CN220971750U

CN220971750U - Semiconductor processing grinding equipment

Info

Publication number: CN220971750U
Application number: CN202322229311.2U
Authority: CN
Inventors: 王湙鈜
Original assignee: Lianyaxin Xiamen Technology Co ltd
Current assignee: Baigeng Xiamen Technology Co ltd
Priority date: 2023-08-18
Filing date: 2023-08-18
Publication date: 2024-05-17
Anticipated expiration: 2033-08-18

Abstract

The utility model discloses a semiconductor processing grinding device, which relates to the technical field of wafer grinding devices and comprises a fixed plate, wherein a plurality of second rotating rods are rotatably arranged in the fixed plate, the top ends of the second rotating rods extend to the upper part of the fixed plate and are provided with a placing disc, a movable plate is arranged above the fixed plate, the inner wall of the movable plate is rotatably provided with a plurality of first rotating rods, the bottom ends of the first rotating rods extend to the lower part of the movable plate, a plurality of polishing discs are arranged below the movable plate, the diameter of each polishing disc is larger than that of the placing disc, a rotating shaft penetrates through the inside of the movable plate vertically, and a mounting cylinder penetrates through the inside of the fixed plate vertically. According to the utility model, the placing disc is rotated to drive the wafer placed in the placing disc to rotate, and meanwhile, the polishing disc can rotate reversely with the wafer after being transmitted, so that the polishing effect and efficiency of the polishing disc on the wafer are improved.

Description

Semiconductor processing grinding equipment

Technical Field

The utility model relates to the technical field of wafer grinding equipment, in particular to semiconductor processing grinding equipment.

Background

Wafers are silicon wafers used for manufacturing silicon semiconductor integrated circuits, and are called wafers because of their round shape, and various circuit element structures can be manufactured on the silicon wafers to form I C products with specific electrical functions, and in the production and processing of semiconductors, the wafers need to be polished, and related devices exist in the prior art for polishing the wafers, for example, a "semiconductor processing and polishing device" with the national patent number of CN 212444726U, and the patent indicates: the grinding mechanism drives the grinding disc to rotate so as to grind the surface of the wafer, but the device only depends on the rotation of the grinding disc to grind the wafer, so that the grinding effect is not ideal, and the device is generated by intensive research aiming at the problems.

Disclosure of utility model

The utility model aims to provide a semiconductor processing grinding device, which solves the problem that the grinding effect proposed in the background technology is not ideal.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor processing grinding equipment, includes the fixed plate, the inside rotation of fixed plate installs a plurality of second rotary rods, and the top of second rotary rod all extends to the top of fixed plate and installs and place the dish, the top of fixed plate is provided with the fly leaf, and the inner wall rotation of fly leaf installs a plurality of first rotary rods, the bottom of first rotary rod all extends to the below of fly leaf, and the below of fly leaf is provided with a plurality of polishing discs, the diameter of polishing disc is greater than the diameter of placing the dish, the inside of fly leaf runs through vertically and has the rotation axis, the inside of fixed plate is vertical to be run through there is the installation section of thick bamboo.

Preferably, the outer wall of fixed plate installs a plurality of bracing pieces through the mounting, and the roof is installed on the top of bracing piece, a plurality of electric putter are installed in the top outside of roof, and electric putter's output all is connected with the top of fly leaf, driving motor is installed to the top intermediate position department of roof, and driving motor's output is connected with the top of rotation axis.

Preferably, the top of first rotary rod outer wall all is fixed with driven round gear, the driving round gear is installed to the outer wall of rotation axis, and meshes between driven round gear and the driving round gear.

Preferably, the mounting disc is installed to the bottom of mounting cylinder, and the inner wall of mounting disc is fixed with the ring gear, the bottom of second rotary rod all extends to the inside of mounting disc and installs driven gear, and meshes between driven gear and the ring gear.

Preferably, the top end of the mounting cylinder is provided with a rectangular groove, and the bottom end of the rotating shaft is provided with a rectangular block matched with the rotating shaft.

Preferably, the top of beating the mill is seted up flutedly, and the inner wall of recess has seted up two draw-in grooves, the inside of recess is all extended to the bottom of first rotary rod, and the cavity has all been seted up to the inside of first rotary rod, the dwang is installed through the pivot on the inside top of cavity, and the top of dwang all extends to the top of first rotary rod and install the knob, the inside dwang outer wall cover of cavity is equipped with movable section of thick bamboo, and the outer wall of movable section of thick bamboo installs the transfer line through the articulated elements, the fixture block is installed through the articulated elements to the one end of transfer line, and the one end of fixture block all extends to the inside of draw-in groove.

