CN220985931U - High-efficient radiating circuit board - Google Patents
High-efficient radiating circuit board Download PDFInfo
- Publication number
- CN220985931U CN220985931U CN202322730702.2U CN202322730702U CN220985931U CN 220985931 U CN220985931 U CN 220985931U CN 202322730702 U CN202322730702 U CN 202322730702U CN 220985931 U CN220985931 U CN 220985931U
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- fixedly connected
- heat radiation
- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 230000005855 radiation Effects 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims abstract description 19
- 230000000712 assembly Effects 0.000 claims description 6
- 238000000429 assembly Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 238000009423 ventilation Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000003139 buffering effect Effects 0.000 abstract description 5
- 230000000191 radiation effect Effects 0.000 abstract description 5
- 239000000306 component Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 238000013016 damping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a circuit board with high-efficiency heat dissipation, which relates to the technical field of circuit boards and comprises the following components: the circuit board comprises a circuit board body, wherein a chip is arranged on the upper surface of the circuit board body, and mounting seats are symmetrically and fixedly connected to the upper surface of the circuit board body. In the utility model, in the process of finishing installation and use of the heat radiation component, the heat radiation fins and the heat conduction plate can be kept in a close fit state with the circuit board body all the time by using the resilience force of the second spring, and the vibration conducted to the position of the heat conduction plate when the heat radiation fan works can be eliminated by using the buffering of the second damper and the second spring because the heat radiation fins and the heat conduction plate are not hard-connected with the pressing plate, so that the heat radiation effect can be prevented from being influenced by the deviation of the position of the heat conduction plate, and the problem that in the background art, the screw of the heat radiation mechanism is loosened under long-time high-frequency vibration in the operation process of the circuit board, so that gaps appear between the heat conduction plate and the circuit board, and the heat radiation effect is influenced is solved.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a circuit board with efficient heat dissipation.
Background
The circuit board is one of core components in the computer system, is a circuit board for connecting and supporting communication and coordination work among all parts of the computer, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances.
In the prior art, the circuit board generally adopts an air cooling heat dissipation mechanism to provide heat dissipation for the circuit board and the chip, however, after the heat dissipation mechanism and the circuit board are installed, a certain vibration can be generated when the heat dissipation fan operates, and the screw of the heat dissipation mechanism can be loosened due to long-time high-frequency vibration in the operation process of the circuit board, so that gaps appear between the heat conduction sheet and the circuit board, and the heat dissipation effect is affected.
Disclosure of utility model
The utility model aims to solve the problems that in the prior art, a circuit board generally adopts an air cooling heat dissipation mechanism to provide heat dissipation for the circuit board and a chip, however, after the heat dissipation mechanism and the circuit board are installed, a heat dissipation fan can generate certain vibration during operation, and screws of the heat dissipation mechanism can be loosened under long-time high-frequency vibration in the operation process of the circuit board, so that gaps appear between a heat conduction sheet and the circuit board, and the heat dissipation effect is influenced.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: a circuit board with efficient heat dissipation, comprising: the circuit board comprises a circuit board body, wherein a chip is arranged on the upper surface of the circuit board body, mounting seats are symmetrically and fixedly connected to the upper surface of the circuit board body, and clamping grooves are formed in the outer surfaces of the two mounting seats; the number of the installation components is two, the two installation components are positioned in the inner position of the installation seat, and the installation components comprise insertion blocks; the heat dissipation assembly is fixedly connected between the upper surfaces of the two inserting blocks and comprises a mounting plate.
Preferably, the notch is offered to the inserted block surface, bottom equidistance fixedly connected with a plurality of first dampers in the notch, a plurality of first damper surface all overlaps and is equipped with first spring, a plurality of fixedly connected with fixture block between the first damper terminal surface.
Preferably, the outer surface of the inserting block is connected with the inner surface of the mounting seat in an inserting way, the clamping block is matched with the clamping groove in position, and the outer surface of the clamping block is arranged in an arc surface.
Preferably, the upper surface of the mounting plate is provided with a ventilation groove, and the inner surface of the ventilation groove is fixedly connected with a cooling fan.
Preferably, the mounting plate lower surface evenly fixedly connected with a plurality of second dampers, a plurality of second dampers surface all overlaps and is equipped with the second spring, a plurality of fixedly connected with clamp plate between the second damper terminal surface.
Preferably, the clamping frame is fixedly connected to the lower surface of the pressing plate, and the radiating fins are arranged on the lower surface of the pressing plate and located at the inner side of the clamping frame.
Preferably, the heat conducting plate is arranged on the lower surface of the heat radiating fin, and the lower surface of the heat conducting plate is attached to the upper surface of the chip.
Compared with the prior art, the utility model has the advantages and positive effects that,
1. In the utility model, in the process of finishing installation and use of the heat radiation component, the heat radiation fins and the heat conduction plate can be kept in a close fit state with the circuit board body all the time by using the resilience force of the second spring, and the vibration conducted to the position of the heat conduction plate when the heat radiation fan works can be eliminated by using the buffering of the second damper and the second spring because the heat radiation fins and the heat conduction plate are not hard-connected with the pressing plate, so that the heat radiation effect can be prevented from being influenced by the deviation of the position of the heat conduction plate, and the problem that in the background art, the screw of the heat radiation mechanism is loosened under long-time high-frequency vibration in the operation process of the circuit board, so that gaps appear between the heat conduction plate and the circuit board, and the heat radiation effect is influenced is solved.
2. According to the utility model, when the heat radiation assembly and the circuit board body are installed in an adapting way, the mounting plate drives the insert block to be inserted into the mounting seat, the clamping block is driven to be ejected and clamped in the clamping groove by utilizing the resilience force of the first spring, so that the heat radiation assembly is installed and fixed, the installation operation of the heat radiation assembly is more convenient and quick, and the heat radiation assembly has stronger practicability.
Drawings
Fig. 1 is a perspective view of a circuit board with efficient heat dissipation according to the present utility model;
Fig. 2 is a top view of a circuit board with efficient heat dissipation according to the present utility model;
Fig. 3 is a bottom view of a circuit board with efficient heat dissipation according to the present utility model;
Fig. 4 is a schematic diagram of a mounting assembly of a circuit board with efficient heat dissipation according to the present utility model;
Fig. 5 is a schematic diagram of a heat dissipation assembly of a circuit board with efficient heat dissipation according to the present utility model.
Legend description: 1. a circuit board body; 2. a chip; 3. a mounting base; 4. a clamping groove; 5. a mounting assembly; 501. inserting blocks; 502. a notch; 503. a first damper; 504. a first spring; 505. a clamping block; 6. a heat dissipation assembly; 601. a mounting plate; 602. a heat radiation fan; 603. a second damper; 604. a second spring; 605. a pressing plate; 606. a clamping frame; 607. a heat radiation fin; 608. a heat conducting plate.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, without conflict, the embodiments of the present utility model and features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
In embodiment 1, as shown in fig. 1-5, the present utility model provides a circuit board with efficient heat dissipation, comprising: the circuit board comprises a circuit board body 1, wherein a chip 2 is arranged on the upper surface of the circuit board body 1, mounting seats 3 are symmetrically and fixedly connected to the upper surface of the circuit board body 1, and clamping grooves 4 are formed in the outer surfaces of the two mounting seats 3; the number of the mounting assemblies 5 is two, the two mounting assemblies 5 are positioned in the inner position of the mounting seat 3, and the mounting assemblies 5 comprise inserting blocks 501; the heat dissipation assembly 6, heat dissipation assembly 6 fixed connection is between two inserts 501 upper surfaces, heat dissipation assembly 6 includes mounting panel 601, ventilation groove has been seted up to mounting panel 601 upper surface, ventilation groove internal surface fixedly connected with radiator fan 602, a plurality of second dampers 603 of even fixedly connected with of mounting panel 601 lower surface, the equal cover of a plurality of second dampers 603 surface is equipped with second spring 604, fixedly connected with clamp plate 605 between a plurality of second dampers 603 terminal surfaces, clamp plate 605 lower surface fixedly connected with card frame 606, clamp plate 605 lower surface is provided with radiator fin 607, radiator fin 607 is located card frame 606 inboard position, radiator fin 607 lower surface is provided with heat-conducting plate 608, heat-conducting plate 608 lower surface and chip 2 upper surface laminating.
