CN220944943U - Clamping device for processing semiconductor material - Google Patents

Abstract

The utility model discloses a clamping device for processing semiconductor materials, which comprises a bottom plate and supporting legs, wherein the supporting legs are arranged at four corners of the bottom end of the bottom plate, a first side plate is fixedly connected to one side of the upper end of the bottom plate, an electric push rod is arranged on the outer side of the upper end of the first side plate, an extension end of the electric push rod penetrates through the first side plate to be rotationally connected with a first L-shaped plate, and a second side plate is fixedly connected to the other side of the upper end of the bottom plate. The beneficial effects of the utility model are as follows: according to the utility model, through ingenious design of the adsorption clamping assembly, the semiconductor material can be adsorbed and clamped through the sucking disc, and the soft surface layer is arranged, so that the semiconductor material can be effectively prevented from being damaged during clamping; according to the utility model, through the design of the air suction component, the scraps generated after the processing of the semiconductor material can be sucked into the collecting box, so that the scraps can be collected intensively, and the problem that the scraps fall randomly and are difficult to collect intensively is effectively avoided.

Description

Clamping device for processing semiconductor material

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a clamping device for semiconductor material processing.

Background

Semiconductor materials are a class of electronic materials having semiconductor properties that can be used to fabricate semiconductor devices and integrated circuits, such as the following: CN202022718458.4, patent name: the utility model provides a clamping equipment for semiconductor processing, includes the bottom plate, both sides fixed connection bracing piece on the bottom plate, bracing piece top fixed connection roof, fixed connection electric hydraulic telescoping rod on the bottom plate between the bracing piece, electric hydraulic telescoping rod, fixed connection mounting panel on the electric hydraulic telescoping rod, both sides fixed connection mount pad on the mounting panel, rotation connecting gear on the mount pad, sliding connection movable rod on the mounting panel on gear one side, fixed connection mounting shell on the movable rod, the mounting shell is U-shaped structure, fixed connection telescopic spring in the mounting shell, telescopic spring one side fixed connection grip block, grip block and mounting shell sliding connection, articulated connection transfer line on the gear, transfer line one side is articulated with the mounting shell lateral wall be connected, place semiconductor part on the mounting panel between the mounting shell, the device principle is reasonable in design, and the operation is practical convenient, and practical is high, but the device probably produces the sweeps when processing semiconductor, and these sweeps are easy to drift and are difficult for concentrating and collect.

Disclosure of utility model

The utility model aims to overcome the defects that scraps are likely to be generated during the processing of semiconductor materials in the prior art, the scraps are easy to fall randomly and are difficult to collect intensively, and the scraps are easy to damage during the clamping of the semiconductor materials.

The aim of the utility model is achieved by the following technical scheme: the clamping device for processing the semiconductor material comprises a bottom plate and supporting legs, wherein the supporting legs are arranged at four corners of the bottom end of the bottom plate, a first side plate is fixedly connected to one side of the upper end of the bottom plate, an electric push rod is arranged on the outer side of the upper end of the first side plate, a first L-shaped plate is rotatably connected to the extension end of the electric push rod through the first side plate, a second side plate is fixedly connected to the other side of the upper end of the bottom plate, a second L-shaped plate is arranged at the upper end of the second side plate through a turnover mechanism, and adsorption clamping assemblies capable of clamping the semiconductor material are arranged on the second L-shaped plate and the first L-shaped plate;

The collecting box is installed to the middle part lower extreme of bottom plate, the opening that is convenient for sweeps to flow into the collecting box is seted up at the middle part of bottom plate, be equipped with the subassembly of breathing in the collecting box.

Preferably, the turnover mechanism comprises a rotating shaft, a first gear, a rotating shaft and a second gear, wherein the rotating shaft is rotationally connected to the second side plate, the rotating shaft positioned on the inner side of the second side plate is fixedly connected with the second L-shaped plate, the first gear is installed on the rotating shaft, the rotating shaft is rotationally connected to the second side plate, and the second gear meshed with the first gear is installed on the rotating shaft.

Preferably, a handle is mounted at one end of the rotating shaft away from the second L-shaped plate.

Preferably, the absorption clamping assembly comprises an air pump, a connecting rod, a clamping plate, a soft surface layer, a vent pipe and a sucker, wherein the clamping plate is arranged on the upper side and the lower side of the air pump through the connecting rod, the soft surface layer is arranged on the clamping plate, the sucker is arranged in the middle of the soft surface layer, and the air pump is communicated with the sucker through the vent pipe.

