CN219504409U - Grinding equipment for processing magnetron sputtering high-purity nickel target - Google Patents
Grinding equipment for processing magnetron sputtering high-purity nickel target Download PDFInfo
- Publication number
- CN219504409U CN219504409U CN202320559927.3U CN202320559927U CN219504409U CN 219504409 U CN219504409 U CN 219504409U CN 202320559927 U CN202320559927 U CN 202320559927U CN 219504409 U CN219504409 U CN 219504409U
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- CN
- China
- Prior art keywords
- negative pressure
- polishing
- magnetron sputtering
- driving mechanism
- purity nickel
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 238000001755 magnetron sputter deposition Methods 0.000 title claims abstract description 21
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 21
- 238000000227 grinding Methods 0.000 title description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 74
- 238000005498 polishing Methods 0.000 claims abstract description 46
- 238000001179 sorption measurement Methods 0.000 claims abstract description 20
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000003754 machining Methods 0.000 claims 1
- 239000010902 straw Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000001914 filtration Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000013077 target material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model discloses polishing equipment for processing a magnetron sputtering high-purity nickel target, which comprises a base, a clamping and fixing mechanism, a hydraulic telescopic cylinder, a driving mechanism, a polishing mechanism, a negative pressure bellows and an adjusting mechanism, wherein the clamping and fixing mechanism is arranged on one side of the top of the base, the bottom of the hydraulic telescopic cylinder is fixedly connected to the other side of the top of the base, the driving mechanism is arranged at the output end of the hydraulic telescopic cylinder, the polishing mechanism is arranged on one side below the driving mechanism, one side of the negative pressure bellows corresponding to the polishing mechanism is arranged below the driving mechanism, and an adsorption assembly is arranged on the outer side of the negative pressure bellows. According to the utility model, the negative pressure fan of the negative pressure air box works, so that negative pressure adsorption is generated in the negative pressure air box, gas and scattered scraps are adsorbed into the negative pressure air box through the adsorption component, and the scrap treatment efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of magnetron sputtering high-purity nickel target processing, in particular to polishing equipment for magnetron sputtering high-purity nickel target processing.
Background
The T-shaped magnetron sputtering coating has the advantages of high uniformity, strong controllability and the like, and gradually becomes one of the most critical processes in the production process of integrated circuits and semiconductor chips, and the quality of a sputtering target determines the coating effect of magnetron sputtering and the performance of a semiconductor device, so that the T-shaped magnetron sputtering coating becomes an essential material in the field of semiconductors, especially in the chip manufacturing industry, the quality of a thin film formed after sputtering the target, such as the thickness, the uniformity and the like, can obviously influence the performance of a product in the semiconductor industry, and the thickness and the uniformity of the thin film almost completely depend on the tissue of the target, such as the refinement degree, the uniformity and the like of grains, therefore, in order to improve the quality of the nickel target, the grain size and the grain orientation during the preparation of the nickel target are very important, and a polishing device is required to polish raw materials.
The prior patent with the publication number of CN206677686U discloses polishing equipment, and when polishing materials, a fan at the dust removal box sucks dust into the dust removal box through a dust hood. In the nickel target processing field, to its in-process of polishing, carry out negative pressure adsorption filtration to the sweeps that wafts, when can follow grinding machanism and remove, carry out different angles and carry out negative pressure adsorption filtration to the sweeps that wafts, reduce the sweeps and follow the air and waft and drop, avoid causing the influence to operating personnel and equipment.
Disclosure of Invention
The utility model aims to solve the problems in the prior art, and provides polishing equipment for processing a magnetron sputtering high-purity nickel target, which can perform different-angle adsorption and filtration operations when adsorbing and filtering scattered sweeps under negative pressure so as to solve the problem that only a single position adsorbs the scattered sweeps.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a magnetron sputtering high-purity nickel target processing is with equipment of polishing, includes base, clamping fixture, hydraulic telescoping cylinder, actuating mechanism, grinding machanism, negative pressure bellows and adjustment mechanism, clamping fixture sets up base top one side, hydraulic telescoping cylinder bottom fixed connection is in base top opposite side, hydraulic telescoping cylinder output with actuating mechanism connects and drives actuating mechanism goes up and down, grinding machanism sets up actuating mechanism below one side, actuating mechanism drives grinding machanism rectilinear motion, negative pressure bellows corresponds grinding machanism one side sets up the actuating mechanism below, the negative pressure bellows outside is provided with adsorption component, adjustment mechanism sets up the negative pressure bellows bottom, just adjustment structure adjusts adsorption component adsorbs the angle.
In the above scheme, the centre gripping fixed establishment is used for the fixed use of material position, and passes through grinding machanism polishes the material, and passes through drive structure carries out horizontal adjustment to grinding machanism's processing position, through the flexible jar output of hydraulic pressure is to actuating mechanism and grinding machanism altitude mixture control, in the process of polishing, through produce negative pressure amount of wind in the negative pressure bellows and adsorb the sweeps that produce of polishing through the adsorption component, and pass through adjustment mechanism is to adsorption component angle modulation to carry out the multi-angle and to the sweeps collection that wafts.
On the basis of the above technical scheme, preferably, the driving mechanism comprises a case, a motor, a screw and a movable frame, wherein one side of the bottom of the case is fixedly connected to the output end of the hydraulic telescopic cylinder, the screw is rotationally connected to the inside of the case, the motor is fixedly connected to the inner wall of the case, the output end of the motor is fixedly connected to one end of the screw, one side of the bottom of the case is communicated with the inside of the case, the movable frame is slidably connected to the inside of the case and extends to the lower part of the case, the screw is communicated with the movable frame in a threaded manner, and the polishing mechanism and the negative pressure bellows are respectively arranged on two sides of the bottom of the movable frame.
On the basis of the technical scheme, preferably, the negative pressure air box comprises a negative pressure fan and a filter screen, the negative pressure fan is arranged outside the negative pressure air box in a penetrating mode, the filter screen is obliquely arranged inside the negative pressure air box corresponding to the negative pressure fan air suction opening, and the inclination angle is 30-50 degrees.
Negative pressure wind is generated in the negative pressure wind box through the work of the negative pressure fan so as to absorb scattered waste scraps, and the waste scraps are isolated in the negative pressure wind box through the filter screen so as to be collected.
On the basis of the technical scheme, preferably, the adsorption assembly comprises a hose and a suction pipe, the top end of the hose is communicated and connected with the negative pressure bellows, and the suction pipe is arranged at the bottom end of the hose and is subjected to angle adjustment through the adjusting mechanism.
Through the straw is collected the sweeps, and in collecting process, adjustment mechanism drives straw angle modulation carries out different position absorption, improves collection efficiency.
On the basis of the technical scheme, preferably, the adjusting mechanism comprises an L-shaped mounting frame, an electric push rod and a hinge, wherein the top end of the L-shaped mounting frame is fixedly connected with the bottom of the negative pressure bellows, the bottom of the electric push rod is movably connected with the L-shaped mounting frame through the hinge, the output end of the electric push rod is movably connected with one side of the suction pipe through the hinge, and one end, close to the suction pipe, of the L-shaped mounting frame is movably connected with one side of the suction pipe through the hinge.
The electric putter is on L type mounting bracket, just electric putter output with the straw is connected, all passes through hinge swing joint makes the straw is in under the effect of electric putter output, angle modulation is more convenient.
On the basis of the above technical scheme, preferably, the negative pressure air box further comprises a collecting box, wherein the collecting box is arranged inside the negative pressure air box and used for collecting scraps.
On the basis of the technical scheme, the base is preferably provided with a plurality of support columns, and the support columns are respectively and fixedly connected to the periphery of the bottom of the base.
Compared with the prior art, the utility model has the beneficial effects that:
1. through setting up negative pressure bellows, negative pressure bellows includes adsorption component, negative pressure fan and filter screen, and during polishing, work through negative pressure fan, produces negative pressure amount of wind for produce negative pressure absorption in the negative pressure bellows, adsorb in the negative pressure bellows with gaseous and the sweeps that fly away through adsorption component, and filter gaseous in inlet scoop department through the filter screen, fall the sweeps after will filtering in the negative pressure bellows and collect, improve the sweeps treatment effeciency to in the air, reduce the sweeps that fly away to the influence of operating personnel and equipment.
2. Through setting up adjustment mechanism, adjustment mechanism includes L type mounting bracket, electric putter and hinge including adjusting the structure, for better carry out the sweeps is handled, at the in-process of polishing, electric putter passes through swing joint on L type mounting bracket through the hinge, and the straw passes through hinge and L type mounting bracket swing joint, electric putter's output passes through one side swing joint of hinge and straw, one side through electric putter's output effect to the straw for the straw angle changes, carries out different positions and absorbs gas and drift sweeps, thereby improves treatment effeciency.
Drawings
FIG. 1 is a three-dimensional view of a polishing apparatus for processing a magnetron sputtering high-purity nickel target material according to the present utility model;
FIG. 2 is a schematic diagram of the structure of a cabinet of a polishing device for processing a magnetron sputtering high-purity nickel target material;
FIG. 3 is a schematic diagram of the structure of a filter box of the polishing device for processing the magnetron sputtering high-purity nickel target material;
fig. 4 is an enlarged schematic view of the structure at a in fig. 1.
In the figure: 1. a base; 2. a clamping and fixing mechanism; 3. a hydraulic telescopic cylinder; 4. a driving mechanism; 41. a chassis; 410. a limit groove; 42. a driving motor; 43. a screw rod; 44. a moving rack; 5. a polishing mechanism; 6. a negative pressure bellows; 61. an adsorption assembly; 611. a hose; 612. a suction pipe; 62. a negative pressure fan; 63. a filter screen; 64. a collection box; 7. an adjusting mechanism; 71. an L-shaped mounting rack; 72. an electric push rod; 73. a hinge; 8. and (5) supporting the column.
Detailed Description
The following description of the embodiments of the present utility model will be made more apparent and fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on embodiments of the present utility model, are within the scope of the present utility model.
As shown in figures 1-4, the polishing equipment for processing the magnetron sputtering high-purity nickel target comprises a base 1, a clamping and fixing mechanism 2, a hydraulic telescopic cylinder 3, a driving mechanism 4, a polishing mechanism 5, a negative pressure bellows 6 and an adjusting mechanism 7, wherein the clamping and fixing mechanism 2 is arranged on one side of the top of the base 1, the bottom of the hydraulic telescopic cylinder 3 is fixedly connected to the other side of the top of the base 1, the driving mechanism 4 is arranged on the output end of the hydraulic telescopic cylinder 3, the driving mechanism 4 is driven to rise and fall in height by the output end of the hydraulic telescopic cylinder 3, the polishing mechanism 5 is arranged on one side below the driving mechanism 4, the clamping and fixing mechanism 2 is used for fixing materials, the driving mechanism 4 is driven to adjust in height by the output end of the hydraulic telescopic cylinder 3, and the height of the polishing mechanism 5 can be adjusted, so that the polishing mechanism 5 can polish the materials conveniently, and the polishing mechanism 5 is driven to move linearly by the driving mechanism 4, so that the polishing mechanism 5 can polish the materials uniformly;
the negative pressure bellows 6 corresponds one side setting of grinding machanism 5 in the below of actuating mechanism 4, the negative pressure bellows 6 outside is provided with adsorption component 61, adsorption component 61 includes hose 611 and straw 612, the hose 611 top communicates with each other with negative pressure bellows 6 and is connected, the straw 612 sets up in hose 611 bottom and through adjustment mechanism 7 to straw 612 angle modulation, adjustment mechanism 7 sets up in the bottom of negative pressure bellows 6, the sweeps that produce when polishing fly away in the air, cause the influence to operating personnel and equipment, produce the negative pressure in through negative pressure bellows 6, inhale negative pressure bellows 6 with gaseous and the sweeps that fly away through straw 612, through adjustment mechanism 7 to the angle modulation of straw 612, so that straw 612 more efficient absorbs gaseous and the sweeps that fly away.
As a preferred embodiment, the driving mechanism 4 comprises a case 41, a motor 42, a screw 43 and a moving frame 44, wherein one side of the bottom of the case 41 is fixedly connected to the output end of the hydraulic telescopic cylinder 3, the screw 43 is rotatably connected to the inside of the case 41, the motor 42 is fixedly connected to the inner wall of the case 41, the output end of the motor 42 is fixedly connected to one end of the screw 43, one side of the bottom of the case 41 is communicated, the moving frame 44 is slidably connected to the inside of the case 41 and the moving frame 44 extends to the lower part of the case 41, the screw 43 penetrates and is in threaded connection with the moving frame 44, the polishing mechanism 5 and the negative pressure bellows 6 are respectively arranged on two sides of the bottom of the moving frame 44, the screw 43 is driven to rotate by the output end of the motor 42 in the case 41, and the moving frame 44 moves horizontally, so that the polishing mechanism 5 and the negative pressure bellows 6 move horizontally, and polishing and sweeps adsorption processes.
As a preferred embodiment, the negative pressure wind box 6 includes a negative pressure wind box 62 and a filter screen 63, the negative pressure wind box 62 is penetrated and arranged outside the negative pressure wind box 6, the filter screen 63 is arranged inside the negative pressure wind box 6 corresponding to the air suction inlet of the negative pressure wind box 62, the filter screen 63 is inclined at a certain angle, and the inclination angle is 30-50 degrees, the negative pressure wind box 62 works to generate negative pressure wind volume, so that negative pressure absorption is generated in the negative pressure wind box 6, gas and flying waste chips are absorbed inside, the gas is filtered at the air suction inlet through the filter screen 63, and the filtered waste chips fall into the negative pressure wind box 6 to be collected.
As a preferred embodiment, the adjusting structure 7 comprises an L-shaped mounting frame 71, an electric push rod 72 and a hinge 73, wherein the top end of the L-shaped mounting frame 71 is fixedly connected to the bottom of the negative pressure bellows 6, the bottom of the electric push rod 72 is movably connected to the L-shaped mounting frame 71 through the hinge 73, the output end of the electric push rod 72 is movably connected to one side of the suction pipe 612 through the hinge 73, one side of the L-shaped mounting frame 71 is movably connected to one side of the suction pipe 612 through the hinge 73, the angle of the suction pipe 612 is changed, the output end of the electric push rod 72 is applied to the suction pipe 612, the angle of the suction pipe 612 is changed, the suction pipe 612 absorbs gas and drifts at different positions, and the treatment efficiency is improved.
As a preferred embodiment, the negative pressure bellows 6 further comprises a collecting box 64, the collecting box 64 being arranged inside the negative pressure bellows 6 for the collection of waste.
As a preferred embodiment, the base further comprises a plurality of support columns 8, wherein the support columns 8 are respectively fixedly connected around the bottom of the base 1 and used for supporting the base.
Working principle: fix the material on clamping fixture 2, drive quick-witted case 41 altitude mixture control through the output of hydraulic telescoping cylinder 3, thereby highly adjust grinding machanism 5, so that grinding machanism 5 polishes the material, make grinding machanism 5 evenly remove the operation of polishing in material department, work through negative pressure fan 62, produce negative pressure amount of wind, produce negative pressure absorption in the negative pressure bellows 6, adsorb negative pressure bellows 6 through suction pipe 612 the sweeps that produce of polishing, through adjustment mechanism 7 to suction pipe 612 angle modulation, improve suction efficiency, filter the sweeps through filter screen 63, collect it in collecting box 64, so that centralized processing, sweeps treatment efficiency when improving the polishing.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The polishing equipment for processing the magnetron sputtering high-purity nickel target is characterized by comprising a base, a clamping and fixing mechanism, a hydraulic telescopic cylinder, a driving mechanism, a polishing mechanism, a negative pressure bellows and an adjusting mechanism, wherein the clamping and fixing mechanism is arranged on one side of the top of the base, the bottom of the hydraulic telescopic cylinder is fixedly connected to the other side of the top of the base, the output end of the hydraulic telescopic cylinder is connected with the driving mechanism and drives the driving mechanism to lift, the polishing mechanism is arranged on one side below the driving mechanism, the driving mechanism drives the polishing mechanism to linearly move, and the negative pressure bellows is arranged below the driving mechanism corresponding to one side of the polishing mechanism;
the negative pressure bellows outside is provided with the adsorption component, adjustment mechanism sets up negative pressure bellows bottom, just adjustment mechanism adjusts the adsorption component adsorbs the angle.
2. The polishing device for magnetron sputtering high-purity nickel target machining according to claim 1, wherein the driving mechanism comprises a case, a motor, a screw and a movable frame, one side of the bottom of the case is fixedly connected to the output end of the hydraulic telescopic cylinder, the screw is rotationally connected to the inside of the case, the motor is fixedly connected to the inner wall of the case, the output end of the motor is fixedly connected with one end of the screw, one side of the bottom of the case is communicated, the movable frame is slidingly connected to the inside of the case and extends to the lower portion of the case, the screw is communicated and in threaded connection with the movable frame, and the polishing mechanism and the negative pressure bellows are respectively arranged on two sides of the bottom of the movable frame.
3. The polishing device for processing the magnetron sputtering high-purity nickel target according to claim 1, wherein the negative pressure air box comprises a negative pressure fan and a filter screen, the negative pressure fan is arranged outside the negative pressure air box in a penetrating mode, the filter screen is obliquely arranged inside the negative pressure air box corresponding to an air suction opening of the negative pressure fan, and the inclination angle is 30-50 degrees.
4. The polishing device for processing the magnetron sputtering high-purity nickel target according to claim 1, wherein the adsorption assembly comprises a hose and a suction pipe, the top end of the hose is connected with a negative pressure bellows in a communicated mode, and the suction pipe is arranged at the bottom end of the hose and is subjected to angle adjustment through the adjusting mechanism.
5. The polishing device for processing the magnetron sputtering high-purity nickel target according to claim 4, wherein the adjusting mechanism comprises an L-shaped mounting frame, an electric push rod and a hinge, the top end of the L-shaped mounting frame is fixedly connected to the bottom of the negative pressure bellows, the bottom of the electric push rod is movably connected to the L-shaped mounting frame through the hinge, the output end of the electric push rod is movably connected with one side of the suction pipe through the hinge, and one end, close to the suction pipe, of the L-shaped mounting frame is movably connected with one side of the suction pipe through the hinge.
6. The polishing device for processing the magnetron sputtering high-purity nickel target according to claim 1, wherein the negative pressure air box further comprises a collecting box, and the collecting box is arranged inside the negative pressure air box and is used for collecting scraps.
7. The polishing device for processing the magnetron sputtering high-purity nickel target according to claim 1, further comprising a plurality of support columns, wherein the support columns are fixedly connected to the periphery of the bottom of the base respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320559927.3U CN219504409U (en) | 2023-03-21 | 2023-03-21 | Grinding equipment for processing magnetron sputtering high-purity nickel target |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320559927.3U CN219504409U (en) | 2023-03-21 | 2023-03-21 | Grinding equipment for processing magnetron sputtering high-purity nickel target |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219504409U true CN219504409U (en) | 2023-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320559927.3U Active CN219504409U (en) | 2023-03-21 | 2023-03-21 | Grinding equipment for processing magnetron sputtering high-purity nickel target |
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| CN (1) | CN219504409U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117532429A (en) * | 2023-11-13 | 2024-02-09 | 深圳市昕凯数控设备有限公司 | Multi-shaft multi-station deburring machine |
-
2023
- 2023-03-21 CN CN202320559927.3U patent/CN219504409U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117532429A (en) * | 2023-11-13 | 2024-02-09 | 深圳市昕凯数控设备有限公司 | Multi-shaft multi-station deburring machine |
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