The effect that its whole embodiment 1 reaches is, when the circuit board body 1 installs the heat dissipation subassembly 6, after the silicone grease is smeared on the chip 2 surface, place heat conduction board 608 and radiator fin 607 in chip 2 top, afterwards after the mounting panel 601 is pushed down with circuit board body 1 and is accomplished fixedly, radiator fin 607 can be pressed by clamp plate 605 and blocked in the inboard position of card frame 606, through the setting that heat conduction board 608 and chip 2 are laminated, the heat that the operation of circuit board body 1 produced is can fine be absorbed in the cooperation of radiator fin 607, utilize radiator fin 607 and the great area of contact of air, start radiator fan 602 can play better heat dissipation cooling effect to circuit board body 1, in the installation use of accomplishing, the resilience force that utilizes second spring 604 can exert down pressure to clamp plate 605 all the time, thereby make radiator fin 607 and radiator plate 608 exerted down pressure and circuit board body 1 remain closely laminating state all the time, the time cooperate the use of second attenuator 603 and second spring 604, because radiator fin 607 and radiator plate 608 are connected with radiator plate 608 and radiator fan 608 do not have the heat dissipation damping effect that the heat conduction board 602 is not offset when can avoid the heat dissipation effect to the heat conduction board 602 to produce when the heat dissipation position.
In embodiment 2, as shown in fig. 1-5, a notch 502 is formed on the outer surface of the insert block 501, a plurality of first dampers 503 are fixedly connected to the inner bottom in the notch 502 at equal intervals, first springs 504 are respectively sleeved on the outer surfaces of the plurality of first dampers 503, a clamping block 505 is fixedly connected between the end faces of the plurality of first dampers 503, the outer surface of the insert block 501 is in inserting connection with the inner surface of the mounting seat 3, the clamping block 505 is matched with the position of the clamping groove 4, and the outer surface of the clamping block 505 is in an arc surface arrangement.
The effect that its whole embodiment 2 reached is, when installing radiator module 6 and circuit board body 1 adaptation, drive the inserted block 501 with mounting panel 601 and insert in mount pad 3, when the inserted block 501 inserts in mount pad 3, through the cambered surface setting in fixture block 505 outside, fixture block 505 and mount pad 3 contact can be pressed into notch 502 inside and oppress first spring 504 and take place to shrink, after the insert block 501 inserts completely, notch 502 aligns with draw-in groove 4 position, the resilience force of utilizing first spring 504 can drive fixture block 505 and pop out the card in draw-in groove 4, the installation of radiator module 6 is fixed, the installation operation to radiator module 6 is comparatively convenient and fast, have stronger practicality, through the cooperation use of first attenuator 503 and first spring 504, can play buffering cushioning effect, it produces vibration to avoid radiator module 6 to run and lead to fixture block 505 position offset, the stability to radiator module 6 installation has been promoted.
Working principle: when the heat radiation component 6 is installed on the circuit board body 1, after the silicone grease is smeared on the surface of the chip 2, the heat conducting plate 608 and the heat radiation fins 607 are placed above the chip 2, then after the mounting plate 601 and the circuit board body 1 are pressed down to be fixed, the heat radiation fins 607 can be pressed and clamped at the inner side position of the clamping frame 606 by the pressing plate 605, the heat generated by the operation of the circuit board body 1 can be well absorbed by the arrangement of the heat conducting plate 608 and the chip 2 and the use of the heat radiation fins 607, the heat radiation cooling effect can be better achieved on the circuit board body 1 by starting the heat radiation fan 602 by utilizing the larger contact area of the heat radiation fins 607 and the air, and in the installation and use process, the downward pressure can be always applied to the pressing plate 605 by utilizing the resilience force of the second spring 604, so that the heat radiation fins 607 and the heat conducting plate 608 are always kept in a close contact state with the circuit board body 1, the second damper 603 is matched with the second spring 604 to play a role in buffering and damping, because the heat radiation fins 607 and the heat conduction plate 608 are not connected with the pressing plate 605 hard, vibration transmitted to the position of the heat conduction plate 608 when the heat radiation fan 602 works can be eliminated by utilizing the buffering of the second damper 603 and the second spring 604, the heat radiation effect can be prevented from being influenced by the deviation of the position of the heat conduction plate 608, when the heat radiation assembly 6 and the circuit board body 1 are matched and installed, the mounting plate 601 drives the insert block 501 to be inserted into the mounting seat 3, when the insert block 501 is inserted into the mounting seat 3, the clamp block 505 is contacted with the mounting seat 3 through the cambered surface arranged outside the clamp block 505 and is pressed into the notch 502 to compress the first spring 504 to shrink, after the insert block 501 is completely inserted, the notch 502 is aligned with the position of the clamping groove 4, the clamp block 505 is driven to be ejected and clamped in the clamping groove 4 by the rebound force of the first spring 504, the installation of the radiating component 6 is completed, the installation operation of the radiating component 6 is convenient and quick, the radiating component 6 has strong practicability, the damping effect can be achieved through the cooperation of the first damper 503 and the first spring 504, the position deviation of the clamping block 505 caused by vibration generated by the running of the radiating component 6 is avoided, and the stability of the installation of the radiating component 6 is improved.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model will still fall within the protection scope of the technical solution of the present utility model.
