CN220896924U

CN220896924U - Tray structure of reflow soldering

Info

Publication number: CN220896924U
Application number: CN202322494947.XU
Authority: CN
Inventors: 付伟; 向孙林; 卢元凯; 肖军
Original assignee: Sichuan Xinghong Electronic Technology Co ltd
Current assignee: Sichuan Xinghong Electronic Technology Co ltd
Priority date: 2023-09-14
Filing date: 2023-09-14
Publication date: 2024-05-03
Anticipated expiration: 2033-09-14

Abstract

The utility model discloses a tray structure for reflow soldering, which comprises a bottom plate, side plates arranged on two sides of the upper part of the bottom plate, wherein a plurality of supporting grooves are respectively formed on the opposite side parts of the two side plates, a space for placing a PCB (printed circuit board) is formed between the two supporting grooves with the same height, and ventilation holes are formed at the positions, away from the supporting grooves, of the two bottom plates. This scheme sets up a plurality of supporting slots, utilizes the supporting slot that is in same height between two curb plates to support the PCB board, can realize effectively supporting a plurality of PCB boards like this, improves the quantity of once reflow soldering to through setting up the ventilation hole, be convenient for hot-blast through, and then conveniently heat, the effectual process of guaranteeing the reflow soldering.

Description

Tray structure of reflow soldering

Technical Field

The utility model relates to the technical field, in particular to a tray structure for reflow soldering.

Background

In the PCB patches, reflow soldering is often used, which is soldering for mechanically and electrically connecting the solder terminals or pins of the surface-mounted components with the pads of the printed board by remelting paste solder pre-dispensed onto the pads of the printed board. In the reflow soldering operation, the PCB board is generally placed in a tray, and then the tray is placed in a furnace body to perform the reflow soldering operation.

The current tray is generally designed into a single-layer structure for fully contacting with hot air, but the single-layer structure is designed, so that the number of PCBs (printed Circuit Board) subjected to one-time reflow soldering is too small, the time of the reflow soldering is too long, and the efficiency of the reflow soldering is affected.

Disclosure of utility model

The utility model mainly aims to provide a tray structure for reflow soldering, so as to solve the problem of low number of reflow soldering in the related art.

In order to achieve the above purpose, the utility model provides a tray structure for reflow soldering, which comprises a bottom plate, side plates arranged on two sides of the upper part of the bottom plate, wherein a plurality of supporting grooves are respectively formed on the opposite side parts of the two side plates, a space for placing a PCB (printed circuit board) is formed between the two supporting grooves with the same height, and ventilation holes are formed on the positions, which are away from the supporting grooves, of the two bottom plates.

In an embodiment of the present utility model, two sides of the upper portion of each of the two side plates are provided with a holding groove for facilitating hand picking.

In one embodiment of the present utility model, the upper parts of the two side plates are provided with extension parts, and the lower part of the bottom plate is provided with grooves matched with the extension parts.

In one embodiment of the utility model, the support groove is provided with a notch with a small inner side and a large outer side at a position adjacent to the edge of the side plate.

In one embodiment of the present utility model, the inner wall of the notch is smooth.

In an embodiment of the present utility model, the positions of the two side plates, where the ventilation holes are not formed, are provided with through holes.

In one embodiment of the utility model, the two side plates are rotatably provided with supporting rods through the through holes, and supporting rollers for supporting the PCB are arranged outside the supporting rods.

In one embodiment of the utility model, the upper wall of the support roller is flush with the lower wall of the support groove.

Compared with the prior art, the utility model has the beneficial effects that: through the tray structure of reflow soldering of above-mentioned design, during the use, place the PCB board in the supporting groove of same height, owing to set up a plurality of supporting grooves, can support simultaneously a plurality of PCB boards, then place the bottom plate in the chain of reflow soldering furnace body, through setting up the ventilation hole, be convenient for hot-blast through, and then conveniently heat, the effectual process of guaranteeing the reflow soldering, and a plurality of PCB boards of once can reflow soldering, improve the efficiency of reflow soldering.

Drawings

Fig. 1 is a schematic view of a first view of a reflow soldering tray structure according to an embodiment of the present utility model;

Fig. 2 is an enlarged schematic view of a portion a in fig. 1 of a reflow soldering tray structure according to an embodiment of the present utility model;

Fig. 3 is a second view schematically illustrating a reflow soldering tray structure according to an embodiment of the present utility model.

In the figure: 1. a bottom plate; 2. a side plate; 3. a support groove; 4. ventilation holes; 5. a holding groove; 6. an extension part; 7. a groove; 8. a notch; 9. a through hole; 10. a support rod; 11. and (5) supporting rollers.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate in order to describe the embodiments of the utility model herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

In the present utility model, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate an azimuth or a positional relationship based on that shown in the drawings. These terms are only used to better describe the present utility model and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.

Also, some of the terms described above may be used to indicate other meanings in addition to orientation or positional relationships, for example, the term "upper" may also be used to indicate some sort of attachment or connection in some cases. The specific meaning of these terms in the present utility model will be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the term "plurality" shall mean two as well as more than two.

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

Example 1

Referring to fig. 1-3, the utility model provides a tray structure for reflow soldering, which comprises a bottom plate 1, side plates 2 arranged on two sides of the upper part of the bottom plate 1, a plurality of supporting grooves 3 respectively arranged on the opposite sides of the two side plates 2, a space for placing a PCB board formed between the two supporting grooves 3 with the same height, and ventilation holes 4 arranged at the positions of the two bottom plates 1 avoiding the supporting grooves 3. When the reflow soldering furnace is specifically used, the PCB is placed in the supporting groove 3 at the same height, the plurality of PCB can be simultaneously supported due to the plurality of supporting grooves 3, then the bottom plate 1 is placed in the chain of the reflow soldering furnace body, the through holes 4 are arranged, hot air is conveniently passed, heating is further conveniently carried out, the reflow soldering process is effectively ensured, a plurality of PCB can be reflow soldered once, and the reflow soldering efficiency is improved. Of course, in order to facilitate the insertion of the PCB board into the supporting groove 3, a notch 8 with a small inside and a large outside is arranged at the position of the supporting groove 3 adjacent to the edge of the side plate 2, and the inner wall of the notch 8 is arranged smoothly.

Referring to fig. 1, in order to facilitate the whole picking, two sides of the upper portions of the two side plates 2 are provided with holding grooves 5 for facilitating the hand picking, and when the picking is needed, the subsequent picking can be performed by holding the holding grooves 5 with fingers.

Referring to fig. 1 and 3, because the reflow oven is different, the upper parts of the two side plates 2 are respectively provided with an extension part 6, the lower part of the bottom plate 1 is provided with a groove 7 matched with the extension part 6, and two or more tray structures can be stacked and placed together by inserting the extension part 6 into the groove 7, so that more PCB boards can be processed at one time, and the reflow soldering efficiency is further improved.

Example 2

Referring to fig. 1, in the actual reflow soldering process, since various electrical components are already mounted on the upper portion of the PCB board, partial warpage may occur due to dead weight during the reflow soldering process, in order to achieve good and effective support, through holes 9 are formed in the portions of the two side plates 2 where the ventilation holes 4 are not formed, the two side plates 2 are rotatably mounted with support rods 10 through the through holes 9, support rollers 11 for supporting the PCB board are disposed on the outer sides of the support rods 10, and the upper walls of the support rollers 11 are flush with the lower walls of the support grooves 3, the lower portion of the PCB board can be supported by the support rollers 11, so that the warpage of the PCB board is improved.

Specifically, the operating principle of the tray structure for reflow soldering is as follows: when the reflow soldering furnace is used, the PCB boards are placed in the supporting grooves 3 with the same height, and the plurality of PCB boards can be simultaneously supported due to the plurality of supporting grooves 3, then the bottom plate 1 is placed in a chain of the reflow soldering furnace body, and through the arrangement of the ventilation holes 4, hot air can conveniently pass through, so that the heating is conveniently carried out, the reflow soldering process is effectively ensured, and a plurality of PCB boards can be reflow soldered once, so that the reflow soldering efficiency is improved; in addition, the lower part of the PCB is supported by the supporting roller 11, so that the warping of the PCB is improved.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a tray structure of reflow soldering, includes bottom plate (1), set up in curb plate (2) of bottom plate (1) upper portion both sides, its characterized in that, two a plurality of supporting slots (3) have been seted up respectively to the lateral part that curb plate (2) are relative, and two of same altitude constitute the space of placing the PCB board between supporting slot (3), two bottom plate (1) avoid ventilation hole (4) have all been seted up at the position of supporting slot (3).

2. A reflow soldering tray structure in accordance with claim 1, wherein the two sides of the upper portion of the two side plates (2) are provided with holding grooves (5) for facilitating hand handling.

3. A reflow soldering tray structure in accordance with claim 1 or 2, wherein the upper parts of both side plates (2) are provided with extensions (6), and the lower part of the bottom plate (1) is provided with grooves (7) for mating with the extensions (6).

4. A reflow soldering tray structure in accordance with claim 1, wherein the support slots (3) are provided with small inside and large outside indentations (8) adjacent the edges of the side plates (2).

5. A reflow soldering tray structure in accordance with claim 4, wherein the inner walls of the indentations (8) are smooth.

6. A reflow soldering tray structure according to claim 1, wherein the two side plates (2) are provided with through holes (9) at positions where the ventilation holes (4) are not provided.

7. A reflow soldering tray structure in accordance with claim 6, wherein the two side plates (2) are rotatably mounted with support bars (10) through the through holes (9), and support rollers (11) for supporting the PCB board are provided outside the support bars (10).

8. A reflow soldering tray structure in accordance with claim 7, wherein the upper wall of the support roller (11) is flush with the lower wall of the support groove (3).