CN220894829U - Edge computing device shell with gas-liquid dual-channel heat dissipation function - Google Patents
Edge computing device shell with gas-liquid dual-channel heat dissipation function Download PDFInfo
- Publication number
- CN220894829U CN220894829U CN202322611200.8U CN202322611200U CN220894829U CN 220894829 U CN220894829 U CN 220894829U CN 202322611200 U CN202322611200 U CN 202322611200U CN 220894829 U CN220894829 U CN 220894829U
- Authority
- CN
- China
- Prior art keywords
- liquid
- heat dissipation
- gas
- channel
- dual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 239000007788 liquid Substances 0.000 title claims abstract description 35
- 238000001816 cooling Methods 0.000 claims abstract description 30
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims abstract description 21
- 238000003860 storage Methods 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 8
- 230000009977 dual effect Effects 0.000 claims abstract description 6
- 230000004907 flux Effects 0.000 abstract description 9
- 238000005265 energy consumption Methods 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An edge computing device housing for dual gas-liquid channel heat dissipation, comprising: the cooling device comprises a protective shell, a gas-liquid dual-channel heat dissipation mechanism, cooling liquid and an interface board, wherein the gas-liquid dual-channel heat dissipation mechanism is connected with the interior of the protective shell, the cooling liquid is arranged in the gas-liquid dual-channel heat dissipation mechanism, the interface board is connected with the rear side of the protective shell, and the gas-liquid dual-channel heat dissipation mechanism is connected with components. Wherein, gas-liquid binary channels heat dissipation mechanism includes: the device comprises a water-cooling type heat pipe radiator, an air cooling channel, a power supply module, a temperature sensor, heat conducting glue, an air return port, a circulating pipeline and a natural cooling liquid storage unit. Compared with the prior art, the utility model has the advantages that the air-liquid double-channel heat dissipation mechanism is additionally arranged, the air cooling channel is utilized to dissipate heat of the low heat flux density components in the device, the water cooling type heat pipe radiator is utilized to dissipate heat of the high heat flux density components in the device, the heat dissipation efficiency is improved, the cooling liquid is naturally cooled by the air conditioner in the natural cooling liquid storage unit, and then is sent back to the internal circulation through the pipeline, so that the energy consumption cost is reduced.
Description
Technical Field
The utility model relates to an edge computing device shell, in particular to a gas-liquid dual-channel heat dissipation edge computing device shell.
Background
Typical applications of edge computing devices are intelligent transportation, intelligent medical, intelligent manufacturing, smart cities, etc. For example, in intelligent traffic, the edge computing device can collect and process information such as vehicles, road conditions, signal lamps and the like in real time, so that traffic optimization and safety management are realized.
The traditional edge computing device is generally placed in a machine room, and the heat dissipation is carried out by utilizing the whole row-to-row air conditioner and a fan, but the heat dissipation effect of components with high heat flux in the device is poor.
To solve the above problems, we have made a series of improvements.
Disclosure of utility model
The present utility model is directed to an edge computing device housing with dual gas-liquid channels to overcome the above-mentioned drawbacks and shortcomings of the prior art.
An edge computing device housing for dual gas-liquid channel heat dissipation, comprising: the cooling device comprises a protective shell, a gas-liquid dual-channel heat dissipation mechanism, cooling liquid and an interface board, wherein the gas-liquid dual-channel heat dissipation mechanism is connected with the interior of the protective shell, the cooling liquid is arranged in the gas-liquid dual-channel heat dissipation mechanism, the interface board is connected with the rear side of the protective shell, and the gas-liquid dual-channel heat dissipation mechanism is connected with components;
Wherein, gas-liquid binary channels heat dissipation mechanism includes: the air conditioner comprises a water-cooling type heat pipe radiator, an air cooling channel, a power supply module, a temperature sensor, heat conducting glue, an air return opening, a circulating pipeline and a natural cooling liquid storage unit, wherein the water-cooling type heat pipe radiator is connected with components through the heat conducting glue, the water-cooling type heat pipe radiator is connected with the natural cooling liquid storage unit through the circulating pipeline, the air cooling channel is connected with the air return opening, the air cooling channel is communicated with an inter-row air conditioner, the air return opening is connected with a protective shell, the power supply module is electrically connected with the water-cooling type heat pipe radiator and the air cooling channel, the power supply module is connected with the components, and the temperature sensor is connected with the interior of the protective shell.
Further, a control display screen is arranged on the protective shell and is electrically connected with the power supply module and the temperature sensor.
The utility model has the beneficial effects that:
Compared with the prior art, the utility model has the advantages that the air-liquid double-channel heat dissipation mechanism is additionally arranged, the air cooling channel is utilized to dissipate heat of the low heat flux density components in the device, the water cooling type heat pipe radiator is utilized to dissipate heat of the high heat flux density components in the device, the heat dissipation efficiency is improved, the cooling liquid is naturally cooled by the air conditioner in the natural cooling liquid storage unit, and then is sent back to the internal circulation through the pipeline, so that the energy consumption cost is reduced.
Description of the drawings:
fig. 1 is a schematic structural view of the present utility model.
Reference numerals:
a protective housing 100 and a control display 110.
The air-liquid dual-channel heat dissipation mechanism 200, a water-cooled heat pipe radiator 210, an air cooling channel 220, a power supply module 230, a temperature sensor 240, heat conducting glue 250, an air return port 260, a circulating pipeline 270 and a natural cooling liquid storage unit 280.
Cooling fluid 300, interface board 400, and components 500.
Detailed Description
The utility model will now be further described with reference to specific examples. It should be understood that the following examples are illustrative of the present utility model and are not intended to limit the scope of the present utility model.
Example 1
Fig. 1 is a schematic structural view of the present utility model.
As shown in fig. 1, an edge computing device housing with dual gas-liquid channel heat dissipation, comprising: the gas-liquid dual-channel heat dissipation mechanism 200 is connected with the inside of the protective shell 100, the cooling liquid 300 is arranged in the gas-liquid dual-channel heat dissipation mechanism 200, the interface board 400 is connected with the rear side of the protective shell 100, and the gas-liquid dual-channel heat dissipation mechanism 200 is connected with the component 500;
Wherein, gas-liquid binary channels heat dissipation mechanism 200 includes: the air-cooled type heat pipe radiator 210, the air cooling channel 220, the power supply module 230, the temperature sensor 240, the heat conducting glue 250, the return air inlet 260, the circulating pipeline 270 and the natural cooling liquid storage unit 280, the water-cooled type heat pipe radiator 210 is connected with the component 500 through the heat conducting glue 250, the water-cooled type heat pipe radiator 210 is connected with the natural cooling liquid storage unit 280 through the circulating pipeline 270, the air cooling channel 220 is connected with the return air inlet 260, the air cooling channel 220 is communicated with an inter-row air conditioner, the return air inlet 260 is connected with the protective shell 100, the power supply module 230 is electrically connected with the water-cooled type heat pipe radiator 210 and the air cooling channel 220, the power supply module 230 is connected with the component 500, and the temperature sensor 240 is connected with the interior of the protective shell 100.
The protective housing 100 is provided with a control display screen 110, and the control display screen 110 is electrically connected with the power supply module 230 and the temperature sensor 240.
The principle of the utility model is that a gas-liquid dual-channel heat dissipation mechanism 200 is designed, a 'no-compressor' liquid cooling channel is adopted to dissipate heat of a high heat flux density component and a high-efficiency air cooling channel 220 is adopted to dissipate heat of a low heat flux density component 500 aiming at the differential heating characteristics of the component 500 in the edge computing device, a water-cooled heat pipe radiator 210 is connected with the component 500 through a heat conducting adhesive 250, the heat conduction efficiency is improved, cooling liquid 300 is utilized to naturally convect in the water-cooled heat pipe radiator 210, a circulating pipeline 270 and a natural cooling liquid storage unit 280 to take away heat, and the temperature of the cooling liquid 300 is reduced by an external air conditioner in the natural cooling liquid storage unit 280 and then is conveyed into the internal and external circulating pipelines 270. The air cooling channel 220 is used for sending air-conditioning cool air into the equipment housing, taking away heat of the components 500, and then discharging the air through a return air inlet on the housing. According to the utility model, the gas-liquid dual-channel heat dissipation mechanism is additionally arranged, the air cooling channel is utilized to dissipate heat of the low heat flux density components in the device, and the water cooling type heat pipe radiator is utilized to dissipate heat of the high heat flux density components in the device, so that the heat dissipation efficiency is improved, the cooling liquid is naturally cooled by the air conditioner in the natural cooling liquid storage unit and then is sent back to the internal circulation through the pipeline, and the energy consumption cost is reduced.
The present utility model has been described in detail with reference to the embodiments, but the present utility model is not limited thereto, and various modifications may be made without departing from the spirit of the present utility model.