Preferably, the subassembly of breathing in includes filter screen, vacuum pump, breathing pipe and head of breathing in, filter screen downward sloping is installed in inside upper end one side of collecting box, install the vacuum pump on the outer wall of collecting box, the vacuum pump intercommunication has the breathing pipe, the one end that the vacuum pump was kept away from to the breathing pipe runs through the collecting box and extends to the collecting box inside, extends to install a plurality of towards the head of breathing in that the filter screen is inhaled on the breathing pipe of collecting box inside.

Preferably, a plurality of motors are arranged at the lower end of the filter screen.

Preferably, a plurality of protrusions are arranged at the upper end of the filter screen.

Preferably, the inclined plate is obliquely arranged at the lower end of the inside of the collecting box, one side of the collecting box is provided with a discharge hole which is convenient for the waste scraps on the inclined plate to flow out, and the discharge hole is provided with a valve.

Compared with the prior art, the utility model provides a clamping device for processing semiconductor materials, which comprises the following components

The beneficial effects are that:

1: according to the utility model, through the arrangement of the electric push rod, the first L-shaped plate can be moved left and right, and the distance between the first L-shaped plate and the second L-shaped plate can be adjusted, so that semiconductor materials with different sizes can be clamped, the first L-shaped plate is rotationally connected with the extension end of the electric push rod, and the clamped semiconductor materials can be rotated according to the needs through the matching design of the turnover mechanism, so that the semiconductor materials are not required to be dismantled, the operation steps are shortened, the working time is saved, and the working efficiency is improved.

2: According to the utility model, through ingenious design of the adsorption clamping assembly, the semiconductor material can be adsorbed and clamped through the sucking disc, and the soft surface layer is arranged, so that the semiconductor material can be effectively prevented from being damaged during clamping.

2: According to the utility model, through the design of the air suction component, the scraps generated after the processing of the semiconductor material can be sucked into the collecting box, so that the scraps can be collected intensively, and the problem that the scraps fall randomly and are difficult to collect intensively is effectively avoided.

Drawings

FIG. 1 is a schematic view of a partial cross-sectional structure of the present utility model;

FIG. 2 is an enlarged view of a portion of the utility model at A;

FIG. 3 is a schematic view of the attachment and mounting structure of the clamping plate, soft surface layer and suction cup of the present utility model;

Fig. 4 is a schematic structural view of the present utility model.

In the figure: 1. a bottom plate; 2. a first side plate; 3. an electric push rod; 4. a first L-shaped plate; 5. an adsorption clamping assembly; 501. an air pump; 502. a connecting rod; 503. a clamping plate; 504. a soft facing layer; 505. a vent pipe; 506. a suction cup; 6. a second L-shaped plate; 7. a turnover mechanism; 701. a rotating shaft; 702. a handle; 703. a first gear; 704. a rotating shaft; 705. a second gear; 8. a second side plate; 9. support legs; 10. a collection box; 11. a suction assembly; 1101. a filter screen; 1102. a motor; 1103. a protrusion; 1104. a vacuum pump; 1105. an air suction pipe; 1106. an air suction head; 12. a sloping plate; 13. a discharge port; 14. and (3) a valve.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, based on the embodiments of the utility model, which are apparent to those of ordinary skill in the art without inventive faculty, are intended to be within the scope of the utility model.

In addition, the embodiments of the present utility model and the features of the embodiments may be combined with each other without collision.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, or are directions or positional relationships conventionally understood by those skilled in the art, are merely for convenience of describing the present utility model and for simplifying the description, and are not to indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1-4, the clamping device for processing semiconductor materials comprises a bottom plate 1 and supporting legs 9, the supporting legs 9 are installed at four corners of the bottom end of the bottom plate 1, a first side plate 2 is fixedly connected to one side of the upper end of the bottom plate 1, an electric push rod 3 is installed on the outer side of the upper end of the first side plate 2, an extension end of the electric push rod 3 penetrates through the first side plate 2 to be rotationally connected with a first L-shaped plate 4, a second side plate 8 is fixedly connected to the other side of the upper end of the bottom plate 1, a second L-shaped plate 6 is installed at the upper end of the second side plate 8 through a turnover mechanism 7, and an adsorption clamping assembly 5 capable of clamping semiconductor materials is installed on each of the second L-shaped plate 6 and the first L-shaped plate 4;

The collecting box 10 is installed to the middle part lower extreme of bottom plate 1, the opening that is convenient for sweeps flow into collecting box 10 is offered at the middle part of bottom plate 1, be equipped with the subassembly 11 of breathing in the collecting box 10, in this embodiment, through the setting of electric putter 3, can move about first L template 4, and then can adjust the interval between first L template 4 and the second L template 6, thereby can carry out the centre gripping to the semiconductor material of equidimension, and the extension end rotation of first L template 4 and electric putter 3 is connected, the cooperation design of rethread tilting mechanism 7, can rotate the semiconductor material of centre gripping as required, need not to demolish semiconductor material, operating procedure has been shortened, operating time has been saved, work efficiency has been improved, through the ingenious design of absorption clamping assembly 5, can effectively prevent to make the damage when semiconductor material centre gripping, through the design of breathing in subassembly 11, can be concentrated the sweeps that produce after the semiconductor material processing absorbs into collecting box 10, be convenient for collect the sweeps, the problem that sweeps falls and is difficult to be carried out at will.

In this embodiment, the turnover mechanism 7 includes a rotation shaft 701, a first gear 703, a rotation shaft 704 and a second gear 705, the rotation shaft 701 is rotatably connected to the second side plate 8, the rotation shaft 701 located inside the second side plate 8 is fixedly connected to the second L-shaped plate 6, the first gear 703 is mounted on the rotation shaft 701, the rotation shaft 704 is rotatably connected to the second side plate 8, and the second gear 705 meshed with the first gear 703 is mounted on the rotation shaft 704; the handle 702 is installed to the one end that the axis of rotation 701 kept away from second L template 6, and when specifically using, through handle 702 rotation axis of rotation 701, axis of rotation 701 drives first gear 703 and rotates, and first gear 703 and second gear 705 meshing rotate, and then can make second L template 6 rotate as required.

In this embodiment, the adsorption clamping assembly 5 includes an air pump 501, a connecting rod 502, a clamping plate 503, a soft surface layer 504, a vent pipe 505 and a sucker 506, the upper and lower sides of the air pump 501 are provided with the clamping plate 503 through the connecting rod 502, the soft surface layer 504 is provided on the clamping plate 503, the sucker 506 is provided in the middle of the soft surface layer 504, the air pump 501 is communicated with the sucker 506 through the vent pipe 505, when in specific use, the air pump 501 is started, the sucker 506 can be sucked through the vent pipe 505, and then the sucker 506 can be used for adsorbing and clamping semiconductor materials, and in the adsorption clamping process, the semiconductor materials can be effectively prevented from being damaged when being clamped through the arrangement of the soft surface layer 504.

In this embodiment, the air suction assembly 11 includes a filter screen 1101, a vacuum pump 1104, an air suction pipe 1105 and an air suction head 1106, the filter screen 1101 is installed at one side of the upper end of the interior of the collecting box 10 in a downward inclined manner, the vacuum pump 1104 is installed on the outer wall of the collecting box 10, the vacuum pump 1104 is communicated with the air suction pipe 1105, one end of the air suction pipe 1105 far away from the vacuum pump 1104 penetrates through the collecting box 10 and extends into the collecting box 10, a plurality of air suction heads 1106 which suck air towards the filter screen 1101 are installed on the air suction pipe 1105 extending into the collecting box 10, when the air suction assembly is in specific use, the vacuum pump 1104 is started, the lower end of the filter screen 1101 is sucked through the air suction pipe 1105 and the air suction heads 1106, so that negative pressure is generated at the upper end of the interior of the collecting box 10, and waste chips generated by processing semiconductor materials can be sucked into the filter screen 1101 in time and then fall into the lower end of the interior of the collecting box 10 from the filter screen 1101.

In this embodiment, in order to facilitate the falling of the debris on the filter screen 1101, a plurality of motors 1102 are mounted at the lower end of the filter screen 1101.

In this embodiment, in order to avoid the blockage of the filter screen 1101 by the scraps, a plurality of protrusions 1103 are installed at the upper end of the filter screen 1101, and by the arrangement of the protrusions 1103, a certain gap is formed between the scraps on the filter screen 1101, so that the filter screen 1101 is prevented from being blocked, and the air suction is facilitated to the upper end of the filter screen 1101.

In this embodiment, in order to facilitate the outflow of the scraps in the collecting box 10, the inclined plate 12 is obliquely mounted at the lower end of the interior of the collecting box 10, one side of the collecting box 10 is provided with a discharge port 13 which facilitates the outflow of the scraps on the inclined plate 12, and the discharge port 13 is provided with a valve 14.

The working process of the utility model is as follows: when the semiconductor material clamping device is required to be used, the air pump 501 is started, the semiconductor material is placed on the sucker 506, then the electric push rod 3 is started, the first L-shaped plate 4 is moved, the semiconductor material is further clamped in an adsorption mode, after the clamping is finished, the semiconductor material can be processed, in the processing process, the rotating shaft 701 can be rotated through the handle 702 according to the requirement, the first gear 703 and the second gear 705 can be further rotated, the semiconductor material can be driven to rotate, and the semiconductor material can be processed at different positions conveniently;

In the course of working, start vacuum pump 1104, inhale the below of filter screen 1101 through inhaling head 1106, and then can make the inside upper end of collecting box 10 produce negative pressure, thereby can in time inhale the sweeps that the semiconductor material produced in the course of working on filter screen 1101, start motor 1102, can make filter screen 1101 shake, and then can drop the sweeps on the filter screen 1101 on the swash plate 12 of collecting box 10 inside, in the course of inhaling filter screen 1101, owing to the design of protruding 1103, can make the sweeps that are located on filter screen 1101 have certain clearance, be convenient for make the inside upper end to collecting box 10 produce certain negative pressure, finally open valve 14, can flow the sweeps on the swash plate 12 from discharge gate 13, and then concentrate the collection to the sweeps.

Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims (8)

1. Clamping device is used in processing of semiconductor material, including bottom plate (1) and supporting leg (9), its characterized in that are installed in bottom four corners of bottom plate (1): the novel plastic lifting device is characterized in that a first side plate (2) is fixedly connected to one side of the upper end of the bottom plate (1), an electric push rod (3) is arranged on the outer side of the upper end of the first side plate (2), the extension end of the electric push rod (3) penetrates through the first side plate (2) to be connected with a first L-shaped plate (4) in a rotating mode, a second side plate (8) is fixedly connected to the other side of the upper end of the bottom plate (1), a second L-shaped plate (6) is arranged at the upper end of the second side plate (8) through a turnover mechanism (7), and an adsorption clamping assembly (5) capable of clamping semiconductor materials is arranged on the second L-shaped plate (6) and the first L-shaped plate (4);

The collecting box (10) is installed at the lower end of the middle part of the bottom plate (1), an opening which is convenient for scraps to flow into the collecting box (10) is formed in the middle part of the bottom plate (1), and the collecting box (10) is internally provided with an air suction component (11).

2. The clamping device for processing semiconductor materials according to claim 1, wherein: the turnover mechanism (7) comprises a rotating shaft (701), a first gear (703), a rotating shaft (704) and a second gear (705), wherein the rotating shaft (701) is rotationally connected to a second side plate (8), the rotating shaft (701) positioned on the inner side of the second side plate (8) is fixedly connected with a second L-shaped plate (6), the rotating shaft (701) is provided with the first gear (703), the rotating shaft (704) is rotationally connected to the second side plate (8), and the rotating shaft (704) is provided with the second gear (705) meshed with the first gear (703).

3. The clamping device for processing semiconductor materials according to claim 2, wherein: a handle (702) is arranged at one end of the rotating shaft (701) far away from the second L-shaped plate (6).

4. The clamping device for processing semiconductor materials according to claim 1, wherein: the adsorption clamping assembly (5) comprises an air pump (501), a connecting rod (502), a clamping plate (503), a soft surface layer (504), a vent pipe (505) and a sucker (506), wherein the clamping plate (503) is arranged on the upper side and the lower side of the air pump (501) through the connecting rod (502), the soft surface layer (504) is arranged on the clamping plate (503), the sucker (506) is arranged in the middle of the soft surface layer (504), and the air pump (501) is communicated with the sucker (506) through the vent pipe (505).

5. The clamping device for processing semiconductor materials according to claim 1, wherein: the utility model provides a subassembly (11) breathes in, including filter screen (1101), vacuum pump (1104), breathing pipe (1105) and head of breathing in (1106), filter screen (1101) downward sloping is installed in inside upper end one side of collecting box (10), install vacuum pump (1104) on the outer wall of collecting box (10), vacuum pump (1104) intercommunication has breathing pipe (1105), the one end that vacuum pump (1104) were kept away from to breathing pipe (1105) runs through collecting box (10) and extends to collecting box (10) inside, extends to install a plurality of on breathing pipe (1105) inside collecting box (10) and breathe in head of breathing in (1106) towards filter screen (1101).

6. The clamping device for semiconductor material processing according to claim 5, wherein: the lower end of the filter screen (1101) is provided with a plurality of motors (1102).

7. The clamping device for semiconductor material processing according to claim 6, wherein: the upper end of the filter screen (1101) is provided with a plurality of bulges (1103).

8. The clamping device for processing semiconductor materials according to claim 1, wherein: the inclined plate (12) is obliquely arranged at the lower end of the inside of the collecting box (10), a discharging hole (13) which is convenient for the waste scraps on the inclined plate (12) to flow out is formed in one side of the collecting box (10), and a valve (14) is arranged on the discharging hole (13).