Preferably, the outer wall of the rotating rod is provided with external threads, the inner wall of the movable cylinder is provided with internal threads matched with the rotating rod, and the clamping block is connected with the cavity in a sliding mode.

Compared with the prior art, the utility model has the beneficial effects that:

Through making place the rotatory wafer that drives its inside and place of dish and rotate, the grinding dish can be through transmission back and wafer counter-rotation simultaneously to improve grinding dish and to the grinding effect and the efficiency of wafer.

Drawings

FIG. 1 is a schematic cross-sectional elevation view of the present utility model;

FIG. 2 is a schematic view of a partial perspective view of a mounting cylinder of the present utility model;

FIG. 3 is a schematic top view of the combination of the sanding disc and the first rotary lever of the present utility model;

Fig. 4 is a schematic cross-sectional elevation view of the combination of the sanding disc and the first rotary lever of the present utility model.

In the figure: 1. an electric push rod; 2. a top plate; 3. a driving motor; 4. a rotation shaft; 5. a driving round gear; 6. a support rod; 7. a movable plate; 8. polishing the grinding disc; 9. a fixing plate; 10. a driven gear; 11. a mounting cylinder; 12. a mounting plate; 13. a second rotating lever; 14. a gear ring; 15. placing a tray; 16. a first rotating lever; 17. driven round gears; 18. a groove; 19. a cavity; 20. a rotating lever; 21. a clamping groove; 22. a clamping block; 23. a transmission rod; 24. a movable cylinder.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples: referring to fig. 1-4, a semiconductor processing grinding device includes a fixed plate 9, wherein a plurality of second rotating rods 13 are rotatably installed inside the fixed plate 9, the top ends of the second rotating rods 13 extend to the upper side of the fixed plate 9 and are provided with a placement disc 15, a movable plate 7 is arranged above the fixed plate 9, a plurality of first rotating rods 16 are rotatably installed on the inner wall of the movable plate 7, the bottom ends of the first rotating rods 16 extend to the lower side of the movable plate 7, a plurality of grinding discs 8 are arranged below the movable plate 7, the diameter of the grinding discs 8 is larger than that of the placement disc 15, a rotating shaft 4 vertically penetrates through the inside of the movable plate 7, and a mounting cylinder 11 vertically penetrates through the inside of the fixed plate 9;

Specifically, as shown in fig. 1, the placing disc 15 is rotated to drive the wafer placed inside the placing disc to rotate, and meanwhile, the polishing disc 8 can reversely rotate with the wafer after being transmitted, so that the polishing effect and efficiency of the polishing disc 8 on the wafer are improved.

The outer wall of the fixed plate 9 is provided with a plurality of support rods 6 through fixing pieces, the top ends of the support rods 6 are provided with a top plate 2, the outer sides of the top ends of the top plates 2 are provided with a plurality of electric push rods 1, the output ends of the electric push rods 1 are connected with the top ends of the movable plates 7, the middle position of the top end of the top plate 2 is provided with a driving motor 3, and the output end of the driving motor 3 is connected with the top end of the rotating shaft 4;

specifically, as shown in fig. 1, the electric push rod 1 can change the height of the movable plate 7, so as to change the position of the grinding surface of the grinding disc 8, and the driving motor 3 can drive the rotation shaft 4 to rotate.

The top ends of the outer walls of the first rotating rods 16 are respectively fixed with a driven round gear 17, the outer walls of the rotating shafts 4 are provided with driving round gears 5, and the driven round gears 17 are meshed with the driving round gears 5;

Specifically, as shown in fig. 1, when the rotation shaft 4 rotates, it can cause the plurality of driven circular gears 17 to reversely rotate the first rotation lever 16 and the sanding plate 8 by means of the cooperation of the driving circular gear 5 and the driven circular gears 17.

The bottom end of the mounting cylinder 11 is provided with a mounting disc 12, the inner wall of the mounting disc 12 is fixedly provided with a gear ring 14, the bottom ends of the second rotating rods 13 extend into the mounting disc 12 and are provided with driven gears 10, and the driven gears 10 are meshed with the gear ring 14;

a rectangular groove is formed in the top end of the mounting cylinder 11, and a rectangular block matched with the rotating shaft 4 is mounted at the bottom end of the rotating shaft;

Specifically, as shown in fig. 1 and 2, the rotation of the rotation shaft 4 can drive the mounting plate 12 to rotate through the cooperation of the rectangular groove and the rectangular block, so that the second rotation rod 13 and the placement plate 15 are caused to rotate in the same direction as the rotation shaft 4 by the cooperation of the ring gear 14 and the driven gear 10.

