CN220887141U - EDI module with heat dissipation function - Google Patents
EDI module with heat dissipation function Download PDFInfo
- Publication number
- CN220887141U CN220887141U CN202322127930.0U CN202322127930U CN220887141U CN 220887141 U CN220887141 U CN 220887141U CN 202322127930 U CN202322127930 U CN 202322127930U CN 220887141 U CN220887141 U CN 220887141U
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- Prior art keywords
- heat dissipation
- wall
- edi module
- heat
- copper pipe
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 65
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000000428 dust Substances 0.000 claims description 25
- 238000010030 laminating Methods 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 42
- 239000008213 purified water Substances 0.000 abstract description 13
- 238000001816 cooling Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 description 10
- 239000002826 coolant Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 150000001450 anions Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000011033 desalting Methods 0.000 description 2
- -1 hydrogen ions Chemical class 0.000 description 2
- 238000005342 ion exchange Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007646 directional migration Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000000909 electrodialysis Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003456 ion exchange resin Substances 0.000 description 1
- 229920003303 ion-exchange polymer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an EDI module with a heat dissipation function, which relates to the field of heat dissipation of the EDI module. According to the utility model, the heat conduction copper pipe, the spiral copper pipe and the heat dissipation fan are arranged, so that water purified by the EDI module main body enters the heat conduction copper pipe through the water outlet pipe, heat of the EDI module main body and heat on the heat dissipation fins are led into purified water in the heat conduction copper pipe, and after heated purified water enters the spiral copper pipe, the contact area of air flow driven by the heat dissipation fan is increased, so that the heat of purified water can be taken away by the air flow blown by the heat dissipation fan, and meanwhile, the heat dissipation fan can conduct air cooling heat dissipation on the EDI module main body, so that the heat dissipation efficiency of the device is improved.
Description
Technical Field
The utility model relates to the field of EDI module heat dissipation, in particular to an EDI module with a heat dissipation function.
Background
The ED I is also called continuous electric desalting technology, scientifically integrates electrodialysis technology and ion exchange technology, realizes directional migration of ions in water under the action of an electric field through the selective permeation action of cation and anion membranes on cations and anions and the ion exchange action of ion exchange resin on water, so as to achieve deep purification and desalting of water, and continuously regenerates filling resin through hydrogen ions and hydroxyl ions generated by water electrolysis, so that high-quality ultrapure water can be continuously prepared without acid and alkali chemicals regeneration in the EDI water preparation process.
In the existing EDI module, because the accumulated heat cannot be dissipated in the running state of large current and small flow for a long time, the membrane with the EDI approaching electrode is heated and deformed, and the purification effect of water quality is reduced.
An existing patent (issued notice number: CN 215311489U) is an EDI module with a heat dissipation function, comprising: the base is arranged on the shell, the module body in the shell is arranged, part of heat on the module body is conducted through the heat conducting piece, the water pump is started, water in the cooling box body is cooled through the cooling pipeline, the air cooling assembly is restarted, air is blown to the cooling pipeline and the heat conducting piece, the heat dissipation capacity of the cooling pipeline is improved, the heat on the heat conducting piece is blown out from the shell, through the arrangement, the heat generated by the EDI module during working can be emitted, the temperature of the EDI module is reduced, the protection effect is achieved on the EDI module, and the purification effect of water quality is improved.
However, the above technical scheme still has certain deficiency, needs to set up the cooling tank alone, and the cost is higher, and the coolant liquid in the cooling tank can make the temperature of coolant liquid become high after absorbing the heat on the module body, but does not have the device to the coolant liquid cooling in this case for the coolant liquid just loses the cooling effect after being heated, leads to the device radiating effect not good.
Disclosure of utility model
Based on this, the present utility model is directed to an EDI module with a heat dissipation function, so as to solve the technical problems set forth in the background above.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an EDI module with heat dissipation function, includes the casing, the inner wall bottom of casing is equipped with the EDI module main part, the outer wall of EDI module main part is equipped with multiunit heat radiation fins, the outer wall winding of EDI module main part has heat conduction copper pipe, and heat conduction copper pipe's outer wall and heat radiation fins's outer wall and the laminating of the outer wall of EDI module main part, the outer wall of casing is equipped with two sets of heat dissipation fans, the outer wall of casing is equipped with the dust screen.
As an EDI module with a heat dissipation function, the preferred technical scheme is that a water inlet pipe is arranged on the outer wall of an EDI module main body, a water outlet pipe is arranged on the side wall of the EDI module main body, one end of the water outlet pipe is communicated with a heat conduction copper pipe, the tail end of the heat conduction copper pipe is communicated with a spiral copper pipe, the tail end of the spiral copper pipe is communicated with a water outlet pipe, and one end of the water outlet pipe extends to the outside of a shell.
As an optimal technical scheme of the EDI module with the heat dissipation function, two groups of fan frames are arranged on the side wall of the shell, a bracket is arranged on the inner walls of the two groups of fan frames, and a heat dissipation fan is arranged on the side wall of the bracket.
As an optimal technical scheme of the EDI module with the heat dissipation function, two groups of air deflectors are arranged on the inner wall of the shell.
As an optimal technical scheme of the EDI module with the heat dissipation function, the inner walls of the two groups of fan frames are rotatably connected with a plurality of groups of rotating blades.
As an EDI module with a heat dissipation function, the shell is provided with two groups of sliding doors in a sliding manner, connecting rods are arranged at the top ends of the two groups of sliding doors, dust removing brushes are arranged on the side walls of the two groups of connecting rods, and the end parts of the dust removing brushes are attached to the outer wall of the dust screen.
As an optimal technical scheme of the EDI module with the heat dissipation function, the side walls of one ends, close to each other, of the two groups of sliding doors are respectively provided with a positive magnetic block and a negative magnetic block.
In summary, the utility model has the following advantages:
According to the utility model, the heat conduction copper pipe, the spiral copper pipe and the heat dissipation fan are arranged, so that water purified by the EDI module main body enters the heat conduction copper pipe through the water outlet pipe, heat of the EDI module main body and heat on the heat dissipation fins are led into purified water in the heat conduction copper pipe, and after heated purified water enters the spiral copper pipe, the contact area of air flow driven by the heat dissipation fan is increased, so that the heat of purified water can be taken away by the air flow blown by the heat dissipation fan, and meanwhile, the heat dissipation fan can conduct air cooling heat dissipation on the EDI module main body, so that the heat dissipation efficiency of the device is improved.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a rear perspective view of the present utility model;
fig. 3 is a schematic view of the internal structure of the housing of the present utility model.
In the figure: 1. a housing; 2. an EDI module body; 3. a heat radiation fin; 4. a heat conducting copper pipe; 5. a fan frame; 6. a bracket; 7. a heat dissipation fan; 8. rotating leaves; 9. a dust screen; 10. a water inlet pipe; 11. a water outlet pipe; 12. a spiral copper pipe; 13. a drain pipe; 14. an air deflector; 15. a sliding door; 16. a connecting rod; 17. a dust removing brush.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
Hereinafter, an embodiment of the present utility model will be described in accordance with its entire structure.
The EDI module with the heat dissipation function comprises a shell 1, an EDI module main body 2 is arranged at the bottom end of the inner wall of the shell 1, a plurality of groups of heat dissipation fins 3 are arranged on the outer wall of the EDI module main body 2, a heat conduction copper pipe 4 is wound on the outer wall of the EDI module main body 2, the outer wall of the heat conduction copper pipe 4 is attached to the outer wall of the heat dissipation fins 3 and the outer wall of the EDI module main body 2, two groups of heat dissipation fans 7 are arranged on the outer wall of the shell 1, a dust screen 9 is arranged on the outer wall of the shell 1, a water inlet pipe 10 is arranged on the outer wall of the EDI module main body 2, a water outlet pipe 11 is arranged on the side wall of the EDI module main body 2, one end of the water outlet pipe 11 is communicated with the heat conduction copper pipe 4, a spiral copper pipe 12 is communicated with a water outlet pipe 13, one end of the water outlet pipe 13 extends to the outer part of the shell 1, two groups of fan frames 5 are arranged on the side wall of the shell 1, a support 6 is arranged on the inner wall of the two groups of fan frames 5, and the heat dissipation fans 7 are arranged on the side wall of the support 6.
The heat dissipation efficiency of the EDI module main body 2 is improved through the arrangement of the heat dissipation fins 3, water purified by the EDI module main body 2 enters the heat conduction copper pipe 4 through the water outlet pipe 11, heat of the EDI module main body 2 and heat on the heat dissipation fins 3 are led into purified water in the heat conduction copper pipe 4, the heat dissipation effect of the device is further improved, after heated purified water enters the spiral copper pipe 12, the contact area of the air flow driven by the heat dissipation fan 7 is enlarged, therefore the heat of the purified water can be taken away by the air flow blown by the heat dissipation fan 7, the air flow enters the shell 1 through the dust screen 9, heat emitted by the EDI module main body 2 is absorbed after the air flow enters the shell 1, the heat is blown out through the two groups of heat dissipation fans 7, the heat dissipation effect of the device is further improved, and dust is prevented from entering the shell 1.
Referring to fig. 3, two sets of air deflectors 14 are disposed on the inner wall of the housing 1.
After the air flow of the air deflector 14 enters the shell 1, the air flow is blown onto the EDI module main body 2 through the air deflector 14 and then blown away by the two groups of heat dissipation fans 7, so that the contact area between the air flow and the EDI module main body 2 is increased, the air flow is prevented from being blown away by the heat dissipation fans 7 just after being extruded into the shell 1, and the heat dissipation effect of the device is further improved.
Referring to fig. 1-3, a plurality of sets of rotating blades 8 are rotatably connected to the inner walls of the two sets of fan frames 5.
When the EDI module main body 2 is not started, the rotary blades 8 naturally droop due to no airflow blowing, so that the fan frame 5 is blocked, dust is prevented from entering the shell 1 through the fan cover, and the dustproof effect of the device is improved.
Referring to fig. 1-2, the outer wall of the housing 1 is slidably connected with two groups of sliding doors 15, the top ends of the two groups of sliding doors 15 are provided with connecting rods 16, the side walls of the two groups of connecting rods 16 are provided with dust brushes 17, the end parts of the dust brushes 17 are attached to the outer wall of the dust screen 9, and the side walls of one ends, close to each other, of the two groups of sliding doors 15 are respectively provided with a positive magnetic block and a negative magnetic block.
The air current enters into inside the casing 1 through the dust screen 9, and the air current can drive the dust and adhere to on the dust screen 9, influences the air input easily to reduce the radiating effect, open the sliding door 15, the sliding door 15 passes through connecting rod 16 and drives dust removal brush 17 and remove, and dust removal brush 17 can be with dust brush removal that dust screen 9 outer wall is attached, prevents that dust screen 9 from blockking up.
When the novel heat-dissipation device is used, water purified by the EDI module main body 2 enters the heat-conducting copper pipe 4 through the water outlet pipe 11, so that heat of the EDI module main body 2 and heat on the heat-dissipation fins 3 are led into purified water in the heat-conducting copper pipe 4, after heated purified water enters the spiral copper pipe 12, the contact area of the heated purified water with air flow driven by the heat-dissipation fan 7 is increased, so that the heat of the purified water can be taken away by the air flow blown by the heat-dissipation fan 7, and meanwhile, the heat-dissipation fan 7 can conduct air-cooling heat dissipation on the EDI module main body 2, and the heat-dissipation efficiency of the novel heat-dissipation device is improved.
Although embodiments of the utility model have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the utility model as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the utility model, provided that such modifications are within the scope of the appended claims.
Claims (7)
1. The utility model provides an EDI module with heat dissipation function, includes casing (1), its characterized in that: the novel solar cell module is characterized in that an EDI module main body (2) is arranged at the bottom end of the inner wall of the shell (1), a plurality of groups of radiating fins (3) are arranged on the outer wall of the EDI module main body (2), a heat conduction copper pipe (4) is wound on the outer wall of the EDI module main body (2), the outer wall of the heat conduction copper pipe (4) is attached to the outer wall of the radiating fins (3) and the outer wall of the EDI module main body (2), two groups of radiating fans (7) are arranged on the outer wall of the shell (1), and a dust screen (9) is arranged on the outer wall of the shell (1).
2. The EDI module with heat dissipation according to claim 1, wherein: the outer wall of EDI module main part (2) is equipped with inlet tube (10), the lateral wall of EDI module main part (2) is equipped with outlet pipe (11), the one end and the heat conduction copper pipe (4) of outlet pipe (11) communicate, the terminal intercommunication of heat conduction copper pipe (4) has spiral copper pipe (12), the terminal intercommunication of spiral copper pipe (12) has drain pipe (13), and the one end of drain pipe (13) extends to the outside of casing (1).
3. The EDI module with heat dissipation according to claim 1, wherein: the side wall of the shell (1) is provided with two groups of fan frames (5), the inner walls of the two groups of fan frames (5) are provided with brackets (6), and the side wall of each bracket (6) is provided with a heat dissipation fan (7).
4. The EDI module with heat dissipation according to claim 1, wherein: two groups of air deflectors (14) are arranged on the inner wall of the shell (1).
5. An EDI module with heat dissipation according to claim 3, wherein: the inner walls of the two groups of fan frames (5) are rotatably connected with a plurality of groups of rotating blades (8).
6. The EDI module with heat dissipation according to claim 1, wherein: the outer wall sliding connection of casing (1) has two sets of sliding door (15), two sets of the top of sliding door (15) is equipped with connecting rod (16), two sets of the lateral wall of connecting rod (16) is equipped with dust removal brush (17), and the tip and the outer wall laminating of dust screen (9) of dust removal brush (17).
7. The EDI module with heat dissipation according to claim 6, wherein: the side walls of one ends of the two groups of sliding doors (15) close to each other are respectively provided with a positive magnetic block and a negative magnetic block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322127930.0U CN220887141U (en) | 2023-08-09 | 2023-08-09 | EDI module with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322127930.0U CN220887141U (en) | 2023-08-09 | 2023-08-09 | EDI module with heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220887141U true CN220887141U (en) | 2024-05-03 |
Family
ID=90877940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322127930.0U Active CN220887141U (en) | 2023-08-09 | 2023-08-09 | EDI module with heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220887141U (en) |
-
2023
- 2023-08-09 CN CN202322127930.0U patent/CN220887141U/en active Active
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