Claims (7)
1. The utility model provides a circuit board of high-efficient heat dissipation which characterized in that includes: the circuit board comprises a circuit board body (1), wherein a chip (2) is arranged on the upper surface of the circuit board body (1), mounting seats (3) are symmetrically and fixedly connected to the upper surface of the circuit board body (1), and clamping grooves (4) are formed in the outer surfaces of the two mounting seats (3);
The number of the installation assemblies (5) is two, the two installation assemblies (5) are positioned in the installation seat (3), and the installation assemblies (5) comprise inserting blocks (501);
The heat dissipation assembly (6), heat dissipation assembly (6) fixed connection is between two inserted block (501) upper surfaces, heat dissipation assembly (6) include mounting panel (601).
2. The high-efficiency heat dissipation circuit board of claim 1, wherein: the outer surface of the inserting block (501) is provided with a notch (502), a plurality of first dampers (503) are fixedly connected to the inner bottom of the notch (502) at equal intervals, a plurality of first springs (504) are sleeved on the outer surface of each first damper (503), and a plurality of clamping blocks (505) are fixedly connected between the end faces of the first dampers (503).
3. The high-efficiency heat dissipation circuit board of claim 2, wherein: the outer surface of the inserting block (501) is in inserting connection with the inner surface of the mounting seat (3), the clamping block (505) is matched with the clamping groove (4), and the outer surface of the clamping block (505) is in cambered surface arrangement.
4. The high-efficiency heat dissipation circuit board of claim 1, wherein: the upper surface of the mounting plate (601) is provided with a ventilation groove, and the inner surface of the ventilation groove is fixedly connected with a cooling fan (602).
5. The high-efficiency heat dissipation circuit board of claim 1, wherein: the mounting plate (601) lower surface evenly fixedly connected with a plurality of second dampers (603), a plurality of second dampers (603) surface all overlap and are equipped with second spring (604), a plurality of fixedly connected with clamp plate (605) between second damper (603) terminal surface.
6. The high-efficiency heat dissipation circuit board of claim 5, wherein: the clamp plate (605) lower surface fixedly connected with card frame (606), clamp plate (605) lower surface is provided with heat radiation fins (607), heat radiation fins (607) are located card frame (606) inboard position.
7. The high-efficiency heat dissipation circuit board of claim 6, wherein: the lower surface of the radiating fin (607) is provided with a heat conducting plate (608), and the lower surface of the heat conducting plate (608) is attached to the upper surface of the chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322730702.2U CN220985931U (en) | 2023-10-12 | 2023-10-12 | High-efficient radiating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322730702.2U CN220985931U (en) | 2023-10-12 | 2023-10-12 | High-efficient radiating circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220985931U true CN220985931U (en) | 2024-05-17 |
Family
ID=91066346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322730702.2U Active CN220985931U (en) | 2023-10-12 | 2023-10-12 | High-efficient radiating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220985931U (en) |
-
2023
- 2023-10-12 CN CN202322730702.2U patent/CN220985931U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |