CN220965271U - High-density circuit board with good heat dissipation performance - Google Patents
High-density circuit board with good heat dissipation performance Download PDFInfo
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- CN220965271U CN220965271U CN202322955903.2U CN202322955903U CN220965271U CN 220965271 U CN220965271 U CN 220965271U CN 202322955903 U CN202322955903 U CN 202322955903U CN 220965271 U CN220965271 U CN 220965271U
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- circuit board
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- heat dissipation
- box
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 230000000670 limiting effect Effects 0.000 claims description 11
- 230000000694 effects Effects 0.000 abstract description 24
- 238000007664 blowing Methods 0.000 abstract description 11
- 238000005192 partition Methods 0.000 abstract description 9
- 208000002925 dental caries Diseases 0.000 abstract description 7
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of circuit boards, in particular to a high-density circuit board with good heat dissipation performance, which comprises a box body, wherein a plurality of partition boards are fixedly connected inside the box body, if the partition boards divide the box body into a plurality of cavities, one ends of the cavities are fixedly connected with a first fan, the top parts of the box body and the partition boards are jointly provided with a circuit board main body, and one side of the outer wall of the box body is fixedly connected with two connecting rods. The utility model has the advantages that: the inside division of box of a plurality of division boards is a plurality of cavitys, leaves the distance between cavity and the circuit board main part, can prevent that heat from piling up, and the heat that circuit board main part bottom surface distributes enters into a plurality of cavitys inside, blows to a plurality of cavitys through first fan, blows out from the other end of cavity, makes the inside heat of cavity take out the cavity along with blowing, just can dispel the heat to circuit board main part bottom surface to can form the wind channel through the cavity, it is better to blow radiating effect.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-density circuit board with good heat dissipation performance.
Background
The high-density circuit board is a new technology developed by the PCB industry, the circuit distribution is more precise, and if the traditional circuit board surface is adopted to passively dissipate heat during high-load operation, the heat dissipation effect is poor, and the circuit is easy to damage when in long-time hot working, so that the structural strength of the circuit board is ensured, and meanwhile, the high-density circuit board with good heat dissipation performance is designed.
The prior Chinese patent with publication number CN210112512U discloses an HDI high-density circuit board with good heat dissipation performance, which belongs to the technical field of circuit boards, and comprises an HDI board body and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a containing box, two air guide pipes which are fixed on one side surface of the containing box and are symmetrically arranged, and a radiator which is fixed in the containing box and is communicated with the air guide pipes, sliding grooves which are arranged along the length direction of the air guide pipes and are used for the movable insertion of the side edges of the HDI board body are respectively arranged on opposite inner side walls between the air guide pipes, clamping areas are formed between the sliding grooves for the HDI board body, exhaust holes which are uniformly distributed along the length direction of the air guide pipes are respectively arranged on the two side positions of the sliding grooves on the inner side walls of the air guide pipes, one end of the air guide pipes stretches into the containing box and is provided with an opening, connecting pipes which are respectively communicated with one ends of the air guide pipes are arranged in the containing box, the radiator is fixed at one side position of the connecting pipes, and one side surface close to the radiator is provided with an air inlet which is communicated with an air outlet of the radiator; the utility model has the advantages of compact structure and high heat dissipation efficiency. But in the heat dissipation process, the air blown out by the exhaust holes at two sides can be converged at the middle part of the circuit board, so that the air is scattered away from the circuit board, and the heat dissipation effect at the middle part of the circuit board is poor and is not uniform.
Disclosure of utility model
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an objective of the present utility model is to provide a high-density circuit board with good heat dissipation performance, so as to solve the problems mentioned in the background art and overcome the defects in the prior art.
In order to achieve the above object, an embodiment of an aspect of the present utility model provides a high-density circuit board with good heat dissipation performance, which comprises a box body, wherein a plurality of partition boards are fixedly connected in the box body, the partition boards divide the interior of the box body into a plurality of cavities, one ends of the cavities are fixedly connected with a first fan, the top of the box body and the top of the partition boards are jointly provided with a circuit board main body, one side of the outer wall of the box body is fixedly connected with two connecting rods, one side of each connecting rod is jointly and slidably connected with a top plate, one side of each top plate corresponds to the circuit board main body is fixedly connected with a plurality of heat pipes, the top surface of each top plate is fixedly connected with an air outlet, a second fan is arranged in the air outlet, the top plate is fixedly connected with a first connecting plate near the middle of the two connecting rods, the outer wall of the box body is fixedly connected with a second connecting plate near the lower part of the first connecting plate, one side of the first connecting plate is in threaded connection with a screw rod, and one end of the screw rod penetrates through the first connecting plate to be rotationally connected with the second connecting plate.
By above-mentioned arbitrary scheme preferably, two bar spout has all been seted up to one side of connecting rod, the roof passes through bar spout and two connecting rod sliding connection, the length of connecting rod equals with the length of wire rod.
The technical effect achieved by adopting the scheme is as follows: by using the scheme, the top plate can be limited, so that the top plate is more stable when moving up and down.
By any of the above schemes, it is preferable that the plurality of heat conduction pipes are uniformly distributed on one side of the top plate, two of the plurality of heat conduction pipes are arranged in an X shape, the center of the heat conduction pipe corresponds to the center of the air outlet, and the plurality of heat conduction pipes are uniformly connected.
The technical effect achieved by adopting the scheme is as follows: through using this scheme can be through the heat pipe that X put with a plurality of area heat pipes connection, increase radiating effect and efficiency when the second fan dispels the heat to the heat pipe.
By the above-mentioned scheme preferred, the both ends that the box is close to a plurality of cavitys are all fixedly connected with filter, the width of filter is greater than the width of box outer wall.
The technical effect achieved by adopting the scheme is as follows: by using the scheme, dust and impurities can be reduced from entering the cavity, the service life of the circuit board mounting device is prolonged, and meanwhile, the circuit board mounting device can play a role in limiting and guiding in the circuit board mounting process, so that the circuit board mounting position is more accurate.
By either of the above-mentioned modes, it is preferable that two of the connecting rods are distributed at both ends of one side of the case.
The technical effect achieved by adopting the scheme is as follows: through the adoption of the scheme, the top plate can be more stable when moving up and down, a limiting effect can be provided for the circuit board main body, and the circuit board main body can be more conveniently installed.
By the above-mentioned scheme preferred, the size of roof board size equals with the size of circuit board main part, all fixedly connected with limiting plate around the roof, the width of limiting plate is greater than the thickness of roof.
The technical effect achieved by adopting the scheme is as follows: through using this scheme, the messenger's heat pipe that can be better pastes with the circuit board main part, increases the effect of heat conduction, and it is also more convenient to install when utilizing the limiting plate to prevent circuit board main part dislocation.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
1. This high density circuit board that heat dispersion is good, a plurality of division boards divide into a plurality of cavitys with the box inside, leave the distance between cavity and the circuit board main part, can prevent that the heat from piling up, the heat that circuit board main part bottom surface distributes enters into a plurality of cavitys inside, blow to a plurality of cavitys through first fan, can increase the effect of blowing, the other end of blowing from the cavity blows off, make the inside heat of cavity take the cavity along with blowing, just can dispel the heat to circuit board main part bottom surface to can form the wind channel through the cavity, it is better to blow radiating effect.
2. According to the high-density circuit board with good heat dissipation performance, the top plate is in sliding connection with the connecting rod through the strip-shaped sliding groove, the first connecting plate and the second connecting plate are fixedly connected to one side of the top plate and one side of the box body respectively, the screw rod is in threaded connection with the first connecting plate and is in rotary connection with the second connecting plate, the top plate can be driven to move up and down through rotating the screw rod, the circuit board is convenient to overhaul and install, and the flexibility of the circuit board is improved.
