CN220895642U

CN220895642U - Battery module PCM heat abstractor based on semiconductor refrigeration piece

Info

Publication number: CN220895642U
Application number: CN202322559756.7U
Authority: CN
Inventors: 李倩; 陈丽红; 吴青青
Original assignee: Hefei Atomic Bit Laboratory Co ltd
Current assignee: Hefei Atomic Bit Laboratory Co ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2024-05-03
Anticipated expiration: 2033-09-20

Abstract

The utility model relates to the field of battery module heat dissipation, in particular to a battery module PCM heat dissipation device based on a semiconductor refrigeration piece, wherein at least one side of the battery module is provided with the semiconductor refrigeration piece, and the refrigeration surface of the semiconductor refrigeration piece is abutted with the battery module; the heat exchange cover is fixed on the side of the semiconductor refrigerating sheet of the battery module, and the cover surface of the heat exchange cover is abutted with the heating surface of the semiconductor refrigerating sheet; heat exchange fins are arranged in the heat exchange cover at intervals, and PCM phase change materials are filled between adjacent heat exchange fins. The utility model greatly reduces the space occupation rate of the cooling system and has high cooling efficiency.

Description

Battery module PCM heat abstractor based on semiconductor refrigeration piece

Technical Field

The utility model relates to the field of heat dissipation of battery modules, in particular to a battery module PCM heat dissipation device based on a semiconductor refrigerating sheet.

Background

The battery module is a battery assembly which is formed by connecting battery monomers in series, parallel or series-parallel connection and has only one pair of positive and negative output terminals; heat is generated during the charge and discharge of the battery module, so that the battery module is provided with a heat dissipation device. As described in patent No. CN219435983U, in order to achieve a good heat dissipation effect, heat dissipation plates attached to the side walls of the battery cells and connected in series are arranged between the battery cells, so that cooling liquid flows through each heat dissipation plate and forms a cycle, thereby dissipating heat of the battery cells; the cooling liquid is required to circulate continuously in the heat dissipation mode, the whole circulating cooling system occupies a large space, and the cooling efficiency of the cooling liquid can be reduced after long-time working, so that the problem is to be solved.

Disclosure of Invention

In order to avoid and overcome the technical problems in the prior art, the utility model provides a battery module PCM heat dissipation device based on a semiconductor refrigeration piece. The utility model greatly reduces the space occupation rate of the cooling system and has high cooling efficiency.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

A battery module PCM heat abstractor based on semiconductor refrigerating piece, at least one side of the battery module is installed with the semiconductor refrigerating piece, the refrigerating surface of the semiconductor refrigerating piece is abutted with the battery module; the heat exchange cover is fixed on the side of the semiconductor refrigerating sheet of the battery module, and the cover surface of the heat exchange cover is abutted with the heating surface of the semiconductor refrigerating sheet; heat exchange fins are arranged in the heat exchange cover at intervals, and PCM phase change materials are filled between adjacent heat exchange fins.

As a further scheme of the utility model: the cover surface size of the heat exchange cover corresponds to the side surface size of the battery module, and two ends of the heat exchange fin extend out of the cover surface range of the heat exchange cover.

As still further aspects of the utility model: the heat exchange fins are arranged in parallel and at intervals in the cover body of the heat exchange cover, the heat exchange fins are arranged vertically with the semiconductor refrigerating plate, and the width of the heat exchange fins corresponds to the thickness of the heat exchange cover.

As still further aspects of the utility model: the edge of the heat exchange cover is connected with the edge of the battery module through the connecting plate, and the heat exchange cover, the connecting plate and the battery module are matched with each other to form a sealing cavity in a surrounding mode, so that the semiconductor refrigerating sheets are located in the sealing cavity.

As still further aspects of the utility model: the heat exchange cover body is internally provided with a guide groove for the insertion and fixation of each heat exchange fin.

As still further aspects of the utility model: the heat exchange fins are corrugated fins, and the corrugations are arranged along the vertical direction.

As still further aspects of the utility model: the semiconductor refrigerating sheets are arranged in a lattice mode on the battery module.

Compared with the prior art, the utility model has the beneficial effects that:

1. According to the utility model, the heat exchange with the battery module is realized through the lamination of the cooling surface of the semiconductor cooling plate and the battery module, the cooling of the battery module is accelerated, the heat of the heating surface of the semiconductor cooling plate is laminated with the heat exchange cover, the heat is absorbed by the PCM phase change material and then is dispersed into the outside air through the heat exchange fins, the cooling efficiency is high, and the space occupation rate of the whole cooling system is extremely low.

2. The heat exchange cover has the same side surface size as the battery module, can be used as a shell of the battery module to reinforce the battery module while playing a role in heat exchange, and the two ends of the heat exchange fin extend out of the range of the cover surface of the heat exchange cover after the heat exchange fin is fixed, so that the end part of the heat exchange fin directly exchanges heat with external air, and the heat exchange efficiency is improved.

3. According to the utility model, the heat exchange fins are arranged in a plurality of groups and are arranged in parallel at intervals, so that a plurality of groups of clamping cavities are formed in a separated mode for injecting and fixing the PCM material in batches, the heat exchange fins can play a role in reinforcing ribs when exchanging heat after being fixed, and the rigidity of the battery module is further improved; the heat exchange fins are fixedly inserted into the heat exchange cover through the guide grooves, so that the heat exchange fins are convenient to assemble and disassemble and firm to fix, and the corrugated design of the fins greatly improves the heat exchange area with the PCM material.

4. The heat exchange cover and the battery module are fixedly connected through the connecting plate, so that each semiconductor refrigeration piece is enclosed into the sealing cavity, the semiconductor refrigeration piece is prevented from being contacted with external dust, and the cleanliness of the working environment is improved.

Drawings

Fig. 1 is a schematic structural view of the present utility model.

Fig. 2 is an enlarged view of the structure of the semiconductor refrigeration sheet according to the present utility model.

In the figure:

1. A battery module; 2. a semiconductor refrigeration sheet; 3. a heat exchange cover;

4. PCM phase change material; 5. a heat exchange fin; 6. a connector plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-2, in an embodiment of the utility model, a PCM heat dissipation device based on a semiconductor cooling plate is illustrated as an example of a block-shaped battery module 1, at least one of six sides of the battery module 1 is provided with a semiconductor cooling plate 2, and the semiconductor cooling plate 2 is fixed on the side of the battery module 1 in a lattice type. After the semiconductor refrigerating sheet 2 is connected and fixed with a power supply, the refrigerating surface of the semiconductor refrigerating sheet is attached and fixed with the side surface of the battery module 1.

The side surfaces of the battery modules 1 where the semiconductor refrigerating sheets 2 are positioned are respectively fixed with a heat exchange cover 3, the heat exchange covers 3 are square shell-shaped, and the cover surfaces of the heat exchange covers are abutted with the heating surfaces of the semiconductor refrigerating sheets 2. The cover body of the heat exchange cover 3 is matched with the side surface of the battery module 1 in shape, the side edge of the cover body of the heat exchange cover 3 is connected with the side edge of the battery module 1 through a connecting plate 6, and the heat exchange cover 3, the battery module 1 and the connecting plate 6 can be enclosed to form a sealing cavity, so that each semiconductor refrigeration piece 2 is positioned in the sealing cavity.

Heat exchange fins 5 are arranged in the heat exchange cover 3 at equal intervals in parallel, and the fin surfaces of the heat exchange fins 5 are arranged perpendicular to the heating surface of the semiconductor refrigeration sheet 2. The heat exchange fins 5 are preferably corrugated fins to enlarge the heat dissipation area, and the PCM phase change material 4 is filled between two adjacent groups of heat exchange fins 5, and after heat is stored through the PCM phase change material 4, the heat exchange fins exchange heat with the heat exchange fins 5.

Along the length direction of the heat exchange cover 3, the heat exchange fins 5 are uniformly arranged, the length of the heat exchange fins 5 is equal to the width of the heat exchange cover 3, and in order to improve the heat dissipation effect, the two ends of the heat exchange fins 5 preferably extend out of the heat exchange cover 3. The width of the heat exchanging fin 5 is correspondingly equal to the thickness of the heat exchanging cover 3, and the thickness of the heat exchanging cover 3 can be understood as the height of the heat exchanging cover 3.

For conveniently fixing the heat exchange fins 5, guide grooves are formed in the heat exchange cover 3 along the width direction of the heat exchange cover for the heat exchange fins 5 to be inserted and fixed, and the heat exchange cover 3 is divided into a plurality of groups of separation cavities after the heat exchange fins 5 are inserted so as to be filled with the PCM phase change materials 4 in sequence.

The basic principles of the present application have been described above in connection with specific embodiments, but it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not intended to be limiting, and these advantages, benefits, effects, etc. are not to be construed as necessarily possessed by the various embodiments of the application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not necessarily limited to practice with the above described specific details.

The block diagrams of the devices, apparatuses, devices, systems referred to in the present application are only illustrative examples and are not intended to require or imply that the connections, arrangements, configurations must be made in the manner shown in the block diagrams. As will be appreciated by one of skill in the art, the devices, apparatuses, devices, systems may be connected, arranged, configured in any manner. Words such as "including," "comprising," "having," and the like are words of openness and mean "including but not limited to," and are used interchangeably therewith. The terms "or" and "as used herein refer to and are used interchangeably with the term" and/or "unless the context clearly indicates otherwise. The term "such as" as used herein refers to, and is used interchangeably with, the phrase "such as, but not limited to.

Claims

1. The battery module PCM heat abstractor based on the semiconductor refrigerating piece is characterized in that at least one side of the battery module (1) is provided with the semiconductor refrigerating piece (2), and the refrigerating surface of the semiconductor refrigerating piece (2) is abutted with the battery module (1); the heat exchange cover (3) is fixed on the side of the semiconductor refrigerating sheet (2) of the battery module (1), and the cover surface of the heat exchange cover (3) is abutted with the heating surface of the semiconductor refrigerating sheet (2); heat exchange fins (5) are arranged in the heat exchange cover (3) at intervals, and PCM phase change materials (4) are filled between adjacent heat exchange fins (5).

2. The PCM heat sink of the battery module based on the semiconductor cooling fin according to claim 1, wherein the cover dimension of the heat exchanging cover (3) corresponds to the side dimension of the battery module (1), and both ends of the heat exchanging fin (5) extend out of the cover dimension of the heat exchanging cover (3).

3. The battery module PCM heat sink based on the semiconductor cooling fin according to claim 1, wherein the heat exchanging fins (5) are arranged in parallel and spaced apart from each other in the housing of the heat exchanging housing (3), the heat exchanging fins (5) are arranged perpendicular to the semiconductor cooling fin (2), and the width of the heat exchanging fins (5) corresponds to the thickness of the heat exchanging housing (3).

4. A PCM heat sink according to any of claims 1 to 3, wherein the edge of the heat exchanger (3) is connected to the edge of the battery module (1) by a connector plate (6), and the heat exchanger (3), the connector plate (6) and the battery module (1) cooperate with each other to form a sealed cavity, so that each semiconductor cooling fin (2) is located in the sealed cavity.

5. A PCM heat sink based on semiconductor cooling fins according to any of claims 1 to 3, characterized in that the heat exchanger housing (3) is provided with guiding grooves for the insertion and fixation of the heat exchanger fins (5).

6. A PCM heat sink according to any one of claims 1 to 3, wherein the heat exchanging fins (5) are corrugated fins and the corrugations are arranged in the vertical direction.

7. A battery module PCM heat sink based on semiconductor cooling fins according to any of claims 1 to 3, wherein the semiconductor cooling fins (2) are arranged in a lattice on the battery module (1).