Claims (2)
1. An edge computing device housing for dual gas-liquid channel heat dissipation, comprising: the gas-liquid dual-channel heat dissipation device comprises a protective shell (100), a gas-liquid dual-channel heat dissipation mechanism (200), cooling liquid (300) and an interface board (400), wherein the gas-liquid dual-channel heat dissipation mechanism (200) is connected with the inside of the protective shell (100), the cooling liquid (300) is arranged in the gas-liquid dual-channel heat dissipation mechanism (200), the interface board (400) is connected with the rear side of the protective shell (100), and the gas-liquid dual-channel heat dissipation mechanism (200) is connected with a component (500);
Wherein, gas-liquid binary channels heat dissipation mechanism (200) include: the air-cooled type heat pipe radiator comprises a water-cooled type heat pipe radiator (210), an air cooling channel (220), a power supply module (230), a temperature sensor (240), heat conducting glue (250), an air return port (260), a circulating pipeline (270) and a natural cooling liquid storage unit (280), wherein the water-cooled type heat pipe radiator (210) is connected with a component (500) through the heat conducting glue (250), the water-cooled type heat pipe radiator (210) is connected with the natural cooling liquid storage unit (280) through the circulating pipeline (270), the air cooling channel (220) is connected with the air return port (260), the air cooling channel (220) is communicated with an inter-row air conditioner, the air return port (260) is connected with a protective shell (100), the power supply module (230) is electrically connected with the water-cooled type heat pipe radiator (210) and the air cooling channel (220), the power supply module (230) is connected with the component (500), and the temperature sensor (240) is connected with the interior of the protective shell (100).
2. The gas-liquid dual channel heat dissipating edge computing device housing of claim 1, wherein: the protective shell (100) is provided with a control display screen (110), and the control display screen (110) is electrically connected with the power supply module (230) and the temperature sensor (240).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322611200.8U CN220894829U (en) | 2023-09-25 | 2023-09-25 | Edge computing device shell with gas-liquid dual-channel heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322611200.8U CN220894829U (en) | 2023-09-25 | 2023-09-25 | Edge computing device shell with gas-liquid dual-channel heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220894829U true CN220894829U (en) | 2024-05-03 |
Family
ID=90843567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322611200.8U Active CN220894829U (en) | 2023-09-25 | 2023-09-25 | Edge computing device shell with gas-liquid dual-channel heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220894829U (en) |
-
2023
- 2023-09-25 CN CN202322611200.8U patent/CN220894829U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11109518B2 (en) | Water-cooled motor controller | |
| CN205921051U (en) | Liquid cooling type thermal management system of battery package | |
| US20200404811A1 (en) | Liquid-cooled cold plate device | |
| CN104735959A (en) | Cooling system of cabinet | |
| CN205946492U (en) | Water -cooled type heat dissipation module and adopt this water -cooled type heat dissipation module fill electric pile module | |
| CN204598537U (en) | A kind of cooling system of rack | |
| CN108153401A (en) | A kind of computer server radiator | |
| CN112331092B (en) | Liquid crystal display screen with heat dissipation function | |
| CN202050634U (en) | Sealing water cooling device for cooling electronic equipment | |
| CN201407147Y (en) | Cooling device of vacuum pump | |
| CN220894829U (en) | Edge computing device shell with gas-liquid dual-channel heat dissipation function | |
| CN207624749U (en) | A kind of battery case radiator structure | |
| CN203083195U (en) | Sealed box body imperforated silencing heat dissipating device | |
| CN207476101U (en) | It is a kind of to integrate water cooling and air-cooled radiator | |
| CN104133538A (en) | Zone bit liquid cooling quick mounting modular server system | |
| CN205052051U (en) | Thermal module is mixed to forced air cooling, water -cooling based on semiconductor refrigeration | |
| CN207719367U (en) | A kind of radiating structure and battery pack | |
| CN109037833B (en) | Energy-saving battery radiator for electric automobile | |
| CN208315709U (en) | Take into account air-cooled and liquid cooling power battery coldplate | |
| CN101470496A (en) | Cooling cabinet apparatus | |
| CN204227381U (en) | The active heat removal system of high-power LED mine lamp | |
| WO2023060974A1 (en) | Heat dissipation system of mobile device and mobile device | |
| CN111045496A (en) | CPU radiator of mini-host computer | |
| CN221188182U (en) | Vehicle lithium battery charger | |
| CN103838336A (en) | Novel server cooling cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |