CN220902130U - Vacuum reflow oven - Google Patents
Vacuum reflow oven Download PDFInfo
- Publication number
- CN220902130U CN220902130U CN202322632294.7U CN202322632294U CN220902130U CN 220902130 U CN220902130 U CN 220902130U CN 202322632294 U CN202322632294 U CN 202322632294U CN 220902130 U CN220902130 U CN 220902130U
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- Prior art keywords
- working cavity
- vacuum reflow
- vacuum
- soldering furnace
- reflow soldering
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- 238000000034 method Methods 0.000 claims abstract description 27
- 238000005476 soldering Methods 0.000 claims description 46
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 25
- 239000007789 gas Substances 0.000 claims description 19
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 12
- 235000019253 formic acid Nutrition 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000012159 carrier gas Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000002912 waste gas Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of high-power semiconductor laser packaging, in particular to a vacuum reflow oven, which comprises a vacuum reflow oven working cavity, a touch screen support, a first starting button, a power switch, a scram switch, a second starting button, a three-color buzzer, an exhaust gas discharge port, an upper lock seat and a working cavity top cover, wherein the first starting button and the second starting button are pressed simultaneously to close the vacuum reflow oven working cavity, the scram switch is pressed to immediately stop a device process, the scram switch is twisted clockwise to reset the switch, the locking of a strong electric element is released, the working cavity top cover can close the cavity, the upper lock seat can be fixedly locked, so that the integrated design of a heating plate and a workpiece clamp is realized, and the vacuum reflow oven has the advantages of rapid and accurate temperature curve control, accurate and automatic process gas flow control and easy operation of a graphical interface.
Description
Technical Field
The utility model relates to the technical field of high-power semiconductor laser packaging, in particular to a vacuum reflow soldering furnace.
Background
In the domestic current vacuum reflow soldering furnace market, foreign brands still dominate, and domestic vacuum reflow soldering furnaces lack precise process control, flexible process application range and intelligent and convenient operation experience.
The vacuum reflow oven has the defects of poor process precision, insufficient welding quality, no formic acid deoxidization module suitable for low-temperature solder, no intelligent and convenient Chinese graphical interface and inconvenient operation.
Disclosure of utility model
The utility model aims to provide a vacuum reflow oven, which solves the problems of the prior art that the vacuum reflow oven has poor process precision, insufficient welding quality, no formic acid deoxidization module suitable for low-temperature solder, no intelligent and convenient Chinese graphical interface and inconvenient operation.
In order to achieve the above purpose, the utility model provides a vacuum reflow soldering furnace, which comprises a vacuum reflow soldering furnace working cavity, a touch screen support, a first starting button, a power switch, a scram switch, a second starting button, a three-color buzzer, an exhaust gas discharge port, an upper lock seat and a working cavity top cover, wherein the touch screen support is arranged above the vacuum reflow soldering furnace working cavity, the touch screen is arranged on the touch screen support, the first starting button, the power switch, the scram switch and the second starting button are sequentially arranged on one side of the vacuum reflow soldering furnace working cavity, the three-color buzzer and the exhaust gas discharge port are sequentially arranged on the other side of the vacuum reflow soldering furnace working cavity, the working cavity top cover is connected with the vacuum reflow soldering furnace working cavity through a pin shaft, and the upper lock seat is arranged on the front part of the cavity top cover.
The vacuum reflow soldering furnace further comprises a plurality of rollers, wherein the rollers are fixedly connected with the working cavity of the vacuum reflow soldering furnace and are sequentially distributed below the working cavity of the vacuum reflow soldering furnace.
The vacuum reflow soldering furnace further comprises three panels and a plurality of panel handles, wherein the three panels are sequentially installed outside the working cavity of the vacuum reflow soldering furnace, and the panel handles are respectively fixedly connected with the corresponding panels and sequentially distributed on one side of the panels.
The other side of the working cavity of the vacuum reflow soldering furnace is sequentially provided with a cooling nitrogen inlet, a water outlet, a barometer, a process gas inlet, a formic acid carrier gas inlet and an oil pump interface.
The vacuum reflow soldering furnace further comprises a barometer, a vacuum valve and an electromagnetic valve, wherein the barometer is fixedly connected with the working cavity of the vacuum reflow soldering furnace and is positioned on the other side of the working cavity of the vacuum reflow soldering furnace, and the vacuum valve and the electromagnetic valve are fixedly connected with the working cavity of the vacuum reflow soldering furnace and are sequentially distributed on the other side of the working cavity of the vacuum reflow soldering furnace.
According to the vacuum reflow soldering furnace, the touch screen is supported by the touch screen support, the power switch is twisted to the ON gear, and the equipment is electrified; the power switch is twisted to an OFF gear, the equipment is powered OFF, after the equipment is powered on, the first starting button and the second starting button are pressed simultaneously, the working cavity of the vacuum reflow oven can be closed, the scram switch is pressed, the equipment process can be stopped immediately, all the strong electric elements are locked to a state incapable of being started, the scram switch is twisted clockwise, the switch can be reset, the locking of the strong electric elements is released, the top cover of the working cavity can close the cavity, the locking seat can be fixedly locked, the three-color buzzer can lighten signal lamps with different colors according to signals sent by the PLC, or give out alarm buzzes, and the waste gas discharge port can discharge waste gas, so that the integrated design of the heating plate and the workpiece clamp is realized, and the integrated design of the integrated equipment has the advantages of rapid and accurate temperature curve control, accurate automatic process gas flow control and easy operation of a graphical interface.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic overall structure of the present utility model.
Fig. 2 is a top view of the entirety of the present utility model.
The device comprises a 1-touch screen, a 2-touch screen support, a 3-first starting button, a 4-power switch, a 5-panel handle, a 6-roller, a 7-scram switch, an 8-second starting button, a 9-three-color buzzer, a 10-exhaust gas discharge port, an 11-locking seat, a 12-working cavity top cover, a 13-panel, a 14-vacuum reflow oven working cavity, a 15-oil pump interface, a 16-formic acid carrier gas inlet, a 17-vacuum valve, a 18-electromagnetic valve, a 19-cooling nitrogen inlet, a 20-water inlet, a 21-water outlet, a 22-barometer and a 23-process gas inlet.
Detailed Description
The following detailed description of embodiments of the utility model, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the utility model.
Referring to fig. 1 and 2, the utility model provides a vacuum reflow soldering furnace, which comprises a vacuum reflow soldering furnace working cavity 14, a touch screen 1, a touch screen support 2, a first starting button 3, a power switch 4, a scram switch 7, a second starting button 8, a three-color buzzer 9, an exhaust gas discharge port 10, an upper lock seat 11 and a working cavity top cover 12, wherein the touch screen support 2 is arranged above the vacuum reflow soldering furnace working cavity 14, the touch screen 1 is arranged on the touch screen support 2, the first starting button 3, the power switch 4, the scram switch 7 and the second starting button 8 are sequentially arranged on one side of the vacuum reflow soldering furnace working cavity 14, the three-color buzzer 9 and the exhaust gas discharge port 10 are sequentially arranged on the other side of the vacuum reflow soldering furnace working cavity 14, the working cavity top cover 12 is connected with the vacuum reflow soldering furnace working cavity 14 through a pin shaft, and the upper lock seat 11 is arranged in front of the cavity top cover.
Further, the vacuum reflow soldering furnace further comprises a plurality of rollers 6, and the rollers 6 are fixedly connected with the vacuum reflow soldering furnace working cavity 14 and are sequentially distributed below the vacuum reflow soldering furnace working cavity 14.
Further, the vacuum reflow oven further comprises three panels 13 and a plurality of panel handles 5, wherein the three panels 13 are sequentially installed outside the working cavity 14 of the vacuum reflow oven, and the panel handles 5 are respectively and fixedly connected with the corresponding panels 13 and are sequentially distributed on one side of the panels 13.
Further, a cooling nitrogen inlet 19, a water inlet 20, a water outlet 21, a barometer 22, a process gas inlet 23, a formic acid carrier gas inlet 16 and an oil pump interface 15 are sequentially arranged on the other side of the working cavity 14 of the vacuum reflow oven.
Further, the vacuum reflow soldering furnace further comprises a barometer, a vacuum valve 17 and an electromagnetic valve 18, wherein the barometer is fixedly connected with the vacuum reflow soldering furnace working cavity 14 and is positioned at the other side of the vacuum reflow soldering furnace working cavity 14, and the vacuum valve 17 and the electromagnetic valve 18 are fixedly connected with the vacuum reflow soldering furnace working cavity 14 and are sequentially distributed at the other side of the vacuum reflow soldering furnace working cavity 14.
In this embodiment, the model of the vacuum reflow oven working cavity 14 is VSR-8, three-phase 380V ac power is supplied by a five-core cable, the power switch 4 is twisted to ON gear, the device is energized, the power switch 4 is twisted to OFF gear, the device is deenergized, after the device is energized, the first start button 3 and the second start button 8 are pressed at the same time, the working cavity can be closed, the emergency stop switch 7 is pressed in the process of the device, the device process can be stopped immediately, all the strong electric elements are locked to a state that cannot be started, the emergency stop switch 7 is twisted clockwise, the switch can be reset, the locking of the strong electric elements is released, detachable panels are installed ON the front side, the left side and the right side of the device, the internal device is isolated from the outside, the lock hole beside the panel handle 5 is pressed, the panel handle 5 can be popped up, the panel handle 5 is rotated, the panel can be unlocked or locked, and the device can be pushed down by a plurality of rollers 6, so that the device can be pushed and can be saved; in the upper left part of the equipment, the touch screen 1 is in communication connection with the PLC, and an operator can directly control the PLC through the touch screen. The working cavity is positioned at the top of the equipment and is a main place and a core part for process, the two sides of the bottom of the cavity are provided with hook rings which hook the upper lock seat 11, the cavity is locked and closed, the PLC can control the cylinder to stretch out and draw back by controlling the opening and closing of the cylinder valve so as to control the movement of the working cavity top cover 12 and the hook rings to finish the control of the opening and closing of the cavity, the working cavity top cover is provided with an observation window and an illuminating lamp, the condition inside the cavity is conveniently observed at any time, 8 quartz lamp tubes with 220v power supply are connected to the two sides of the cavity to provide a heating environment for the process, meanwhile, the quartz lamp tubes are connected with 2 power regulators inside the front side panel of the equipment, and after the power regulators receive the signal input of the temperature controller and the PLC, the heating power of the quartz lamp tubes is controlled, so that the control of the process heating part is realized; the three-color buzzer 9 is connected with the PLC at the latter half part of the top of the equipment, can lighten signal lamps with different colors according to signals sent by the PLC, or sends out alarm buzzes, the formic acid process gas inlet 23 and the process gas inlet 23 are connected with the working cavity through a 6mm stainless steel pipe, an electromagnetic valve 18 and a mass flow controller MFC are arranged between pipelines for gas path control, inert process gas is introduced into the equipment through the process gas inlet 23, protective atmosphere and reflux environment can be provided for the process, formic acid carrier gas is introduced into the working cavity through the formic acid carrier gas inlet 16, formic acid in a formic acid tower between formic acid pipelines is blown into the working cavity, reducing atmosphere is provided for the process, a cooling nitrogen inlet 19 is connected with the working cavity through a 12mm stainless steel pipe, gas path control is carried out by the cooling nitrogen inlet 19, a large amount of cooling nitrogen is input into the cavity to realize rapid cooling, a vacuum pump is connected with the working cavity through a KF25 pipe joint and a KF25 corrugated pipe, the vacuum valve 17 can control the switch of the vacuum pipeline, the vacuum gauge can measure the internal vacuum gauge and generate waste gas which is discharged to the outside through a vacuum treatment device or waste gas is discharged to the outside after the waste gas treatment device is exhausted; in the lower part of equipment rear side, air inlet one end is connected with air compressor through 6mm hose, and one end is connected with cylinder, pneumatic valve through 6mm hose, 4mm hose barometer, water inlet 20 one end is connected with the cooling water machine through 10mm hose, and one end is connected with delivery port 21 through 10mm hose and 3 water-cooling blocks, water-cooling KF25 through connection. And the other end of the water outlet 21 is also connected with a water chiller through a 10mm hose to form waterway circulation. The oil pump interface 15 is a 5-core interface and is used for supplying power to an oil pump, an electric cabinet is arranged inside the left side panel of the equipment and is a circuit connection core of the equipment, and the PLC, the PC, the remote transmission module and the like are also arranged in the electric cabinet;
And (3) placing the solder between the substrate and the element in advance, closing the working cavity, heating the solder to a reduction temperature in the circulation of vacuumizing and filling inert process gas, introducing the reduction gas to remove oxides on the interface, improving wettability between the solder and the substrate and between the solder and the element, continuing to heat the solder to a process temperature of melting and reflowing, and welding the element and the substrate together under the protection of a reducing atmosphere. Then vacuumizing, quickly overflowing bubbles in the solder under a negative pressure environment, finally controlling the temperature to be reduced to the solidification temperature of the solder, then reducing the temperature of a workpiece to be the safe temperature of a product, and opening a cavity door to take out a welded device, so that the vacuum reflow oven has PID temperature control with higher precision when in operation, in a 2-half stable section precision test, the highest temperature floating is not higher than 0.1 ℃, the average temperature floating is only 0.072 ℃, in a heating plate temperature uniformity test, the temperature uniformity in the 80% heating plate area is better than +/-2%, and a stable process flow control, a convenient and intelligent graphical control system is configured with various process gases and formic acid modules, and is more suitable for high-flexibility low-temperature welding.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present application, and it is not intended to limit the scope of the claims hereof, as persons of ordinary skill in the art will understand that all or part of the processes for practicing the embodiments described herein may be practiced with equivalent variations in the claims, which are within the scope of the application.
Claims (5)
1. A vacuum reflow oven is characterized in that,
Including vacuum reflow oven working cavity, touch-sensitive screen support, first start button, switch, scram switch, second start button, three-color buzzer, exhaust emission mouth, go up lock seat and working cavity top cap, the touch-sensitive screen support set up in the top of vacuum reflow oven working cavity, the touch-sensitive screen is installed on the touch-sensitive screen support, first start button the switch scram switch with second start button set gradually in one side of vacuum reflow oven working cavity, three-color buzzer exhaust emission mouth installs in proper order the opposite side of vacuum reflow oven working cavity, the working cavity top cap pass through the round pin axle with vacuum reflow oven working cavity connects, cavity top cap front portion installs go up lock seat.
2. The vacuum reflow oven of claim 1, wherein,
The vacuum reflow soldering furnace further comprises a plurality of rollers, and the rollers are fixedly connected with the working cavity of the vacuum reflow soldering furnace and are sequentially distributed below the working cavity of the vacuum reflow soldering furnace.
3. The vacuum reflow oven of claim 2, wherein,
The vacuum reflow soldering furnace further comprises three panels and a plurality of panel handles, wherein the three panels are sequentially installed outside the working cavity of the vacuum reflow soldering furnace, and the panel handles are respectively and fixedly connected with the corresponding panels and are sequentially distributed on one side of the panels.
4. The vacuum reflow oven of claim 3, wherein,
The other side of the vacuum reflow soldering furnace working cavity is sequentially provided with a cooling nitrogen inlet, a water outlet, a barometer, a process gas inlet, a formic acid carrier gas inlet and an oil pump interface.
5. The vacuum reflow oven of claim 4, wherein,
The vacuum reflow soldering furnace further comprises a barometer, a vacuum valve and an electromagnetic valve, wherein the barometer is fixedly connected with the working cavity of the vacuum reflow soldering furnace and is positioned on the other side of the working cavity of the vacuum reflow soldering furnace, and the vacuum valve and the electromagnetic valve are fixedly connected with the working cavity of the vacuum reflow soldering furnace and are sequentially distributed on the other side of the working cavity of the vacuum reflow soldering furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322632294.7U CN220902130U (en) | 2023-09-27 | 2023-09-27 | Vacuum reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322632294.7U CN220902130U (en) | 2023-09-27 | 2023-09-27 | Vacuum reflow oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220902130U true CN220902130U (en) | 2024-05-07 |
Family
ID=90904976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322632294.7U Active CN220902130U (en) | 2023-09-27 | 2023-09-27 | Vacuum reflow oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220902130U (en) |
-
2023
- 2023-09-27 CN CN202322632294.7U patent/CN220902130U/en active Active
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