CN220986459U

CN220986459U - LED substrate

Info

Publication number: CN220986459U
Application number: CN202322402500.5U
Authority: CN
Inventors: 陈凤; 赵跃兰; 陈薇; 杜露; 信潇雅
Original assignee: Shenzhen North South Vision Optoelectronics Co ltd
Current assignee: Shenzhen North South Vision Optoelectronics Co ltd
Priority date: 2023-09-01
Filing date: 2023-09-01
Publication date: 2024-05-21
Anticipated expiration: 2033-09-01

Abstract

The application provides an LED substrate, which comprises a substrate; the light source module comprises a substrate, a packaging layer and a light source module, wherein the substrate is provided with a substrate, the substrate is provided with a packaging plate and a packaging block, the packaging plate is arranged in the packaging block, and the packaging block is used for improving light uniformity; the heat dissipation block is arranged on the other surface of the substrate and used for dissipating heat; the two mounting plates are arranged on two opposite sides of the substrate, are positioned between the substrate and the radiating block and are used for fixing. By the aid of the LED substrate, light uniformity of the LED substrate can be improved.

Description

LED substrate

Technical Field

The application relates to the field of LEDs, in particular to an LED substrate.

Background

LED substrates are one of the key components common in modern lighting and electronics for supporting and packaging LED chips and providing thermal management. However, conventional LED substrates present some challenges in light uniformity. It is difficult for conventional packaging structures to fully ensure uniform distribution of light, which may lead to non-uniformity of lighting effects and an undesirable visual experience.

In order to solve the problem of uniformity of light of the LED substrate, some means are generally adopted in the prior art to optimize light distribution. One common approach is to use different optical elements, such as lenses and diffusers, on the LED chip to adjust the direction and angle of propagation of the light to achieve a more uniform illumination or display effect. Another approach is to optimize the light output distribution by adjusting the arrangement of LED chips or using an optical model. However, these methods may be subject to size limitations, manufacturing complexity, and cost, and thus may not achieve the desired light uniformity in some cases.

However, the prior art solutions still have some limitations in improving the uniformity of the light of the LED substrate. Some of these methods may result in increased design complexity, increased manufacturing costs, or increased system size. In addition, some methods may not achieve sufficient light uniformity under specific environments, thereby affecting the practical application effect of the LED substrate. Therefore, a more efficient, simpler and reliable method is needed to improve the light uniformity of the LED substrate to meet the requirements of different application scenarios.

Disclosure of utility model

In view of the foregoing, there is a need for an improved packaging layer and multiple heat dissipation LED substrate to solve the above-mentioned problems.

An embodiment of the present application provides an LED substrate including:

a substrate;

The packaging layer comprises a packaging plate and a packaging block, the packaging block is arranged on one surface of the substrate, the packaging plate is arranged in the packaging block, and the packaging block is used for improving light uniformity;

the heat dissipation block is arranged on the other surface of the substrate and used for dissipating heat;

the two mounting plates are arranged on two opposite sides of the substrate, are positioned between the substrate and the radiating block and are used for fixing.

In at least one embodiment of the present application, the encapsulation layer is provided with a high reflectivity coating in all directions.

In at least one embodiment of the application, the package plate is a wide angle lens. For improving the uniformity of light.

In at least one embodiment of the present application, the substrate is an aluminum substrate.

In at least one embodiment of the application, the aluminum substrate is provided with a thermally conductive coating.

In at least one embodiment of the present application, the heat sink is a thermally conductive plastic.

In at least one embodiment of the present application, the mounting plate is provided with holes for fixing the LED substrate by screws.

In at least one embodiment of the present application, a plurality of heat dissipation holes are formed on two sides of the package block for further heat dissipation.

In at least one embodiment of the present application, a plurality of T-shaped grooves are uniformly formed on the peripheral packaging edge of the packaging layer, and the T-shaped grooves are used for clamping the wide-angle lens.

In at least one embodiment of the present application, the four peripheries of the wide-angle lens are provided with T-shaped bulges for attaching the encapsulation layer.

The LED substrate provided by the above can maintain stable working temperature and stable fixation of the mounting plate by using the packaging block to diffuse and reflect light and the heat dissipation block, so that better effect can be obtained in lighting, display and other applications, and the light uniformity of the LED substrate is improved.

Drawings

Fig. 1 is an exploded view of an LED substrate according to an embodiment of the present application.

Description of the main reference signs

100. An LED substrate; 10. a substrate; 20. an encapsulation layer; 21. a package plate; 22. packaging blocks; 221. a heat radiation hole; 23. a T-shaped groove; 24. t-shaped bulge; 30. a heat dissipation block; 40. a mounting plate; 41. and (3) a hole.

Detailed Description

Embodiments of the present application will now be described with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application.

It is noted that when one component is considered to be "connected" to another component, it may be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed" on another element, it can be directly on the other element or intervening elements may also be present. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "rear," and the like are used herein for illustrative purposes only.

The embodiment of the application provides an LED substrate, which comprises a substrate; the packaging structure comprises a substrate, and is characterized by also comprising a packaging layer, wherein the packaging layer comprises a packaging plate and a packaging block, the packaging block is arranged on one surface of the substrate, the packaging plate is arranged in the packaging block, and the packaging block is used for improving light uniformity; the heat dissipation block is arranged on the other surface of the substrate and used for dissipating heat; the heat dissipation device further comprises two mounting plates, wherein the two mounting plates are arranged on two opposite sides of the substrate, are positioned between the substrate and the heat dissipation block and are used for fixing.

Some embodiments of the application are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to fig. 1, an embodiment of the present application provides an LED substrate 100, including a base 10; the packaging layer 20 comprises a packaging plate 21 and a packaging block 22, wherein the packaging block 22 is arranged on one surface of the substrate 10, the packaging plate 21 is arranged in the packaging block 22, and the packaging block 22 is used for improving light uniformity; the heat dissipation device further comprises a heat dissipation block 30, wherein the heat dissipation block 30 is arranged on the other surface of the substrate 10 and is used for dissipating heat; the heat dissipation device further comprises two mounting plates 40, wherein the two mounting plates 40 are arranged on two opposite sides of the base 10, and are positioned between the base 10 and the heat dissipation block 30 for fixing.

Specifically, the package board 21 is located in the package layer 20, and can protect sensitive parts such as LED elements and circuits, and prevent substances such as external dust and moisture from entering, so as to prolong the service life of the LED substrate 100; the package 22 is located on one side of the substrate 10, and the presence of these packages 22 helps to improve the uniformity of the light. They can disperse light and reduce hot spots that may occur, ensuring that the LED illumination is more uniform.

Further, a heat sink 30 is located on the other side of the substrate 10 to reduce the operating temperature of the LED element by dissipating heat. In LED lighting, high temperatures may reduce the efficiency and lifetime of the LED, and the presence of the heat sink 30 helps to maintain a stable operating state of the LED.

Still further, two mounting plates 40 are located on opposite sides of the base 10, sandwiched between the base 10 and the heat sink 30. Their main function is to fix the LED substrate 100 at a desired position, ensuring stability and reliability of the LED substrate 100.

In summary, this feature combines packaging, heat dissipation and fixation functions, is suitable for LED luminaire manufacturing and lighting applications, provides better light uniformity and heat dissipation performance, while ensuring stability and reliability of the LED substrate 100.

In a specific embodiment, the encapsulation layer 20 is provided with a high reflectivity coating in all directions. In particular, this feature indicates that the encapsulation layer 20 of the LED substrate 100 is provided with a high reflectivity coating in all directions. This means that both the outer surface and the inner part of the encapsulation layer 20 are covered with a high reflectivity coating.

Further, in the process of manufacturing the LED substrate 100, the outer surface and the inner portion of the encapsulation layer 20 are coated with a high-reflectivity coating. Meanwhile, the high-reflectivity coating can reflect more emitted light back into the package layer 20 when the LED emits light, so that the utilization rate and uniformity of the light are improved.

Still further, in LED lighting applications, the reflection and diffusion of light may be increased by using high reflectivity coatings both inside and outside of the encapsulation layer 20, thereby enhancing the lighting effect. This is particularly important for lighting scenes that require higher light uniformity and brightness, such as indoor lighting, road lighting, etc.

Still further, the high reflectivity coating helps to reduce the loss of light at the surface of the encapsulant layer 20, ensuring that more light is directed to the desired illumination area, reducing energy waste. Meanwhile, by increasing the reflectivity of light, the LED substrate 100 may use a lower current at the same brightness, thereby reducing heat generation and extending the life of the LED.

In summary, the light utilization rate of the LED substrate 100 can be significantly improved, the lighting effect is improved, the light energy loss is reduced, and the heat generation of the LED is reduced, so that the service life of the LED is prolonged. The design feature can play a positive role in various application scenes requiring high-efficiency illumination, thereby providing a higher-quality illumination experience for users.

In a specific embodiment, the package plate 21 is a wide angle lens. For improving the uniformity of light. In particular, this feature indicates that the package plate 21 of the LED substrate 100 adopts a design of a wide angle lens. The wide-angle lens can make light more uniformly spread in the process of light emission, so that the uniformity and distribution of the light are improved.

Further, in designing the LED substrate 100, the package plate 21 is designed as a wide-angle lens so that light can be guided and diffused by the lens after being emitted from the LED chip. Meanwhile, the wide-angle lens can diffuse light rays emitted by the LED chip in a larger range, so that the light rays can uniformly irradiate the target area.

Furthermore, in indoor illumination application, the wide-angle lens can uniformly irradiate the light rays emitted by the LEDs to the whole room, so that uneven brightness is avoided, and a more comfortable illumination environment is provided; meanwhile, the wide-angle lens can ensure that light rays are uniformly distributed in a wide area, and the visual effect and safety are enhanced; in LED display screen applications, the wide angle lens can make the display content visible in a larger viewing angle, avoiding the appearance of visual dead angles and color distortions.

In summary, the presence of this feature can improve the distribution of the LED light to more uniformly illuminate the target area, which is suitable for various lighting and display applications. The design of wide angle lens can provide better lighting effect, strengthens visual experience.

In a specific implementation, the substrate is an aluminum substrate. In particular, this feature indicates that the base 10 of the LED substrate 100 is made of an aluminum substrate material. The aluminum substrate has good heat conduction performance, is favorable for rapidly conducting heat generated by the LED chip to the heat dissipation block 30, and dissipates the heat to the surrounding environment through the heat dissipation block 30, so that the temperature stability of the LED chip is maintained.

Specifically, the aluminum substrate has superior heat conductive properties, generates heat when the LED chip emits light, and can rapidly conduct the heat to the heat sink 30 of the base 10. Meanwhile, the heat dissipation block 30 is located on the other side of the base 10, and the heat dissipation block 30 can dissipate heat to the surrounding environment through the conduction of the aluminum substrate, so that the LED chip is prevented from being overheated.

In summary, the existence of the feature makes the LED substrate 100 have excellent heat conducting performance, and can rapidly conduct and dissipate heat generated by the LED chip, so as to improve the high temperature resistance and stability of the LED. The application of the aluminum substrate can be suitable for various environments and scenes, and the LED lamp can reliably work under various conditions.

In a specific embodiment, the aluminum substrate is provided with a heat conductive coating. In particular, this feature indicates that the aluminum substrate surface of the LED substrate 100 is coated with a thermally conductive coating. The heat conducting coating can further enhance the heat conducting performance of the aluminum substrate and improve the heat conducting efficiency, so that the heat generated by the LED chip is transferred to the heat radiating block 30 more effectively, and the working temperature of the LED chip is kept.

Further, the heat conducting coating forms a layer of coating with good heat conducting performance on the surface of the aluminum substrate, and can conduct heat more effectively, so that the heat conducting performance of the whole substrate is improved. Meanwhile, when the LED chip generates heat, the heat conducting coating can rapidly conduct the heat to the heat dissipating block 30 of the substrate 10, so that rapid heat dissipation is realized.