3. This high density circuit board that heat dispersion is good, when the roof falls, the heat pipe pastes with the top surface of circuit board main part mutually, the heat that circuit board main part top surface distributes is absorbed through the heat pipe, a plurality of heat pipes link to each other, utilize the effectual characteristic of heat pipe heat conduction, can make the even distribution of heat in the everywhere of heat pipe, the center of a plurality of heat pipe connections is corresponding with the center of air outlet simultaneously, the inside second fan that is provided with of air outlet, the second fan outwards airs exhaust, the heat at heat pipe center is discharged, when the temperature at heat pipe center falls, the heat of other everywhere just can transfer, circulation in proper order, just can accomplish the heat dissipation to circuit board top surface, the radiating effect of circuit board bottom surface and top surface is more even.
Drawings
FIG. 1 is a schematic view of a first view of the present utility model;
FIG. 2 is a schematic diagram of a second view of the present utility model;
FIG. 3 is a schematic view of a third view of the present utility model;
FIG. 4 is a schematic diagram of a fourth view of the present utility model;
fig. 5 is a schematic structural view of a fifth view of the present utility model.
In the figure: the heat-conducting box comprises a box body 1, a top plate 2, a limiting plate 3, a second fan 4, a connecting rod 5, an air outlet 6, a screw rod 7, a first connecting plate 8, a strip-shaped chute 9, a filter plate 10, a partition plate 11, a first fan 12, a cavity 13, a second connecting plate 14, a circuit board 15 and a heat-conducting pipe 16.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings, but the scope of the present utility model is not limited to the following.
As shown in fig. 1 to 5, a high-density circuit board with good heat dissipation performance comprises a box body 1, a plurality of division boards 11 are fixedly connected to the inside of the box body 1, the inside of the box body 1 is divided into a plurality of cavities 13 by the plurality of division boards 11, a first fan 12 is fixedly connected to one end of each of the plurality of cavities 13, the top of the box body 1 and the plurality of division boards 11 are jointly provided with a circuit board main body 15, two connecting rods 5 are fixedly connected to one side of the outer wall of the box body 1, a top plate 2 is fixedly connected to one side of each of the two connecting rods 5 in a sliding manner, a plurality of heat pipes 16 are fixedly connected to one side of each of the top plate 2 corresponding to the circuit board main body 15, an air outlet 6 is fixedly connected to the top surface of each top plate 2, a second fan 4 is arranged in the air outlet 6, the top plate 2 is close to the middle of each of the two connecting rods 5, a second connecting plate 14 is fixedly connected to the position of each of the outer wall of the box body 1, a screw rod 8 is connected to the second connecting plate 7 in a threaded manner, one end of each screw rod 7 penetrates through the first connecting plate 8 and the second connecting plate 14.
As an alternative technical scheme of the utility model, one side of each of the two connecting rods 5 is provided with the strip-shaped chute 9, the top plate 2 is in sliding connection with the two connecting rods 5 through the strip-shaped chute 9, the length of each connecting rod 5 is equal to that of the screw rod 7, and the top plate 2 can be limited by using the scheme, so that the top plate 2 is more stable when moving up and down.
As an alternative technical scheme of the utility model, a plurality of heat conduction pipes 16 are uniformly distributed on one side of the top plate 2, two of the heat conduction pipes 16 are arranged in an X shape, the center of the heat conduction pipes corresponds to the center of the air outlet 6, the heat conduction pipes 16 are uniformly connected, the heat conduction pipes 16 with the X-shaped arrangement can be connected through the heat conduction pipes 16, and the heat dissipation effect and efficiency are improved when the second fan 4 dissipates heat of the heat conduction pipes 16.
As an alternative technical scheme of the utility model, the two ends of the box body 1, which are close to the cavities 13, are fixedly connected with the filter plates 10, the width of the filter plates 10 is larger than that of the outer wall of the box body 1, dust and impurities can be reduced from entering the cavities 13 by using the scheme, the service life of the utility model is prolonged, and meanwhile, the effect of limiting and guiding can be achieved in the process of installing the circuit board main body 15, so that the installation position of the circuit board 15 is more accurate.
