CN220873610U

CN220873610U - Laser peeling device

Info

Publication number: CN220873610U
Application number: CN202322215800.2U
Authority: CN
Inventors: 邱成峰; 裴小明; 彭虎
Original assignee: Xiamen Sitan Semiconductor Co ltd
Current assignee: Xiamen Sitan Semiconductor Co ltd
Priority date: 2023-08-17
Filing date: 2023-08-17
Publication date: 2024-04-30
Anticipated expiration: 2033-08-17

Abstract

The present utility model provides a laser peeling device, comprising: vacuum adsorption platform and thickness adjustment mechanism. The thickness adjusting mechanism comprises a thickness adjusting piece and a driving piece, wherein the driving piece is in driving connection with the thickness adjusting piece, and the thickness adjusting piece is close to or far away from the vacuum adsorption platform along a first direction under the action of the driving piece. The laser peeling device can improve the yield of laser peeling of the sapphire substrate.

Description

Laser peeling device

Technical Field

The utility model relates to the technical field of laser stripping equipment, in particular to a laser stripping device.

Background

Micro LED (Micro LIGHT EMITTING Diode) displays have excellent performance, and most of Micro LED chips on the market at present are based on GaN luminescent materials, and the sapphire substrate becomes a main stream substrate for epitaxially growing GaN materials due to low lattice mismatch degree of GaN and sapphire and low price. However, in the sapphire substrate peeling process, there is a problem that the laser peeling yield of the sapphire substrate is low.

Disclosure of utility model

In view of the above, an object of the present utility model is to overcome the defects in the prior art, and to provide a laser lift-off apparatus capable of improving the yield of laser lift-off of a sapphire substrate.

The utility model provides the following technical scheme:

The laser peeling device according to the embodiment of the utility model comprises: a vacuum adsorption platform; the thickness adjusting mechanism comprises at least one thickness adjusting piece and at least one driving piece, each driving piece is in driving connection with one thickness adjusting piece, and each thickness adjusting piece is close to or far away from the vacuum adsorption platform along a first direction under the action of one driving piece.

Embodiments of the present utility model have the following advantages:

In the above-mentioned laser stripping device, the vacuum adsorption platform is used for fixing Micro LED product, before the above-mentioned laser stripping device peels the sapphire substrate, can be close to the vacuum adsorption platform along first direction through thickness adjustment mechanism's thickness adjustment spare drive thickness adjustment mechanism's driving piece, so that thickness adjustment spare can keep away from the one side of vacuum adsorption platform along first direction with Micro LED product, at this moment, driving piece drive thickness adjustment spare is kept close to the vacuum adsorption platform along first direction, so that thickness adjustment spare can produce towards vacuum adsorption platform's pressure to Micro LED product, so that Micro LED product can be moved towards the direction that is close to vacuum adsorption platform along the region that the vacuum adsorption platform was most kept away from along first direction, so that distance between Micro LED product everywhere and the focus facula is in the scope of peeling off, thereby improve the yield of sapphire substrate's laser stripping.

According to the laser stripping device provided by the embodiment of the utility model, the driving piece comprises a first linear motion module, a second linear motion module and a third linear motion module, the thickness adjusting piece moves along the first direction under the action of the first linear motion module, the thickness adjusting piece moves along the second direction under the action of the second linear motion module, the thickness adjusting piece moves along the third direction under the action of the third linear motion module, the third direction is perpendicular to the second direction, and the second direction and the third direction are perpendicular to the first direction.

According to the laser stripping device provided by the embodiment of the utility model, the thickness adjusting parts and the driving parts are two, the two thickness adjusting parts respectively move along the first direction under the action of different first linear movement modules, the two thickness adjusting parts respectively move along the second direction under the action of different second linear movement modules, and the two thickness adjusting parts respectively move along the third direction under the action of different third linear movement modules.

According to the laser peeling device of the embodiment of the utility model, each thickness adjusting member is arranged to extend along the second direction and/or each thickness adjusting member is arranged to extend along the third direction.

According to the laser stripping device provided by the embodiment of the utility model, the repeated position precision of the first linear motion module is a, and the requirements are satisfied: a is more than or equal to 0 μm and less than or equal to 0.5 μm.

