CN220836371U - Automatic positioning point glue device for SMT chip mounter - Google Patents
Automatic positioning point glue device for SMT chip mounter Download PDFInfo
- Publication number
- CN220836371U CN220836371U CN202322568717.3U CN202322568717U CN220836371U CN 220836371 U CN220836371 U CN 220836371U CN 202322568717 U CN202322568717 U CN 202322568717U CN 220836371 U CN220836371 U CN 220836371U
- Authority
- CN
- China
- Prior art keywords
- glue
- connecting plate
- chip mounter
- smt chip
- fastening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003292 glue Substances 0.000 title claims abstract description 32
- 238000003860 storage Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 7
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 4
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 4
- 241001330002 Bambuseae Species 0.000 claims description 4
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 4
- 239000011425 bamboo Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 4
- 210000002421 cell wall Anatomy 0.000 claims 2
- 230000002457 bidirectional effect Effects 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
The utility model discloses an automatic positioning point glue device for an SMT (surface mount technology) chip mounter, which is characterized by comprising an electric telescopic rod, a connecting plate, a mounting cylinder, glue dispensing components, a bidirectional screw rod, an adjusting button, a moving rod and a fastening plate, wherein the connecting plate is connected to the telescopic end of the electric telescopic rod, the bidirectional screw rod is connected to the connecting plate, the two sides of the bidirectional screw rod are respectively connected with the moving rod in a threaded manner, the upper bolt of the moving rod is connected with the fastening plate, the connecting plate is connected with the mounting cylinder through two fastening plates, and the glue dispensing components are mounted in the mounting cylinder.
Description
Technical Field
The utility model relates to the technical field of SMT chip mounters, in particular to an automatic positioning point glue device for an SMT chip mounter.
Background
The SMT chip mounter is special equipment for surface assembly technology, also called as a "mounting machine" and a "surface mounting system", and is equipment for realizing high-speed and high-precision mounting of components, and is key and complex equipment in the whole SMI and production process. The utility model of an example patent number CN212120625U discloses a dispensing device of an SMT chip mounter, and relates to the technical field of SMT chip mounters, and the dispensing device comprises a dispensing processing platform, wherein first electric guide rails are fixedly arranged on two sides of the top of the dispensing processing platform, sliding guide blocks are slidably connected to the tops of the first electric guide rails, supporting columns are fixedly arranged on the tops of the sliding guide blocks, top plates are fixedly arranged on the tops of the supporting columns, mounting frames are fixedly arranged on the bottoms of the top plates, and second electric guide rails are fixedly arranged in the mounting frames. This SMT chip mounter's point gum device through setting up first electronic guide rail and slip guide block, makes the point gum machine construct and can carry out the back-and-forth movement, through setting up second electronic guide rail and connecting block, makes the point gum machine construct and can carry out the horizontal movement, reaches the purpose that makes the point gum machine construct and can carry out all-round removal, replaces manual operation by automatic, reduces the cost input, has improved production machining efficiency greatly.
In the dispensing working process, the dispensing assembly needs to be regularly taken down to clean and maintain and manage the glue heads, but the dispensing assembly in the file is fixedly installed on the connecting plate, so that the dispensing assembly is inconvenient to detach, and the cleaning and maintenance are also troublesome to reinstall.
Disclosure of utility model
According to the technical problems, the utility model provides an automatic positioning point glue device for an SMT chip mounter, which is characterized by comprising an electric telescopic rod, a connecting plate, a mounting cylinder, a glue dispensing component, a bidirectional screw rod, an adjusting button, a moving rod and a fastening plate, wherein the telescopic end of the electric telescopic rod is connected with the connecting plate, a left moving groove and a right moving groove are arranged on the connecting plate, one end of the bidirectional screw rod is connected with the wall of the left moving groove through a bearing, the other end of the bidirectional screw rod is connected with the wall of the right moving groove through a bearing after penetrating through the middle position of the connecting plate, the two sides of the bidirectional screw rod are respectively connected with the moving rod through threads, the upper bolt of the moving rod is connected with the fastening plate, the connecting plate is connected with the mounting cylinder through two fastening plates, the glue dispensing component is arranged in the mounting cylinder,
The dispensing assembly consists of a dispensing head, a rubber conveying pipe and a glue storage tank, the glue storage tank is arranged on a partition plate arranged in the mounting cylinder, the glue storage tank is connected with the dispensing head through the rubber conveying pipe,
The fastening plate is arranged in an arc-shaped structure.
Specifically, the two moving rods are respectively positioned in the left moving groove and the right moving groove.
Specifically, the threads on two sides of the bidirectional screw rod are in opposite directions.
The utility model has the beneficial effects that:
According to the utility model, the clamping and fastening of the mounting cylinder are realized through the relative movement of the adjusting button and the fastening plates at the two sides of the bidirectional screw rod, the mounting and fixing of the dispensing assembly are completed, the adjusting button is only required to be rotated during the dismounting, the operation is convenient, the dispensing assembly is assembled and mounted in the mounting cylinder, the dispensing assembly is not scattered and mounted on the connecting plate, the dismounting and mounting are only required to be carried out at one side, and the mounting and dismounting operation amount is reduced.
The utility model relates to a method for manufacturing a semiconductor device.
Drawings
Fig. 1 is a schematic diagram of the overall structure of an automatic adhesive positioning device for an SMT chip mounter;
Fig. 2 is a schematic diagram of a partial structure of an automatic adhesive positioning device for an SMT chip mounter according to the present utility model;
Fig. 3 is a schematic diagram of an internal structure of a mounting cylinder of an automatic positioning point glue device for an SMT chip mounter;
The following figures are shown: 1. electric telescopic rod, 2, connecting plate, 21, left moving groove, 22, right moving groove, 3, mounting cylinder, 31, partition plate, 41, glue storage tank, 42, glue conveying pipe, 43, glue dispensing head, 5, bidirectional screw rod, 6, adjusting button, 7, moving rod and 8, fastening plate.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
As shown in the figure, the telescopic end of the electric telescopic rod 1 is connected with a connecting plate 2, the connecting plate 2 is provided with a left moving groove 21 and a right moving groove 22, as shown in figure 2, one end of a bidirectional screw rod 5 is connected with an adjusting button 6 by a bearing and penetrates through the groove wall of the left moving groove 21, the other end of the bidirectional screw rod 5 penetrates through the middle position of the connecting plate 2 and is connected with the groove wall of the right moving groove 22 by a bearing, threads on two sides of the bidirectional screw rod 5 are in opposite directions, two sides of the bidirectional screw rod 5 are respectively connected with a moving rod 7 by threads, an upper bolt of the moving rod 7 is connected with a fastening plate 8, the fastening plate 8 is provided with an arc-shaped structure, the two moving rods 7 are respectively positioned in the left moving groove 21 and the right moving groove 22,
The connecting plate 2 is connected with the mounting cylinder 3 through two fastening plates 8, as shown in fig. 3, a glue storage tank 41 is mounted on a partition plate 31 arranged in the mounting cylinder 3, and the glue storage tank 41 is connected with a dispensing head 43 through a glue conveying pipe 42.
Example 2
When the utility model is used, when the mounting cylinder 3 of the mounting point glue assembly is dismounted, a worker only needs to rotate the adjusting button 6, the adjusting button 6 drives the bidirectional screw rod 5 to rotate, the moving rods 7 which are respectively connected with the two sides of the bidirectional screw rod 5 in a threaded manner drive the two fastening plates 8 which fasten the mounting cylinder 3 to move in opposite directions, the mounting cylinder 3 can be dismounted and taken down for maintenance and management, the mounting cylinder 3 is placed between the two fastening plates 8 in the same way during mounting, and then the adjusting button 6 is rotated, so that the two fastening plates 8 relatively move to finish limiting fastening on the mounting cylinder 3, and the mounting and the dismounting are convenient;
the assembly collection is installed in installation section of thick bamboo 3, does not scatter the assembly of gluing to the connecting plate 2, and dismantlement installation only needs one side can, reduces the repeated operation volume of installation dismantlement.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. Various components mentioned in the present utility model are common in the art, and it should be understood by those skilled in the art that the present utility model is not limited by the above embodiments, and the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications can be made in the present utility model without departing from the spirit and scope of the utility model, which is defined in the claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (3)
1. The utility model provides an automatic setpoint is glued device for SMT chip mounter, its characterized in that includes electric telescopic handle, connecting plate, installation section of thick bamboo, some gluey subassembly, two-way lead screw, adjusting knob, movable rod, fastening plate, the flexible end department of electric telescopic handle connects the connecting plate, be provided with left movable groove and right movable groove on the connecting plate, the one end of two-way lead screw passes left movable groove cell wall through the bearing connection and is connected with the adjusting knob, the other end of two-way lead screw passes behind the connecting plate intermediate position and passes through the bearing connection on right movable groove cell wall, both sides respectively threaded connection movable rod on the two-way lead screw, the last bolted connection fastening plate of movable rod, be connected with the installation section of thick bamboo through two fastening plates on the connecting plate, installation point glues the subassembly in the installation section of thick bamboo.
2. The automatic positioning point glue device for the SMT chip mounter according to claim 1, wherein the glue dispensing assembly comprises a glue dispensing head, a glue conveying pipe and a glue storage tank, wherein the glue storage tank is arranged on a partition plate arranged in the mounting cylinder, and the glue storage tank is connected with the glue dispensing head through the glue conveying pipe.
3. An automatic positioning point glue device for an SMT chip mounter according to claim 1, wherein said fastening plate is provided in an arc-shaped structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568717.3U CN220836371U (en) | 2023-09-21 | 2023-09-21 | Automatic positioning point glue device for SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322568717.3U CN220836371U (en) | 2023-09-21 | 2023-09-21 | Automatic positioning point glue device for SMT chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220836371U true CN220836371U (en) | 2024-04-26 |
Family
ID=90741367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322568717.3U Active CN220836371U (en) | 2023-09-21 | 2023-09-21 | Automatic positioning point glue device for SMT chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220836371U (en) |
-
2023
- 2023-09-21 CN CN202322568717.3U patent/CN220836371U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |