CN210731966U - Grinding device is used in integrated circuit board processing - Google Patents
Grinding device is used in integrated circuit board processing Download PDFInfo
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- CN210731966U CN210731966U CN201921678906.3U CN201921678906U CN210731966U CN 210731966 U CN210731966 U CN 210731966U CN 201921678906 U CN201921678906 U CN 201921678906U CN 210731966 U CN210731966 U CN 210731966U
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Abstract
The utility model relates to the technical field of circuit board processing, in particular to a polishing device for processing an integrated circuit board, which comprises a shell, wherein a placing platform is fixedly connected at the bottom of the inner side of the shell, a third telescopic rod fixedly connected with the shell is arranged on the placing platform, a pressing plate is fixedly connected at the bottom of the third telescopic rod, polishing mechanisms are arranged at the left side and the right side of the placing platform, and a dust removing mechanism is arranged at one side of the polishing mechanism, which is far away from the placing platform, the utility model can control the inclination angle of the polishing wheels at the two sides according to the model of the circuit board by arranging an adjusting mechanism, so that the polishing wheels can fully polish the periphery of the circuit board, the device not only can be suitable for polishing circuit boards with different sizes, but also can improve the polishing efficiency, and the dust generated during polishing can be collected by, and the environment is protected.
Description
Technical Field
The utility model relates to a circuit board processing technology field specifically is a grinding device is used in integrated circuit board processing.
Background
The integrated circuit board is made by using semiconductor manufacturing process, and many transistors, resistors, capacitors and other components are manufactured on a small single crystal silicon chip, and the components are combined into a complete electronic circuit by using a multilayer wiring or tunnel wiring method.
The circuit board is required to be processed before the integrated circuit board is processed, the circuit board is generally in a cuboid or cube structure, certain edges and corners exist at the edge of the circuit board, and therefore the periphery of the circuit board is required to be polished smoothly by a flat file or gauze manually, burrs are removed, the manual polishing force is not uniform, the polishing flatness is poor, and the polishing speed is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a grinding device is used in integrated circuit board processing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a grinding device is used in integrated circuit board processing, includes the casing, casing inboard bottom fixed connection is provided with places the platform, place bench be provided with casing fixed connection's third telescopic link, third telescopic link bottom fixed connection is provided with the clamp plate, it all is provided with grinding machanism to place the platform left and right sides, grinding machanism keeps away from and places platform one side and is provided with dust removal mechanism.
As a further aspect of the present invention: grinding machanism includes base and U type frame, the base sets up and is placing the platform left and right sides, base and casing sliding connection, the base front side is provided with actuating mechanism, base top fixed connection is provided with U type frame, U type frame inboard is provided with two second motors, be provided with adjustment mechanism between second motor and the U type frame, second motor output end and grinding wheel are connected.
As a further aspect of the present invention: the driving mechanism comprises a third motor, the third motor is arranged at the bottom end of the inner side of the shell in a bolted connection mode, the output end of the third motor is connected with the rotating rod, a threaded rod is arranged on the inner side of the base in a threaded connection mode, and the threaded rod is connected with the rotating rod through bevel gears in a meshed mode.
As a further aspect of the present invention: adjustment mechanism includes ejector pad and connecting block, ejector pad sliding connection sets up at U type frame inboardly, fixed connection is provided with first telescopic link between ejector pad and the U type frame, the ejector pad is close to circuit board one side and is provided with the connecting block, fixed connection is provided with the second telescopic link between connecting block and the ejector pad, the connecting block inboard is rotated and is connected and is provided with the movable block, the movable block is connected with first motor output, first motor bolted connection sets up in the connecting block outside, the movable block is close to circuit board one end bolted connection and is provided with the second motor.
As a further aspect of the present invention: dust removal mechanism includes dust absorption mouth, air exhauster and rose box, U type frame is kept away from circuit board one side and is provided with a plurality of dust absorption mouths, the dust absorption mouth passes through connecting pipe and air exhauster, air exhauster bolted connection sets up the filter box top, rose box and casing fixed connection, the inboard joint of rose box is provided with a plurality of filter plates, filter plate one end fixed connection is provided with the dust collection box, the filter plate downside is provided with can dismantle the filter screen of being connected with the rose box, the rose box bottom is provided with the gas outlet.
Compared with the prior art, the beneficial effects of the utility model are that:
1. by arranging the adjusting mechanism, the inclination angle of the grinding wheel at two sides can be controlled according to the model of the circuit board, so that the grinding wheel can fully grind the periphery of the circuit board, the device can be suitable for grinding circuit boards with different sizes by adjusting the distance between the grinding wheel and the circuit board, and the grinding efficiency can be improved by grinding two sides simultaneously;
2. by arranging the driving mechanism, the bases on the two sides can be controlled to move back and forth, so that the grinding mechanism can comprehensively grind the periphery of the circuit board;
3. through setting up dust removal mechanism, the dust that produces when can collecting polishing avoids the dust of production to waft during falling the outside air, the environmental protection.
Drawings
Fig. 1 is a schematic structural diagram of a polishing device for processing an integrated circuit board.
Fig. 2 is a side view of a connection block in a grinding device for integrated circuit board processing.
Fig. 3 is a schematic structural diagram of a filter box in the polishing device for processing the integrated circuit board.
In the figure: 1-shell, 2-U-shaped frame, 3-first telescopic rod, 4-push block, 5-second telescopic rod, 6-connecting block, 7-first motor, 8-movable block, 9-second motor, 10-grinding wheel, 11-third telescopic rod, 12-pressing plate, 13-placing table, 14-third motor, 15-rotating rod, 16-base, 17-threaded rod, 18-dust suction port, 19-connecting pipe, 20-exhaust fan, 21-filter box, 22-filter plate, 23-dust collection box, 24-filter screen and 25-air outlet.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1
Please refer to fig. 1-3, in an embodiment of the present invention, a polishing device for integrated circuit board processing, includes a housing 1, a placing table 13 is provided at the bottom of the inner side of the housing 1, a third telescopic rod 11 fixedly connected with the housing 1 is provided on the placing table 13, a pressing plate 12 is provided at the bottom of the third telescopic rod 11, polishing mechanisms are provided at the left and right sides of the placing table 13, and a dust removing mechanism is provided at one side of the polishing mechanism away from the placing table 13.
Example 2
In this embodiment, grinding machanism includes base 16 and U type frame 2, base 16 sets up and is placing the platform 13 left and right sides, base 16 and 1 sliding connection of casing, the 16 front sides of base are provided with actuating mechanism, 16 top fixed connection of base is provided with U type frame 2, 2 inboards of U type frame are provided with two second motors 9, be provided with adjustment mechanism between second motor 9 and the U type frame 2, second motor 9 output and grinding wheel 10 are connected, through setting up adjustment mechanism, can be according to the model control both sides grinding wheel 10 inclination of circuit board, make grinding wheel 10 can provide fully to polish around the circuit board, through adjusting the distance between grinding wheel 10 and the circuit board, make the device can be applicable to not polishing of unidimensional circuit board, both sides are polished simultaneously, can improve the efficiency of polishing.
In this embodiment, actuating mechanism includes third motor 14, third motor 14 bolted connection sets up in the inboard bottom of casing 1, third motor 14 output and bull stick 15 are connected, 16 inboard threaded connection of base is provided with threaded rod 17, threaded rod 17 is connected through bevel gear meshing between 15 with the bull stick, through setting up actuating mechanism, can control both sides base 16 and carry out the back-and-forth movement, makes grinding machanism can carry out comprehensive polishing to the circuit board all around.
In this embodiment, adjustment mechanism includes ejector pad 4 and connecting block 6, 4 sliding connection of ejector pad sets up in 2 inboards of U type frame, fixed connection is provided with first telescopic link 3 between ejector pad 4 and the U type frame 2, ejector pad 4 is close to circuit board one side and is provided with connecting block 6, fixed connection is provided with second telescopic link 5 between connecting block 6 and the ejector pad 4, 6 inboard rotations of connecting block are connected and are provided with movable block 8, movable block 8 is connected with 7 output of first motor, 7 bolted connection of first motor set up in the 6 outsides of connecting block, movable block 8 is close to circuit board one end bolted connection and is provided with second motor 9.
In this embodiment, dust removal mechanism includes dust absorption mouth 18, air exhauster 20 and rose box 21, U type frame 2 is kept away from circuit board one side and is provided with a plurality of dust absorption mouths 18, dust absorption mouth 18 passes through connecting pipe 19 and air exhauster 20, air exhauster 20 bolted connection sets up the top of rose box 21, rose box 21 and 1 fixed connection of casing, the inboard joint of rose box 21 is provided with a plurality of filter plates 22, filter plate 22 one end fixed connection is provided with dust collection box 23, filter plate 22 downside is provided with can dismantle the filter screen 24 of being connected with rose box 21, rose box 21 bottom is provided with gas outlet 25, through setting up dust removal mechanism, can collect the dust that produces when polishing, avoids the dust that produces to waft in the outside air, protects the environment.
In this embodiment, the connection pipe 19 is a long hose.
In this embodiment, the end of the threaded rod 17 not provided with a bevel gear is connected with the housing 1 through a bearing.
This integrated circuit board is grinding device for processing, through setting up adjustment mechanism, can be according to the model control both sides grinding wheel 10 inclination of circuit board, make grinding wheel 10 can provide abundant the polishing to the circuit board all around, through adjusting the distance between grinding wheel 10 and the circuit board, make the device can be applicable to polishing of unidimensional circuit board, both sides are polished simultaneously, can improve the efficiency of polishing, through setting up actuating mechanism, can control both sides base 16 and carry out the back-and-forth movement, make grinding mechanism can carry out comprehensive polishing to the circuit board all around, through setting up dust removal mechanism, can collect the dust that produces when polishing, avoid the dust that produces to waft in the outside air, the environmental protection.
The utility model discloses a theory of operation is: place the circuit board at placing platform 13 top, the extension of third telescopic link 11, make clamp plate 12 fix the circuit board on placing platform 13, later control first telescopic link 3, make wheel 10 of polishing be located circuit board upper and lower both sides through the position of adjusting ejector pad 4, make wheel 10 and the circuit board butt of polishing through controlling second telescopic link 5, can adjust the angle of wheel 10 of polishing through controlling first motor 7, start second motor 9, wheel 10 of polishing is polished to the circuit board, third motor 14 drives threaded rod 17 through bull stick 15 and rotates, make wheel 10 of polishing carry out the back-and-forth movement, accomplish polishing to the circuit board, during polishing, the dust that produces is inhaled rose box 21 by air exhauster 20, discharge from gas outlet 25 through the filtration of rose box 21.
The above is only the preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent.
Claims (5)
1. The utility model provides a grinding device is used in integrated circuit board processing, includes casing (1), its characterized in that, casing (1) inboard bottom fixed connection is provided with places platform (13), place and be provided with third telescopic link (11) with casing (1) fixed connection on platform (13), third telescopic link (11) bottom fixed connection is provided with clamp plate (12), it all is provided with grinding machanism to place platform (13) left and right sides, grinding machanism keeps away from and places platform (13) one side and is provided with dust removal mechanism.
2. The grinding device for processing the integrated circuit board as claimed in claim 1, wherein the grinding mechanism comprises a base (16) and a U-shaped frame (2), the base (16) is arranged on the left side and the right side of the placing table (13), the base (16) is slidably connected with the shell (1), a driving mechanism is arranged on the front side of the base (16), the U-shaped frame (2) is fixedly connected to the top of the base (16), two second motors (9) are arranged on the inner side of the U-shaped frame (2), an adjusting mechanism is arranged between the second motors (9) and the U-shaped frame (2), and the output ends of the second motors (9) are connected with the grinding wheel (10).
3. The grinding device for processing the integrated circuit board as claimed in claim 2, wherein the driving mechanism comprises a third motor (14), the third motor (14) is arranged at the bottom end of the inner side of the shell (1) in a bolted connection mode, the output end of the third motor (14) is connected with the rotating rod (15), a threaded rod (17) is arranged on the inner side of the base (16) in a threaded connection mode, and the threaded rod (17) is connected with the rotating rod (15) in a meshed mode through a bevel gear.
4. The polishing device for processing an IC board according to claim 2, the adjusting mechanism comprises a push block (4) and a connecting block (6), the push block (4) is arranged on the inner side of the U-shaped frame (2) in a sliding connection manner, a first telescopic rod (3) is fixedly connected between the push block (4) and the U-shaped frame (2), a connecting block (6) is arranged on one side of the push block (4) close to the circuit board, a second telescopic rod (5) is fixedly connected between the connecting block (6) and the push block (4), the inner side of the connecting block (6) is rotatably connected with a movable block (8), the movable block (8) is connected with the output end of a first motor (7), the first motor (7) is arranged outside the connecting block (6) in a bolt connection way, and a second motor (9) is arranged at one end, close to the circuit board, of the movable block (8) in a bolt connection mode.
5. The polishing device for integrated circuit board processing according to claim 4, wherein the dust removing mechanism comprises a dust suction port (18), an exhaust fan (20) and a filter box (21), a plurality of dust suction ports (18) are arranged on one side, away from the circuit board, of the U-shaped frame (2), the dust suction ports (18) are connected with the exhaust fan (20) through a connecting pipe (19), the exhaust fan (20) is connected with the top of the filter box (21) through bolts, the filter box (21) is fixedly connected with the shell (1), a plurality of filter plates (22) are clamped inside the filter box (21), one ends of the filter plates (22) are fixedly connected with a dust collection box (23), a filter screen (24) detachably connected with the filter box (21) is arranged on the lower side of the filter plates (22), and an air outlet (25) is arranged at the bottom of the filter box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921678906.3U CN210731966U (en) | 2019-10-09 | 2019-10-09 | Grinding device is used in integrated circuit board processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921678906.3U CN210731966U (en) | 2019-10-09 | 2019-10-09 | Grinding device is used in integrated circuit board processing |
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| Publication Number | Publication Date |
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| CN210731966U true CN210731966U (en) | 2020-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921678906.3U Active CN210731966U (en) | 2019-10-09 | 2019-10-09 | Grinding device is used in integrated circuit board processing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111906611A (en) * | 2020-08-13 | 2020-11-10 | 烟台工程职业技术学院(烟台市技师学院) | Multi-functional equipment of polishing of machining |
| CN112338680A (en) * | 2020-11-02 | 2021-02-09 | 江苏汉印机电科技股份有限公司 | Electronic equipment printed circuit board edging machine tool |
| CN113211223A (en) * | 2021-05-24 | 2021-08-06 | 江阴市科诚技术有限公司 | Pultrusion plate edge polishing device for wind power blade main beam |
| CN114851015A (en) * | 2022-07-11 | 2022-08-05 | 宿迁恒信工艺品有限公司 | Edge grinding device and edge grinding method for plates |
-
2019
- 2019-10-09 CN CN201921678906.3U patent/CN210731966U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111906611A (en) * | 2020-08-13 | 2020-11-10 | 烟台工程职业技术学院(烟台市技师学院) | Multi-functional equipment of polishing of machining |
| CN112338680A (en) * | 2020-11-02 | 2021-02-09 | 江苏汉印机电科技股份有限公司 | Electronic equipment printed circuit board edging machine tool |
| CN112338680B (en) * | 2020-11-02 | 2021-10-08 | 江苏汉印机电科技股份有限公司 | Electronic equipment printed circuit board edging machine tool |
| CN113211223A (en) * | 2021-05-24 | 2021-08-06 | 江阴市科诚技术有限公司 | Pultrusion plate edge polishing device for wind power blade main beam |
| CN114851015A (en) * | 2022-07-11 | 2022-08-05 | 宿迁恒信工艺品有限公司 | Edge grinding device and edge grinding method for plates |
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