According to the laser peeling device of the embodiment of the utility model, the thickness adjustment range of the thickness adjustment member along the first direction is b, and the following conditions are satisfied: b is more than 5 μm and less than or equal to 8 μm.

According to the laser stripping device provided by the embodiment of the utility model, the laser stripping device further comprises a position identification mechanism, and the position identification mechanism is electrically connected with the driving piece.

According to the laser stripping device provided by the embodiment of the utility model, the vacuum adsorption platform comprises a platform main body, an adsorption part and a buffer layer, wherein the adsorption part is arranged on the platform main body, and the buffer layer is arranged on one side, away from the platform main body, of the adsorption part along the first direction.

According to the laser peeling device provided by the embodiment of the utility model, the buffer layer is a colloid flexible buffer layer, and the thickness of the colloid flexible buffer layer along the first direction is changed under the action of the driving piece.

According to the laser peeling device provided by the embodiment of the utility model, the thickness adjusting range of the colloid flexible buffer layer along the first direction is c, and the following conditions are satisfied: c is more than or equal to 0 μm and less than or equal to 4 μm.

In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a front view of a laser lift-off apparatus of an embodiment of the present utility model;

fig. 2 shows a top view of a laser lift-off apparatus according to an embodiment of the present utility model.

Description of main reference numerals:

100-vacuum adsorption platform; 110-a platform body; 120-adsorption part;

200-a thickness adjusting mechanism; 210-thickness adjuster; 220-a driver;

300-position recognition mechanism.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the templates herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a laser lift-off apparatus according to an embodiment of the present utility model includes: vacuum adsorption stage 100 and thickness adjustment mechanism 200.

Specifically, the thickness adjusting mechanism 200 includes a thickness adjusting member 210 and a driving member 220, the driving member 220 is in driving connection with the thickness adjusting member 210, and the thickness adjusting member 210 is moved toward or away from the vacuum adsorption platform 100 along a first direction by the driving member 220.

It should be noted that the first direction is the direction indicated by x in fig. 1, i.e. the thickness direction of the Micro LED product.

Further, the principle of the laser lift-off technology is to instantaneously break the adhesion between the thin film material and the substrate by using the high energy density of the laser pulse, thereby causing the lift-off. In this process, the laser beam is focused onto a spot (i.e., a focused spot) by a focusing lens to form a high energy density region (i.e., a sacrificial layer). When this region reaches the failure threshold of the material, the material is instantaneously heated and vaporized or dissolved, thereby forming a bubble. The pressure generated inside the bubbles is instantaneously diffused into the surrounding environment, resulting in an instantaneous decrease or disappearance of the adhesion force between the material and the substrate, so that the material can be easily peeled off from the substrate. In this process, the focal depth of the laser focusing is the length of the laser filament, and determines the irradiation area of the focusing light spot, i.e. the position of the sacrificial layer.

In the above-mentioned laser lift-off apparatus, the vacuum adsorption platform 100 is used for fixing the Micro LED product, before the above-mentioned laser lift-off apparatus lifts off the sapphire substrate, the thickness adjusting member 210 of the thickness adjusting mechanism 200 can be driven by the driving member 220 of the thickness adjusting mechanism 200 to approach the vacuum adsorption platform 100 along the first direction, so that the thickness adjusting member 210 can contact with one side of the Micro LED product far away from the vacuum adsorption platform 100 along the first direction, at this time, the driving member 220 drives the thickness adjusting member 210 to continuously approach the vacuum adsorption platform 100 along the first direction, so that the thickness adjusting member 210 can generate pressure towards the vacuum adsorption platform 100 on the Micro LED product, so that the region of the Micro LED product furthest away from the vacuum adsorption platform 100 along the first direction can move towards the direction near the vacuum adsorption platform 100, so that the distance between each place of the Micro LED product and the focused light spot is within the lift-off range, thereby improving the yield of laser lift-off of the sapphire substrate.

Specifically, the driving member 220 includes a first linear motion module, a second linear motion module, and a third linear motion module, the thickness adjusting member 210 moves along a first direction under the action of the first linear motion module, the thickness adjusting member 210 moves along a second direction under the action of the second linear motion module, the thickness adjusting member 210 moves along a third direction under the action of the third linear motion module, the third direction is perpendicular to the second direction, and both the second direction and the third direction are perpendicular to the first direction.

The second direction is the direction indicated by y in fig. 2, and the third direction is the direction indicated by z in fig. 2.

It will be appreciated that the Micro LED product needs to be secured to the adsorption platform prior to laser stripping of the Micro LED product, at which point the driving member 220 is remote from the vacuum adsorption platform 100 to facilitate securing of the Micro LED product. When the Micro LED product is fixed on the adsorption platform, the second linear motion module of the driving member 220 can drive the thickness adjusting member 210 to move along the second direction so as to approach the Micro LED product, the third linear motion module of the driving member 220 can drive the thickness adjusting member 210 to move along the third direction so as to adjust the relative positional relationship between the thickness adjusting member 210 and the Micro LED product, and finally the first linear motion module of the driving member 220 can drive the thickness adjusting member 210 to move along the first direction so that the thickness adjusting member 210 approaches the Micro LED product from the first direction, thereby enabling the thickness adjusting member 210 to reach the preset thickness adjusting position. Then, the thickness adjusting piece 210 is driven by the first linear motion module to continuously move along the first direction towards the direction close to the vacuum adsorption platform 100, so that the thickness adjusting piece 210 can generate pressure towards the vacuum adsorption platform 100 on the Micro LED product, the area, farthest away from the vacuum adsorption platform 100, of the Micro LED product along the first direction can move towards the direction close to the vacuum adsorption platform 100, the distance between each part of the Micro LED product and a focusing light spot is in a stripping range, and the yield of laser stripping of the sapphire substrate is improved.

Referring to fig. 1 and 2, the thickness adjusting members 210 and the driving members 220 are two, the two thickness adjusting members 210 move along a first direction under the action of different first linear motion modules, the two thickness adjusting members 210 move along a second direction under the action of different second linear motion modules, and the two thickness adjusting members 210 move along a third direction under the action of different third linear motion modules.

It can be understood that when the Micro LED product is fixed on the adsorption platform, the two thickness adjusting members 210 can be driven to move in opposite directions along the second direction by different second linear motion modules respectively, so that the two thickness adjusting members 210 are close to the Micro LED product, and then the two thickness adjusting members 210 are driven to move in opposite directions along the third direction by different third linear motion modules respectively, so that when the thickness of the Micro LED product is adjusted by the thickness adjusting members 210, the two thickness adjusting members 210 can be contacted with two sides of the Micro LED product along the third direction respectively, namely, the two thickness adjusting members 210 can be contacted with two opposite angles of the Micro LED product respectively, so that the Micro LED product is prevented from being overturned by the thickness adjusting members 210, and the Micro LED product is prevented from being overturned; finally, the two thickness adjusting members 210 are driven to move in the same direction along the first direction by different first linear motion modules, so that the two thickness adjusting members 210 are close to the Micro LED product from the first direction.

With continued reference to fig. 1 and 2, each thickness adjuster 210 may be disposed to extend in the second direction and/or each thickness adjuster 210 may be disposed to extend in the third direction.

Specifically, in the above-described embodiment, the thickness adjuster 210 is a high-strength probe.

It can be appreciated that the thickness adjusting member 210 extending along the second direction and/or along the third direction can enable the thickness adjusting member 210 to have a larger adjusting range, so that the middle portion of the Micro LED product along the second direction and/or along the third direction can also be in contact with the thickness adjusting member 210, thereby enabling the Micro LED product to have a good thickness adjusting effect.

Specifically, the repeated position precision of the first linear motion module is a, and the following conditions are satisfied: a is more than or equal to 0 μm and less than or equal to 0.5 μm.

Specifically, in the above-described embodiment, the repeating position accuracy of the first linear motion module is 0.3 μm, but in other embodiments, the repeating position accuracy of the first linear motion module may be 0.2 μm, 0.4 μm, 0.5 μm, or the like. When the repeated position precision of the first linear movement module is larger than 0.5 mu m, the flatness of the surface of the Micro LED product cannot meet the stripping requirement, namely the distance between each part of the Micro LED product and the focusing light spot cannot be in the stripping range.