Further, the high power LED chip generates a larger amount of heat, and requires better heat dissipation measures. In high-power LED application, the aluminum substrate is provided with the heat conducting coating, so that the heat dissipation efficiency can be effectively improved, and the stable work of the LED chip is ensured.

In summary, by adding the heat-conducting coating on the surface of the aluminum substrate, the heat-conducting property of the substrate is further improved, and the heat generated by the LED chip is effectively conducted, so that the working temperature of the LED chip is kept, and the LED chip is suitable for high-power and high-brightness LED application scenes.

In a specific embodiment, the heat dissipating block 30 is a heat conductive plastic. In particular, this feature indicates that the heat sink 30 of the LED substrate 100 is made of thermally conductive plastic. The heat conductive plastic has excellent heat conductive performance, can effectively conduct heat generated by the LED chip, and improves the overall heat dissipation efficiency, thereby maintaining the stable working temperature of the LED chip.

Further, when the LED chip generates heat, the heat conductive plastic heat sink 30 can rapidly conduct heat from the LED chip to the surface of the heat sink 30 of the substrate 10. Meanwhile, due to the excellent heat conducting property of the heat conducting plastic, it can transfer heat from the heat source to the substrate 10 more effectively, promoting rapid dissipation of heat.

In summary, this feature improves the heat dissipation efficiency by using the heat conductive plastic to manufacture the heat dissipation block 30, and helps to rapidly conduct the heat generated by the LED chip, which is suitable for various LED application scenarios requiring efficient heat dissipation, especially in limited space and severe environments.

In a specific embodiment, the mounting plate 40 is provided with holes 41 for fixing the LED board 100 by screws.

Specifically, this feature indicates that holes 41 are opened in the two mounting boards 40 of the LED substrate 100 for fixing the LED substrate 100 by screws. This manner of attachment provides significant convenience and flexibility in manufacturing, installation, and maintenance while also helping to maintain the stability and reliability of the LED substrate 100.

Further, in the process of manufacturing the LED substrate 100, the LED substrate 100 is combined with other devices, and then the two mounting boards 40 are clamped by screws, so that the LED substrate 100 is fixed at a desired position. And by passing the screw through the hole 41 of the mounting board 40 and tightening it, a sufficient tightening force can be generated to firmly fix the LED substrate 100 in a desired position.

In summary, this feature provides a convenient and reliable way of fixing the LED substrate 100 by forming the hole 41 and using screws, which is suitable for various LED application scenarios, especially in the case of needing to fix firmly.

In a specific implementation, a plurality of heat dissipation holes 221 are formed on two sides of the package 22 for further heat dissipation.

In particular, this feature indicates that the package 22 on the LED substrate 100 is provided with a plurality of heat dissipating holes 221 on both sides, and the presence of these heat dissipating holes 221 can promote faster heat removal, thereby enhancing the heat dissipation effect. By further heat dissipation, the operating temperature of the LED substrate 100 can be effectively reduced, improving the stability and lifetime of the LED.

Further, the LEDs generate heat when they emit light, and these heat are conducted to the heat sink 30 through the substrate. And the heat dissipation holes 221 provided in the package block 22 on the heat dissipation block 30 may provide another heat transfer path to conduct heat from the package block 22 to the heat dissipation holes 221 and further to the external environment.

Still further, high power LEDs generate more heat during operation, requiring a better heat dissipation mechanism. By providing the heat dissipation holes 221 of the package block 22 on the LED substrate 100, the heat dissipation effect can be enhanced, which is suitable for high power LED applications such as lighting and display fields.

In summary, this feature provides a more efficient heat transfer and convection heat dissipation mechanism through the heat dissipation holes 221 on both sides of the package block 22, thereby further enhancing the heat dissipation performance of the LED substrate 100, and being suitable for various LED application scenarios requiring efficient heat dissipation.

In a specific embodiment, a plurality of T-shaped grooves 23 are uniformly formed on the peripheral packaging edge of the packaging layer 20, so as to clamp the wide-angle lens.

Specifically, this feature indicates that the package layer 20 of the LED substrate 100 is uniformly provided with a plurality of T-shaped grooves 23 on the periphery thereof for clamping the wide-angle lens. The design of these T-shaped grooves 23 ensures that the wide angle lens is firmly fixed to the LED substrate 100, thereby keeping the optical performance of the LED stable.

Further, the edges of the wide angle lens have T-shaped protrusions 24 that fit into T-shaped grooves 23 of the encapsulation layer 20. During assembly, the edge of the wide-angle lens is inserted into the T-shaped groove 23 of the encapsulation layer 20, and then the wide-angle lens is gently rotated so that its convex shape is engaged with the in-groove structure, thereby firmly fixing the wide-angle lens on the LED substrate 100.

Still further, in LED lighting applications, wide angle lenses are typically used to control the divergence angle of the light, thereby achieving a more uniform light distribution. The design of this feature ensures that the wide angle lens is always in the correct position to maintain the desired optical effect.

In summary, this feature effectively fixes the wide-angle lens on the LED substrate 100 by combining the T-shaped groove 23 and the wide-angle lens, ensures the stability and consistency of the LED optical performance, and is suitable for the LED application scenario requiring precise optical control.

In a specific embodiment, the four peripheries of the wide-angle lens are provided with T-shaped bulges 24 for attaching the encapsulation layer 20.

Specifically, this feature indicates that the peripheral edge of the wide-angle lens of the LED substrate 100 is provided with a T-shaped protrusion 24 for engagement with the encapsulation layer 20. By the design, better adhesion between the wide-angle lens and the packaging layer 20 can be ensured, so that penetration of external stray light is prevented, and the optical efficiency and performance stability of the LED system are improved.

Further, the peripheral edge of the wide angle lens is configured as a T-shaped bulge 24, which allows the lens edge to have a protruding portion that better nests with the structure of the encapsulant layer 20. Meanwhile, in the process of assembling the LED substrate 100, the T-shaped protrusion 24 of the wide-angle lens and the T-shaped groove 23 of the encapsulation layer 20 are nested with each other to form a tight fit, so that the lens is ensured to be accurately positioned on the encapsulation layer 20, and light leakage is reduced.

Further, in an illumination system requiring highly controlled light distribution and reduced light loss, by using such a design, the optical performance of the LED substrate 100 can be optimized, ensuring that light can be efficiently transmitted to a target area, and improving illumination effect. Meanwhile, in an LED display screen and a display module, ensuring the light transmission and distribution of LEDs is of great importance. This feature can improve the image quality and brightness uniformity of the LED display. Moreover, in various optical devices, it is desirable to precisely control the transmission and distribution of light, and this design ensures a tight bond between the lens and the encapsulation layer 20, improving the optical performance of the device.

In summary, this feature ensures the tight combination between the wide-angle lens of the LED substrate 100 and the encapsulation layer 20 by the adhesion of the T-shaped protrusion 24 and the encapsulation layer 20, thereby improving the optical performance of the LED system, and being suitable for various application scenarios requiring highly controlled light.

While the application has been described with respect to the above embodiments, it should be noted that modifications can be made by those skilled in the art without departing from the inventive concept, and these are all within the scope of the application.

Claims

1. An LED substrate, comprising:

a substrate;

2. The LED substrate of claim 1, wherein said encapsulation layer is provided with a high reflectivity coating in all directions.

3. The LED substrate of claim 1, wherein said package plate is a wide angle lens for improving uniformity of light.

4. The LED substrate of claim 1, wherein said substrate is an aluminum substrate.

5. An LED substrate according to claim 4 wherein the aluminum substrate is provided with a thermally conductive coating.

6. The LED substrate of claim 1, wherein said heat sink is a thermally conductive plastic.

7. The LED substrate of claim 1, wherein said mounting plate is perforated for securing said LED substrate by screws.

8. The LED substrate of claim 1, wherein a plurality of heat dissipation holes are formed on both sides of the package for further heat dissipation.

9. An LED board according to claim 3 wherein a plurality of T-shaped grooves are uniformly provided on the peripheral edges of the encapsulation layer for clamping the wide angle lens.

10. The LED substrate of claim 9, wherein said wide angle lens has a T-shaped protrusion on its periphery for engaging said encapsulation layer.