CN220940324U - Mixing device - Google Patents

Abstract

The utility model relates to the technical field of mixing equipment, in particular to mixing equipment, which comprises: the stirring assembly, the container body, the semiconductor refrigerating piece and the controller; a mixing cavity is formed in the container main body, and the stirring assembly is used for stirring materials in the mixing cavity; the semiconductor refrigerating piece is arranged on the side wall and/or the bottom wall of the container main body; the controller is electrically connected with the semiconductor refrigerating piece and is used for controlling the current direction of the semiconductor refrigerating piece so that the semiconductor refrigerating piece can cool or heat materials in the mixing cavity. The bottom wall and/or the side wall of the container main body are/is provided with the semiconductor refrigerating piece, and the direction of the current of the semiconductor refrigerating piece is controlled by the controller, so that the semiconductor refrigerating piece can cool or heat the mixing cavity. Compared with the prior art, the mixing equipment has simpler structure, smaller volume, reduced manufacturing difficulty and manufacturing cost and stronger universality. And the device has the advantages of quick response, stronger temperature control effect, quick and accurate temperature control and the like.

Description

Mixing device

Technical Field

The utility model relates to the technical field of mixing equipment, in particular to mixing equipment.

Background

The mixing device is a device for mixing materials, and is widely applied to a plurality of fields such as construction, metallurgy, chemical industry and the like.

The mixing equipment comprises a mixing tank and a stirring mechanism, wherein the stirring mechanism is used for stirring materials in the mixing tank so as to mix the materials. In the mixing process, heat can be generated by high-speed dispersion of materials to cause temperature rise, if the temperature inside a mixing tank can not be controlled in a proper range during mixing, the mixing effect is not ideal, the follow-up technological performance of powder is further influenced, and therefore, the control of the temperature of mixing equipment has significance for improving the mixing effect.

In the prior art, in order to control the temperature of a mixing tank, a liquid nitrogen refrigerating and resistance wire heating rod or an air cooling system is generally arranged outside the mixing tank. However, the former needs to be provided with a container for storing substances such as liquid nitrogen and other structures such as gas and liquid circulation inlet and outlet pipelines, and the like, so that the problems of easy leakage and blockage of a heat conducting medium exist during use, the whole weight and the whole volume of the equipment are large, the manufacturing difficulty and the cost are increased, and the universality is limited; although the latter can take away the heat of compounding jar surface through fan or air convection, the required time of heat dissipation is longer, and the radiating effect is poor to can't realize accurate accuse temperature.

Disclosure of utility model

The utility model solves the problems that: the existing temperature control system outside the mixing tank has the problems of complex structure, higher failure rate, poor heat dissipation effect and the like.

(II) technical scheme

In order to solve the above technical problems, an embodiment of the present utility model provides a mixing apparatus, including: the stirring assembly, the container body, the semiconductor refrigerating piece and the controller;

A mixing cavity is formed in the container main body, and the stirring assembly is used for stirring materials in the mixing cavity;

The semiconductor refrigerating piece is arranged on the side wall and/or the bottom wall of the container main body;

The controller is electrically connected with the semiconductor refrigerating piece, and the controller is used for controlling the current direction of the semiconductor refrigerating piece so that the semiconductor refrigerating piece can cool or heat materials in the mixing cavity.

Further, the heat dissipation plate is also included;

The heat dissipation plate covers the outer side wall of the container main body, and the semiconductor refrigerating piece is fixed between the outer wall of the container main body and the heat dissipation plate.

Further, the surface of the semiconductor refrigeration piece is coated with heat-conducting silica gel;

The semiconductor refrigerating piece is adhered to the radiating plate through heat-conducting silica gel;

And/or;

the semiconductor refrigerating piece is adhered to the outer side wall of the container main body through the heat-conducting silica gel.

Further, the periphery of the semiconductor refrigerating piece is sleeved with a protective sleeve.

Further, the device also comprises a machine base and a cover plate;

The container main body and the cover plate are both arranged on the machine base, and the cover plate is rotationally connected with the machine base;

The container body is provided with an open end, and the cover plate is used for opening or closing the open end of the container body.

Further, the device also comprises a temperature sensor, wherein the temperature sensor is electrically connected with the controller, and the temperature sensor is fixed on one surface of the cover plate, which faces the mixing cavity;

the temperature sensor is used for monitoring temperature information of materials in the mixing cavity and can feed back the temperature information of the materials in the mixing cavity to the controller;

The controller can control the current direction and the current value of the semiconductor refrigerating piece according to the temperature information of the materials in the mixing cavity.

Further, a plurality of temperature sensors are arranged;

Along the depth direction of mixing chamber, divide there are a plurality of monitoring areas in the mixing chamber, monitoring area with temperature sensor corresponds, temperature sensor is used for monitoring the temperature information of material in the corresponding monitoring area.

Further, the anti-collision device also comprises an anti-collision shell;

The temperature sensor is arranged in the anti-collision shell, and a temperature measuring probe of the temperature sensor extends out of the anti-collision shell.

Further, the stirring assembly includes: the stirring device comprises a first driving motor, a first transmission assembly, a stirring shaft and a stirring paddle;

The stirring paddle is arranged on the stirring shaft, and the first driving motor is in transmission connection with the stirring shaft through the first transmission assembly and drives the stirring shaft to rotate.

Further, the stirring assembly includes: a second drive motor and a second transmission assembly;

The second driving motor is in transmission connection with the container main body through the second transmission assembly and drives the container main body to rotate.

The utility model has the beneficial effects that:

the present utility model provides a mixing apparatus comprising: the stirring assembly, the container body, the semiconductor refrigerating piece and the controller; a mixing cavity is formed in the container main body, and the stirring assembly is used for stirring materials in the mixing cavity; the semiconductor refrigerating piece is arranged on the side wall and/or the bottom wall of the container main body; the controller is electrically connected with the semiconductor refrigerating piece, and the controller is used for controlling the current direction of the semiconductor refrigerating piece so that the semiconductor refrigerating piece can cool or heat materials in the mixing cavity.

Through setting up the material of stirring subassembly stirring mixing chamber, can improve mixing efficiency, set up the semiconductor refrigeration piece on container body's diapire and/or lateral wall, the direction of cooperation controller control semiconductor refrigeration piece electric current can make the semiconductor refrigeration piece cool off or heat mixing chamber. The semiconductor refrigerating piece has the characteristics of simple structure, easy integration, quick response, simple control and the like. Compared with the prior art, the temperature of the mixing equipment is controlled through the semiconductor refrigerating piece, and the mixing equipment has the advantages of simpler structure, smaller volume and the like, reduces the manufacturing difficulty and the manufacturing cost, and has stronger universality. And the device has the advantages of quick response, stronger temperature control effect, quick and accurate temperature control and the like.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a mixing device according to an embodiment of the present utility model;

Fig. 2 is a cross-sectional view of a mixing apparatus provided by an embodiment of the present utility model;

FIG. 3 is an exploded view of a container body and a heat sink plate according to an embodiment of the present utility model;

fig. 4 is a schematic partial structure of a heat dissipation plate according to an embodiment of the utility model.

Icon: 11-a container body; 111-a mixing chamber; 12-cover plate; 13-a stand;

21-a semiconductor refrigeration member; 22-a heat dissipation plate; 23-a temperature sensor; 24-crashproof shell; 25-protecting sleeves;

31-a first drive motor; 32-a first transmission assembly; 33-stirring shaft; 34-stirring paddles; 35-a second drive motor; 36-a second transmission assembly.

Detailed Description

The technical solutions of the present utility model will be clearly and completely described in connection with the embodiments, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, an embodiment of the present utility model provides a mixing apparatus for mixing materials, the mixing apparatus comprising: a stirring assembly, a container body 11, a semiconductor refrigeration unit 21, and a controller; a mixing cavity 111 is formed in the container main body 11, and the stirring assembly is used for stirring materials in the mixing cavity 111; the semiconductor refrigerating element 21 is arranged on the side wall and/or the bottom wall of the container main body 11; the controller is electrically connected with the semiconductor refrigeration piece 21, and the controller is used for controlling the current direction of the semiconductor refrigeration piece 21, so that the semiconductor refrigeration piece 21 can cool or heat the materials in the mixing cavity 111.

The mixing apparatus provided in this embodiment includes a stirring member, a container body 11, a semiconductor refrigeration member 21, and a controller. The container body 11 has a bottom wall and a side wall, the side wall surrounds the bottom wall to form a container body 11 with an open end, a mixing cavity 111 is formed in the container body 11, and accordingly, the mixing cavity 111 is formed by surrounding the bottom wall and the side wall, and the mixing cavity 111 is also open at one end. The stirring assembly is used for stirring the materials in the mixing cavity 111 so as to improve the mixing efficiency. The semiconductor cooling element 21 has a sheet-like or plate-like structure, and is attached to the side wall and/or the bottom wall of the container body 11, that is, the semiconductor cooling element 21 may be attached to the side wall of the container body 11, the semiconductor cooling element 21 may be attached to the bottom wall of the container body 11, and the semiconductor cooling element 21 may be attached to the bottom wall and the side wall of the container body 11 at the same time, and the specific arrangement mode is described below. The controller is electrically connected with the semiconductor refrigeration piece 21, and the controller comprises a current control chip and is used for controlling the current direction of the semiconductor refrigeration piece 21 so that the semiconductor refrigeration piece 21 can refrigerate and cool materials in the mixing cavity 111 or heat materials in the mixing cavity 111.

In the present embodiment, the semiconductor refrigeration member 21 is based on the peltier effect, i.e. when direct current passes through a thermocouple formed by connecting two different semiconductor materials in series, besides irreversible joule heat, the junction at the two semiconductors will take on the phenomena of heat absorption and heat release respectively with the difference of the current direction, and this phenomenon is reversible.

Specifically, the semiconductor refrigeration element 21 has a cold surface and a hot surface, and when the semiconductor refrigeration element 21 is supplied with forward current, the hot surface heats and the cold surface cools; and when the semiconductor refrigerating element 21 is electrified with reverse current, the hot surface is refrigerated and the cold surface is heated. By providing a controller to control the direction of the current of the semiconductor cooling element 21, the cooling or heating of the semiconductor cooling element 21 can be determined, and the effect of controlling the temperature in the mixing chamber 111 can be achieved.

In use, when the temperature in the mixing chamber 111 is too high, the temperature of the mixing chamber 111 can be reduced by refrigerating the semiconductor refrigerating element 21, and when the temperature in the mixing chamber 111 is too low, the temperature of the mixing chamber 111 can be increased by heating the semiconductor refrigerating element 21.

According to the mixing equipment provided by the embodiment, the mixing efficiency can be improved by arranging the stirring assembly to stir the materials in the mixing cavity 111, the semiconductor refrigerating piece 21 is arranged on the bottom wall and/or the side wall of the container main body 11, and the semiconductor refrigerating piece 21 can be cooled or heated to the mixing cavity 111 by controlling the current direction of the semiconductor refrigerating piece 21 in cooperation with the controller. The semiconductor refrigeration piece 21 has the characteristics of simple structure, easy integration, quick response, simple control and the like. Compared with the prior art, the temperature of the mixing equipment is controlled by the semiconductor refrigerating piece 21, so that the mixing equipment has the advantages of simpler structure, smaller volume and the like, reduces the manufacturing difficulty and the manufacturing cost, and has stronger universality. And the device has the advantages of quick response, stronger temperature control effect, quick and accurate temperature control and the like.

The mixing device provided by the embodiment of the utility model, as shown in fig. 1 to 3, further comprises a heat dissipation plate 22; the heat radiation plate 22 covers the outer wall of the container body 11, and the semiconductor refrigeration material 21 is fixed between the outer wall of the container body 11 and the heat radiation plate 22.

In the present embodiment, it is preferable that the semiconductor refrigeration member 21 is provided only on the side wall of the container body 11, and the semiconductor refrigeration member 21 is also provided on the outer side wall of the container body 11, avoiding damage to the material moving when provided in the mixing chamber 111, and the like.

It should be noted that, the two sides of the side wall of the container body 11 are an inner side wall and an outer side wall, and the two sides of the bottom wall of the container body 11 are an inner bottom wall and an outer bottom wall, wherein the inner side wall and the inner bottom wall are directly contacted with the material, that is, the inner side wall and the inner bottom wall enclose the mixing chamber 111.

In this embodiment, the outer side wall of the container body 11 is covered with the heat dissipating plate 22, and the heat dissipating plate 22 may be fixed to the outer side wall of the container body 11 by bolts, or may be fixed to the outer side wall of the container body 11 by fastening, caulking, welding, or by providing a clip. The heat sink 22 is used to fix the semiconductor refrigeration material 21, and the semiconductor refrigeration material 21 can be fixed between the container body 11 and the heat sink 22 by providing the heat sink 22.

In this embodiment, a plurality of semiconductor refrigerating elements 21 are provided, each semiconductor refrigerating element 21 is electrically connected to a controller, and the controller can control the current direction of all semiconductor refrigerating elements 21 simultaneously or can control the current direction of a certain semiconductor refrigerating element 21 individually. It should be noted that, when the semiconductor refrigeration piece 21 is disposed, the cold surface and the hot surface need to be consistent, that is, either all the cold surfaces of the semiconductor refrigeration piece 21 face the outer side wall of the container main body 11, and the hot surfaces face the heat dissipation plate 22; or the hot surfaces of all the semiconductor refrigerating elements 21 face the outer side wall of the container body 11, and the cold surfaces face the heat radiating plate 22.

Further, the surface of the semiconductor refrigeration piece 21 is coated with heat-conducting silica gel; the semiconductor refrigerating piece 21 is adhered to the heat radiating plate 22 through heat conducting silica gel; and/or; the semiconductor refrigeration piece 21 is adhered to the outer side wall of the container body 11 through the heat conductive silicone.

In this embodiment, the surface of the semiconductor refrigeration piece 21 is coated with heat conductive silica gel, and the semiconductor refrigeration piece 21 is adhered to the heat dissipation plate 22 and/or the outer side wall of the container body 11 through the heat conductive silica gel.

In this embodiment, the semiconductor refrigeration piece 21 is bonded through the heat-conducting silica gel, so that the bonding is firm, the effect is good, and the heat-conducting silica gel has good heat conductivity, so that the cooling or heating effect of the semiconductor refrigeration piece 21 is not affected.

The surface of the semiconductor refrigeration piece 21 is a cold surface and a hot surface, and when the semiconductor refrigeration piece is assembled, heat-conducting silica gel can be coated on one surface only, and at the moment, the semiconductor refrigeration piece 21 can be adhered to the outer side wall of the container main body 11 or the heat dissipation plate 22; the semiconductor refrigerating element 21 may be coated with a heat conductive silicone on both sides thereof, and the semiconductor refrigerating element 21 may be bonded to the outer side wall of the container body 11 and the heat dissipating plate 22.

In this embodiment, in order to facilitate maintenance of the hybrid device, it is preferable that the heat conductive silica gel is coated on only one surface of the semiconductor refrigeration element 21, and the heat dissipation plate 22 is detachably mounted on the outer side wall of the main body by bolts.

In this embodiment, optionally, a groove is formed on a surface of the heat dissipation plate 22 facing the outer side wall of the container body 11, and heat-conducting silica gel is coated on a surface of the semiconductor refrigeration member 21 facing the heat dissipation plate 22, and the semiconductor refrigeration member 21 is adhered in the groove through the heat-conducting silica gel, so that a surface of the semiconductor refrigeration member 21 facing away from the heat dissipation plate 22 can be flush with the surface of the heat dissipation plate 22.

In the present embodiment, the semiconductor refrigeration material 21 may be directly inserted into the recess, and then the heat radiating plate 22 may be fixed to the outer wall of the container body 11.

As shown in fig. 3, in the mixing apparatus provided by the embodiment of the present utility model, the protecting jacket 25 is sleeved on the peripheral side of the semiconductor refrigeration unit 21.

In this embodiment, since the semiconductor cooling element 21 is made of ceramic material, a circle of protective sleeve 25 is sleeved around the semiconductor cooling element 21 to prevent the semiconductor cooling element 21 from being crushed and to protect the semiconductor cooling element 21.

In this embodiment, the protective cover 25 may be made of foam cotton, silica gel, rubber, or the like.

In the present embodiment, since the thickness of the semiconductor refrigeration material 21 increases after the cover 25 is fitted, the semiconductor refrigeration material 21 needs to be fixed to the outer side wall of the container body 11 by the heat radiation plate 22.

The mixing device provided by the embodiment of the utility model, as shown in fig. 1 and 4, further comprises a temperature sensor 23, wherein the temperature sensor 23 is electrically connected with the controller; the temperature sensor 23 is configured to monitor temperature information of the material in the mixing chamber 111, and is capable of feeding back the temperature information of the material in the mixing chamber 111 to the controller; the controller can control the current direction and the current value of the semiconductor refrigeration unit 21 according to the temperature information of the materials in the mixing chamber 111.

In this embodiment, the mixing apparatus further comprises a temperature sensor 23, the temperature sensor 23 being adapted to monitor temperature information of the material in the mixing chamber 111. The temperature sensor 23 is further electrically connected with a controller, temperature information of materials in the mixing cavity 111 monitored by the temperature sensor 23 can be transmitted into the controller through a wire, and the controller controls the current direction and the current value of the semiconductor refrigeration piece 21 according to the temperature information of the materials in the mixing cavity 111 fed back by the temperature sensor 23.

The semiconductor refrigerator 21 is cooled when the current flows in the forward direction, and the semiconductor refrigerator 21 is heated when the current flows in the reverse direction. For example, when the temperature sensor 23 detects that the temperature of the material in the mixing chamber 111 is higher than the preset temperature, the controller controls the semiconductor refrigeration member 21 to start refrigeration, and when the temperature sensor 23 detects that the temperature of the material in the mixing chamber 111 is lower than the preset temperature, the controller controls the semiconductor refrigeration member 21 to start heating.

For example, when the temperature sensor 23 detects that the temperature of the material in the mixing chamber 111 is still higher than the preset temperature during the cooling process of the semiconductor cooling element 21, the controller controls the current of the semiconductor cooling element 21 to increase so as to improve the cooling effect of the semiconductor cooling element 21. During the heating process of the semiconductor refrigeration piece 21, when the temperature sensor 23 detects that the temperature of the material in the mixing cavity 111 is still lower than the preset temperature, the controller controls the current of the semiconductor refrigeration piece 21 to decrease, so as to improve the heating effect of the semiconductor refrigeration piece 21.

For example, when the temperature sensor 23 detects that the temperature of the material in the mixing chamber 111 is lower than the preset temperature during the cooling process of the semiconductor cooling element 21, the controller changes the current direction of the semiconductor cooling element 21, so that the semiconductor cooling element 21 starts to heat, and the material in the mixing chamber 111 is heated. In the heating process of the semiconductor refrigeration piece 21, when the temperature sensor 23 detects that the temperature of the material in the mixing cavity 111 is higher than the preset temperature, the controller changes the current direction of the semiconductor refrigeration piece 21, so that the semiconductor refrigeration piece 21 starts to refrigerate, and the material in the mixing cavity 111 is cooled.

The mixing device provided in this embodiment, by setting the temperature sensor 23 to cooperate with the controller and the semiconductor refrigeration element 21, enables the controller to accurately control the current and the current direction of the semiconductor refrigeration element 21, and further enables the temperature to be controlled more accurately.

The mixing device provided by the embodiment of the utility model, as shown in fig. 1 and 2, further comprises a base 13 and a cover plate 12; the container main body 11 and the cover plate 12 are both arranged on the base 13, and the cover plate 12 is rotatably connected with the base 13; the container body 11 is provided with an open end, and the cover 12 is used for opening or closing the open end of the container body 11.

In this embodiment, the mixing device further comprises a housing 13 and a cover plate 12. Wherein, container main body 11 and apron 12 are all installed on frame 13 to apron 12 still rotates with frame 13 to be connected. As mentioned above, one end of the container body 11 is provided to be opened, and the cover plate 12 is used to open or close the open end of the container body 11.

For example, the cover 12 opens the open end of the container body 11 when the material is put into the mixing chamber 111 or the material is taken out from the mixing chamber 111, and the cover 12 closes the open end of the container body 11 when the mixing apparatus is used or not used.

In this embodiment, when in use, the cover plate 12 is rotated to separate or connect the cover plate 12 and the container main body 11, so as to open or close the open end of the mixing cavity 111, ensure the temperature in the mixing cavity 111, and simultaneously avoid external dust entering the mixing cavity 111, and avoid the material in the mixing cavity 111 from being spilled under the stirring of the stirring assembly when the mixing cavity 111 is in operation.

As shown in fig. 1, 2 and 4, the temperature sensor 23 is fixed on a surface of the cover 12 facing the mixing chamber 111.

In the present embodiment, the temperature sensor 23 is fixed on the cover 12, and is located on a surface of the cover 12 facing the mixing chamber 111. Through setting firmly temperature sensor 23 on apron 12, temperature sensor 23 can get into and leave mixing chamber 111 along with the rotation of apron 12, when throwing the material to mixing chamber 111, or when getting the material by mixing chamber 111 in, temperature sensor 23 is not in mixing chamber 111, can avoid throwing the material or getting the material in-process, and the material damages temperature sensor 23.

In this embodiment, one end of the temperature sensor 23 is a temperature measuring probe, the other end is provided with a screw structure, a threaded hole corresponding to the screw structure is provided on one surface of the cover plate 12 facing the mixing cavity 111, and the temperature sensor 23 is fixed on the cover plate 12 through the cooperation of the threaded hole and the screw structure.

In the present embodiment, the temperature sensor 23 may be fixed to the cover plate 12 by clamping or welding.

Alternatively, in this embodiment, grooves or holes may be provided on the inner wall of the mixing chamber 111 for fixing the temperature sensor 23 to the inner wall of the mixing chamber 111.

In the mixing apparatus provided in the embodiment of the present utility model, as shown in fig. 1 and fig. 3, the temperature sensor 23 is provided with a plurality of monitoring areas, and a plurality of monitoring areas are divided into the mixing chamber 111 along the depth direction of the mixing chamber 111, where the monitoring areas correspond to the temperature sensor 23, and the temperature sensor 23 is configured to monitor temperature information of materials in the corresponding monitoring areas.

In this embodiment, preferably, the temperature sensor 23 is provided with a plurality of, and when in use, the temperature of the materials at different positions can be monitored by providing a plurality of temperature sensors 23, so as to realize more accurate temperature control.

Specifically, in the present embodiment, the mixing chamber 111 is divided into a plurality of monitoring areas along the depth direction thereof. For example, the depth of the mixing chamber 111 is 60 cm, and the monitoring area is divided into three, namely, 0-20 cm is one monitoring area, 20-40 cm is one monitoring area, and 40-60 cm is one monitoring area. Wherein the zero point is the bottom wall of the mixing chamber 111.

In this embodiment, the number of the temperature sensors 23 is the same as the number of the monitoring areas, so that each monitoring area can be provided with one temperature sensor 23 for monitoring the temperature of the material in the monitoring area.

Optionally, in this embodiment, the temperature sensor 23 is connected to the cover 12, so that a plurality of temperature sensors 23 may be provided, and each temperature sensor 23 has a different length, so that each temperature sensor 23 can monitor the temperature of the material in the corresponding monitoring area.

Alternatively, a plurality of temperature sensors 23 may be connected in series, with the spacing between two adjacent temperature sensors 23 being set with reference to the size of the monitored area, so that each temperature sensor 23 can monitor the temperature of the material in the corresponding monitored area.

Further, in the present embodiment, the mixing apparatus further includes an impact shell 24; the temperature sensor 23 is arranged in the anti-collision shell 24, and a temperature measuring probe of the temperature sensor 23 extends out of the anti-collision shell 24.

In this embodiment, the anti-collision housing 24 has a tubular or rod-shaped structure, two ends of the anti-collision housing 24 are open, one end of the anti-collision housing 24 is welded to the cover plate 12, the inner edge of the anti-collision housing 24 is located at the edge of the threaded hole, and the other end of the anti-collision housing 24 is open. When in use, one end of the temperature sensor 23 provided with a thread structure penetrates through the anti-collision shell 24 to be connected with the threaded hole, and the temperature measuring probe at the other end extends out of the anti-collision shell 24 and is positioned in the mixing cavity 111.

In this embodiment, through setting up crashproof casing 24, can play certain guard action to temperature sensor 23, avoid leading to temperature sensor 23 to damage because of the stirring of material, influence controller accuse temperature effect.

In the present embodiment, it is preferable that not every temperature sensor 23 is provided with the impact shell 24, and only the temperature sensor 23 monitoring the temperature at a deep position may be provided with the impact shell 24.

For example, in this embodiment, two temperature sensors 23 are provided, and two temperature sensors 23 are connected to the cover 12, where one temperature sensor 23 is shorter, the temperature probe is close to the cover 12, and the other temperature sensor 23 is longer, and the temperature probe is close to the bottom wall (inner bottom wall of the container main body 11) of the mixing chamber 111, so as to save cost, avoid affecting normal stirring of the materials in the mixing chamber 111, and only the anti-collision housing 24 is arranged outside the longer temperature sensor 23. And the shorter temperature sensor 23 is less affected by material agitation, so that no anti-collision shell 24 is needed.

As shown in fig. 1 and fig. 2, the mixing device provided by the embodiment of the present utility model, the stirring assembly includes: a first drive motor 31, a first transmission assembly 32, a stirring shaft 33 and a stirring paddle 34; the stirring paddle 34 is disposed on the stirring shaft 33, and the first driving motor 31 is in transmission connection with the stirring shaft 33 through the first transmission assembly 32, and drives the stirring shaft 33 to rotate.

As shown in fig. 1 and fig. 2, the mixing device provided by the embodiment of the present utility model, the stirring assembly includes: a second drive motor 35 and a second transmission assembly 36; the second driving motor 35 is in transmission connection with the container main body 11 through the second transmission assembly 36, and drives the container main body 11 to rotate.

In this embodiment, the stirring assembly has two setting modes, and the mixing device may adopt one or both of them, and in order to improve the stirring effect of the stirring assembly, the latter is preferably adopted in this embodiment.

In one arrangement of the stirring assembly, the stirring assembly comprises a first drive motor 31, a first transmission assembly 32, a stirring shaft 33 and a stirring paddle 34. The stirring paddles 34 are provided in plurality, and all the stirring paddles 34 are provided on the stirring shaft 33 at intervals in the circumferential direction and the axial direction of the stirring shaft 33. The first driving motor 31 is in transmission connection with the stirring shaft 33 through the first transmission assembly 32, and drives the stirring shaft 33 to rotate.

In use, the stirring shaft 33 extends into the mixing chamber 111, the first driving motor 31 drives the stirring shaft 33 to rotate, and the stirring paddles 34 on the stirring shaft 33 stir the materials in the mixing chamber 111.

In this embodiment, the first transmission assembly 32 may alternatively be a gear set, a sprocket and chain, or a belt and pulley, etc.

In this embodiment, the first driving motor 31 and the first transmission assembly 32 are fixedly disposed on a surface of the cover plate 12 facing away from the mixing cavity 111, the stirring shaft 33 penetrates through the cover plate 12, and when the cover plate 12 closes to close the open end of the mixing cavity 111, the stirring shaft 33 extends into the mixing cavity 111.

In another arrangement of the stirring assembly, the stirring assembly comprises a second drive motor 35 and a second transmission assembly 36. The second driving motor 35 is directly connected with the container body 11 in a transmission way through the second transmission assembly 36 and drives the container body 11 to rotate so as to stir the materials in the mixing cavity 111.

In this embodiment, alternatively, the second transmission assembly 36 may be a transmission shaft, where one end of the transmission shaft is fixedly connected to the center of the outer bottom wall of the container body 11, and the other end of the transmission shaft is fixedly connected to the output shaft of the second driving motor 35, and the second driving motor 35 is mounted on the stand 13. The second driving motor 35 drives the transmission shaft to rotate, thereby driving the container body 11 to rotate.

In this embodiment, the second transmission assembly 36 may also be a gear shaft and a gear set that mates with the gear shaft.

In the present embodiment, it is preferable that the rotation direction of the stirring paddle 34 is opposite to the rotation direction of the container body 11.

The embodiment of the utility model provides mixing equipment. The container main body 11 is mounted on the base 13, and the cover plate 12 is rotatably mounted on the base 13 through a rotation shaft. The second driving motor 35 is installed in the one side of apron 12 facing away from mixing chamber 111, is equipped with the driving pulley on the output shaft of second driving motor 35, and (mixing) shaft 33 one end sets up a plurality of stirring rake 34, and the other end passes apron 12 to be provided with driven pulleys, set up the drive belt between driving pulley and the driven pulleys. The second driving motor 35 is mounted on the stand 13 and is located below the container main body 11, one end of the transmission shaft is fixedly connected with the center of the outer bottom wall of the container main body 11, and the other end of the transmission shaft is fixedly connected with an output shaft of the second driving motor 35. Two threaded holes are formed in one face, facing the mixing cavity 111, of the cover plate 12, each threaded hole is internally provided with one temperature sensor 23, and one temperature sensor 23 is longer, and the other temperature sensor 23 is shorter; accordingly, the mixing chamber 111 is divided into two monitoring areas corresponding to the temperature sensors 23, and the temperature sensors 23 are used for monitoring the temperature of the materials in the corresponding monitoring areas. The heat conductive silica gel is coated on the hot surface of the semiconductor refrigerating piece (semiconductor refrigerating piece 21), and is adhered to the heat radiating plate 22, the heat radiating plate 22 is fixed on the outer side wall of the container main body 11 through bolts, and the cold surface of the semiconductor refrigerating piece is adhered to the outer side wall of the container main body 11.

When the mixing device is used, the mixing cavity 111 is opened, and materials to be mixed are put into the mixing cavity 111; material delivery completion rotating the cover plate 12 connects the cover plate 12 to the container body 11 to close the open end of the mixing chamber 111. The first drive motor 31 and the second drive motor 35 are started to start stirring the materials to be mixed in the mixing chamber 111, and at the same time, the two temperature sensors 23 monitor the temperature of the materials to be mixed in the mixing chamber 111. When the temperature sensor 23 detects that the temperature of the materials in the mixing cavity 111 is higher than the preset temperature, the current control chip (controller) controls the semiconductor refrigerating sheet to be electrified, the cold surface absorbs heat generated in the mixing cavity 111, and the hot surface releases heat; when the temperature sensor 23 detects that the temperature of the material in the mixing cavity 111 is lower than the preset temperature, the current control chip controls the semiconductor refrigerating sheet to be electrified, and the hot surface releases heat to the inside of the mixing cavity 111 through the heat conduction of the side wall of the container main body 11.

The current control chip can accurately control the current magnitude and direction of the semiconductor refrigerating sheet, so that more accurate temperature control is realized, and the mixing effect and efficiency are improved. Compared with the prior art, the semiconductor refrigerating plate has the advantages that the semiconductor refrigerating plate can be used for refrigerating and heating, the refrigerating and heating can be switched rapidly, and the efficiency is improved; meanwhile, the semiconductor refrigerating sheet does not need a heat conducting medium, has no pollution and noise, saves space, has strong reliability and is small in limitation; the temperature can be accurately controlled and regulated within the range of 0.1 ℃; constant temperature control of the mixing chamber 111 can be achieved, avoiding temperature variations affecting the mixing effect.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the communication may be direct or indirect through an intermediate medium, or may be internal to two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

The foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the utility model are intended to be included within the scope of the utility model.

Claims (10)

1. A mixing apparatus, comprising: a stirring assembly, a container body (11), a semiconductor refrigeration piece (21) and a controller;

a mixing cavity (111) is formed in the container main body (11), and the stirring assembly is used for stirring materials in the mixing cavity (111);

The semiconductor refrigerating piece (21) is arranged on the side wall and/or the bottom wall of the container main body (11);

The controller is electrically connected with the semiconductor refrigerating piece (21), and the controller is used for controlling the current direction of the semiconductor refrigerating piece (21) so that the semiconductor refrigerating piece (21) can cool or heat materials in the mixing cavity (111).

2. The mixing device according to claim 1, further comprising a heat dissipating plate (22);

the heat radiation plate (22) covers the outer side wall of the container body (11), and the semiconductor refrigerating element (21) is fixed between the outer wall of the container body (11) and the heat radiation plate (22).

3. Mixing device according to claim 2, wherein the surface of the semiconductor cooling element (21) is coated with a thermally conductive silicone;

The semiconductor refrigerating piece (21) is adhered to the radiating plate (22) through heat-conducting silica gel;

And/or;

The semiconductor refrigerating piece (21) is adhered to the outer side wall of the container main body (11) through the heat-conducting silica gel.

4. Mixing device according to claim 2, wherein the semiconductor cooling element (21) is peripherally fitted with a protective sleeve (25).

5. Mixing device according to any one of claims 1-4, further comprising a housing (13) and a cover plate (12);

the container main body (11) and the cover plate (12) are arranged on the base (13), and the cover plate (12) is rotationally connected with the base (13);

The container body (11) is provided with an open end, and the cover plate (12) is used for opening or closing the open end of the container body (11).

6. The mixing device according to claim 5, further comprising a temperature sensor (23), the temperature sensor (23) being electrically connected to the controller, the temperature sensor (23) being fixed to a face of the cover plate (12) facing the mixing chamber (111);

The temperature sensor (23) is used for monitoring temperature information of materials in the mixing cavity (111) and can feed back the temperature information of the materials in the mixing cavity (111) to the controller;

The controller can control the current direction and the current value of the semiconductor refrigerating piece (21) according to the temperature information of the materials in the mixing cavity (111).

7. Mixing device according to claim 6, wherein the temperature sensor (23) is provided in plurality;

along the depth direction of the mixing cavity (111), a plurality of monitoring areas are divided in the mixing cavity (111), the monitoring areas correspond to the temperature sensors (23), and the temperature sensors (23) are used for monitoring temperature information of materials in the corresponding monitoring areas.

8. The mixing device of claim 6, further comprising an anti-collision housing (24);

The temperature sensor (23) is arranged in the anti-collision shell (24), and a temperature measuring probe of the temperature sensor (23) extends out of the anti-collision shell (24).

9. The mixing apparatus of claim 1, wherein the stirring assembly comprises: the stirring device comprises a first driving motor (31), a first transmission assembly (32), a stirring shaft (33) and stirring paddles (34);

The stirring paddle (34) is arranged on the stirring shaft (33), and the first driving motor (31) is in transmission connection with the stirring shaft (33) through the first transmission assembly (32) and drives the stirring shaft (33) to rotate.

10. The mixing apparatus of claim 1, wherein the stirring assembly comprises: a second drive motor (35) and a second transmission assembly (36);

The second driving motor (35) is in transmission connection with the container main body (11) through the second transmission assembly (36) and drives the container main body (11) to rotate.