It will be appreciated that for the same batch of Micro LED products, when the same laser focus depth is required for laser lift-off of the Micro LED products, the thickness adjuster 210 needs to have the same movement distance in the first direction when adjusting the thickness difference for different Micro LED products of the same batch, i.e. so that different Micro LED products of the same batch have the same thickness adjustment value. When the repeated position precision a of the first linear motion module meets the following conditions: when a is more than or equal to 0 μm and less than or equal to 0.5 μm, the influence of the error of the movement distance of the thickness adjusting member 210 in the first direction on the thickness adjusting value can be reduced, so that the focusing light spots of the laser are positioned at the same position on different Micro LED products in the same batch, and the yield of laser stripping of the sapphire substrate is improved.

Specifically, the thickness adjustment range of the thickness adjustment member 210 in the first direction is b, satisfying: b is more than 5 μm and less than or equal to 8 μm.

Specifically, in the above-mentioned embodiment, the thickness adjustment range of the thickness adjustment member 210 along the first direction is 6 μm, in addition to that, in other embodiments, the thickness adjustment range of the thickness adjustment member 210 along the first direction may be 7 μm, 8 μm, etc. so that the distance between each place of the Micro LED product and the focusing light spot is less than or equal to 35 μm, so that the focusing light spot has a better peeling effect on the sapphire substrate.

It should be noted that, due to manufacturing errors of the Micro LED product, differences in adsorption force of the vacuum adsorption platform 100 to the Micro LED product, and differences in height generated after the accumulated bonding of GaN, the thickness differences of the Micro LED product are over 40 μm, when the thickness difference of the Micro LED product is more than 40 μm, the focusing position of the focusing light spot of the laser is different from place to place, and the situation that the sacrificial layer is not uniform is easy to occur, namely the laser stripping yield of the sapphire substrate is reduced.

It can be appreciated that when the thickness adjustment range b of the thickness adjustment member 210 in the first direction satisfies: when b is more than 5 mu m and less than or equal to 8 mu m, the thickness difference of each part of the Micro LED product can be reduced, so that the difference of focusing positions of focusing light spots of laser is reduced, the uniformity of the sacrificial layer is increased, and the laser stripping yield of the sapphire substrate is improved. Meanwhile, when the thickness adjustment range b of the thickness adjustment member 210 along the first direction is greater than or equal to 8 μm, the pressure of the thickness adjustment member 210 on the Micro LED product is too high, which is easy to damage the Micro LED product.

Specifically, the laser peeling device further includes a position recognition mechanism 300, and the position recognition mechanism 300 is electrically connected to the driving member 220.

It can be understood that the position with a larger thickness difference of the Micro LED product can be identified through the position identifying mechanism 300, the identified position information is sent to the signal receiving element in the driving element 220 through the sensor in the position identifying mechanism 300, so as to calculate the distance that the driving element 220 needs to move to the thickness adjusting element 210 along the first direction, the second direction and the third direction respectively, the thickness adjusting element 210 is driven to move to the preset position along the first direction through the first linear motion module of the driving element 220, the thickness adjusting element 210 is driven to move to the preset position along the second direction through the second linear motion module of the driving element 220, and the thickness adjusting element 210 is driven to move to the preset position along the third direction through the third linear motion module of the driving element 220, so that the thickness of the Micro LED product is accurately adjusted.

Referring to fig. 1, the vacuum adsorption stage 100 includes a stage main body 110, an adsorption part 120, and a buffer layer (not shown), the adsorption part 120 being disposed on the stage main body 110, the buffer layer being disposed at a side of the adsorption part 120 away from the stage main body 110 in a first direction.

It is understood that the adsorption part 120 is used to adsorb and fix the Micro LED product so as to perform the laser lift-off operation on the Micro LED product. When the Micro LED product is fixed, since the adsorption part 120 is provided with the buffer layer along the first direction away from one side of the platform main body 110, the adsorption force of the adsorption part 120 to the Micro LED product can be buffered through the buffer layer, and damage to the Micro LED product caused by overlarge adsorption force of the adsorption part 120 is prevented.

Specifically, the cushioning layer is a flexible gum cushioning layer, and the thickness of the flexible gum cushioning layer in the first direction varies under the action of the driving member 220.

It can be appreciated that, since the thickness of the flexible buffer layer in the first direction can be changed under the action of the driving member 220, when the driving member 220 drives the thickness adjusting member 210 to apply pressure to the Micro LED product in the first direction, the flexible buffer layer can provide a buffer force for the Micro LED product, so as to prevent the Micro LED product from being damaged due to too large pressure applied by the thickness adjusting member 210 to the Micro LED product. Meanwhile, the flatness of the surface of the Micro LED product far away from the vacuum adsorption platform 100 can be adjusted by changing the thickness of the colloid flexible buffer layer, so that the focusing light spot of laser irradiates on the same thickness position of the Micro LED product, and the laser stripping yield of the sapphire substrate is improved.

Specifically, the thickness adjustment range of the colloid flexible buffer layer along the first direction is c, and the following conditions are satisfied: c is more than or equal to 0 μm and less than or equal to 4 μm.

Specifically, in the above-described embodiment, the thickness adjustment range of the gum flexible buffer layer in the first direction is 3 μm, but in other embodiments, the thickness adjustment range of the gum flexible buffer layer in the first direction may be 1 μm, 2 μm, 4 μm, or the like.

It will be appreciated that when the thickness adjustment range c of the gum flexible buffer layer along the first direction satisfies: when c is more than or equal to 0 mu m and less than or equal to 4 mu m, the thickness difference of each part of the Micro LED product can be reduced, so that the difference of focusing positions of focusing light spots of laser is reduced, the uniformity of the sacrificial layer is increased, and the laser stripping yield of the sapphire substrate is improved.

Any particular values in all examples shown and described herein are to be construed as merely illustrative and not a limitation, and thus other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

The above examples merely represent a few embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the present utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.

Claims

1. A laser lift-off apparatus, comprising:

A vacuum adsorption platform;

The thickness adjusting mechanism comprises a thickness adjusting piece and a driving piece, wherein the driving piece is in driving connection with the thickness adjusting piece, and the thickness adjusting piece is close to or far away from the vacuum adsorption platform along a first direction under the action of the driving piece.

2. The laser lift-off device of claim 1, wherein the driving member includes a first linear motion module, a second linear motion module, and a third linear motion module, the thickness adjusting member moves in the first direction under the action of the first linear motion module, the thickness adjusting member moves in the second direction under the action of the second linear motion module, the thickness adjusting member moves in the third direction under the action of the third linear motion module, the third direction is perpendicular to the second direction, and both the second direction and the third direction are perpendicular to the first direction.

3. The laser lift-off device of claim 2, wherein the thickness adjusting members and the driving members are two, the two thickness adjusting members respectively move along the first direction under the action of the different first linear motion modules, the two thickness adjusting members respectively move along the second direction under the action of the different second linear motion modules, and the two thickness adjusting members respectively move along the third direction under the action of the different third linear motion modules.

4. A laser peeling apparatus according to claim 3, wherein each of the thickness regulating members is provided extending in the second direction and/or each of the thickness regulating members is provided extending in the third direction.

5. The laser lift-off apparatus of claim 2, wherein the repeating position accuracy of the first linear motion module is a, satisfying: a is more than or equal to 0 μm and less than or equal to 0.5 μm.

6. The laser peeling apparatus according to claim 2, wherein a thickness adjustment range of the thickness adjustment member in the first direction is b, satisfying: b is more than 5 μm and less than or equal to 8 μm.

7. The laser lift-off device of any one of claims 1-6, further comprising a position identification mechanism electrically coupled to the drive member.

8. The laser lift-off apparatus of any one of claims 1 to 6, wherein the vacuum adsorption stage includes a stage main body, an adsorption portion provided on the stage main body, and a buffer layer provided on a side of the adsorption portion away from the stage main body in the first direction.

9. The laser lift-off device of claim 8, wherein the buffer layer is a gum flexible buffer layer having a thickness along the first direction that varies under the action of the driver.

10. The laser lift-off device of claim 9, wherein the thickness adjustment range of the gum flexible buffer layer along the first direction is c, satisfying: c is more than or equal to 0 μm and less than or equal to 4 μm.