CN220914565U - Electronic device - Google Patents

Abstract

The application provides an electronic device, which comprises an antenna and a dielectric layer, wherein the antenna is provided with a first side surface and a second side surface, and the dielectric layer bears the antenna, wherein the distance between the first side surface and the second side surface is gradually reduced along the direction away from the dielectric layer. The application provides an electronic device, which is beneficial to reducing the thickness of the whole device and shortening the signal transmission paths of the antenna and other parts in the device by directly forming the antenna on a dielectric layer of the device, thereby reducing attenuation loss of signals in the transmission process; in addition, the distance between the first side surface and the second side surface of the antenna gradually decreases along the direction away from the dielectric layer, namely, the antenna is of a three-dimensional structure protruding out of the surface of the dielectric layer and gradually shrinking in width, so that the range and angle of wireless signal transmission or reception can be maximized, and the performance of the antenna is effectively improved.

Description

Electronic device

Technical Field

The application relates to the technical field of electronics, in particular to an electronic device.

Background

In the age of technology increasing progress, portable electronic products have been an integral part of people's life. For example, a large number of consumers select to use the wireless Bluetooth headset, so as to avoid the trouble of wires and be convenient to use.

Referring to fig. 1, a longitudinal cross-section of an electronic structure in a conventional wireless bluetooth headset is shown, in which a BT antenna 50 is generally manufactured by a Laser Direct Structuring (LDS) process, and the LDS process needs to use a special material as a substrate to perform laser engraving activation to form a radiation pattern of the antenna on the surface of the substrate in an electroless plating manner, so that the BT antenna 50 can only be manufactured as an independent module by the LDS process, and then is in butt joint with a SIP (SYSTEMINPACKAGE, system-in-package) module 51 by a flexible printed circuit board 52. The technology is not beneficial to the reduction of the whole thickness of the product, does not meet the development requirement of portability of the electronic product, and simultaneously, leads to longer signal transmission paths from the SIP module 51 to the BT antenna 50 through the flexible printed circuit board 52, so that signal attenuation is caused, and signal transmission is not facilitated.

Disclosure of utility model

The application provides an electronic device.

In a first aspect, the present application provides an electronic device, including an antenna and a dielectric layer, where the antenna has a first side and a second side opposite to each other, and the dielectric layer carries the antenna, and a distance between the first side and the second side gradually decreases along a direction away from the dielectric layer.

In some alternative embodiments, the antenna has opposite upper and lower surfaces, the lower surface being connected to the dielectric layer, the first side or the second side being inwardly tapered in a direction toward the upper surface.

In some alternative embodiments, the roughness of both the first side and the second side of the antenna is greater than the roughness of the upper surface.

In some alternative embodiments, the first side or the second side is curved.

In some alternative embodiments, the interface of the antenna and the dielectric layer is the widest of the antenna.

In some alternative embodiments, the dielectric layer has a first surface that includes a first plane and a second plane, the first plane and the second plane forming a stepped structure, the first plane being connected to the antenna.

In some alternative embodiments, the antenna further comprises a feed element, wherein the feed element penetrates through the dielectric layer and is exposed out of the dielectric layer and is connected to the antenna.

In some alternative embodiments, the antenna connects the top surface and the side surface of the feed element.

In some alternative embodiments, the antenna is wrapped around a side surface of the feed element.

In some alternative embodiments, the feed element and the antenna are made of different materials.

In some alternative embodiments, the feed element is a copper pillar.

In some alternative embodiments, the antenna and the feed element are both solid structures.

In some alternative embodiments, the dielectric layer is a mold seal.

In some alternative embodiments, the feed element has a plurality of feed elements.

In some alternative embodiments, the device further comprises a substrate, and the dielectric layer is disposed on the substrate.

In some alternative embodiments, the feed element is soldered to the substrate by a connector.

In some alternative embodiments, the upper surface of the antenna is planar or curved and the lower surface is planar.

In some alternative embodiments, the upper surface is parallel to the lower surface.

In some alternative embodiments, the antenna is trapezoidal or semicircular in cross section.

In some alternative embodiments, the height of the antenna is less than the thickness of the dielectric layer.