As an alternative technical scheme of the utility model, the two connecting rods 5 are distributed at two ends of one side of the box body 1, so that the top plate 2 can be more stable when moving up and down by using the scheme, a limiting effect can be provided for the circuit board main body 15, and the circuit board main body 15 is more convenient to install.
As an alternative technical scheme of the utility model, the size of the top plate 2 is equal to that of the circuit board main body 15, the limit plates 3 are fixedly connected to the periphery of the top plate 2, the width of each limit plate 3 is larger than the thickness of the top plate 2, the heat conduction pipe 16 can be better attached to the circuit board main body 15 by using the scheme, the heat conduction effect is improved, and the circuit board main body 15 is prevented from being misplaced by using the limit plates 3 and is more convenient to install.
A high-density circuit board with good heat dissipation performance has the following working principle:
1) The inside of the box body 1 is divided into the cavities 13 by the partition plates 11, the cavities 13 and the circuit board main body 15 are separated by a distance, heat accumulation can be prevented, heat emitted from the bottom surface of the circuit board main body 15 enters the cavities 13, the cavities 13 are blown by the first fan 12, the blowing effect can be improved, the blowing air is blown out from the other ends of the cavities 13, the heat in the cavities 13 is taken out of the cavities 13 along with the blowing air, the bottom surface of the circuit board main body 15 can be cooled, an air channel can be formed through the cavities 13, and the blowing and cooling effects are better;
2) The top plate 2 is in sliding connection with the connecting rod 5 through the strip-shaped sliding groove 9, a first connecting plate 8 and a second connecting plate 14 are fixedly connected to one side of the top plate 2 and one side of the box body 1 respectively, the screw rod 7 is in threaded connection with the first connecting plate 8 and is in rotary connection with the second connecting plate 14, the top plate 2 can be driven to move up and down by rotating the screw rod 7, so that the overhaul and the installation of the circuit board main body 15 are facilitated, and the flexibility of the utility model is improved;
3) When the top plate 2 falls down, the heat conducting pipes 16 are attached to the top surface of the circuit board main body 15, heat emitted by the top surface of the circuit board main body 15 is absorbed by the heat conducting pipes 16, the heat conducting pipes 16 are connected, the heat is uniformly distributed at all positions of the heat conducting pipes 16 by utilizing the characteristic of good heat conducting effect of the heat conducting pipes 16, meanwhile, the centers of the connection of the heat conducting pipes 16 correspond to the centers of the air outlets 6, the second fan 4 is arranged in the air outlets 6, the second fan 4 is used for exhausting the heat at the centers of the heat conducting pipes 16, when the temperature at the centers of the heat conducting pipes 16 falls down, the heat at all other positions is transferred, the heat is sequentially circulated, and the heat dissipation of the top surface of the circuit board main body 15 can be completed, and the heat dissipation effect of the bottom surface and the top surface of the circuit board main body 15 is more uniform.
In summary, the high-density circuit board with good heat dissipation performance is characterized in that firstly, the inside of the box body 1 is divided into a plurality of cavities 13 by a plurality of partition boards 11, a distance is reserved between each cavity 13 and the circuit board main body 15, heat accumulation can be prevented, heat emitted from the bottom surface of the circuit board main body 15 enters into the plurality of cavities 13, the plurality of cavities 13 are blown by the first fan 12, the blowing effect can be increased, the air is blown out from the other end of each cavity 13, the heat in the cavities 13 is taken out of the cavities 13 along with the air blowing, the bottom surface of the circuit board main body 15 can dissipate heat, an air duct can be formed through the cavities 13, the effect of blowing and heat dissipation is better, secondly, the top plate 2 is in sliding connection with the connecting rod 5 through the strip-shaped sliding groove 9, one side of the top plate 2 is fixedly connected with the second connecting plate 14 of the first connecting plate 8 and one side of the box body 1 respectively, the screw rod 7 is in threaded connection with the first connecting plate 8 and is in rotary connection with the second connecting plate 14, the top plate 2 can be driven to move up and down by rotating the screw rod 7, the overhaul and the installation of the circuit board main body 15 are facilitated, the flexibility of the utility model is increased, finally, when the top plate 2 falls down, the heat conducting pipe 16 is attached to the top surface of the circuit board main body 15, the heat emitted by the top surface of the circuit board main body 15 is absorbed by the heat conducting pipe 16, a plurality of heat conducting pipes 16 are connected, the heat can be uniformly distributed at all positions of the heat conducting pipe 16 by utilizing the characteristic of good heat conducting effect of the heat conducting pipe 16, the connecting center of the plurality of heat conducting pipes 16 corresponds to the center of the air outlet 6, the second fan 4 is arranged inside the air outlet 6, the heat of the center of the heat conducting pipe 16 is exhausted outwards, the heat of the rest all positions can be transmitted when the temperature of the center of the heat conducting pipe 16 is reduced, and the rest heat can be circulated in sequence, the heat dissipation of the top surface of the circuit board body 15 can be completed, and the heat dissipation effect of the bottom surface and the top surface of the circuit board body 15 is more uniform.
Although embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the utility model. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
1. A high-density circuit board with good heat dissipation performance is characterized in that: including box (1), the inside fixedly connected with of box (1) a plurality of division board (11), a plurality of division board (11) divide into a plurality of cavity (13) with the inside of box (1), a plurality of the equal fixedly connected with first fan (12) of one end of cavity (13), the top of box (1) and a plurality of division board (11) is provided with circuit board main part (15) jointly, one side fixedly connected with two connecting rods (5) of box (1) outer wall, two the common sliding connection in one side of connecting rod (5) has roof (2), a side fixedly connected with a plurality of heat pipe (16) of roof (2) corresponding to circuit board main part (15), roof (2) top surface fixedly connected with air outlet (6), the inside of air outlet (6) is provided with second fan (4), roof (2) are close to the position fixedly connected with first connecting plate (8) in the middle of two connecting rods (5), the position fixedly connected with first connecting plate (14) below first connecting plate (8) outer wall of box (1) is close to first connecting plate (8), screw thread connection in one side (7), one end of the screw rod (7) penetrates through the first connecting plate (8) and is rotationally connected with the second connecting plate (14).
2. The high-density circuit board with good heat dissipation performance according to claim 1, wherein: the two connecting rods (5) are provided with a strip-shaped sliding groove (9) on one side, the top plate (2) is in sliding connection with the two connecting rods (5) through the strip-shaped sliding groove (9), and the length of each connecting rod (5) is equal to that of each screw rod (7).
3. The high-density circuit board with good heat dissipation performance according to claim 2, wherein: the heat conduction pipes (16) are uniformly distributed on one side of the top plate (2), two of the heat conduction pipes (16) are arranged in an X shape, the center of the heat conduction pipe corresponds to the center of the air outlet (6), and the heat conduction pipes (16) are connected.
4. A high-density wiring board with good heat dissipation performance according to claim 3, wherein: the two ends of the box body (1) close to the cavities (13) are fixedly connected with filter plates (10), and the width of each filter plate (10) is larger than that of the outer wall of the box body (1).
5. The high-density circuit board with good heat dissipation performance according to claim 4, wherein: the two connecting rods (5) are distributed at two ends of one side of the box body (1).
6. The high-density circuit board with good heat dissipation performance according to claim 5, wherein: the size of roof (2) equals with the size of circuit board main part (15), all be connected with limiting plate (3) around roof (2), the width of limiting plate (3) is greater than the thickness of roof (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322955903.2U CN220965271U (en) | 2023-11-02 | 2023-11-02 | High-density circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322955903.2U CN220965271U (en) | 2023-11-02 | 2023-11-02 | High-density circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220965271U true CN220965271U (en) | 2024-05-14 |
Family
ID=91008945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322955903.2U Active CN220965271U (en) | 2023-11-02 | 2023-11-02 | High-density circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220965271U (en) |
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2023
- 2023-11-02 CN CN202322955903.2U patent/CN220965271U/en active Active
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