroplating time is 60min, and the temperature of a copper cylinder loaded with the hole filling electroplating solution is 21-27 ℃. The main components of the hole-filling plating solution include copper sulfate, sulfuric acid, chloride and a plating solution. A formula of high-concentration copper sulfate is adopted; the sulfuric acid content is 200g/L-260g/L; the content of copper sulfate is 40g/L-90g/L. The plating gloss agent comprises a carrier, a gloss agent and a leveling agent. The carrier is mainly a polyoxyalkyl type large molecular weight compound, and is adsorbed on a high current area on the surface of the cathode together with chloride ions to reduce the copper plating rate. The gloss agent is mainly sulfur-containing small molecular weight compound and is adsorbed on the low current area of the cathode surface to displace the attached carrier agent and accelerate the deposition of the coating. The leveling agent is mainly a nitrogenous heterocyclic chemical, and can drive away landed gloss agent particles in a high-current area at a protruding point, so that rapid copper plating of the area is inhibited, and the copper thickness is more uniform.
In some embodiments of the present invention, the through-hole plating process for the circuit board specifically includes: and (3) placing the circuit board into through hole electroplating liquid, and carrying out secondary electroplating on the circuit board, wherein the electroplating current is 15ASF-18ASF, the electroplating time is 50min, and the temperature of a copper cylinder for loading the through hole electroplating liquid is 21-27 ℃. The main components of the through hole plating solution are copper sulfate and sulfuric acid, and a high-concentration sulfuric acid low-concentration copper sulfate formula is adopted, so that the uniformity of plate surface thickness distribution and deep plating capability of deep holes during plating are ensured; the sulfuric acid content is 180g/L-220g/L; the copper sulfate content is generally 60g/L-90g/L, and trace chloride ions can be contained in the bath solution to play a role of gloss together with the copper gloss agent as an auxiliary gloss agent.
In some embodiments of the invention, the copper deposition process comprises a first copper deposition process and a second copper deposition process, the first copper deposition process comprising degreasing, microetching, presoaking, activating, chemical copper deposition, and out-of-cylinder; the second copper deposition comprises presoaking, activating, chemical copper and discharging. Deoiling, namely treating the circuit board by using a deoiling agent to remove grease and an oxide layer on the circuit board, so that the effect of chemical reaction of the circuit board is improved; microetching, forming a rough microstructure on the circuit board by utilizing chemical reaction so as to improve the adhesion rate of the chemical copper layer on the circuit board; presoaking, namely cleaning impurities on the circuit board by using an acidic solution with tin ions so as to facilitate uniform adsorption of copper liquid medicine during activation; activating to enable colloid to be uniformly attached to the hole wall, and initiating an electroless copper plating initial reaction; under the action of a catalyst, the copper complex and the reducing agent generate oxidation-reduction reaction to deposit elemental copper; and taking out the plate after chemical copper out of the copper deposition cylinder.
Referring to fig. 5, a second aspect of the present invention further provides a circuit board, where the circuit board is metallized by using the circuit board metallization method of the first aspect, and it can be understood that after copper deposition, a layer of chemical copper is deposited on the hole wall of the circuit board, so that the hole that is originally non-conductive has conductivity, so as to facilitate the subsequent electroplating process; the hole-filling electroplating treatment with low current and long time can fill hemispherical pits 201 on the hole wall, and the first copper layer 300 is electroplated on the pits 201 in the hole; after the filled circuit board is subjected to through hole electroplating treatment, the hole wall of the circuit board is electroplated with the second copper layer 400, the pits 201 on the circuit board can ensure that the through holes are fully electroplated after being filled, the pits 201 in the holes can be electroplated with copper, and the conduction reliability of the circuit board is ensured.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (8)
1. A circuit board hole metallization method, which is characterized by being applied to a circuit board made of a hollow filler plate, comprising:
carrying out copper deposition treatment on the circuit board with the holes so as to deposit a layer of chemical copper on the wall of the holes;
performing hole filling electroplating treatment with low current for a long time on the circuit board, so that a first copper layer is electroplated on the pit in the hole;
and carrying out through hole electroplating treatment on the circuit board according to the preset copper thickness and the hole aspect ratio of the circuit board, so that a second copper layer is electroplated on the hole wall.
2. The circuit board hole metallization method of claim 1, wherein the hole filling electroplating process specifically comprises: and (3) placing the circuit board into a hole filling electroplating solution, and electroplating the circuit board, wherein the electroplating current is 4ASF-5ASF, the electroplating time is 60min, and the temperature of a copper cylinder for loading the hole filling electroplating solution is 21-27 ℃.
3. The method of circuit board hole metallization according to claim 2, wherein the through-hole plating process specifically comprises: and placing the circuit board into through hole electroplating liquid, and performing secondary electroplating on the circuit board, wherein the electroplating current is 15ASF-18ASF, the electroplating time is 50min, and the temperature of a copper cylinder for loading the through hole electroplating liquid is 21-27 ℃.
4. The circuit board hole metallization method of claim 1, wherein the first copper layer has a thickness of 3 microns to 5 microns.
5. The method of metallizing a circuit board hole according to claim 1, further comprising, before said step of copper deposition of the drilled circuit board, the steps of: and carrying out plasma treatment on the circuit board.
6. The method of metallizing a circuit board hole of claim 5, wherein said plasma treating said circuit board specifically comprises: firstly, controlling the total flow of gas to be 2.5SLM under the working power of 8.0KW by using a plasma machine, wherein the circuit board is subjected to gumming residue removal treatment for 30min by using 2.0SLM of oxygen and 0.5SLM of nitrogen, then, controlling the circuit board to be treated for 8min by using 2.0SLM of oxygen, 0.25SLM of nitrogen and 0.25SLM of carbon tetrafluoride under the working power of 5.0KW by using the plasma machine, and finally, treating the circuit board for 15min by using 2.5SLM of oxygen.
7. The circuit board hole metallization method of claim 1, wherein the copper deposition process comprises a first copper deposition and a second copper deposition, wherein the first copper deposition comprises degreasing, microetching, pre-dipping, activating, chemical copper deposition, out-of-cylinder; the second copper deposition comprises presoaking, activating, chemical copper and discharging.
8. A circuit board, characterized in that the holes of the circuit board are metallized by the circuit board hole metallization method according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311423828.3A CN117545194A (en) | 2023-10-30 | 2023-10-30 | Circuit board hole metallization method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311423828.3A CN117545194A (en) | 2023-10-30 | 2023-10-30 | Circuit board hole metallization method and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117545194A true CN117545194A (en) | 2024-02-09 |
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ID=89785205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311423828.3A Pending CN117545194A (en) | 2023-10-30 | 2023-10-30 | Circuit board hole metallization method and circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN117545194A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118632442A (en) * | 2024-08-13 | 2024-09-10 | 四川英创力电子科技股份有限公司 | Control method of ICD (ICD) of circuit board |
-
2023
- 2023-10-30 CN CN202311423828.3A patent/CN117545194A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118632442A (en) * | 2024-08-13 | 2024-09-10 | 四川英创力电子科技股份有限公司 | Control method of ICD (ICD) of circuit board |
| CN118632442B (en) * | 2024-08-13 | 2024-10-29 | 四川英创力电子科技股份有限公司 | Control method of ICD (ICD) of circuit board |
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