In order to solve the problems that in the prior art, an antenna module is manufactured into an independent module through an LDS process and then is in butt joint with other modules, so that the thickness of a product is not easy to thin and the signal transmission is not easy to realize, the application provides an electronic device, and the thickness of the whole device is easy to reduce by directly forming an antenna on a dielectric layer of the device, and the signal transmission paths of the antenna and other parts in the device are easy to shorten, so that the attenuation loss of signals in the transmission process is reduced; in addition, the distance between the first side surface and the second side surface of the antenna gradually decreases along the direction away from the dielectric layer, namely, the antenna is of a three-dimensional structure protruding out of the surface of the dielectric layer and gradually shrinking in width, so that the range and angle of wireless signal transmission or reception can be maximized, and the performance of the antenna is effectively improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:

fig. 1 is a schematic cross-sectional structure of an electronic structure of a conventional wireless bluetooth headset;

FIG. 2 is a schematic perspective view of one embodiment of an electronic device according to the present application;

FIG. 3 is a partial cross-sectional view according to one embodiment 3a at AA in FIG. 2;

FIG. 4 is a partial cross-sectional view according to one embodiment 4a at AA in FIG. 2;

FIG. 5 is a partial cross-sectional view according to one embodiment 5a at AA in FIG. 2;

FIG. 6 is a partial cross-sectional view according to one embodiment 6a at AA in FIG. 2;

FIG. 7 is a partial cross-sectional view according to one embodiment 7a at BB in FIG. 2;

FIGS. 8-11 are schematic diagrams illustrating a manufacturing process of the antenna structure shown in FIG. 3, respectively, in one embodiment of an electronic device according to the present application;

FIGS. 12-15 are schematic diagrams of a manufacturing process of the antenna structure shown in FIG. 7, respectively, in one embodiment of an electronic device according to the present application;

Fig. 16 is a schematic diagram of a manufacturing flow of an embodiment of an electronic device according to the application.

Reference numerals/symbol description:

10-antenna, 11-first side, 12-second side, 13-upper surface, 14-lower surface;

20-a dielectric layer, 21-a first surface, 22-a first plane, 23-a second plane, 24-a pattern groove;

30-feeding element, 31-top surface, 32-side surface, 33-connector;

40-a substrate;

50-BT antenna, 51-SIP module, 52-Flexible Printed Circuit Board (FPCB).

Detailed Description

The following description of the embodiments of the present application will be given with reference to the accompanying drawings and examples, and it is easy for those skilled in the art to understand the technical problems and effects of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. In addition, for convenience of description, only a portion related to the related application is shown in the drawings.

It should be readily understood that the meanings of "on", "above" and "above" in the present application should be interpreted in the broadest sense so that "on" means not only "directly on" but also "on" including intermediate components or layers that exist therebetween.

Further, spatially relative terms, such as "below," "under," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or component's relationship to another element or component as illustrated in the figures. In addition to the orientations depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 ° or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The term "layer" as used herein refers to a portion of material that includes regions having a certain thickness. The layers may extend over the entire underlying or overlying structure, or may have a degree less than the extent of the underlying or overlying structure. Furthermore, the layer may be a region of homogeneous or heterogeneous continuous structure having a thickness less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of horizontal planes therebetween. The layers may extend horizontally, vertically and/or along a tapered surface. The substrate (substrate) may be a layer, may include one or more layers therein, and/or may have one or more layers thereon, and/or thereon. One layer may comprise multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

The term "substrate" as used herein refers to a material to which subsequent layers of material are added. The substrate itself may be patterned. The material added to the top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate may be made of a non-conductive material, such as glass, plastic, or sapphire wafer, or the like. Further alternatively, the substrate may have a semiconductor device or a circuit formed therein.

As used herein, the terms "substantially," "about," and "approximately" are used to indicate and explain minor variations. For example, when used in connection with a numerical value, the term may refer to a range of variation of less than or equal to the corresponding numerical value of + -10%, such as a range of variation of less than or equal to + -5%, less than or equal to + -4%, less than or equal to + -3%, less than or equal to + -2%, less than or equal to + -1%, less than or equal to + -0.5%, less than or equal to + -0.1%, or less than or equal to + -0.05%. As another example, the thickness of a film or layer may be "substantially uniform" to refer to an average thickness of the film or layer that is less than or equal to a standard deviation of ± 10%, such as less than or equal to ± 5%, less than or equal to ± 4%, less than or equal to ± 3%, less than or equal to ± 2%, less than or equal to ± 1%, less than or equal to ± 0.5%, less than or equal to ± 0.1% or less than or equal to ± 0.05% standard deviation. The term "substantially coplanar" may refer to two surfaces lying within 50 μm along the same plane (such as within 40 μm, within 30 μm, within 20 μm, within 10 μm, or within 1 μm along the same plane). Two components may be considered to be "substantially aligned" if, for example, the two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm. Two surfaces or components may be considered "substantially perpendicular" if the angle between them is, for example, 90 ° ± 10 ° (such as ± 5 °, ±4 °, ±3°, ±2°, ±1°, ±0.5 °, ±0.1°, or ± 0.05 °). When used in connection with an event or circumstance, the terms "substantially," "substantial," "about," and "approximately" can refer to the precise occurrence of the event or circumstance and the very close proximity of the event or circumstance.

It should be noted that, the structures, proportions, sizes, etc. shown in the drawings are only used for being matched with those described in the specification for understanding and reading, and are not intended to limit the applicable limitation of the present application, so that the present application has no technical significance, and any modification of structures, changes in proportions or adjustment of sizes, without affecting the efficacy and achievement of the present application, should still fall within the scope covered by the technical content disclosed in the present application. Also, the terms "upper", "first", "second", and "a" and the like are used herein for descriptive purposes only and are not intended to limit the scope of the application for which the application may be practiced, but rather for relative changes or modifications without materially altering the technical context.

It should be further noted that, in the embodiment of the present application, the corresponding longitudinal section may be a section corresponding to a front view direction, the corresponding transverse section may be a section corresponding to a right view direction, and the corresponding horizontal section may be a section corresponding to an upper view direction.

In addition, the embodiments of the present application and the features in the embodiments may be combined with each other without collision. The application will be described in detail below with reference to the drawings in connection with embodiments.

Referring to fig. 2 and 3, fig. 2 is a perspective view of one embodiment of an electronic device according to the present application, and fig. 3 is a partial cross-sectional view of one embodiment 3a at AA in fig. 2. As shown in fig. 2 and 3, the electronic device of the present application includes an antenna 10 and a dielectric layer 20.

The antenna 10 has a first side 11 and a second side 12 opposite to each other. The dielectric layer 20 carries the antenna 10. The distance between the first side 11 and the second side 12 decreases gradually in a direction away from the dielectric layer 20.

Here, the dielectric layer 20 is an insulating support material for supporting the antenna 10.

Here, the antenna 10 is a conductive body directly formed on and bonded to the dielectric layer 20, and its material includes, but is not limited to, metal.

In some alternative embodiments, the antenna 10 protrudes from the dielectric layer 20. Optionally, the antenna 10 has an upper surface 13 and a lower surface 14 opposite to each other, the lower surface 14 is connected to the dielectric layer 20, the upper surface 13 is far from the dielectric layer 20, and the first side 11 and the second side 12 are connected between the upper surface 13 and the lower surface 14.

In some alternative embodiments, the first side 11 or the second side 12 is inwardly tapered in a direction toward the upper surface 13, i.e., the first side 11 or the second side 12 may be inclined surfaces tapered toward the inside of the antenna 10. Here, the side surface of the antenna 10 may be an inclined surface only on the first side surface 11, an inclined surface only on the second side surface 12, or both the first side surface 11 and the second side surface 12 may be inclined surfaces, as long as the width of the upper surface 13 of the antenna 10 is smaller than the width of the lower surface 14.

In some alternative embodiments, the roughness of both the first side 11 and the second side 12 of the antenna 10 is greater than the roughness of the upper surface 13. This is because the first side 11 and the second side 12 of the antenna 10 may be formed by removing part of the material by laser (laser) engraving, the surface after laser engraving is relatively rough, and the upper surface 13 thereof may be polished during the process to be relatively smooth.

In some alternative embodiments, the width of the antenna 10 (the width in a direction parallel to the surface of the dielectric layer 20) is wider closer to the dielectric layer 20, such that the interface of the antenna 10 and the dielectric layer 20 is the widest of the antenna 10.

In some alternative embodiments, the dielectric layer 20 may be a molding compound, which may be directly molded by a molding process. Here, the dielectric layer 20 may be formed of various molding materials. By way of example, the molding material may include one or more combinations of epoxy (Epoxyresin), filler (Filler), catalyst (Pigment), release agent (RELEASEAGENT), flame retardant (FLAMERETARDANT), coupling agent (CouplingAgent), hardener (Hardener), low stress absorber (LowStressAbsorber), adhesion promoter (Adhesion Promoter), ion trap (IonTrappingAgent), and the like. As an example, the molding material may be EMC (EpoxyMoldingCompound ).

In some alternative embodiments, the antenna 10 may be formed on the dielectric layer 20 by a printing process. That is, a conductive material, such as a metallic conductive paste or a nonmetallic conductive paste or a mixed metal and nonmetallic conductive paste, is printed on the dielectric layer 20 in a printing process to form the antenna 10.

In some alternative embodiments, the electronic device of the present application further comprises a substrate 40, and the dielectric layer 20 is disposed on the substrate 40. Illustratively, the dielectric layer 20 may be a molding compound directly formed on the substrate 40 through a molding process.

Here, the substrate 40 may be made of various semiconductor materials or non-conductive materials, including semiconductor devices or circuits formed therein. Illustratively, the substrate 40 may be an FPCB (flexible printed circuit board).

In some alternative embodiments, the electronic device of the present application further includes an electronic component (not shown) disposed on the substrate 40, and the electronic component is electrically connected to the antenna 10 through the substrate 40. The electronic component may be, for example, a System In Package (SiP). Electronic components include, but are not limited to, radio frequency chips.

In this embodiment, the thickness of the entire device is reduced by forming the dielectric layer 20 directly on the substrate 40 and forming the antenna 10 directly on the dielectric layer 20. Illustratively, in the prior art, the overall thickness of the antenna structure is 5mm-6mm or more, and the minimum thickness of the antenna structure after the antenna structure is quantitatively changed in the scheme can be less than 2.2mm. Meanwhile, the distance between the first side 11 and the second side 12 of the antenna 10 gradually decreases along the direction away from the dielectric layer 20, that is, the antenna 10 is a three-dimensional structure protruding from the surface of the dielectric layer 20 and having a tapered width, so as to maximize the range and angle of signal transmission or reception, and effectively improve the performance of the antenna 10.

It should be noted that in the prior art, an antenna module is manufactured by an independent LDS process, that is, a material is provided with electroless plating property after being activated by laser through adding a laser-induced activating substance and blending extrusion granulation of other additives into a plastic material, and then a three-dimensional conductive path is formed by injection molding, laser activating pattern and circuit metallization to realize that a plastic part is formed into an antenna, and then the antenna is bonded with a substrate.

With continued reference to fig. 3, fig. 3 is a partial cross-sectional view according to one embodiment 3a at AA in fig. 2. In some alternative embodiments, as shown in fig. 3, the antenna 10 is trapezoidal in cross-section.

Here, the upper surface 13 and the lower surface 14 of the antenna 10 are both planar, and the upper surface 13 and the lower surface 14 of the antenna 10 are parallel, thereby realizing a trapezoid structure of the cross section of the antenna 10.

In some alternative embodiments, the height of the antenna 10 is less than the thickness of the dielectric layer 20.

Referring to fig. 4, fig. 4 is a partial cross-sectional view of one embodiment 4a at AA in fig. 2. The electronic device 4a shown in fig. 4 is similar to the electronic device 3a shown in fig. 3, except that in the electronic device 4a, the first side 11 or the second side 12 of the antenna 10 is an arc-shaped curved surface.

In some alternative embodiments, the upper surface 13 of the antenna 10 may also be curved.

In some alternative embodiments, the antenna 10 may be semi-circular in cross-section.

Referring to fig. 5 and 6, fig. 5 is a partial cross-sectional view according to one embodiment 5a at AA in fig. 2, and fig. 6 is a partial cross-sectional view according to one embodiment 6a at AA in fig. 2. In some alternative embodiments, as shown in fig. 5 and 6, the dielectric layer 20 has a first surface 21, the first surface 21 of the dielectric layer 20 includes a first plane 22 and a second plane 23, and the first plane 22 and the second plane 23 form a stepped structure. Here, the first plane 22 is higher than the second plane 23, and the first plane 22 is connected with the antenna 10.

Here, the step structure between the first plane 22 and the second plane 23 may be laser-formed. In the process of forming the antenna by adopting a laser mode, a first plane 22 and a second plane 23 can be formed on the first surface 21, and the height of the second plane 23 is lower than that of the first plane 22, so that a step structure is formed between the first plane 22 and the second plane 23. Optionally, the width of the first plane 22 is substantially equal to the width of the lower surface 14 of the antenna 10.

Referring to fig. 7, fig. 7 is a partial cross-sectional view according to one embodiment 7a at BB in fig. 2. As shown in fig. 7, in some alternative embodiments, the electronic device of the present application further includes a feeding element 30, where the feeding element 30 passes through the dielectric layer 20 and is exposed out of the dielectric layer 20 and is connected to the antenna 10.

Here, the feeding element 30 may be electrically connected to the substrate 40, and electrically connected to the electronic element through the substrate 40, as a transmission path of the feeding signal of the antenna 10.

Here, the feeding element 30 protrudes out of the surface of the dielectric layer 20 and extends into the antenna 10, and has a larger contact surface with the antenna 10, so as to strengthen the bonding strength of the antenna 10, enhance the signal electrical property, and reduce the operation difficulty in the process.

In some alternative embodiments, the antenna 10 is connected to the top surface 31 and the side surface 32 of the feeding element 30, and the antenna 10 is formed to wrap around the side surface 32 of the feeding element 30. Here, the antenna 10 and the feeding element 30 have a larger contact area, and compared with the mode that the antenna 10 is only connected with the top surface 31 of the feeding element 30, the joint strength between the feeding element 30 and the antenna 10 is improved, the antenna 10 is reinforced, the antenna 10 is prevented from falling off when encountering external force, and the electrical property is enhanced.

With continued reference to fig. 2 and 7, in some alternative embodiments, the feed element 30 has a plurality of feed elements, and the feed element 30 is made of a different material than the antenna 10.

Here, the material of the antenna 10 may be a material having conductive properties and suitable for laser (laser) process, including but not limited to various conductive pastes, for example, conductive metal paste doped with copper or silver by polyepoxide. Here, the material of the feeding element 30 may be copper, and the feeding element 30 may be a copper pillar.

In some alternative embodiments, the antenna 10 and the feeding element 30 are both solid structures.

Referring to fig. 8-11, fig. 8-11 are schematic diagrams of a manufacturing process for one embodiment of an antenna structure according to the present application as shown in fig. 3, respectively.

Referring to fig. 8, a substrate 40 is provided, a dielectric layer 20 is formed on the substrate 40, and a pattern groove 24 of a radiation direction of the antenna 10 is formed on the dielectric layer 20 through a laser process. Here, the dielectric layer 20 may be, for example, a mold seal material. The patterned groove 24 may be a recess recessed inward from the surface of the dielectric layer 20. The width of the opening of the pattern groove 24 may be greater than the width of the bottom of the pattern groove 24 to facilitate the subsequent filling of the conductive metal paste.

Referring to fig. 9, a conductive metal paste is filled into the pattern groove 24 formed on the dielectric layer 20, and cured to initially mold the antenna 10.

Referring to fig. 10, the antenna 10 in the pattern groove 24 of the radiation direction of the antenna 10 formed on the dielectric layer 20 provided on the substrate 40 in fig. 9 is polished (ground) until it is substantially flush with the surface of the dielectric layer 20 (the edge of the pattern groove 24).

Referring to fig. 11, the antenna 10 and the dielectric layer 20 of fig. 10 are irradiated, the dielectric layer 20 around the antenna 10 is removed, and the antenna 10 is shaped until the antenna 10 is shaped in a trapezoid.

Referring to fig. 12-15, fig. 12-15 are schematic diagrams of a manufacturing process of the antenna structure shown in fig. 7, respectively, in an embodiment of the electronic device according to the application.

Referring to fig. 12, a substrate 40 is provided, a feeding element 30 is disposed on the substrate 40, a dielectric layer 20 is formed on the substrate 40 by molding, and the feeding element 30 is encapsulated, a pattern groove 24 in a radiation direction of the antenna 10 is formed on the dielectric layer 20 by a laser process, and the feeding element 30 is exposed at the bottom of the pattern groove 24 and protrudes at a certain height from the bottom of the pattern groove 24.

Referring to fig. 13, conductive metal paste is filled into a pattern groove 24 in the radiation direction of an antenna 10 formed on a dielectric layer 20 provided on a substrate 40, and a part of a feeding element 30 in the groove is coated and cured, thereby preliminarily molding the antenna 10.

Referring to fig. 14, the antenna 10 of fig. 13 is ground until it is flush with the edge of the patterned slot 24, and a portion of the feeding element 30 extends into the interior of the antenna 10, and another portion of the feeding element 30 is buried within the dielectric layer 20.

Referring to fig. 15, the antenna 10 and the dielectric layer 20 of fig. 14 are irradiated, the dielectric layer 20 around the antenna 10 is removed, and the antenna 10 is shaped until the antenna 10 is shaped in a trapezoid.

Referring to fig. 16, fig. 16 is a schematic diagram of a manufacturing flow of an embodiment of an electronic device according to the present application.

As shown in fig. 16 (1), a substrate 40 is provided, and a connector 33 is provided on the substrate 40. The connector 33 includes, but is not limited to, solder, such as solder paste.

As shown in fig. 16 (2), the feeding member 30 is soldered to the substrate 40 via the connection member 33. The feed element 30 includes, but is not limited to, a copper pillar.

As shown in fig. 16 (3), a dielectric layer 20 is formed on a substrate 40, and a feed element 30 is buried inside the dielectric layer 20. Illustratively, a molding material may be formed on the substrate 40 by molding as the dielectric layer 20.

As shown in fig. 16 (4), the dielectric layer 20 is polished for the first time to thin the dielectric layer 20 to a desired thickness.

As shown in fig. 16 (5), a patterned groove 24 in the radiation direction of the antenna 10 is formed on the surface of the dielectric layer 20 by a laser process, and a part of the feeding element 30 is exposed to the inside of the patterned groove 24 in the radiation direction of the antenna 10.

As shown in fig. 16 (6), the pattern groove 24 in the radiation direction of the antenna 10 is filled with a conductive metal paste, and a part of the feeding element 30 in the groove is covered and cured, thereby forming the antenna 10 preliminarily.

As shown in fig. 16 (6) and (7), the antenna 10 in the pattern groove 24 of the radiation direction of the antenna 10 formed on the dielectric layer 20 is polished until it is flush with the edge of the pattern groove 24.

As shown in fig. 16 (7) and (8), the antenna 10 and the dielectric layer 20 are subjected to laser treatment, the excess dielectric layer 20 around the antenna 10 is removed by a certain thickness, and the antenna 10 is subjected to laser shaping until the antenna 10 is formed into a desired shape (e.g., a trapezoid or a semicircle).

As shown in (9) of fig. 16, individual electronic devices are obtained by the dicing process. In the electronic device obtained in this case, the antenna 10, the dielectric layer 20, and the substrate 40 are sequentially arranged from top to bottom, wherein a part of the feeding element 30 extends into the antenna 10, and a part of the feeding element is buried in the dielectric layer 20 and electrically connected to the substrate 40.

While the application has been described and illustrated with reference to specific embodiments thereof, the description and illustration is not intended to limit the application. It will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof within the embodiments thereof without departing from the true spirit and scope of the application as defined by the appended claims. The illustrations may not be drawn to scale. There may be a distinction between technical reproduction and actual implementation in the present application due to variables in the manufacturing process, etc. Other embodiments of the application not specifically illustrated may exist. The specification and drawings are to be regarded in an illustrative rather than a restrictive sense. Modifications may be made to adapt a particular situation, material, composition of matter, method or process to the objective, spirit and scope of the present application. All such modifications are intended to fall within the scope of the claims appended hereto. Although the methods disclosed herein have been described with reference to particular operations being performed in a particular order, it should be understood that these operations may be combined, sub-divided, or reordered to form an equivalent method without departing from the teachings of the present disclosure. Thus, the order and grouping of the operations is not a limitation of the present application unless specifically indicated herein.

Claims (10)

1. An electronic device, comprising:

An antenna having opposite first and second sides;

The dielectric layer is used for bearing the antenna;

wherein the distance between the first side and the second side gradually decreases in a direction away from the dielectric layer.

2. The electronic device of claim 1, wherein the antenna has opposing upper and lower surfaces, the lower surface being connected to the dielectric layer, the first side or the second side being inwardly tapered in a direction toward the upper surface.

3. The electronic device of claim 2, wherein the roughness of both the first side and the second side of the antenna is greater than the roughness of the upper surface.

4. The electronic device of claim 2, wherein the first side or the second side is curved.

5. The electronic device of claim 1, wherein the interface of the antenna and the dielectric layer is the widest of the antenna.

6. The electronic device of claim 1, wherein the dielectric layer has a first surface comprising a first plane and a second plane, the first plane and the second plane forming a stepped structure, the first plane being connected to the antenna.

7. The electronic device of claim 1, further comprising a feed element passing through the dielectric layer and exposed to the dielectric layer and connected to the antenna.

8. The electronic device of claim 7, wherein the antenna connects a top surface and a side surface of the feed element.

9. The electronic device of claim 8, wherein the antenna is wrapped around a side surface of the feed element.

10. The electronic device of claim 7, wherein the feed element and the antenna are made of different materials.