CN220927030U - Heat exchange device and single crystal furnace - Google Patents

Abstract

The application discloses a heat exchange device and a single crystal furnace, and belongs to the technical field of single crystal silicon production. Comprising the following steps: a body enclosing to form a cylindrical cavity; the cooling component is arranged in the cylindrical cavity and connected with the inner wall of the body, and the cooling component is arranged at the lower port of the body; the cooling flow passage is arranged in the cooling component and comprises at least one bending part so as to increase the flowing length of the cooling medium in the cooling component. The cooling flow channel with the bent portion can extend the length of the cooling flow channel in the cooling module, that is, the flow length of the cooling medium. The longer the flow length of the cooling medium in the cooling flow passage, the better the cooling effect of the cooling component, namely the better the effect of the heat exchange device on the temperature reduction above the crystal growth liquid level, and the embodiment of the application has the beneficial effects of increasing the temperature gradient between the crystal and the melt and improving the crystallization rate.

Description

Heat exchange device and single crystal furnace

Technical Field

The application belongs to the technical field of monocrystalline silicon production, and particularly relates to a heat exchange device and a monocrystalline furnace.

Background

The single crystal furnace is equipment for melting polycrystalline materials such as polysilicon and the like in an inert gas environment by using a graphite heater and growing single crystals by using a Czochralski method, and currently, the Czochralski silicon single crystals are developing towards the directions of high purity, high integrity, high uniformity and large diameter.

In the prior art, in the process of manufacturing the silicon single crystal, the yield is generally improved by increasing the feeding amount, so that the aim of reducing the production cost is fulfilled. In order to further reduce the cost, it is also necessary to increase the growth rate of the silicon single crystal. The crystallization rate, in turn, determines the growth rate, and the longitudinal temperature gradients of the crystal and melt are important factors affecting the crystallization rate.

However, the heat exchange effect of the heat exchange device of the single crystal furnace on the crystallization interface of the single crystal rod in the prior art is poor, the longitudinal temperature gradient of the crystal and the melt is small, and the crystallization rate is affected.

Disclosure of utility model

The embodiment of the application aims to provide a heat exchange device and a single crystal furnace, which can solve the problem that the heat exchange effect of the heat exchange device and the single crystal furnace on a crystallization interface of a single crystal rod in the prior art is poor.

In order to solve the technical problems, the application is realized as follows:

In a first aspect, an embodiment of the present application provides a heat exchange device disposed above a crystal growth liquid level in a single crystal furnace, including: the body is enclosed to form a cylindrical cavity; the cooling component is arranged in the cylindrical cavity and connected with the inner wall of the body, and the cooling component is arranged at the lower port of the body; the cooling flow passage is arranged in the cooling assembly and comprises at least one bending part so as to increase the flowing length of the cooling medium in the cooling assembly.

The heat exchange device is arranged in the single crystal furnace and above the crystal growth liquid level and is used for creating a relatively low-temperature environment above the crystal growth liquid level. In practical application, in order to increase the longitudinal temperature gradient of the crystal and the melt so as to promote the melt to increase the crystallization rate, the cooling capacity of a cooling component arranged at one end of the heat exchange device, which is close to the crystal growth liquid level, has a larger influence. In the embodiment of the application, the body encloses a cylindrical cavity, and the cylindrical cavity can be a regular cylinder or a cone bucket with a large upper part and a small lower part, which is not limited in this embodiment. The cooling assembly is disposed in the cavity and connected to the inner wall of the body, and for further increasing the longitudinal temperature gradient of the crystal and melt, the cold zone assembly for reducing the temperature is disposed at the lower port of the body, i.e., at the end near the crystal growth liquid level. Further, a cooling flow passage is arranged in the cooling assembly, and the cooling flow passage comprises at least one bending part. It can be appreciated that the arrangement of the bending portion can enable the cooling flow passage to be arranged in a bending manner in the cooling assembly, and compared with a cooling flow passage without the bending portion, the cooling flow passage with the bending portion can prolong the length of the cooling flow passage in the cooling assembly. In addition, set up cooling module at the body inner wall, cooling module is closer to the crystal bar surface more, can carry out more heat exchange, can effectively reduce the temperature on crystal bar surface, improves crystal bar axial temperature gradient. In practical application, when the cooling medium flows in the cooling flow passage, the temperature of the heat exchange device above the crystal growth liquid level and the surface temperature of the crystal bar are reduced, and the flow length of the cooling flow passage is prolonged, namely the flow length of the cooling medium is increased. It will be appreciated that the longer the flow length of the cooling medium in the cooling flow channel, the better the cooling effect of the cooling assembly, i.e. the better the effect of the heat exchange device on the temperature reduction above the crystal growth liquid level, has the beneficial effect of increasing the temperature gradient between the crystal and the melt and increasing the crystallization rate.

It should be noted that the liquid cooling assembly may be integrally disposed on the inner wall of the body, or may be a plurality of split-type liquid cooling assemblies disposed on the inner wall of the body, which is not limited in this embodiment.

The cooling medium may be a fluid, specifically, may be a liquid or a gas, and the present embodiment is not limited in any way.

In a second aspect, an embodiment of the present application provides a single crystal furnace, including a heat exchange device as described above.

In the embodiment of the application, the single crystal furnace with the heat exchange device is provided with the cooling flow passage with the bending part, so that it can be understood that the cooling flow passage with a plurality of sub flow passages is provided, the cooling effect of the cooling plate can be improved, the cooling effect of the cooling component is further improved, and the better the cooling effect of the cooling component is, the better the effect of the heat exchange device in the single crystal furnace on temperature reduction above the crystal growth liquid level is, the temperature gradient between the crystal and the melt is increased, and the crystallization rate is improved.

Drawings

FIG. 1 is a schematic view of a heat exchange device according to an embodiment of the present application;

FIG. 2 is a schematic view of a cooling plate according to an embodiment of the present application;

Fig. 3 is a schematic structural view of another heat exchange device according to an embodiment of the present application.

Reference numerals illustrate:

10. A body; 11. a body flow passage; 20. a cooling assembly; 21. a cooling plate; 22. a first sub-cooling assembly; 23. a second sub-cooling assembly; 30. a cooling flow passage; 31. a bending part; 32. a sub-runner; 40. a rib.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The heat exchange device and the single crystal furnace provided by the embodiment of the application are described in detail through specific embodiments and application scenes thereof by combining the accompanying drawings.

Referring to fig. 1 to 3, an embodiment of the present application provides a heat exchange device disposed above a crystal growth liquid level in a single crystal furnace, including: the body 10, the body 10 encloses and forms the tubular cavity; the cooling assembly 20 is arranged in the cylindrical cavity and connected with the inner wall of the body 10, and the cooling assembly 20 is arranged at the lower port of the body 10; the cooling flow channel 30, the cooling flow channel 30 is disposed in the cooling assembly 20, and the cooling flow channel 30 includes at least one bending portion 31 to increase the flow length of the cooling medium in the cooling assembly 20.

The heat exchange device is arranged in the single crystal furnace and above the crystal growth liquid level and is used for creating a relatively low-temperature environment above the crystal growth liquid level. Specifically, in practical applications, in order to increase the longitudinal temperature gradient of the crystal and the melt to promote the increase of the crystallization rate of the melt, the cooling capacity of the cooling module 20 disposed at the end of the heat exchange device near the crystal growth liquid surface has a large influence. In the embodiment of the present application, the body 10 encloses a cylindrical cavity, which may be a regular cylinder, or a cone with a large top and a small bottom, which is not limited in this embodiment. The cooling module 20 is disposed in the cavity and connected to the inner wall of the body 10, and in order to further increase the longitudinal temperature gradient of the crystal and the melt, the cooling module 20 for reducing the temperature is disposed at the lower port of the body 10, i.e., at the end near the crystal growth liquid level. Further, a cooling flow channel 30 is disposed in the cooling assembly 20, and the cooling flow channel 30 includes at least one bending portion 31. It is understood that the bending portion 31 may be disposed such that the cooling flow channels 30 are arranged in a bending manner in the cooling module 20, and the cooling flow channels 30 having the bending portion 31 may extend the length of the cooling flow channels 30 in the cooling module 20 compared to the cooling flow channels 30 without the bending portion 31. In addition, set up cooling module 20 at body 10 inner wall, cooling module 20 is closer to the crystal bar surface, can carry out more heat exchange, can effectively reduce the temperature on crystal bar surface, improves crystal bar axial temperature gradient. In practical applications, when the cooling medium flows in the cooling flow channel 30, the temperature of the heat exchange device above the crystal growth liquid level and the surface temperature of the crystal rod are reduced, and the flowing length of the cooling flow channel 30 is prolonged, namely, the flowing length of the cooling medium is increased. It will be appreciated that the longer the length of flow of cooling medium in the cooling flow path 30, the better the cooling effect of the cooling module 20, i.e. the better the effect of the heat exchange means on the temperature decrease above the crystal growth liquid level, has the beneficial effect of increasing the temperature gradient between the crystal and the melt and increasing the crystallization rate.

It should be noted that the liquid cooling assembly may be integrally disposed on the inner wall of the main body 10, or may be a plurality of separate components disposed on the inner wall of the main body 10, which is not limited in this embodiment.

The cooling medium may be a fluid, specifically, may be a liquid or a gas, and the present embodiment is not limited in any way.

Alternatively, in the embodiment of the present application, the cooling assembly 20 includes a plurality of cooling plates 21, the plurality of cooling plates 21 are disposed around the inner wall of the body 10, and the adjacent two cooling plates 21 are uniformly spaced apart, and the cooling plates 21 include a first end and a second end that are disposed opposite to each other, the first end being close to the lower port of the body 10, and the second end being far from the lower port of the body 10.

In the embodiment of the present application, the plurality of cooling plates 21 are circumferentially arranged along the inner wall of the body 10 with uniform intervals between two adjacent cooling plates 21, and specifically, the number of cooling plates 21 may be set according to the size of the body 10, which is not limited in any way. The cooling plate 21 includes a first end and a second end disposed opposite each other, the first end being disposed at the lower port, i.e., the end near the crystal growth liquid surface, and the second end being remote from the lower port, it being understood that the cooling plate 21 extends from the lower port in a direction away from the lower port. The provision of the plurality of cooling plates 21 serves to increase the contact area of the cooling module 20 with the temperature above the crystal growth liquid surface, and increases the heat exchange capacity by increasing the surface area of the inner surface of the heat exchange device, which has the beneficial effect of increasing the temperature gradient between the crystal and the melt and increasing the crystallization rate.

It should be noted that the width and length of the cooling plates 21 and the interval between any two cooling plates 21 are all related to the size of the body 10, and the interval between any two cooling plates 21 is set to be about the width of a common cooling plate 21, so that the cooling effect of the heat exchanger can be further improved by using the structure of the cooling plate 21.

Optionally, in the embodiment of the present application, the cooling plate 21 includes a first plate body and a second plate body, where the first plate body and/or the second plate body are provided with grooves, and the first plate body and the second plate body are hermetically connected such that the grooves form cooling channels 30 for the cooling medium to flow.

In the embodiment of the present application, the cooling flow channel 30 may be formed by enclosing the first plate body and the second plate body. Wherein, the first plate body and the second plate body are all provided with grooves which are matched with each other, and under the condition that the first plate body and the second plate body are connected in a sealing way, the two grooves are matched with each other to form a cooling flow channel 30 for cooling medium to flow. Or the first plate body is provided with a groove, and under the condition that the first plate body is in sealing connection with the second plate body, the groove arranged on the first plate body and the second plate body are mutually matched to form a cooling flow channel 30 for cooling medium to flow. Or the second plate body is provided with a groove, and under the condition that the first plate body and the second plate body are connected in a sealing way, the groove arranged on the second plate body and the first plate body are matched with each other to form a cooling flow channel 30 for cooling medium to flow. In the embodiment of the application, the cooling plate 21 provided with the cooling flow channels 30 provides a flow passage for a cooling medium in the cooling plate 21, so that the cooling effect of the cooling plate 21 is improved, the temperature gradient between the crystal and the melt is increased, and the crystallization rate is improved.

Alternatively, in an embodiment of the present application, the cooling plate 21 includes cooling pipes embedded in the cooling plate 21 to provide cooling flow passages 30 for the cooling medium.

In an embodiment of the application, the cooling conduit is arranged to provide a cooling flow passage 30 for a cooling medium to flow through. Wherein, cooling duct and cooling plate 21 are the individual of mutual independence, inlay cooling duct in locating cooling plate 21, when cooling medium flows through cooling runner 30, namely has flowed through cooling plate 21 for cooling medium provides the passageway of flowing through in the cooling plate 21, has the beneficial effect that improves cooling plate 21 cooling effect, increases the temperature gradient between crystal and the fuse-element, improves crystallization rate.

It should be noted that the cooling pipe may be made of metal, or may be made of other materials with better heat exchange properties, which is not limited in this embodiment.

Alternatively, in the embodiment of the present application, the cooling flow channel 30 includes a plurality of sub flow channels 32 that are arranged at intervals along the first direction and are communicated, the plurality of sub flow channels 32 extend along the second direction, and any two sub flow channels 32 are communicated through the bending portion 31; the first direction is a direction from the first end to the second end, and the second direction is a direction perpendicular to the first direction.

In the embodiment of the present application, the cooling flow channel 30 includes a plurality of sub-flow channels 32, and the plurality of sub-flow channels 32 are arranged at intervals along the first direction, and meanwhile, the plurality of sub-flow channels 32 extend from the first end to the second end, so that the sub-flow channels 32 are fully distributed in the cooling plate 21, so as to increase the heat exchange area of the sub-flow channels 32, and further improve the heat exchange efficiency. The plurality of sub-flow passages 32 may be sequentially connected to each other or may be arranged in parallel, and the present embodiment is not limited to this. In addition, the plurality of sub-flow passages 32 are all communicated with each other through the bent portions 31 to achieve the flow of the cooling medium between the plurality of sub-flow passages 32. The embodiment of the present application has the advantageous effect of improving the cooling effect of the cooling plate 21.

It should be noted that the cross section of the sub-flow channel 32 along the second direction may be circular, square, oval or polygonal. The cross sections of the plurality of sub-flow passages 32 may be the same or different, and the present embodiment is not limited in any way, and may be specific as the case may be.

It should be noted that, the sub-flow channel 32 may be a linear type or a curved type with a certain degree of curvature, which is not limited in this embodiment. As for the arrangement of the sub-flow passages 32 on the cooling plate 21, they may be arranged parallel to the first direction, they may be arranged perpendicular to the first direction, or they may be arranged neither parallel to the first direction nor perpendicular to the first direction, which is not limited in any way, and may be determined according to circumstances.

Alternatively, in the embodiment of the present application, the cooling flow channel 30 includes a plurality of sub flow channels 32 that are arranged at intervals along the second direction and are communicated, the plurality of sub flow channels 32 extend along the first direction, and any two sub flow channels 32 are communicated through the bending portion 31; the first direction is a direction from the first end to the second end, and the second direction is a direction perpendicular to the first direction.

In the embodiment of the application, the cooling flow channel 30 includes a plurality of sub flow channels 32, and the plurality of sub flow channels 32 are arranged from the first end to the second end, and meanwhile, the plurality of sub flow channels 32 extend along the second direction, so that the sub flow channels 32 are distributed in the cooling plate 21, thereby increasing the heat exchange area of the sub flow channels 32 and further improving the heat exchange efficiency. The plurality of sub-flow passages 32 may be sequentially connected to each other or may be arranged in parallel, and the present embodiment is not limited to this. In addition, the plurality of sub-flow passages 32 are all communicated with each other through the bent portions 31 to achieve the flow of the cooling medium between the plurality of sub-flow passages 32. The embodiment of the present application has the advantageous effect of improving the cooling effect of the cooling plate 21.

It should be noted that the cross section of the sub-flow channel 32 along the first direction may be circular, square, oval or polygonal. The cross sections of the plurality of sub-flow passages 32 may be the same or different, and the present embodiment is not limited in any way, and may be specific as the case may be.

It should be noted that, the sub-flow channel 32 may be a linear type or a curved type with a certain degree of curvature, which is not limited in this embodiment. As for the arrangement of the sub-flow passages 32 on the cooling plate 21, they may be arranged parallel to the second direction, they may be arranged perpendicular to the second direction, or they may be arranged neither parallel to the second direction nor perpendicular to the second direction, which is not limited in this embodiment, and may be determined according to circumstances.

Optionally, in the embodiment of the present application, the cooling flow channel 30 includes a plurality of parallel sub-flow channels 32, and any one of the sub-flow channels 32 is a zigzag flow channel, and any one of the sub-flow channels 32 has a bending portion 31 to form the zigzag flow channel.

In the embodiment of the application, the cooling flow channel 30 is provided with a plurality of sub flow channels 32, the plurality of sub flow channels 32 are arranged in parallel, each sub flow channel 32 is configured as a back-shaped flow channel, so as to increase the cooling area of the sub flow channel 32, ensure that the contact area between the cooling flow channel 30 and the temperature above the crystal growth liquid level is large enough, ensure that the heat exchange area between the cooling flow channel 30 and the crystal rod is large enough, enable the cooling plate 21 to sufficiently cool the temperature above the crystal growth liquid level, further improve the cooling performance of the cooling assembly 20, and have the beneficial effects of improving the cooling effect of the cooling plate 21, increasing the temperature gradient between the crystal and the melt and improving the crystallization rate.

Optionally, in an embodiment of the present application, the body 10 includes: the body runner is arranged in the body 10, and the body runner and the cooling runner 30 are mutually independent.

In the embodiment of the present application, the body 10 is further provided with a body flow passage, which is provided to provide a flow passage for the cooling medium in the body 10. The arrangement of the body flow channel is used for utilizing the inner space of the body 10, further improving the heat exchange capacity of the heat exchange device, and has the beneficial effects of improving the cooling effect of the cooling plate 21, increasing the temperature gradient between the crystal and the melt and improving the crystallization rate.

It should be noted that the body flow channel may be implemented by grooving in the body 10, or by embedding a pipe in the body 10, which is not limited in this embodiment according to the specific situation.

It should be noted that, the main body flow channel and the cooling flow channel 30 are independent from each other, after the cooling medium is introduced from the inflow port of the heat exchange device, the cooling medium is divided into two paths and introduced into the main body flow channel and the cooling flow channel 30 respectively, and the cooling medium flows through the main body flow channel and the cooling flow channel 30 respectively to improve the heat exchange capability and then flows out of the heat exchange device from the outflow port.

Or according to actual use condition, the flow channel of the body 10 and the cooling flow channel 30 can be mutually communicated, and the cooling medium is communicated with the cooling flow channel 30 after flowing through the flow channel of the body 10 after flowing in from the inflow port of the heat exchange device.

Alternatively, in an embodiment of the present application, the cooling assembly 20 includes a first sub-cooling assembly 22 and a second sub-cooling assembly 23 that are independent of each other; the first sub-cooling assembly 22 is disposed at the lower port of the body 10, and the first sub-cooling assembly 22 includes a plurality of cooling plates 21; the second sub-cooling assembly 23 is disposed at an end of the first sub-cooling assembly 22 remote from the port of the body 10, and the second sub-cooling assembly 23 includes a plurality of cooling plates 21; wherein the first sub-cooling assembly 22 and the second sub-cooling assembly 23 are independent of each other.

In the embodiment of the present application, the upper and lower cooling modules 20 are arranged in the first direction by the arrangement of the first sub-cooling module 22 and the second sub-cooling module 23. The first sub-cooling assembly 22 includes a plurality of cooling plates 21, and the plurality of cooling plates 21 are disposed around the inner wall of the body 10 and connected to the inner wall of the body 10. The second sub-cooling assembly 23 also includes a plurality of cooling plates 21, and the plurality of cooling plates 21 are disposed around the inner wall of the body 10 and connected to the inner wall of the body 10. The first sub-cooling assembly 22 and the second sub-cooling assembly 23 are independent of each other, and it can be appreciated that the independent arrangement can increase the cooling effect of different cold areas of the heat exchange device.

When the body 10 encloses a cavity having a cone shape, the body 10 is divided into a first sub-body and a second sub-body having a trapezoid and a rectangle cross section along the first direction. The first sub-cooling assembly 22 is disposed inside the first sub-body, and the second sub-cooling assembly 23 is disposed inside the second sub-body. Because the joint of the first sub-body and the second sub-body is provided with the joint, the first sub-cooling assembly 22 and the second sub-cooling assembly 23 which are mutually independent are respectively arranged at the two sides of the joint, and the beneficial effect of reducing the installation difficulty of the cooling assembly 20 is achieved.

It should be noted that, as shown in fig. 3, a rib 40 may be further disposed at an end of the heat exchange device away from the crystal growth liquid surface, and the rib 40 may be a solid structure, so as to increase the heat exchange area of the heat exchange device. The rib 40 may also be provided with an intra-rib cooling flow passage, and the structure of the intra-rib cooling flow passage may be determined according to practical situations, and the embodiment of the present application is not limited to any specific structure.

Optionally, in an embodiment of the present application, there is further provided a single crystal furnace, including a heat exchange device as described above.

In the embodiment of the present application, the single crystal furnace having the heat exchange device as described above has the cooling flow channel 30 having the bending portion 31, and it can be understood that the cooling flow channel 30 having the plurality of sub flow channels 32 is provided, so that the cooling effect of the cooling plate 21 can be increased, and further, the cooling effect of the cooling assembly 20 is improved, and the better the cooling effect of the cooling assembly 20 is, that is, the better the effect of the heat exchange device in the single crystal furnace on the temperature reduction above the crystal growth liquid level is, the temperature gradient between the crystal and the melt is increased, and the crystallization rate is improved.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

The embodiments of the present application have been described above with reference to the accompanying drawings, but the present application is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present application and the scope of the claims, which are to be protected by the present application.

Claims (10)

1. The utility model provides a heat transfer device sets up in single crystal growing furnace, its characterized in that includes:

The device comprises a body (10), wherein the body (10) is enclosed to form a cylindrical cavity;

The cooling assembly (20) is arranged in the cylindrical cavity and connected with the inner wall of the body (10), and the cooling assembly (20) is arranged at the lower port of the body (10);

And the cooling flow channel (30) is arranged in the cooling assembly (20), and the cooling flow channel (30) comprises at least one bending part (31) so as to increase the flowing length of the cooling medium in the cooling assembly (20).

2. The heat exchange device of claim 1, wherein the cooling assembly (20) comprises a plurality of cooling plates (21), the plurality of cooling plates (21) being circumferentially disposed along the inner wall of the body (10), the cooling plates (21) being evenly spaced between adjacent ones of the cooling plates (21), the cooling plates (21) comprising oppositely disposed first and second ends, the first end being proximate the lower port of the body (10) and the second end being distal from the lower port of the body (10).

3. Heat exchange device according to claim 2, wherein the cooling plate (21) comprises a first plate body and a second plate body, the first plate body and/or the second plate body being provided with grooves, the first plate body and the second plate body being sealingly connected such that the grooves form the cooling channels (30) for the flow of cooling medium.

4. Heat exchange device according to claim 2, wherein the cooling plate (21) comprises cooling ducts embedded in the cooling plate (21) providing the cooling flow channels (30) for a cooling medium.

5. The heat exchange device according to any one of claims 3 or 4, wherein the cooling flow passage (30) includes a plurality of sub flow passages (32) arranged at intervals along a first direction and communicated, the plurality of sub flow passages (32) each extend along a second direction, and any two sub flow passages (32) are communicated with each other through the bending portion (31);

Wherein the first direction is a direction from the first end to the second end, and the second direction is a direction perpendicular to the first direction.

6. The heat exchange device according to any one of claims 3 or 4, wherein the cooling flow passage (30) includes a plurality of sub flow passages (32) arranged at intervals along the second direction and communicated, the plurality of sub flow passages (32) each extend along the first direction, and any two sub flow passages (32) are communicated with each other through the bending portion (31);

Wherein the first direction is a direction from the first end to the second end, and the second direction is a direction perpendicular to the first direction.

7. The heat exchange device according to any one of claims 3 or 4, wherein the cooling flow passage (30) comprises a plurality of parallel sub flow passages (32), any one of the sub flow passages (32) is a back flow passage, and any one of the sub flow passages (32) has a bending portion (31) to form the back flow passage.

8. Heat exchange device according to claim 1, wherein the body (10) comprises:

The body runner is arranged in the body (10), and the body runner and the cooling runner (30) are mutually independent.

9. Heat exchange device according to claim 2, wherein the cooling assembly (20) comprises a first sub-cooling assembly (22) and a second sub-cooling assembly (23) independent from each other;

-said first sub-cooling assembly (22) being close to a lower port of said body (10), said first sub-cooling assembly (22) comprising a plurality of said cooling plates (21);

the second sub-cooling assembly (23) is arranged at one end of the first sub-cooling assembly (22) far away from the lower port of the body (10), and the second sub-cooling assembly (23) comprises a plurality of cooling plates (21);

wherein the first sub-cooling assembly (22) and the second sub-cooling assembly (23) are independent of each other.

10. A single crystal furnace comprising a heat exchange device according to any one of claims 1 to 9.