The top of the grinding disc 8 is provided with a groove 18, the inner wall of the groove 18 is provided with two clamping grooves 21, the bottom end of the first rotary rod 16 extends to the inside of the groove 18, the inside of the first rotary rod 16 is provided with a cavity 19, the top inside the cavity 19 is provided with a rotary rod 20 through a rotary shaft, the top end of the rotary rod 20 extends to the top end of the first rotary rod 16 and is provided with a knob, the outer wall of the rotary rod 20 inside the cavity 19 is sleeved with a movable cylinder 24, the outer wall of the movable cylinder 24 is provided with a transmission rod 23 through a hinge, one end of the transmission rod 23 is provided with a clamping block 22 through the hinge, and one end of the clamping block 22 extends to the inside of the clamping groove 21;

The outer wall of the rotating rod 20 is provided with external threads, the inner wall of the movable cylinder 24 is provided with internal threads matched with the external threads, and the clamping block 22 is connected with the cavity 19 in a sliding way;

Specifically, as shown in fig. 1, 3 and 4, the rotating rod 20 may cause the movable cylinder 24 to move in a vertical direction, so that the driving rod 23 pushes or pulls the clamping block 22, so that the clamping block 22 can enter the clamping groove 21 or leave the clamping groove 21, and the first rotating rod 16 is mounted and dismounted from the polishing disc 8.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. Semiconductor processing grinding equipment, including fixed plate (9), its characterized in that: the inside rotation of fixed plate (9) is installed a plurality of second rotary rods (13), and the top of second rotary rod (13) all extends to the top of fixed plate (9) and installs and place dish (15), the top of fixed plate (9) is provided with fly leaf (7), and the inner wall rotation of fly leaf (7) installs a plurality of first rotary rods (16), the bottom of first rotary rod (16) all extends to the below of fly leaf (7), and the below of fly leaf (7) is provided with a plurality of polishing dish (8), the diameter of polishing dish (8) is greater than the diameter of placing dish (15), the inside of fly leaf (7) is run through vertically and is had rotation axis (4), the inside of fixed plate (9) is vertical to be run through and is had install section of thick bamboo (11).

2. The semiconductor processing polishing apparatus according to claim 1, wherein: the outer wall of fixed plate (9) is installed a plurality of bracing pieces (6) through the mounting, and roof (2) are installed on the top of bracing piece (6), a plurality of electric putter (1) are installed in the top outside of roof (2), and the output of electric putter (1) all is connected with the top of fly leaf (7), driving motor (3) are installed on the top intermediate position department of roof (2), and the output of driving motor (3) is connected with the top of rotation axis (4).

3. The semiconductor processing polishing apparatus according to claim 1, wherein: the top of first rotary rod (16) outer wall all is fixed with driven round gear (17), driving round gear (5) are installed to the outer wall of rotation axis (4), and mesh between driven round gear (17) and driving round gear (5).

4. The semiconductor processing polishing apparatus according to claim 1, wherein: the mounting disc (12) is installed to the bottom of mounting cylinder (11), and the inner wall of mounting disc (12) is fixed with ring gear (14), the bottom of second rotary rod (13) all extends to the inside of mounting disc (12) and installs driven gear (10), and meshes between driven gear (10) and ring gear (14).

5. The semiconductor processing polishing apparatus according to claim 1, wherein: rectangular grooves are formed in the top end of the mounting cylinder (11), and rectangular blocks matched with the rotating shaft (4) are mounted at the bottom end of the rotating shaft.

6. The semiconductor processing polishing apparatus according to claim 1, wherein: the utility model discloses a polishing dish, including recess (18) is seted up on the top of polishing dish (8), and two draw-in grooves (21) are seted up to the inner wall of recess (18), the inside of recess (18) is all extended to the bottom of first rotary rod (16), and cavity (19) are all seted up to the inside of first rotary rod (16), dwang (20) are installed through the pivot on the inside top of cavity (19), and the top of dwang (20) all extends to the top of first rotary rod (16) and installs the knob, the inside dwang (20) outer wall cover of cavity (19) is equipped with movable section of thick bamboo (24), and the outer wall of movable section of thick bamboo (24) installs transfer line (23) through the articulated elements, fixture block (22) are installed through the articulated elements to the one end of transfer line (23), and the one end of fixture block (22) all extends to the inside of draw-in groove (21).

7. The semiconductor processing polishing apparatus according to claim 6, wherein: the outer wall of the rotating rod (20) is provided with external threads, the inner wall of the movable barrel (24) is provided with internal threads matched with the external threads, and the clamping block (22) is connected with the cavity (19) in a sliding mode.